An active electronically scanned array (AESA) antenna system can include a plurality of printed circuit boards (PCBs) having a common shape. Each PCB of the plurality of PCBs can include a respective sub-array of antenna elements surrounded by a passive area, and can include electronic circuitry for electrically steering the sub-array of antenna elements. The AESA antenna system can include a mechanical seal for mechanically connecting the PCBs hosting the sub-arrays to form an antenna array of the sub-arrays. The passive areas can form separation areas between adjacent ones of the sub-arrays when the PCBs are mechanically connected to each other. The sub-arrays are arranged such that the separation areas are contiguous along at most one straight direction across the antenna array.
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13. A method of providing an active electronically scanned array (AESA) antenna system, the method comprising:
manufacturing a plurality of printed circuit boards (PCBs) having a common shape, each PCB of the plurality of PCBs including a respective sub-array of antenna elements surrounded by a passive area and having electronic circuitry for electrically steering the sub-array of antenna elements; and
mechanically connecting the plurality of PCBs hosting the sub-arrays to form an antenna array of the sub-arrays,
wherein the passive areas form separation areas between adjacent ones of the sub-arrays, the separation areas being contiguous along at most one straight direction across the antenna array.
1. An active electronically scanned array (AESA) antenna system comprising:
a plurality of printed circuit boards (PCBs) having a common shape, each PCB of the plurality of PCBs including a respective sub-array of antenna elements surrounded by a passive area and having electronic circuitry for electrically steering the sub-array of antenna elements; and
a mechanical seal for mechanically connecting the PCBs including the sub-arrays to form an antenna array of the sub-arrays,
wherein the passive areas form separation areas between adjacent ones of the sub-arrays when the PCBs are mechanically connected to each other, and the sub-arrays are arranged such that the separation areas are contiguous along at most one straight direction across the antenna array.
2. The AESA antenna system of
9. The AESA antenna system of
11. The AESA antenna system of
12. The AESA antenna system of
14. The method of
a plus shape;
a rectangle;
a square;
a hexagon;
a diamond shape; or
a parallelogram.
15. The method of
16. The method of
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Active electronically scanned array (AESA) systems provide reliable performance over respective ultra-wide bands (UWBs) of operating frequencies. AESA systems are commonly used in communication systems, military and weather radar systems, electronic intelligence systems, or biological or medical microwave imaging systems. An AESA system makes use of an array of radiating elements (or antenna elements) steerable via a respective group of transmit/receive modules (TRMs). By independently steering each of its antenna elements, an AESA system provides a relatively high reception/transmission performance through constructive accumulation of signals associated with a plurality of antenna elements. Also, because of the inherent capability to simultaneously use, and independently steer, a respective plurality of antenna elements, the single failure of one or few antenna elements within an AESA system have little effect on the operation of the AESA system as the rest of the antenna elements can continue to function un-interrupted. Furthermore, AESA systems are difficult to jam because of their capability to hop from one operational frequency to another within the respective UWB.
The signal received/transmitted by an AESA antenna system is a combination of the signals received/transmitted by the respective antenna elements. As such, the power of the received/transmitted signal can increase with the number of antenna elements in the AESA system. Various applications call for larger electronically scanned array (ESA) systems, active or passive, to improve signal gain, reception sensitivity, and smaller beam width. As such, printed circuit boards (PCB) of ESA systems are becoming excessively large. However, manufacturing of large PCBs suffers from poor yield, therefore, driving up cost significantly. In particular, manufacturing large PCBs involves a relatively larger number of sequential laminations, which increases the likelihood of manufacturing deficiencies and leads to the poor yield.
Due to the poor yield associated with the fabrication of large PCBs, the demand for larger number of antenna elements in ESA systems may not be practically fulfilled using monolithic PCBs. Another alternative to construct large ESA systems is by tiling multiple smaller PCBs, each corresponding to a respective ESA sub-system, into a large ESA system. Multi-tile ESA systems are beneficial from a yield and cost standpoint. However, tiling PCBs presents various technical challenges with regard to the mechanical coupling of the PCBs without perturbing the electronic components of the respective ESA subsystems, with regard to the protection of the ESA sub-systems, or with regard to the performance of the resulting ESA system.
One common performance factor for antenna arrays is the distribution and strength of respective radiation pattern sidelobes. In particular, the sidelobes that are closest to the main lobe of an antenna array can contribute the most to signal interference. When designing antenna arrays, one of the goals is to reduce the number and the gain of the sidelobes.
In one aspect, the inventive concepts disclosed herein are directed to an active electronically scanned array (AESA) antenna system that includes a plurality of printed circuit boards (PCBs) having a common shape. Each PCB of the plurality of PCBs can include a respective sub-array of antenna elements surrounded by a passive area and has electronic circuitry for electrically steering the sub-array of antenna elements. The AESA antenna system can include a mechanical seal for mechanically connecting the PCBs including the sub-arrays to form an antenna array of the sub-arrays. The passive areas can form separation areas between adjacent ones of the sub-arrays when the PCBs are mechanically connected to each other. The sub-arrays are arranged such that the separation areas are contiguous along at most one straight direction across the antenna array.
In some embodiments, the separation areas can be non-contiguous along any straight direction across the antenna array. The common shape can comprise a plus shape. The common shape can comprise a rectangle. The common shape can comprise a square. The common shape can comprise a hexagon. The common shape can comprise a diamond shape. The common shape can comprise a parallelogram.
In some embodiments, the separation areas can include one or more inactive or disabled antenna elements. The separation areas can be free of antenna elements. The mechanical seal can include a mechanical chassis arranged around a periphery of the antenna array. The mechanical seal can include one or more mechanical connectors arranged at the separation areas for mechanically connecting adjacent PCBs.
In a further aspect, the inventive concepts disclosed herein are directed to an AESA antenna aperture that includes a plurality of sub-array regions having a common shape. Each of the plurality of sub-array regions includes a plurality of antenna elements. The AESA antenna aperture may include a plurality of passive areas residing between adjacent ones of the plurality of sub-array regions. The plurality of passive areas are contiguous along at most one straight direction across the AESA antenna aperture.
The separation areas can be non-contiguous along any straight direction across the antenna array. The common shape can include at least one of a plus shape, a rectangle, a square, a hexagon, a diamond, and a parallelogram. The passive areas can include inactive or disabled antenna elements. In some embodiments, the passive areas can be free of antenna elements.
In a further aspect, the inventive concepts disclosed herein are directed to a method of providing an AESA antenna system. The method comprises manufacturing a plurality of (PCBs having a common shape. Each PCB of the plurality of PCBs includes a respective sub-array of antenna elements surrounded by a passive area. Each PCB of the plurality of PCBs has electronic circuitry for electrically steering the sub-array of antenna elements. The method also comprises mechanically connecting the plurality of PCBs hosting the sub-arrays to form an antenna array of the sub-arrays. The passive areas form separation areas between adjacent ones of the sub-arrays. The separation areas are contiguous along at most one straight direction across the antenna array.
The common shape can includes at least one of a plus shape, a rectangle, a square, a hexagon, a diamond shape, or a parallelogram. The passive areas can include inactive or disabled antenna elements. In some embodiments, the passive areas can be free of antenna elements. The separation areas can be non-contiguous along any straight direction across the antenna array.
Implementations of the inventive concepts disclosed herein may be better understood when consideration is given to the following detailed description thereof. Such description makes reference to the included drawings, which are not necessarily to scale, and in which some features may be exaggerated and some features may be omitted or may be represented schematically in the interest of clarity. Like reference numerals in the drawings may represent and refer to the same or similar element, feature, or function. In the drawings:
The details of various embodiments of the methods and systems are set forth in the accompanying drawings and the description below.
Before describing in detail embodiments of the inventive concepts disclosed herein, it should be observed that the inventive concepts disclosed herein include, but are not limited to a novel structural combination of components and circuits, and not to the particular detailed configurations thereof. Accordingly, the structure, methods, functions, control and arrangement of components and circuits have, for the most part, been illustrated in the drawings by readily understandable block representations and schematic diagrams, in order not to obscure the disclosure with structural details which will be readily apparent to those skilled in the art, having the benefit of the description herein. Further, the inventive concepts disclosed herein are not limited to the particular embodiments depicted in the diagrams provided in this disclosure, but should be construed in accordance with the language in the claims.
Referring now to the drawings,
The mechanical chassis 102 includes o-rings 106 for mechanically coupling the PCBs 104 to the mechanical chassis 102. For instance, an o-ring 106 can overlap with an area of a PCB 104 that is beyond where electric or electronic components of the PCB 104 are located. Any mechanical coupling mechanism to tile the PCBs 104 together should not interfere with the electronics of the PCBs 104. PCB areas behind the antenna elements are usually crowded with electrical or electronic components and may not be suitable for integrating or hosting mechanical coupling means (such as screws, glue or the like). The PCBs 104 can include passive areas (e.g., free of electric or electronic components) used for mechanically coupling or sealing the PCBs 104 to each other into a large multi-PCB ESA system. The passive areas may be usually located at the boundaries of the PCBs 104. The PCBs 104 can be arranged according to horizontal rows and vertical columns as shown in
The relative locations of the sub-arrays with respect to one another, the number of antenna elements in the PCB tiling 100 as well as the size, shape, and number of the passive areas between the sub-arrays, can affect the performance of the multi-PCB ESA system. In particular, the width, the continuity and/or the frequency of the passive areas can influence the distribution and/or amplitudes of the sidelobes associated with the multi-PCB ESA system. For instance, the wider the passive areas and the far apart the sub-arrays from each other, the higher is the level of the sidelobes.
Referring now to
The AESA aperture 202 of
Referring now to
Referring now to
Referring now to
Given the non-practicability of manufacturing large single-PCB AESA antenna systems, the need for AESA antenna systems with relatively large number of antenna elements (e.g., compared to existing AESA systems) calls for multi-tile (or multi-PCB) configurations of AESA systems. However, multi-tile configurations involve the use of passive areas (such as passive areas 212, 306 and 310) for use in mechanically sealing against adjacent PCBs, and such areas can result in increased sidelobe levels in respective antenna beams. In designing multi-tile AESA antenna systems, one of the goals is to improve the antenna array performance in terms of the sidelobe levels, especially in the vicinity of the main lobe. To achieve such a goal, multi-tile configurations can be employed in accordance with the inventive concepts described in this disclosure.
According to inventive concepts disclosed herein, an AESA antenna aperture can include a plurality of sub-array regions (e.g., a two-dimensional tiling of sub-arrays) having a common shape and separated by passive areas that are contiguous along at most one straight direction across the AESA antenna aperture. Each of the plurality of sub-array regions can include a plurality of antenna elements. According to example embodiments of this disclosure, the non-contiguousness of the passive areas along any straight direction across the AESA antenna aperture, or the contiguousness along at most a single straight direction across the AESA antenna aperture, can improve the antenna array performance with respect to sidelobe levels in multi-tile AESA antenna apertures. The periodicity of contiguous elongated passive areas can contribute to increasing sidelobe levels in multi-tile antenna arrays.
Referring now to
In some embodiments, each sub-array unit 402 can correspond to a respective plus-shaped PCB hosting the sub-array of antenna elements 404 and including the respective passive area 406. Each PCB can include electrical (or electronic) circuitry for steering the respective antenna elements 404. The electrical circuitry can be printed on the back of the PCB (e.g., at the other side of the PCB with respect to where the sub-array of antenna elements 404 is located). The electrical circuitry can include for each antenna element a respective transmitter/receiver module (TRM). For each antenna element, the respective TRM can include a phase shifter (or time delay element) and a gain amplifier. The electrical circuitry can also include electric current (or voltage) accumulators and/or electric current (or voltage)splitters. In some embodiments, the electrical circuitry can include a receiving (RX) circuit and/or a transmitting (TX) circuit. In some embodiments, each sub-array unit 402 can be configured to switch between a RX operation mode and a TX operation mode. In some embodiments, some sub-array units 402 can be designated as receivers while others can be designated as transmitters. Electrical circuitries for various sub-array units 402 can be electrically coupled together, for example, via electric current (or voltage) accumulators and/or electric current (or voltage) splitters.
In the sub-array tiling configuration shown in
The AESA antenna aperture 400 can include a mechanical seal to mechanically connect the antenna sub-array units 402 into a multi-tile AESA antenna aperture 402. The mechanical seal can include a mechanical chassis (such as mechanical chassis 102 shown in
Referring now to
Similar to the AESA antenna aperture 400, each sub-array unit 502 can correspond to a respective hexagon-shaped PCB hosting the sub-array of antenna elements 504 and including the respective passive area 506. Each PCB can include electrical (or electronic) circuitry for steering the respective sub-array of antenna elements 504. The electrical circuitry can be printed on the back of the PCB (e.g., at the other side of the PCB with respect to where the sub-array of antenna elements 504 is located). The electrical circuitry can include for each antenna element a respective transmitter/receiver module (TRM). For each antenna element, the respective TRM can include a phase shifter (or time delay element) and a gain amplifier. The electrical circuitry can also include electric current (or voltage) accumulators and/or electric current (or voltage)splitters. In some embodiments, the electrical circuitry can include a receiving (RX) circuit and/or a transmitting (TX) circuit. In some embodiments, each sub-array unit 502 can be configured to switch between a RX operation mode and a TX operation mode. In some embodiments, some sub-array units 502 can be designated as receivers while others can be designated as transmitters. Electrical circuitries for various sub-array units 502 can be electrically coupled together, for example, via electric current (or voltage) accumulators and/or electric current (or voltage) splitters. The AESA antenna aperture 500 can include a mechanical seal or structure to connect the antenna sub-array units 502 into a multi-tile AESA antenna aperture, as discussed above with regard to AESA antenna aperture 400.
Referring now to
Each sub-array unit 602 can correspond to a respective rectangular-shaped PCB hosting the sub-array of antenna elements 604 and including the respective passive area 606. Each PCB can include electrical (or electronic) circuitry for steering the respective sub-array of antenna elements 604. The electrical circuitry can be printed on the back of the PCB (e.g., at the other side of the PCB with respect to where the sub-array of antenna elements 604 is located). The electrical circuitry can include for each antenna element a respective transmitter/receiver module (TRM). For each antenna element, the respective TRM can include a phase shifter (or time delay element) and a gain amplifier. The electrical circuitry can also include electric current (or voltage) accumulators and/or electric current (or voltage)splitters. In some embodiments, the electrical circuitry can include a receiving (RX) circuit and/or a transmitting (TX) circuit. In some embodiments, each sub-array unit 600 can be configured to switch between a RX operation mode and a TX operation mode. In some embodiments, some sub-array units 600 can be designated as receivers while others can be designated as transmitters. Electrical circuitries for various sub-array units 600 can be electrically coupled together, for example, via electric current (or voltage) accumulators and/or electric current (or voltage) splitters. The AESA antenna aperture 600 can include a mechanical seal or structure to connect the antenna sub-array units 602 into a multi-tile AESA antenna aperture, as discussed above with regard to AESA aperture 400.
Referring now to
Each sub-array unit 702 can correspond to a respective parallelogram (or diamond) shaped PCB hosting the sub-array of antenna elements 704 and including the respective passive area 706. Each PCB can include electrical (or electronic) circuitry for steering the respective sub-array of antenna elements 704. The electrical circuitry can be printed on the back of the PCB (e.g., at the other side of the PCB with respect to where the sub-array of antenna elements 704 is located). The electrical circuitry can include for each antenna element a respective transmitter/receiver module (TRM). For each antenna element, the respective TRM can include a phase shifter (or time delay element) and a gain amplifier. The electrical circuitry can also include electric current (or voltage) accumulators and/or electric current (or voltage)splitters. In some embodiments, the electrical circuitry can include a receiving (RX) circuit and/or a transmitting (TX) circuit. In some embodiments, each sub-array unit 702 can be configured to switch between a RX operation mode and a TX operation mode. In some embodiments, some sub-array units 702 can be designated as receivers while others can be designated as transmitters. Electrical circuitries for various sub-array units 702 can be electrically coupled together, for example, via electric current (or voltage) accumulators and/or electric current (or voltage) splitters. The AESA antenna aperture 700 can include a mechanical seal or structure to connect the antenna sub-array units 702 into a multi-tile AESA antenna aperture, as discussed above with regard to AESA aperture 400.
According to inventive concepts of this disclosure, an AESA antenna system can include a plurality of PCBs having a common shape. Each PCB of the plurality of PCBs can correspond to a sub-array unit (such as sub-array units 410, 510, 610 or 710) and can host a respective sub-array of antenna elements (such as sub-arrays 414, 514, 614 or 714) and a passive area (such as passive areas 412, 512, 612 or 712) surrounding the sub-array of antenna elements. Each PCB can also include electronic circuitry for electrically steering the respective sub-array of antenna elements. The AESA antenna system can also include a mechanical seal for mechanically connecting the PCBs hosting the sub-arrays to form an antenna array of the sub-arrays. The passive areas can form separation areas between adjacent sub-arrays when the PCBs are mechanically connected to each other. The sub-arrays can be arranged such that the separation areas are contiguous along at most one straight direction across the antenna array. For instance, the separation areas can be contiguous along a single straight direction such as discussed above with regard to
The mechanical seal can include a mechanical chassis (such as mechanical chassis 15 shown in
The AESA antenna system can also include at least one processor coupled to the sub-arrays of antenna elements via the respective electronic circuitries. The electronic circuitries associated with the plurality of PCBs can be coupled to each other and to the at least one processor via electric current (or voltage) accumulators or electric current (or voltage) splitters. Each electronic circuitry can include TRMs for the respective plurality of antenna elements. The at least one processor can be configured to steer the antenna elements associated with the plurality of PCBs.
While the AESA antenna apertures discussed herein (e.g., with regard to
Referring now to
The antenna array gain for the AESA antenna aperture of
Referring now to
The antenna array gain for the AESA antenna aperture of
Comparing the simulation results for the AESA antenna apertures of
Comparing the simulation results for the AESA antenna aperture of
Referring now to
The method includes manufacturing a plurality of printed circuit boards (PCBs) having a common shape (step 802). The PCBs can have a plus shape (as discussed above with regard to
The electronic (or electrical) circuitry can include for each antenna element a respective transmitter/receiver module (TRM). For each antenna element, the respective TRM can include a phase shifter (or time delay element) and a gain amplifier. The electrical circuitry can also include electric current (or voltage) accumulators and/or electric current (or voltage) splitters. In some embodiments, the electrical circuitry can include a receiving (RX) circuit and/or a transmitting (TX) circuit. In some embodiments, each PCB can be configured to switch between a RX operation mode and a TX operation mode. In some embodiments, some PCBs can be designated as receivers while others can be designated as transmitters.
The method can include mechanically connecting the plurality of PCBs hosting the sub-arrays to form an antenna array of the sub-arrays, such that the passive areas form separation areas, between adjacent sub-arrays, that are contiguous along at most one straight direction across the antenna array (step 804). Mechanically connecting the PCBs can include tiling the plurality of PCBS into an antenna aperture. Mechanically connecting the PCBs can include using a mechanical chassis (such as mechanical chassis 102 shown in
In some embodiments, the method 800 can further include electrically coupling the electrical circuitries for various PCBs to each other and/or to other electrical/electronic components, such as a processor. For instance, the electrical circuitries for various PCBs can be electrically coupled together and/or to other electric components, for example, via electric current (or voltage) accumulators and/or electric current (or voltage) splitters.
The construction and arrangement of the systems and methods are described herein as illustrative examples and are not to be construed interpreted as limiting. Although only a few embodiments have been described in detail in this disclosure, many modifications are possible (e.g., variations in sizes, dimensions, structures, shapes and proportions of the various elements, values of parameters, mounting arrangements, use of materials, colors, orientations). For example, the position of elements may be reversed or otherwise varied and the nature or number of discrete elements or positions may be altered or varied. Accordingly, all such modifications are intended to be included within the scope of the inventive concepts disclosed herein. The order or sequence of any operational flow or method operations may be varied or re-sequenced according to alternative embodiments. Other substitutions, modifications, changes, and omissions may be made in the design, operating conditions and arrangement of the exemplary embodiments without departing from the broad scope of the inventive concepts disclosed herein.
Wolf, Jeremiah D., Livadaru, Matilda G., Dana, Roger A.
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Jul 21 2016 | WOLF, JEREMIAH D | Rockwell Collins, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 039601 | /0690 | |
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