A liquid cooling server includes a chassis including a unit case housing portion; a unit case which moves in a first direction for being inserted in and pulled out from the unit case housing portion and includes a heat generating component and a portion to be cooled; a cooling plate which is disposed to the chassis, opposes the unit case housing portion in a second direction perpendicular to the first direction, and includes a flow path through which a cooling medium flows; a metal portion which is provided to either one of the cooling plate and the portion to be cooled, includes a plurality of first protrusions which protrude in the second direction towards the unit case housing portion and are arranged in the first direction; and a heat transfer body provided between the metal portion and the first member in the second direction, the heat transfer body being elasticity.
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1. A liquid cooling server that cools a heat generating component via a liquid cooling medium, the liquid cooling server comprising:
a chassis configured to include a unit case housing portion;
a unit case configured to be allowed to move in a first direction to be inserted in and pulled out from the unit case housing portion and include the heat generating component and a portion to be cooled;
a cooling plate configured to be provided to the chassis, oppose the unit case housing portion in a second direction perpendicular to the first direction, and include a flow path through which the cooling medium flows;
a metal portion configured to be provided to a first member which is either one of the cooling plate and the portion to be cooled, the metal portion including a plurality of first protrusions which protrude in the second direction towards a side of the unit case housing portion, the plurality of first protrusions being arranged in the first direction; and
a heat transfer body configured to be provided between the metal portion and the first member in the second direction, the heat transfer body having elasticity.
2. The liquid cooling server according to
wherein the metal portion is provided to the first member so as to be displaceable in the second direction with respect to the first member, and
the plurality of first protrusions abut a second member in the second direction in a state where the unit case is housed in the unit case housing portion, the second member being another of the cooling plate and the portion to be cooled.
3. The liquid cooling server according to
wherein the heat transfer body is formed in a flat sheet shape, and
the first member includes second protrusions that protrude in the second direction towards the side of the unit case housing portion in respective positions that correspond to the plurality of first protrusions of the metal portion.
4. The liquid cooling server according to
5. The liquid cooling server according to
wherein the metal portion is displaced in a direction to approach the first member in the second direction due to insertion of the unit case in the unit case housing portion, and
the heat transfer body elastically deforms due to displacement of the metal portion.
6. The liquid cooling server according to
7. The liquid cooling server according to
8. The liquid cooling server according to
wherein the first member is the cooling plate, and
a cooling module in which the cooling plate, the metal portion, and the heat transfer body are integrated is fixed to the chassis.
9. The liquid cooling server according to
wherein the first member is the cooling plate,
each of the plurality of first protrusions includes an abutting surface that abuts the portion to be cooled in the second direction in the state where the unit case is housed in the unit case housing portion and a side surface that is integral with the abutting surface from an entrance side of the unit case housing portion in the first direction, and
the side surface is inclined with respect to the abutting surface in a direction in which a close side to the abutting surface is closer to a back side of the unit case housing portion in the first direction than a far side from the abutting surface.
10. The liquid cooling server according to
11. The liquid cooling server according to
12. The liquid cooling server according to
support members that are provided for both ends of the plurality of metal plates in a third direction and support the plurality of metal plates such that the plurality of metal plates are displaceable in the second direction with respect to the chassis in a case where the third direction is perpendicular to each of the first direction and the second direction.
13. The liquid cooling server according to
14. The liquid cooling server according to
wherein the first member is the cooling plate, and
the unit case accommodates a plurality of heat sinks that respectively form the portion to be cooled in a same position in the second direction.
15. The liquid cooling server according to
wherein the first member is the cooling plate, and
in a state where the unit case is not housed in the unit case housing portion, end portions of the plurality of first protrusions on the side of the unit case housing portion in the second direction are positioned in a space of the unit case housing portion.
16. The liquid cooling server according to
17. The liquid cooling server according to
wherein the first member is the unit case,
each of the plurality of first protrusions includes an abutting surface that abuts the cooling plate in the second direction in the state where the unit case is housed in the unit case housing portion and a side surface that is integral with the abutting surface from a back side of the unit case housing portion in the first direction, and
the side surface is inclined with respect to the abutting surface in a direction in which a close side to the abutting surface is closer to an entrance side of the unit case housing portion in the first direction than a far side from the abutting surface.
18. The liquid cooling server according to
19. The liquid cooling server according to
wherein the first member is the cooling plate, and
a corner portion of the unit case on a side of the cooling plate in the second direction in an end portion on a back side of the unit case housing portion in the first direction has a corner radius.
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This application is based upon and claims the benefit of priority of the prior Japanese Patent Application No. 2016-083898, filed on Apr. 19, 2016, the entire contents of which are incorporated herein by reference.
The embodiments discussed herein are related to a liquid cooling server that cools a heat generating component via a liquid cooling medium.
There has been known a technique in related art that a surface of a cooling chamber inside which a cooling medium circulates is pressed onto a portion to be cooled of a heat generating body by a liquid chamber to which a pressurizing fluid is introduced.
Japanese Examined Patent Application Publication No. 59-015400, Japanese Laid-open Patent Publication No. 2011-171569, and Japanese Laid-open Patent Publication No. 2007-173578 are examples of related art.
According to an aspect of the invention, a liquid cooling server that cools a heat generating component via a liquid cooling medium, the liquid cooling server includes: a chassis configured to include a unit case housing portion; a unit case configured to be allowed to move in a first direction to be inserted in and pulled out from the unit case housing portion and include the heat generating component and a portion to be cooled; a cooling plate configured to be provided to the chassis, oppose the unit case housing portion in a second direction perpendicular to the first direction, and include a flow path through which the cooling medium flows; a metal portion configured to be provided to a first member which is either one of the cooling plate and the portion to be cooled, the metal portion including a plurality of first protrusions which protrude in the second direction towards a side of the unit case housing portion, the plurality of first protrusions being arranged in the first direction; and a heat transfer body configured to be provided between the metal portion and the first member in the second direction, the heat transfer body being elasticity.
The object and advantages of the invention will be realized and attained by means of the elements and combinations particularly pointed out in the claims.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of the invention, as claimed.
However, above related art has difficulty in application to a liquid cooling server in which a unit case accommodating a heat generating component is provided so as to be inserted into and pulled out the liquid cooling server. For example, a configuration including a liquid chamber to which an above pressurizing fluid is introduced is subject to inconvenience in which pressurization or depressurization work of the liquid chamber is requested at each time when the unit case is inserted or pulled out.
Therefore, there is desired a liquid cooling server having enhanced workability related to insertion and pulling out of a unit case.
Embodiments will hereinafter be described in detail with reference to drawings.
[First Embodiment]
In the description below, three orthogonal axes of X, Y, and Z axes indicated in
The liquid cooling server 1 includes a chassis 10, the unit case 20, and a cooling module 30.
The chassis 10 forms a skeletal structure of the liquid cooling server 1 and is in a form of a rack or a shelf. The chassis 10 supports other configuration elements, such as the unit case 20 and so forth, of the liquid cooling server 1. The chassis 10 includes a unit case housing portion 70. The unit case 20 is accommodated in the unit case housing portion 70. The unit case housing portion 70 is provided in accordance with the number of unit cases 20 that are installed in the chassis 10. In the first embodiment, as illustrated in
The unit case housing portion 70 forms a space in which the unit case 20 is accommodated. The inner space included in the unit case housing portion 70, that is, the inner space that is formed by the unit case housing portion 70 is substantially the same as the shape of the unit case 20. The dimension of the unit case housing portion 70 in the Z direction is approximately the same as the height of the unit case 20 in the Z direction. The chassis 10 may be provided with a guide member 60 on the entrance side of the unit case housing portion 70. The guide member 60 has a function of guiding the unit case 20 to an entrance of the unit case housing portion 70 in a case where the unit case 20 is inserted in the unit case housing portion 70.
The unit case 20 is provided so as to be capable of being inserted in and pulled out from the unit case housing portion 70 in the Y direction. Note that “insertion and pulling out” represent both of insertion (inserting) of the unit case 20 in the unit case housing portion 70 and pulling out of the unit case 20 from the unit case housing portion 70 without distinguishing one from another. The unit case 20 has a substantially rectangular parallelepiped external shape. However, a specific shape (the dimensions of the external shape in the X, Y, and Z directions) may be arbitrary or may be based on a standard or the like. In the description below, a state where the unit case 20 is inserted or housed in the unit case housing portion 70 will also be referred to as “housed state of the unit case 20”. A state where the unit case 20 is not inserted in the unit case housing portion 70 will also be referred to as “empty state of the unit case housing portion 70”.
The unit case 20 may be formed of metal such as stainless steel such as SUS430 according to Japanese Industrial Standard, for example. A heat generating component 21 diagrammatically illustrated in
The unit case 20 includes a portion to be cooled 24. The portion to be cooled 24 may be the heat generating component 21 itself or one formed on the unit case 20. The portion to be cooled 24 may be a member which is formed with a member that is attached to or accommodated in the unit case 20 and is thermally coupled with the heat generating component 21. The portion to be cooled 24 is preferably set in a spot in which a relatively wide area may be secured. For example, the portion to be cooled 24 is preferably set on an upper surface side or a lower surface side of the unit case 20 on which a wider area than side surface of the unit case 20 may be secured, where the side surface is, for example, the side surface in the X direction of the unit case 20. In the first embodiment, as illustrated in
In the first embodiment, as one example, thermal grease 25 such as heat dissipation grease is filled in an internal portion of the unit case 20. The thermal grease 25 contains particles with high thermal conduction, for example. The thermal grease 25 reduces the thermal resistance between the heat generating component 21 and the portion to be cooled 24 in the unit case 20. Accordingly, the thermal grease 25 is preferable in a case where the heat generating component 21 is not contacting with the portion to be cooled 24 (see
The cooling module 30 is provided in the chassis 10. The cooling module 30 is preferably provided for each of the unit case housing portions 70. In the first embodiment, as one example, one cooling module 30 is provided for each of the unit case housing portions 70. However, two or more cooling modules 30 may be provided for each of the unit case housing portions 70. In the description below, unless otherwise mentioned, as a representative case, a configuration about one cooling module 30 will be described.
Next, a structure of the cooling module 30 will be described with reference to
The cooling plate 32 is fixed to the chassis 10. The cooling plate 32 may be fixed to the chassis 10 by a fastening tool such as a screw or a bolt, for example, or may be fixed to the chassis 10 by a fitting structure (see
The cooling plate 32 is opposed to the unit case housing portion 70 in the Z direction. The range, as a range in the X-Y plane, in which the cooling plate 32 is opposed to the unit case housing portion 70 is arbitrary but is preferably a range that may cover the whole portion to be cooled 24 of the unit case 20 in the housed state for enhancing the cooling ability. That is, in view of enhancing the cooling ability, the cooling plate 32 preferably extends in the X direction and the Y direction throughout the whole lengths in the X direction and the Y direction of the portion to be cooled 24 of the unit case 20 in the housed state.
In the first embodiment, as illustrated in
As illustrated in
The metal plate 34 is provided on the cooling plate 32. As described later, the metal plate 34 contacts with the portion to be cooled 24 of the unit case 20 in the housed state (see
As illustrated in
The metal plate 34 is formed of sheet metal, for example. The sheet metal is aluminum sheet metal to which a hard anodic oxide coating treatment is applied, for example. As illustrated in
The protrusions 35 of the plural metal plates 34 respectively make pairs with the plural protrusion 322 of the cooling plate 32. Each of the plural metal plates 34 is provided for the protrusion 322 of the cooling plate 32 in a manner such that the protrusion 35 covers the corresponding protrusion 322 of the cooling plate 32. As described later, in the first embodiment, as one example, one heat transfer body 36 is provided between each of the protrusions 35 of the plural metal plates 34 and the corresponding protrusion 322 in the Z direction.
In the example illustrated in
The metal plate 34 extends in the X direction. The length of the metal plate 34 in the X direction is arbitrary. However, the length of the metal plate 34 in the X direction is longer than the length in the Y direction. The length of the metal plate 34 in the X direction is preferably substantially the same as the length of the portion to be cooled 24 in the X direction in view of enhancing the above heat transfer function. The protrusion 35 preferably extends throughout the substantially whole length of the metal plate 34 in the X direction in view of enhancing the above heat transfer function. However, the plural metal plates 34 may be provided in a manner such that those are successively provided in the X direction throughout the whole length in the X direction of the portion to be cooled 24 of the unit case 20 in the housed state.
The metal plate 34 is displaceable in the Z direction with respect to the cooling plate 32. For example, the metal plate 34 may be supported by the cooling plate 32 so as to be displaceable in the Z direction with respect to the cooling plate 32 or may be supported by the chassis 10 so as to be displaceable in the Z direction with respect to the cooling plate 32. A supporting method of the metal plate 34 is arbitrary as long as the metal plate 34 is displaceable in the Z direction with respect to the cooling plate 32. In the example illustrated in
The metal plate 34 is preferably displaced upward (in the direction to approach the cooling plate 32 in the Z direction) due to insertion of the unit case 20 in the unit case housing portion 70 in view of the above heat transfer function. In this case, although described later, the heat transfer efficiency via the heat transfer body 36 is enhanced. For this purpose, the cooling module 30 is arranged in the chassis 10 such that a lower end portion (top portion) of the protrusion 35 is positioned in the unit case housing portion 70 (see region T1 in
As illustrated in
In the example illustrated in
The plural heat transfer bodies 36 are provided between the cooling plate 32 and the plural metal plates 34 in the Z direction. The plural heat transfer bodies 36 respectively make groups with the plural metal plates 34 and the plural protrusions 322 of the cooling plate 32. Accordingly, the plural heat transfer bodies 36 are arranged in a manner such that those are aligned in the Y direction similarly to the plural metal plates 34 and the plural protrusions 322 (see
In the first embodiment, as one example, the heat transfer body 36 is formed in a flat sheet shape. The heat transfer body 36 may be formed of a thermal sheet, a thermal interface material (TIM), or kinds of materials that are similar to those. As the thermal sheet, various kinds of thermal sheets that are indicated in
The heat transfer body 36 may be elastically deformed in the empty state of the unit case housing portion 70. That is, the position of the pressing portion 52 of the support member 50 is appropriately set, and the heat transfer body 36 may thereby be slightly elastically deformed in the empty state of the unit case housing portion 70, for example. In this case, there is prevented a position offset of heat transfer body 36 which may occur when the unit case housing portion 70 is the empty state and the heat transfer body 36 is not elastically deformed, the heat transfer body 36 may hold a normal position. In the first embodiment, the heat transfer body 36 receives an upward pressure in the Z direction via the metal plate 34 and elastically deforms into a protruding shape extending to a lower side in a space between the protrusion 35 and the protrusion 322 as seen in the X direction (see
Next, a description will be made with reference to
As described above, as illustrated in region T1 in
In a case where the unit case 20 is inserted in the unit case housing portion 70, the portion to be cooled 24 of the unit case 20 abuts the protrusions 35 of the metal plates 34 in the Z direction. Although a state where the unit case 20 is entirely housed in the unit case housing portion 70 is not illustrated, the relationship in such a state between the cooling module 30 and the unit case 20 is equivalent to a state illustrated in region T2 in
Further, as illustrated in region T2 in
As described above, in the first embodiment, in the liquid cooling server 1, while the cooling ability that is requested in the housed state of the unit case 20 is secured, workability in insertion and pulling out of the unit case 20 may be enhanced.
Further, in the first embodiment, the plural metal plates 34 are displaceable in the Z direction independently from each other. Thus, as the unit case 20 moves toward the back side when the unit case 20 is inserted, the plural metal plates 34 are caused to sequentially withdraw upward from the entrance side in the Y direction. That is, insertion of the unit case 20 is not hindered by the plural metal plates 34. This results in proper workability in insertion of the unit case 20.
Incidentally, in the first embodiment, the cooling plate 32 includes the protrusions 322. However, in a case where the cooling plate 32 does not include the protrusions 322, hereinafter, this modification example will be referred to as “first modification example”, the following inconvenience occurs. In a case of the first modification example, in a case where the heat transfer body 36 is formed in a flat sheet shape, the elastic deformation amount of the heat transfer body 36 may be insufficient in the housed state of the unit case 20. For example, in the first modification example, in the housed state of the unit case 20, the heat transfer body 36 does not elastically deform into the protruding shape between the protrusion 35 and the protrusion 322. Thus, the contact area among the heat transfer body 36, the cooling plate 32, and the metal plate 34 may be insufficient. Further, in the first modification example, forces F2 are insufficient in the housed state of the unit case 20. Thus, the stability of the contact between the abutting surfaces 341 of the protrusions 35 of the metal plates 34 and the portion to be cooled 24 of the unit case 20 may be insufficient. In this point, in the first embodiment, because the cooling plate 32 includes the protrusions 322 as described above, the inconvenience in the above-described first modification example may be reduced. In the first modification example also, instead of the heat transfer body 36 that is formed in the flat sheet shape, it is possible to reduce the above inconvenience by using a heat transfer body that has a protrusion which fills the space between the protrusion 35 and the cooling plate 32 in the empty state of the unit case housing portion 70.
Incidentally, the distance in the Z direction between the portion to be cooled 24 of the unit case 20 and the cooling module 30 may vary among positions of the portion to be cooled 24 of the unit case 20 along the Y direction due to a component tolerance, an assembly tolerance, or the like. In this case, in a case where the plural metal plates 34 are coupled with each other in the Y direction or a case where, instead of the plural metal plates 34, the length of the abutting surface 341 of the protrusion 35 of one metal plate 34 in the Y direction is elongated, hereinafter, those modifications will be referred to as “second modification”, the following inconvenience occurs. In the second modification example, in the housed state of the unit case 20, the stability of the contact in the Z direction between the portion to be cooled 24 of the unit case 20 and the metal plate may become unstable. That is, in a case where the distance in the Z direction between the portion to be cooled 24 of the unit case 20 and the cooling module is different among positions along the Y direction, in the second modification example, the contact in the Z direction between the portion to be cooled 24 of the unit case 20 and the metal plate may be realized only in a portion along the Y direction. The portion along the Y direction is a portion in which the distance in the Z direction between the portion to be cooled 24 of the unit case 20 and the cooling module is comparatively short.
On the other hand, in the first embodiment, as described above, the plural metal plates 34 do not overlap with each other. Accordingly, the plural metal plates 34 are displaceable in the Z direction independently from each other. The plural metal plates 34 aligned in the Y direction are displaceable in the Z direction independently from each other. Thus, the inconvenience in the above-described second modification example may be reduced. That is, even in a case where the distance in the Z direction between the portion to be cooled 24 of the unit case 20 and the cooling module is different among positions along the Y direction, in the first embodiment, the metal plates 34 in the respective positions along the Y direction may be displaced upward independently from each other in accordance with the distance in the Z direction in the respective positions along the Y direction. As a result, in the first embodiment, even in a case where the distance in the Z direction between the portion to be cooled 24 of the unit case 20 and the cooling module 30 is different among positions along the Y direction, the contact between the metal plates 34 and the portion to be cooled 24 of the unit case 20 may be stabilized in a whole range in the Y direction. Here, “follow-up function” will be defined as following; the follow-up function is a function which is capable of stabilizing the contact between the metal plates 34 and the portion to be cooled 24 of the unit case 20 even in a case where the distance in the Z direction between the portion to be cooled 24 of the unit case 20 and the cooling module is different among positions along the Y direction.
As for pitches in the Y direction of the plural protrusions 35 that are formed by the plural metal plates 34 aligned in the Y direction, the above-described follow-up function is more enhanced as the pitches become shorter. Meanwhile, as the pitches are shorter, the non-contact range in the Y direction between the portion to be cooled 24 of the unit case 20 and the cooling module 30 becomes wider. The non-contact range between the portion to be cooled 24 of the unit case 20 and the cooling module 30 occurs in ranges of the side surfaces 344 and 345 of the protrusions 35 of the metal plates 34 in the Y direction and the end portions 343 of the metal plates 34 on both sides in the Y direction. Accordingly, the pitch may be adapted in consideration of those trade-offs. For example, in a case where the ratio of the total area S1 of all the abutting surfaces 341 of the plural metal plates 34 to an area S0 of the portion to be cooled 24 of the unit case 20 is set as an index, where the ration is S1/S0, the pitch is set such that the ratio becomes 0.4 or more and is set such that the ratio becomes approximately 0.5, for example.
Further, in the first embodiment, because the thermal grease 25 is filled in the unit case 20, the heat of the heat generating components 21 is transferred to the whole portion to be cooled 24 of the unit case 20 via the thermal grease 25. Accordingly, the area of the portion to be cooled 24 is set wide compared to the area of the heat generating components 21, and the heat transmitted from the heat generating components 21 may thereby be transferred to the portion to be cooled 24 while being dispersed. As a result, the heat generating components 21 may efficiently cooled via the portion to be cooled 24. However, in a modification example, the thermal grease 25 may be omitted. In this case, the unit case 20 may be brought into contact with a heat sink (not illustrated) that is thermally coupled with the heat generating components 21.
Next, a description will be made about results of an experiment that was performed by the inventor of the present application with reference to
As illustrated in
TABLE 1
Thermal resistance
Thermal conductivity
Material (component)
(° C./W)
(W/(m · K))
Thermal sheet
0.05
20.0
Metal plate 34
0.007
138
Cooling plate
0.0026
391
Unit case (member 80)
0.038
26
Whole configuration
1.5
0.667
As for the whole configuration in the laminated arrangement form, the thermal resistances of respective contact surfaces between the materials are added to the thermal resistances of the individual materials in the whole configuration. In the experiment, the thermal resistance between points P1 and P2 was calculated by temperature measurement, and the thermal resistance value of the whole configuration was 1.5° C./W. This value indicates that cooling by 40 W is possible for one metal plate 34 in a case where it is assumed that the allowance value of the surface temperature rise of the unit case 20 is 60° C. In order to handle higher heat generation, the area of the portion to be cooled 24 of the unit case 20 is increased, and the plural metal plates 34 are used. For example, the cooling by 120 W is possible by three metal plates and a contact surface of 1200 mm2.
Next, a description will be made about one example of a liquid cooling system that includes the liquid cooling server 1 according to the first embodiment with reference to
The liquid cooling system 2 includes the liquid cooling server 1 and a cooling device 4. The cooling device 4 may be a chiller or the like. The cooling device 4 includes a heat exchanger 41 and a pump 42. The cooling medium from which heat is taken via the heat exchanger 41 is delivered to the liquid cooling server 1 by the pump 42 via a supply path 43 (see arrow “IN” in
Incidentally, the liquid cooling server 1′ may request insertion and pulling out of the heat generating unit for maintenance, replacement, and so forth of the heat generating unit. The point that insertion and pulling out of the unit case 20 may be requested for maintenance, replacement, and so forth similarly applies to the liquid cooling server 1 according to the first embodiment. In the comparative example, because the cooling module is mounted in the heat generating unit, in a case of maintenance and replacement of the heat generating unit, the heat generating unit has to be separated from a cooling water supply route (the supply path 43 and the return path 44). Thus, in the liquid cooling server 1′ according to the comparative example, couplers 90 (or separation components of similar kinds) (see insides of broken line circles in
In this point, the liquid cooling server 1 according to the first embodiment is not subject to the above-described inconvenience that occurs in the liquid cooling server 1′ according to the comparative example. Specifically, as described above, in the liquid cooling server 1 according to the first embodiment, the cooling module 30 and the unit case 20 are separate bodies. Accordingly, in the liquid cooling server 1, even in a case where insertion and pulling out of the unit case 20 are requested for maintenance, replacement, and so forth, as described above with reference to
[Second Embodiment]
A cooling server according to a second embodiment is different from the liquid cooling server 1 according to the above-described first embodiment in a point that the unit case 20 is substituted by a unit case 20A. The other configurations of the liquid cooling server according to the second embodiment may be similar to the liquid cooling server 1 according to the above-described first embodiment, and descriptions will be simplified or omitted.
The unit case 20A is different from the unit case 20 according to the above-described first embodiment in a point that an upper portion is open (not a liquid tight structure) and the thermal grease 25 is not filled therein. Further, the unit case 20A is different from the unit case 20 according to the above-described first embodiment in a point that a heat sink 28 is provided for the heat generating component 21.
The heat sink 28 may be formed of a material with high heat conductivity and may be formed of oxygen-free copper (C10200), for example. As illustrated in
An upper portion of the heat sink 28 forms a portion to be cooled 24A, and an upper surface of the heat sink 28 forms a cooled surface. The upper surface (cooled surface) of the heat sink 28 that is provided for each of the heat generating components 21 extends in substantially the same plane. That is, each of the heat sinks 28 has a contact surface (abutting surface) with the metal plate 34 in the same position in the Z direction. As illustrated in
In a case where the unit case 20A is inserted in the unit case housing portion 70, the portion to be cooled 24A of the heat sink 28 abuts the protrusions 35 in the Z direction. As illustrated in region T2 in
Note that the unit case 20A according to the second embodiment and the unit case 20 according to the above-described first embodiment may be housed in the different unit case housing portions 70 of the same chassis 10. That is, the unit case 20A according to the second embodiment and the unit case 20 according to the above-described first embodiment may be used in combination. Further, in a case where the unit case 20A according to the second embodiment and the unit case 20 according to the above-described first embodiment have the same size, the unit case 20A and the unit case 20 may alternatively be housed in the same unit case housing portion 70.
[Third Embodiment]
A cooling server according to a third embodiment is different from the liquid cooling server 1 according to the above-described first embodiment in a point that the unit case 20 is substituted by a unit case 20B and the cooling module 30 is substituted by a cooling plate 32B. The other configurations of the liquid cooling server according to the third embodiment may be similar to the liquid cooling server 1 according to the above-described first embodiment, and descriptions will be simplified or omitted. In the third embodiment, the metal plates 34 and the heat transfer bodies 36 are provided not on the chassis 10 side but on the unit case 20B side.
The unit case 20B is different from the unit case 20 according to the above-described first embodiment in a point that the portion to be cooled 24 is substituted by a portion to be cooled 24B and the metal plates 34 and the heat transfer bodies 36 are provided to the unit case 20B.
Specifically, as illustrated in
As for the unit case 20B, differently from the corner portion 201 of the unit case 20 according to the above-described first embodiment, a corner portion 201B on an upper side of an end portion on the back side in the Y direction does not abut the cooling plate 32B or the like in a case where the unit case 20B is inserted. Accordingly, a comparatively large corner radius may not be given to the corner portion 201B.
In the third embodiment, the metal plates 34 and the heat transfer bodies 36 are provided not on the chassis 10 side but on the unit case 20B side. That is, in the third embodiment, only the arrangement of the metal plates 34 and the heat transfer bodies 36 is different from the above-described first embodiment. Accordingly, the configuration of the metal plate 34 alone may be similar to the above-described first embodiment. Similarly, the configuration of the heat transfer body 36 alone may be similar to the corresponding one of the above-described first embodiment.
Specifically, the cooling plate 32B is not provided with the metal plate 34 or the heat transfer body 36. Further, the protrusion 322 is not formed either. Accordingly, a lower side surface of the cooling plate 32B is substantially flat. The metal plates 34 are provided to the unit case 20B. The metal plate 34 is arranged such that the side surface 344 is on the back side in the Y direction with respect to the side surface 345 (arranged in the opposite direction to the above-described first embodiment). The metal plate 34 abuts the cooling plate 32B in the Z direction in the housed state of the unit case 20B and has a function, as a heat transfer function, of transferring heat from the unit case 20B to the cooling plate 32B via the heat transfer body 36. Further, by a similar principle to the above-described first embodiment, the metal plate 34 has a function, as an insertion and pulling out facilitation function, of facilitating insertion and pulling out of the unit case 20B. Further, by a similar principle to the above-described first embodiment, the metal plate 34 has a function, as a durability improvement function, of enhancing durability against friction in a case of insertion and pulling out of the unit case 20B.
The heat transfer bodies 36 are provided between the unit case 20B and the plural metal plates 34 in the Z direction. The plural heat transfer bodies 36 respectively make groups with the plural metal plates 34 and the plural protrusions 29B of the unit case 20B. Accordingly, the plural heat transfer bodies 36 are arranged in a manner such that those are aligned in the Y direction similarly to the plural metal plates 34 and the plural protrusions 29B. Each of the plural heat transfer bodies 36 is provided in a manner such that it covers the corresponding protrusion 29B.
As illustrated in region T1 in
In a case where the unit case 20B is inserted in the unit case housing portion 70, the cooling plate 32B abuts the protrusions 35 of the metal plates 34 in the Z direction. As illustrated in region T2 in
As described above, the third embodiment may provide similar effects to the above-described first embodiment. Note that the liquid cooling server according to the third embodiment may be used instead of the liquid cooling server 1 in the liquid cooling system 2 illustrated in
In the third embodiment, the thermal grease 25 is filled in the unit case 20B similarly to the above-described first embodiment. However, similarly to the above-described second embodiment, an upper portion may be open (not a liquid tight structure), and the thermal grease 25 may be omitted. In this case, a protrusion is provided on the upper surface of the heat sink 28, which is described in the above-described second embodiment, and the metal plate 34 and the heat transfer body 36 may be provided to the protrusion.
In the foregoing, the embodiments have been described in detail. However, the techniques described herein are not limited to specific embodiments, but various modifications and alterations are possible within the scope of the claims. Further, it is possible to combine all or plural configuration elements of the above-described embodiments.
For example, in the above-described first embodiment, the metal plate 34 is supported by the support member 50 so as to be displaceable in the Z direction. However, embodiments are not limited to this. For example, the metal plate 34 may be adhered to the heat transfer body 36 by a thermally conductive adhesive. In this case, the heat transfer body 36 may be adhered to the protrusion 322 by a thermally conductive adhesive. Such a modification example may be realized in substantially the same manner in the other second and third embodiments.
All examples and conditional language recited herein are intended for pedagogical purposes to aid the reader in understanding the invention and the concepts contributed by the inventor to furthering the art, and are to be construed as being without limitation to such specifically recited examples and conditions, nor does the organization of such examples in the specification relate to a showing of the superiority and inferiority of the invention. Although the embodiments of the present invention have been described in detail, it should be understood that the various changes, substitutions, and alterations could be made hereto without departing from the spirit and scope of the invention.
Patent | Priority | Assignee | Title |
10356957, | Oct 31 2014 | Hewlett Packard Enterprise Development LP | Adaptive cooling assembly |
11089715, | Sep 17 2019 | Baidu USA LLC | Cooling chassis design for server liquid cooling of electronic racks of a data center |
Patent | Priority | Assignee | Title |
4884167, | Nov 09 1987 | NEC Corporation | Cooling system for three-dimensional IC package |
5245508, | Aug 21 1990 | International Business Machines Corporation | Close card cooling method |
7212409, | Dec 05 2005 | Hewlett-Packard Development Company, L.P. | Cam actuated cold plate |
7312987, | Dec 09 2005 | Oracle America, Inc | Adaptable thin plate modular heat exchanger blade for cooling electronic equipment |
8000103, | Dec 19 2007 | CLUSTERED SYSTEMS COMPANY, INC | Cooling system for contact cooled electronic modules |
8817473, | Sep 26 2011 | Mellanox Technologies Ltd.; Mellanox Technologies Ltd | Liquid cooling system for modular electronic systems |
8879258, | Sep 26 2011 | Mellanox Technologies Ltd. | Liquid cooling system for modular electronic systems |
9713287, | Jan 15 2013 | SMART EMBEDDED COMPUTING, INC | Integrated thermal inserts and cold plate |
20120037339, | |||
DE10112389, | |||
EP580412, | |||
FR2682748, | |||
JP2007173578, | |||
JP2011171569, | |||
JP59015400, |
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