A process for synthesizing a manganese doped phosphor of formula I: Ax [MFy]:Mn4+ is presented. The process includes contacting a first solution with a second solution and a third solution in the presence of a plurality of inert particles. The first solution and the second solution include a composition of formula ii: Ax[MnFy]. The third solution includes a source of m, where A is li, Na, k, Rb, Cs, or combinations thereof; m is Si, Ge, Sn, Ti, Zr, Al, Ga, In, Sc, Hf, Y, La, Nb, Ta, Bi, Gd, or combinations thereof; x is an absolute value of a charge of the [MFy] ion; and y is 5, 6 or 7.
|
15. A process for synthesizing a manganese doped phosphor of formula k2[SiF6]:Mn4+, the process comprising:
contacting a first solution with a second solution and a third solution in the presence of a plurality of inert particles, wherein the first solution comprises a first portion of a composition of formula k2[MnF6] and a source of k, the second solution comprises a second portion of the composition of formula k2[MnF6], and the third solution comprises hexafluorosilicic acid, and wherein at least one of the first solution, the second solution, and the third solution further comprises aqueous hydrofluoric acid.
1. A process for synthesizing a manganese doped phosphor of formula I,
Ax[MFy]:Mn+4 I the process comprising:
contacting a first solution with a second solution and a third solution in the presence of a plurality of inert particles, wherein the first solution and the second solution comprise a composition of formula ii: Ax[MnFy] and the third solution comprises a source of m,
wherein,
A is li, Na, k, Rb, Cs, or combinations thereof;
m is Si, Ge, Sn, Ti, Zr, Al, Ga, In, Sc, Hf, Y, La, Nb, Ta, Bi, Gd, or combinations thereof;
x is an absolute value of a charge of the [MFy] ion; and
y is 5, 6 or 7.
2. The process according to
3. The process according to
4. The process according to
5. The process according to
A is Na, k, Rb, Cs, or combinations thereof;
m is Si, Ge, Ti, or combinations thereof; and
Y is 6.
6. The process according to
9. The process according to
11. The process according to
12. The process according to
13. The process according to
14. The process according to
16. The process according to
17. The process according to
18. The process according to
|
The disclosure relates generally to red-emitting phosphors. More particularly, the disclosure relates to processes for synthesizing manganese doped red-emitting phosphors.
Red-emitting phosphors based on complex fluoride materials doped (or activated) with manganese (Mn4+), such as those described in U.S. Pat. Nos. 8,057,706, 7,497,973, and 7,648,649, can be utilized in combination with yellow/green emitting phosphors such as YAG:Ce or other garnet compositions to achieve warm white light (CCTs<5000 K on the blackbody locus, color rendering index (CRI)>80) from a blue light emitting diode (LED). These red-emitting phosphors absorb blue light, and efficiently emit between about 610-635 nanometers with little deep red emission. Therefore, luminous efficacy of these red-emitting phosphors is maximized compared to other red-emitting phosphors that have significant emission in a deeper red region where eye sensitivity is poor.
Various processes for synthesizing the manganese (Mn4+) doped complex fluoride phosphors are known, for example as described in US20120256125, WO2007/100824, US20100142189 and EP2508586. While the efficacy and CRI of lighting systems using manganese doped complex fluoride phosphors can be quite high, the potential limitations may be color instability and non-uniformity due to their susceptibility to degradation under high temperature and humidity (HTHH) conditions, and particle size distribution. It may be possible to reduce the color instability issue using post-synthesis processing steps, as described in U.S. Pat. No. 8,252,613. However, further improvements in color stability and uniformity of the lighting systems using these manganese doped complex fluoride phosphors may be needed.
Alternative processes for synthesizing manganese doped red-emitting phosphors, which can provide advantages over existing processes, such as improved color stability and uniformity, and lower cost for manufacturing, are desirable.
One aspect of the specification presents a process for synthesizing a manganese doped phosphor of formula I: Ax [MFy]:Mn4+, where A is Li, Na, K, Rb, Cs, or combinations thereof; M is Si, Ge, Sn, Ti, Zr, Al, Ga, In, Sc, Hf, Y, La, Nb, Ta, Bi, Gd, or combinations thereof; x is an absolute value of a charge of the [MFy] ion; and y is 5, 6 or 7. The process includes contacting a first solution with a second solution and a third solution in the presence of a plurality of inert particles. The first solution and the second solution include a composition of formula II: Ax[MnFy]. The third solution includes a source of M.
Another aspect of the specification relates to a manganese doped phosphor of formula I that is synthesized by the process. In some aspects, a lighting apparatus that includes the manganese doped phosphor of formula (I) is provided.
In one aspect of the specification, a process for synthesizing a manganese doped phosphor of formula K2[SiF6]:Mn4+ is provided. The process includes contacting a first solution with a second solution and a third solution in the presence of a plurality of inert particles. The first solution includes a first portion of a composition of formula K2[MnF6] and a source of K. The second solution includes a second portion of the composition of formula K2[MnF6]. The third solution includes hexafluorosilicic acid. At least one of the first solution, the second solution, and the third solution further includes aqueous hydrofluoric acid.
These and other features, aspects, and advantages of the present disclosure will become better understood when the following detailed description is read with reference to the accompanying drawings, wherein:
In the following specification and the claims, the singular forms “a”, “an” and “the” include plural referents unless the context clearly dictates otherwise. As used herein, the term “or” is not meant to be exclusive and refers to at least one of the referenced components being present and includes instances in which a combination of the referenced components may be present, unless the context clearly dictates otherwise.
Approximating language, as used herein throughout the specification and claims, may be applied to modify any quantitative representation that could permissibly vary without resulting in a change in the basic function to which it is related. Accordingly, a value modified by a term or terms, such as “about,” is not limited to the precise value specified. In some instances, the approximating language may correspond to the precision of an instrument for measuring the value.
Unless defined otherwise, technical and scientific terms used herein have the same meaning as is commonly understood by one of skill in the art to which this invention belongs. The terms “comprising,” “including,” and “having” are intended to be inclusive, and mean that there may be additional elements other than the listed elements. The terms “first”, “second”, and the like, as used herein do not denote any order, quantity, or importance, but rather are used to distinguish one element from another.
Any numerical values recited herein include all values from the lower value to the upper value in increments of one unit provided that there is a separation of at least 2 units between any lower value and any higher value. As an example, if it is stated that the amount of a component or a value of a process variable such as, for example, temperature, pressure, time and the like is, for example, from 1 to 90, or 20 to 80, it is intended that values such as 15 to 85, 22 to 68, 43 to 51, 30 to 32 etc. are expressly enumerated in this specification. For values which are less than one, one unit is considered to be 0.0001, 0.001, 0.01 or 0.1 as appropriate. These are only examples of what is specifically intended and all possible combinations of numerical values between the lowest value and the highest value enumerated are to be considered to be expressly stated in this application in a similar manner.
As used herein, the terms “phosphor”, “phosphor composition”, or “phosphor material” may be used to denote both a single phosphor composition as well as blends of two or more phosphors. As used herein, the terms “lamp”, “lighting apparatus”, or “lighting system” refer to any source of visible and ultraviolet light, which can be generated by at least one light emitting element producing a light emission when energized, for example, a phosphor material or a light emitting diode.
Some embodiments provide a process for synthesizing manganese doped phosphor of formula I: Ax[MFy]:Mn4+. The process includes contacting a first solution with a second solution and a third solution in the presence of a plurality of inert particles. The first solution and the second solution include a composition of formula II: Ax[MnFy]. The third solution includes a source of M.
The term “manganese doped phosphor of formula I” may also be referred to as “Mn4+ doped phosphor of formula I” or “phosphor of formula I”, and these terms may be used interchangeably.
Both, the manganese doped phosphor of formula I and the composition of formula II, are complex fluorides. More specifically, the manganese doped phosphor of formula I is a manganese (Mn4+) doped complex fluoride. In the context of the present disclosure, the terms “complex fluoride” and “complex fluoride phosphor” refer to a coordination compound, having a host lattice containing one coordination center (at least M or manganese), surrounded by fluoride ions acting as ligands, and charge-compensated by counter ions (A) as necessary. For example, in K2[SiF6], the coordination center is Si and the counter ion is K. Complex fluorides are occasionally written down as a combination of binary fluorides but such a representation does not indicate the coordination number for the ligands around the coordination center. The square brackets (occasionally omitted for simplicity) indicate that the complex ion they encompass is a new chemical species, different from the simple fluoride ion.
The counter ion A in formula I and formula II, is an alkali metal. In some embodiments, A includes Li, Na, K, Rb, Cs, or combinations thereof, and y is 6. In certain embodiments, A is Na, K, Rb, or combinations thereof. The coordination center M in formula I is an element selected from the group consisting of Si, Ge, Ti, Zr, Hf, Sn, Al, Ga, In, Sc, Y, Bi, La, Gd, Nb, Ta, and combinations thereof. In certain embodiments, M is a tetravalent element. In these embodiments, M is Si, Ge, Ti, or combinations thereof.
The composition of formula II may be a manganese compound that directly provides tetravalent manganese (Mn4+) when combined with aqueous hydrofluoric acid. Suitable examples of the compositions of formula II include K2MnF6 and Na2MnF6. In certain embodiments, the composition of formula II is K2MnF6.
Examples of manganese doped phosphors of formula I include K2[SiF6]:Mn4+, K2[TiF6]:Mn4+, K2[SnF6]:Mn4+, Cs2[TiF6]:Mn4+, Rb2[TiF6]:Mn4+, Cs2[SiF6]:Mn4+, Rb2[SiF6]:Mn4+, Na2[TiF6]:Mn4+, Na2[ZrF6]:Mn4+, K3[ZrF7]:Mn4+, K3[BiF7]:Mn4+, K3[YF7]:Mn4+, K3[LaF7]:Mn4+, K3[GdF7]:Mn4+, K3[NbF7]:Mn4+, K3[TaF7]:Mn4+. In certain embodiments, the manganese doped phosphor of formula I is K2SiF6:Mn4+.
In the manganese doped phosphor of formula I, for example Me doped complex fluoride phosphor such as K2SiF6:Mn4+, a doped element that is, manganese (Mn) acts as an additional coordination center, substituting a part of the coordination center, for example, Si. The doped element ‘Mn’ is referred to as a ‘dopant’ or an ‘activator.’ The terms “doped ion” or “activator ion”, as used herein, refers to an ion (for example Mn4+) doped in a complex fluoride that forms luminescent center and is responsible for the luminescence of the phosphor of formula I. The host lattice (including the counter ions) may further modify the excitation and emission properties of the activator ion.
In some embodiments, the amount of manganese in the manganese doped phosphor of formula I ranges from about 0.3 weight percent (wt %) to about 2.5 wt %, (from about 1.2 mole percent (mol %) to about 10 mol %), based on total weight of phosphor. In some embodiments, the amount of manganese ranges from about 0.50 wt % to about 0.85 wt % (from about 2 mol % to about 3.4 mol %), and in certain embodiments, from about 0.65 wt % to about 0.75 wt % (from about 2.6 mol % to about 3 mol %). In some other embodiments, the amount of manganese ranges from about 0.75 wt %-2.5 wt % (about 3 mol % to about 10 mol %). In some embodiments, the amount of manganese ranges from about 0.9 wt % to 1.5 wt % (from about 3.5 mol % to about 6 mol %), and in certain embodiments, from about 0.9 wt % to about 1.4 wt % (about 3.0 mol % to about 5.5 mol %).
As noted, the third solution includes a source of M. The source of M may be a compound that is soluble in hydrofluoric acid. As described previously, in some embodiments, the element M is Si, Ge, Ti or combinations thereof. In certain embodiments, M is Si. Suitable examples of the sources of M include hexafluorosilicic acid (H2SiF6), alkali metal hexafluorosilicate (A2SiF6), silicon oxide (SiO2), silicon chloride (SiCl4), tetra acetyle orthosilicate Si(OAc)4, tetraethyl orthosilicate (Si(OEt)4) or combinations thereof. In certain embodiments, the source of M is hexafluorosilicic acid (H2SiF6). Other suitable examples of the sources of M include TiO2, titanium hydrate, or combinations thereof.
In one embodiment, at least the first solution, the second solution or the third solution, includes aqueous hydrofluoric acid. In some embodiments, each of the first solution, the second solution and the third solution, includes aqueous hydrofluoric acid. That is, the first solution, the second solution and third solution may be prepared by mixing the corresponding constituents for example, the composition of formula II or the source of M in aqueous hydrofluoric acid. A concentration of aqueous hydrofluoric acid used in the first solution, the second solution and the third solution may range from about 20 weight percent (wt %) to about 70 wt %. In some embodiments, the first solution includes aqueous hydrofluoric acid having a concentration in a range from about 20 wt % to about 40 wt %. In some embodiments, the second solution includes aqueous hydrofluoric acid having a concentration in a range from about 40 wt % to about 70 wt %. In some embodiments, the third solution includes aqueous hydrofluoric acid having a concentration in a range from about 40 wt % to about 70 wt %. A small quantity of other acids may be included in at least the first solution, the second solution or the third solution if desired, such as hexafluorosilicic acid.
The amounts of the constituents in the corresponding first, second, and third solutions, may be suitable to carry out the desirable chemical reaction, and thereby form the manganese doped phosphor of formula I. In some embodiments, the first solution includes a first amount of the composition of formula II. In some embodiments, a ratio of amounts of the composition of formula II in the first solution and the second solution is in a range from about 40:60 to about 60:40.
In some embodiments, the first solution further includes a source of A. In certain embodiments, the source of A may provide A+ ions. The source of A may be a salt, wherein the corresponding anion for A+ ion is fluoride, chloride, acetate, chloride, oxalate, dihydrogen phosphate, or combinations thereof. In certain embodiments, the anion is fluoride. Suitable examples of the sources of A include KF, KHF2, LiF, LiHF2, NaF, NaHF2, RbF, RbHF2, CsF, CsHF2, or combinations thereof. In certain embodiments, the anion is fluoride, and A includes K.
As used herein, the term “inert particles” refers to a plurality of particles including a material that is chemically stable in hydrofluoric acid. In some embodiments, the inert particles are chemically stable in the first solution and the combined solution up to an elevated temperature (for example, 100 degrees Celsius). Moreover, the material may have physical properties, for example, hardness and density, such that the inert particles are compatible in the first solution and the combined solution during the synthesis process. In some embodiments, the inert particles are able to maintain their shape and retain their surfaces without any deformation and erosion during the synthesis process, particularly during an agitated motion (for example, stirring of the solution), and do not contaminate the solutions or a reaction product. Further, in some embodiments, the material has a density such that the inert particles are suspended or float in a solution (for example, the first solution or the combined solution) during the synthesis process.
Non limiting examples of suitable materials for inert particles include low-density polyethylene (LDPE), high-density polyethylene (HDPE), polypropylene (PP), polypropylene copolymer (PPCO), polymethylpentene (PMP), fluorinated polyethylene (FLPE), fluorinated ethylene propylene (FEP), tetrafluoroethylene (TFE), cross-linked high density polyethylene (XLPE), polyfluoroalkoxy (PFA), ethylene-chlorotrifluoroethylene copolymer (ECTFE), ethylene-tetrafluoroethylene (ETFE), polycarbonate, rigid polyvinyl chloride (PVC), flexible polyvinyl chloride (PVC), polyvinylidene fluoride (PVDF), polysulfone (PSF), polystyrene (PS), styrene acrylonitrile (SAN), polyetherimide (PEI), or combinations thereof. In certain embodiments, the inert particles include polytetrafluoroethylene (Teflon™).
The plurality of inert particles may be characterized in a variety of shapes, sizes and geometries. The plurality of inert particles may have any shape including spherical, cuboidal, lenticular, flaky and other shapes. In some embodiments, a cross sectional geometry of the particles may be one or more of circular, ellipsoidal, triangular, rectangular, or polygonal. In certain embodiments, the plurality of inert particles may be substantially spherical in shape. In some other embodiments, the plurality of inert particles may include particles having one or more of the aforementioned shapes and/or geometries. In yet some other embodiments, the particles may be irregular in shape. In certain embodiments, the plurality of inert particles includes polytetrafluoroethylene (Teflon™) beads.
As noted, the process includes contacting the first solution with the second solution and the third solution in the presence of the plurality of inert particles. In some embodiments, the process further includes forming the first solution, the second solution and the third solution before contacting them. The first solution, the second solution and the third solution may be separately prepared by dissolving the corresponding constituents in aqueous hydrofluoric acid. Various details of the constituents (with respect to the materials and their amounts) for preparing the first solution, the second solution and the third solution are discussed previously.
In some embodiments, the process includes first disposing the plurality of inert particles in the first solution, and then contacting the first solution to the second solution and the third solution in the presence of the plurality of inert particles, to form a combined solution. In some embodiments, the contacting step includes adding the second solution and the third solution to the first solution in the presence of the plurality of inert particles. In some embodiments, the contacting step includes simultaneously adding the second solution and the third solution to the first solution.
In some embodiments, the contacting step is carried out for a period of time to substantially complete a chemical reaction. The chemical reaction may be carried out for a long period of time or short period of time, which may depend on several processing parameters, such as a rate of addition of the second solution and the third solution to the first solution, the quantities of constituents, an amount and size of the inert particles, and a speed of an agitation motion. A period of time in which a chemical reaction completes, may also be referred to as a reaction time. As the second solution and the third solution reacts with the first solution, a precipitate may start forming in the combined solution. The precipitate may include particles of manganese doped phosphor of formula I. As the chemical reaction proceeds, the process may include forming and growing the particles of the precipitate. In some embodiments, the chemical reaction is carried out for a reaction time in a range from about 5 minutes to about 10 hours. In certain embodiments, the reaction time is in a range from about 8 minutes to about 30 minutes. Furthermore, in some embodiments, the chemical reaction may be carried out at an elevated temperature, for example up to about 100 degrees Celsius. In certain embodiments, the chemical reaction is carried out at room temperature.
In some embodiments, during the step of contacting the first solution to the second solution and the third solution, the first solution (along with the plurality of inert particles) is subjected to an agitated motion. In some instances, the agiated motion refers to stirring of the first solution. In some embodiments, the process includes continuously subjecting the combined solution to the agitated motion for the entire reaction time. The agitated motion may enable the plurality of inert particles and the formed particles of the precipitate to continuously move within the combined solution.
Without being bound by any theory, it is believed that the plurality of inert particles in the combined solution during the formation and growth of the particles of the precipitate, may collide and break the larger particles (for example, >30 microns) of the precipitate (including the phosphor of formula I). This may result in reducing the particle size of the precipitate particles. Further, during the process, the agitated motion of the combined solution, ensures the continuous movement of the plurality of inert particles and the formed precipitate particles so that these particles may collide with each other.
Thus, the process of the present disclosure allows for control of the particle size of the resulting particles of the phosphor of formula I, while synthesizing them. The presence of the plurality of inert particles during the synthesis process, helps in controlling particle growth of the phosphor of formula I in situ, and enables to provide the particles size distribution of the resulting particles of the phosphor of formula I in a desired range. Moreover, the process advantageously reduces a total amount of the hydrofluoric acid used in the chemical reaction as compared to the other processes.
In some embodiments, the process further includes an ageing step after completion of the contacting step. The ageing step may include continuing to subject the combined solution to the agitated motion for a duration of time after completing the contacting step. The aging step may further allow for controlling of the particle size of the remaining large particles of the precipitate. Depending on several processing parameters, the ageing step may be performed for a suitable duration of time. In some embodiments, the ageing step is performed for a duration from about 1 minute to about 1 hour. In certain embodiments, the ageing step is performed for about 1 minute to about 15 minutes. After the completion of the ageing step, the combined solution includes an amount of the precipitate. In some embodiments, the precipitate includes a plurality of particles of manganese doped phosphor of formula I.
The process may further include filtering the combined solution to obtain the precipitate. In some embodiments, the filtering step further includes removing the plurality of inert particles from the precipitate. The process may further include washing the resulting precipitate followed by drying to obtain a plurality of manganese doped phosphor particles of formula I. In some embodiments, the process thereby includes forming a plurality of manganese doped phosphor particles of formula I. In some embodiments, the plurality of manganese doped phosphor particles of formula I is obtained in a powder form. The terms, “plurality of manganese doped phosphor particles of formula I” and “phosphor particles of formula I” may be used interchangeably throughout the specification.
The particle sizes of the resulting phosphor particles of formula I may depend on various process parameters, for example, one or more of the amount and size of the plurality of inert particles; and the stirring speed of the combined solution during the occurrence of the chemical reaction, and may be controlled by tailoring these parameters.
In some embodiments, the plurality of inert particles has an average particle size in a range from about 1 millimeter to about 10 millimeters. In certain embodiments, the plurality of inert particles has an average particle size in a range from about 5 millimeters to about 10 millimeters. In some embodiments, the plurality of inert particles may include a combination of different sizes of particles. A volume percentage of the plurality of inert particles in the combined solution may be in a range from about 5 percent to about 50 percent, based on a total volume of the first solution. In certain embodiments, the plurality of inert particles are present in a range from about 10 percent to about 30 percent, based on the total volume of the first solution. In some embodiments, an additional amount of inert particles can be added to the combined solution during the occurance of the chemical reaction. Moreover, the speed of stirring the combined solution may be selected such that the inert particle are suspended or float in the combined solution, which may depend on several processing parameters, specifically for example the amount and size of the inert particles. In some embodiments, the speed of stirring the combined solution may be in a range from about 100 rpm to about 500 rpm. In some embodiments, the speed of stirring may be in a range from about 200 rpm to about 300 rpm.
Moreover, in some embodiments, by controlling one or more of the process details such as the amount of hydrofluoric acid in the solutions, the amounts of the constituents in the first, second and third solutions, the temperature of the chemical reaction and the reaction time, the particle sizes of the resulting phosphor particles of formula I can be further tuned.
In some embodiments, the resulting phosphor particles of formula I have a fine particle size distribution having a D50 particle size less than about 35 microns. In some embodiments, the phosphor particles of formula I have a D50 particle size in a range from about 10 microns to about 30 microns. In some embodiments, the phosphor particles of formula I have a D50 particle size in a range from about 15 microns to about 25 microns. In some embodiments, the phosphor particles of formula I have a D90 particle size in a range from about 30 microns to about 50 microns. In some embodiments, a D10 particle size is in a range from about 10 microns to about 20 microns. As used herein, D values such as D90, D50 and D10 are generally used to represent particle size distribution. D90, D50 or D10 is defined as a size value corresponding to cumulative size distribution, respectively, at 90%, 50%, or 10%, which indicates that 90%, 50%, or 10% of particles of a sample are below the D90, D50, or D10 value.
The fine particle size distribution of the manganese doped phosphor of formula I may be advantageous for achieving desired performance improvements in a lighting apparatus. For example, the sedimentation rate (or settling rate) of the phosphor particles of formula I (as described herein) in an encapsulant material (for example, silicone) may be slower because of the reduced particle size than that of the large particles (D50>50 microns). By controlling the particle size and particle size distribution of the phosphor particles of formula I, the sedimentation rate of the phosphor particles of formula I can be tuned to at least match, be slower or be faster than other phosphors in a blend, and thus enables control over the separation of the phosphor of formula I from other phosphors. The separation of the phosphor of formula I from other phosphors may be beneficial to control the amount and the location (proximate or farther from an LED chip) of the phosphor particles of formula I in order to achieve a desired color point, and protect the phosphors of formula I from a damage caused by the excitation flux. Moreover, the fine particle size (as discussed above) may allow the use of simple deposition techniques, for example spray coating techniques.
After completion of the described synthesis process steps, the resulting phosphor particles of formula I may undergo a treatment process. In some embodiments, the resulting phosphor particles of formula I may be post-treated for enhancing performance and color stability of the phosphor of formula I as described in U.S. Pat. No. 8,252,613.
Some embodiments provide a process for synthesizing a manganese doped phosphor of formula K2[SiF6]:Mn4+. The process includes contacting a first solution with a second solution and a third solution in the presence of a plurality of inert particles. The first solution includes a first portion of a composition of formula K2[MnF6] and a source of K. The second solution includes a second portion of the composition of formula K2[MnF6]. The third solution includes hexafluorosilicic acid. At least one of the first solution, the second solution, and the third solution further includes aqueous hydrofluoric acid. The other process details are described hereinabove.
Some embodiments thus provide a manganese doped phosphor of formula I synthesized according to the process as described in the above embodiments. The process includes contacting the first solution with the second solution and the third solution in the presence of the plurality of inert particles. Various process details are described hereinabove.
Some embodiments are directed to a lighting apparatus that includes a phosphor composition radiationally coupled to a light source. The phosphor composition includes the manganese doped phosphor of formula I as disclosed in the above embodiments. In one embodiment, the light source can be a semiconductor radiation source, for example a light emitting diode (LED) or an organic light emitting device (OLED). Radiationally coupled means that radiation from the light source is transmitted to the phosphor composition, and the phosphor composition emits radiation of a different wavelength. A combination of the light from the light source and the light emitted from the phosphor composition may be used to produce a desired color emission or white light. For example, a light emitting LED device may be based on a blue emitting InGaN LED chip. The blue emitting LED chip may be coated with a phosphor composition to convert some of the blue radiation to a complementary color, e.g. a red emission, a green emission or a white emission.
Non-limiting examples of lighting apparatus or devices include devices for excitation by light-emitting diodes (LEDs) such as fluorescent lamps, cathode ray tubes, plasma display devices, liquid crystal displays (LCD's), UV excitation devices, such as in chromatic lamps, lamps for backlighting, liquid crystal displays (LCD), plasma screens, xenon excitation lamps, and UV excitation marking systems. The list of these devices is meant to be merely exemplary and not exhaustive.
Although the general discussion of the exemplary structures of the lighting apparatus discussed herein are directed toward inorganic LED based light sources, it should be understood that the LED chip may be replaced by an organic light emissive structure or other radiation source, unless otherwise noted, and that any reference to an LED chip or semiconductor is merely representative of any appropriate radiation source.
With continued reference to
Various structures of the lamp 10 are known in the art. For example, in some embodiments, the phosphor composition may be interspersed within the encapsulant material, instead of being disposed directly on the LED chip 12. In some other embodiments, the phosphor composition may be coated onto a surface of the envelope 18, instead of being formed over the LED chip 12. Moreover, in some embodiments, the lamp 10 may include a plurality of LED chips. These various structures discussed with respect to
In any of the above structures, the LED based lighting apparatus 10 may also include a plurality of particles (not shown) to scatter or diffuse the emitted light. These scattering particles would generally be embedded in the encapsulant 20. The scattering particles may include, for example, particles made from Al2O3 (alumina) or TiO2 (titania). The scattering particles may effectively scatter the light emitted from the LED chip 12, preferably with a negligible amount of absorption.
In some embodiments, the lighting apparatus can be a fluorescent lamp or a compact fluorescent lamp (CFL), in combination with a LED. For instance, a combination of a LED-generated light and a phosphor-generated light may be used to produce visible light having enhanced color contrast. In this instance, a LED can be mounted in the base of the fluorescent lamp, for example a CFL lamp. The LED can add or supplement light in selected wavelength regions of the visible spectrum (such as, a portion of blue region) to the light being generated by the phosphor composition coated on a glass envelope of the fluorescent lamp.
By use of the embodiments described in the present disclosure, the phosphor compositions described herein, lamps can be provided producing red light or white light having high luminosity, and high CRI values for a low range of color temperatures of interest (2500 K to 4000 K) for general illumination.
Another structure (particularly for backlight applications) is a surface mounted device (“SMD”) type light emitting diode 550, e.g. as illustrated in
In addition to the manganese doped phosphor of formula I, the phosphor composition may include one or more additional phosphors. When the phosphor composition is used in a lighting apparatus in combination with a blue or near UV LED emitting radiation in the range of about 250 to 550 nm, the resultant light emitted by the lighting apparatus may be a white light. Additional phosphors such as green, blue, yellow, red, orange, or other color phosphors may be used in the phosphor composition (for example, a blend) to customize the white color of the resulting light and produce specific spectral power distributions.
Suitable additional phosphors for use in the phosphor composition include, but are not limited to:
((Sr1−z (Ca, Ba, Mg, Zn)z)1−(x+w)(Li, Na, K, Rb)wCex)3(Al1−ySiy)O4+y+3(x−w)F1−y−3(x−w), 0<x≤0.10, 0≤y≤0.5, 0≤z≤0.5, 0≤w≤x; (Ca, Ce)3Sc2Si3O12 (CaSiG); (Sr,Ca,Ba)3Al1−xSixO4+xF1−x:Ce3+ (SASOF)); (Ba,Sr,Ca)5(PO4)3(Cl,F,Br,OH):Eu2+,Mn2+; (Ba,Sr,Ca)BPO5:Eu2+,Mn2+; (Sr,Ca)10(PO4)6*νB2O3:Eu2+ (wherein 0<ν≤1); Sr2Si3O8*2SrCl2:Eu2+; (Ca,Sr,Ba)3MgSi2O8:Eu2+,Mn2+; BaAl8O13:Eu2+; 2SrO*0.84P2O5*0.16B2O3:Eu2+; (Ba,Sr,Ca)MgAl10O17:Eu2+,Mn2+; (Ba,Sr,Ca)Al2O4:Eu2+; (Y,Gd,Lu,Sc,La)BO3:Ce3+,Tb3+; ZnS:Cu+,Cl−; ZnS:Cu+,Al3+; ZnS:Ag+,Cl−; ZnS:Ag+,Al3+; (Ba,Sr,Ca)2Si1-ξO4−2ξ:Eu2+ (wherein −0.2≤ξ≤0.2); (Ba,Sr,Ca)2(Mg,Zn)Si2O7:Eu2+; (Sr,Ca,Ba)(Al,Ga,In)2S4:Eu2+; (Y,Gd,Tb,La,Sm,Pr,Lu)3(Al,Ga)5−αO12−3/2α:Ce3+ (wherein 0≤α≤0.5); (Ca,Sr)8(Mg,Zn)(SiO4)4Cl2:Eu2+,Mn2+; Na2Gd2B2O7:Ce3+,Tb3+; (Sr,Ca,Ba,Mg,Zn)2P2O7:Eu2+,Mn2+; (Gd,Y,Lu,La)2O3:Eu3+,Bi3+; (Gd,Y,Lu,La)2O2S:Eu3+,Bi3+; (Gd,Y,Lu,La)VO4:Eu3+,Bi3+; (Ca,Sr)S:Eu2+,Ce3+; SrY2S4:Eu2+; CaLa2S4:Ce3+; (Ba,Sr,Ca)MgP2O7:Eu2+,Mn2+; (Y,Lu)2WO6:Eu3+,Mo6+; (Ba,Sr,Ca)βSiγNμ:Eu2+ (wherein 2 β+4γ=3μ); (Ba,Sr,Ca)2Si5−xAlxN8−xOx:Eu2+ (wherein 0≤x≤2); Ca3(SiO4)Cl2:Eu2+; (Lu,Sc,Y,Tb)2−u−vCevCa1+uLiwMg2−wPw(Si,Ge)3−wO12−u/2 (where 0.5≤u≤1, 0<v≤0.1, and 0≤w≤0.2); (Y,Lu,Gd)2−φCaφSi4N6+φC1−φ:Ce3+, (wherein 0≤φ≤0.5); (Lu,Ca,Li,Mg,Y), α-SiAlON doped with Eu2+ and/or Ce3+; (Ca,Sr,Ba)SiO2N2:Eu2+,Ce3+; β-SiAlON:Eu2+, 3.5MgO*0.5MgF2*GeO2:Mn4+; (Sr,Ca,Ba)AlSiN3:Eu2+; (Sr,Ca,Ba)3SiO5:Eu2+; Ca1−c−fCecEufAl1+cSi1−cN3, (where 0≤c≤0.2, 0≤f≤0.2); Ca1−h−rCehEurAl1−h(Mg,Zn)hSiN3, (where 0≤h≤0.2, 0≤r≤0.2); Ca1−2s−tCes(Li,Na)sEutAlSiN3, (where 0≤s≤0.2, 0≤f≤0.2, s+t>0); and Ca1−σ−χ−ϕ)Ceσ(Li,Na)χEuϕAl1+σ−χSi1−σ+χN3, (where 0≤σ≤0.2, 0≤χ≤0.4, 0≤ϕ≤0.2).
Other additional materials suitable for use in phosphor composition include electroluminescent polymers such as polyfluorenes, preferably poly(9,9-dioctyl fluorene) and copolymers thereof, such as poly(9,9′-dioctylfluorene-co-bis-N,N′-(4-butylphenyl)diphenylamine) (F8-TFB); poly(vinylcarbazole) and polyphenylenevinylene and their derivatives. In addition, the phosphor composition may include a blue, yellow, orange, green or red phosphorescent dye or metal complex, or combinations thereof. Materials suitable for use as the phosphorescent dye include, but are not limited to, tris(1-phenylisoquinoline) iridium (III) (red dye), tris(2-phenylpyridine) iridium (green dye) and Iridium (III) bis(2-(4,6-difluorephenyl)pyridinato-N,C2) (blue dye). Commercially available fluorescent and phosphorescent metal complexes from ADS (American Dyes Source, Inc.) may also be used. ADS green dyes include ADS060GE, ADS061GE, ADS063GE, and ADS066GE, ADS078GE, and ADS090GE. ADS blue dyes include ADS064BE, ADS065BE, and ADS070BE. ADS red dyes include ADS067RE, ADS068RE, ADS069RE, ADS075RE, ADS076RE, ADS067RE, and ADS077RE.
The ratio of each of the individual phosphors in the blend may vary depending on the characteristics of the desired light output. The relative proportions of individual phosphors in various phosphor blends may be adjusted such that when their emissions are blended and employed in an LED lighting apparatus, there is produced visible light of predetermined x and y values on the CIE chromaticity diagram. As stated, a white light is preferably produced. This white light, for instance, may possess an x value in the range of about 0.20 to about 0.55, and a y value in the range of about 0.20 to about 0.55. As stated, however, the exact identity and amount of each phosphor in the phosphor composition can be varied according to the needs of the end user. For example, the composition can be used for LEDs intended for liquid crystal display (LCD) backlighting. In this application, the LED color point would be appropriately tuned based upon the desired white, red, green, and blue colors after passing through an LCD/color filter combination. The list of potential phosphors for blending given here is not meant to be exhaustive and the manganese doped phosphor of formula I can be blended with various phosphors with different emission to achieve desired spectral power distributions.
The example that follows is merely illustrative, and should not be construed to be any sort of limitation on the scope of the claimed invention.
A phosphor of formula I was prepared by carrying out a synthesis process without using Teflon™ beads. A first solution was prepared by dissolving 16.2 grams KHF2 and 0.268 gram K2MnF6 in 130 milliliters (ml) HF (48%) (Semiconductor grade-LOBA Chemie) in a beaker. A second solution was prepared by dissolving 0.608 gram K2MnF6 in 42 ml HF (48%). A third solution was prepared by dissolving 30 ml H2SiF6 in 120 ml HF (40%) (Aldrich). While stirring the first solution in a beaker at a speed of 200 rpm, the second solution and the third solution were slowly added to the first solution for about 8 minutes until a precipitate was obtained. The stirring was continued for about 1-2 minutes. The precipitate was filtered followed by washing 3 times with acetone and acetic acid. This was followed by washing with water. The resulting product was finally dried in vacuum at about 100 degrees Celsius to obtain a powder of the phosphor.
Examples 1-7 were prepared by carrying out a synthesis process using Teflon™ beads. A first solution, a second solution and a third solution were prepared in the similar manner as described in comparative example 1. Examples 1-7 were synthesized by the process as described in comparative example 1 except that Teflon™ beads of predetermined sizes and in predetermined amounts were disposed in the beaker with the first solution before adding the second and third solutions to the first solution. The sizes and amounts of Teflon™ beads used in examples 1-7 are given in Table 1.
The resulting phosphor powders formed in examples 1-7 were analyzed for their crystal structures using powder x-ray diffraction. The powders were identified to have a crystalline structure similar to K2SiF6, confirming the formation of a complex fluoride. Further, the emission spectra of the powders were measured using a spectrophotometer. The powders displayed red fluorescence when excited with UV or blue light, demonstrating the formation of manganese doped complex fluorides i.e., a phosphor of formula K2SiF6:Mn4+. The phosphors of examples 1-7 were measured for quantum efficiency at excitation wavelength 450 nm by using a quantum efficiency measuring system. The quantum efficiency of the phosphors of examples 1-7 were measured in a range from about 80-90. Also, the yields of examples 1-7 were comparable to that of the comparative example 1.
The phosphors of examples 1-7 were then analyzed using particle size analyzer (Malvern). Table 1 further shows D10/D50/D90 particle sizes of the phosphors of comparative example 1 and examples 1-7. It can be easily observed that the phosphors of examples 1-7 include particles having D10/D50/D90 particle sizes much lower than that of comparative example 1.
TABLE 1
Teflon ™ beads
Particle Size Distribution
Size
Amount (No.
D10
D50
D90
Samples
(mm)
of beads)
(microns)
(microns)
(microns)
Comparative
—
—
35.6
62.0
102.0
example 1
Example 1
5
30
19.8
32.2
49.7
Example 2
10
30
15.2
25.3
40.4
Example 3
5
50
20.8
34.7
54.7
Example 4
10
50
14.4
24.3
39.5
Example 5
5 and
25 of each
17.4
26.9
40.7
10
size
While only certain features of the invention have been illustrated and described herein, many modifications and changes will occur to those skilled in the art. It is, therefore, to be understood that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the invention.
Porob, Digamber Gurudas, Nammalwar, Prasanth Kumar, Hanumantha, Ravikumar
Patent | Priority | Assignee | Title |
11060023, | Aug 10 2017 | ALLY BANK, AS COLLATERAL AGENT; ATLANTIC PARK STRATEGIC CAPITAL FUND, L P , AS COLLATERAL AGENT | Coated manganese doped phosphors |
Patent | Priority | Assignee | Title |
10294418, | Jan 30 2014 | SHIN-ETSU CHEMICAL CO , LTD | Complex fluoride phosphor and method for producing same |
4263011, | Dec 09 1976 | Eastman Kodak Company | Crystallization process |
7497973, | Feb 02 2005 | General Electric Company | Red line emitting phosphor materials for use in LED applications |
7648649, | Feb 02 2005 | General Electric Company | Red line emitting phosphors for use in led applications |
8057706, | Jul 27 2010 | ALLY BANK, AS COLLATERAL AGENT; ATLANTIC PARK STRATEGIC CAPITAL FUND, L P , AS COLLATERAL AGENT | Moisture-resistant phosphor and associated method |
8252613, | Mar 23 2011 | ALLY BANK, AS COLLATERAL AGENT; ATLANTIC PARK STRATEGIC CAPITAL FUND, L P , AS COLLATERAL AGENT | Color stable manganese-doped phosphors |
8491816, | Feb 07 2008 | CITIZEN ELECTRONICS CO , LTD ; Nichia Corporation | Semiconductor light emitting device, backlight, color image display device and phosphor to be used for them |
9657221, | Dec 28 2012 | SHIN-ETSU CHEMICAL CO , LTD | Wavelength conversion member and light-emitting device |
9982189, | Dec 28 2012 | SHIN-ETSU CHEMICAL CO , LTD | Wavelength conversion member and light-emitting device |
20030005552, | |||
20100142189, | |||
20120256125, | |||
20150184067, | |||
20150291878, | |||
20150322338, | |||
CN103400926, | |||
CN105038774, | |||
CN105038776, | |||
EP2508586, | |||
JP2002274844, | |||
JP2010209311, | |||
JP2015143318, | |||
JP5388664, | |||
WO2007100824, | |||
WO2014152787, | |||
WO2015089345, | |||
WO2015115195, | |||
WO2015129116, | |||
WO2015191943, | |||
WO2014104147, | |||
WO2014104155, | |||
WO2015115195, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Nov 23 2015 | HANUMANTHA, RAVIKUMAR | General Electric Company | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 045545 | /0051 | |
Nov 25 2015 | POROB, DIGAMBER GURUDAS | General Electric Company | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 045545 | /0051 | |
Nov 25 2015 | NAMMALWAR, PRASANTH KUMAR | General Electric Company | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 045545 | /0051 | |
Oct 18 2016 | CURRENT LIGHTING SOLUTIONS, LLC | (assignment on the face of the patent) | / | |||
Apr 01 2019 | CURRENT LIGHTING SOLUTIONS, LLC | ALLY BANK, AS COLLATERAL AGENT | SECURITY AGREEMENT | 049672 | /0294 | |
Apr 01 2019 | General Electric Company | CURRENT LIGHTING SOLUTIONS, LLC F K A GE LIGHTING SOLUTIONS, LLC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 048791 | /0001 | |
Feb 01 2022 | Litecontrol Corporation | ALLY BANK, AS COLLATERAL AGENT | CORRECTIVE ASSIGNMENT TO CORRECT THE PATENT NUMBER 10841994 TO PATENT NUMBER 11570872 PREVIOUSLY RECORDED ON REEL 058982 FRAME 0844 ASSIGNOR S HEREBY CONFIRMS THE SECURITY AGREEMENT | 066355 | /0455 | |
Feb 01 2022 | HUBBELL LIGHTING, INC | ALLY BANK, AS COLLATERAL AGENT | CORRECTIVE ASSIGNMENT TO CORRECT THE PATENT NUMBER 10841994 TO PATENT NUMBER 11570872 PREVIOUSLY RECORDED ON REEL 058982 FRAME 0844 ASSIGNOR S HEREBY CONFIRMS THE SECURITY AGREEMENT | 066355 | /0455 | |
Feb 01 2022 | CURRENT LIGHTING SOLUTIONS, LLC | ALLY BANK, AS COLLATERAL AGENT | CORRECTIVE ASSIGNMENT TO CORRECT THE PATENT NUMBER 10841994 TO PATENT NUMBER 11570872 PREVIOUSLY RECORDED ON REEL 058982 FRAME 0844 ASSIGNOR S HEREBY CONFIRMS THE SECURITY AGREEMENT | 066355 | /0455 | |
Feb 01 2022 | DAINTREE NETWORKS INC | ALLY BANK, AS COLLATERAL AGENT | CORRECTIVE ASSIGNMENT TO CORRECT THE PATENT NUMBER 10841994 TO PATENT NUMBER 11570872 PREVIOUSLY RECORDED ON REEL 058982 FRAME 0844 ASSIGNOR S HEREBY CONFIRMS THE SECURITY AGREEMENT | 066355 | /0455 | |
Feb 01 2022 | FORUM, INC | ALLY BANK, AS COLLATERAL AGENT | CORRECTIVE ASSIGNMENT TO CORRECT THE PATENT NUMBER 10841994 TO PATENT NUMBER 11570872 PREVIOUSLY RECORDED ON REEL 058982 FRAME 0844 ASSIGNOR S HEREBY CONFIRMS THE SECURITY AGREEMENT | 066355 | /0455 | |
Feb 01 2022 | HUBBELL LIGHTING, INC | ATLANTIC PARK STRATEGIC CAPITAL FUND, L P , AS COLLATERAL AGENT | CORRECTIVE ASSIGNMENT TO CORRECT THE PATENT NUMBER PREVIOUSLY RECORDED AT REEL: 059034 FRAME: 0469 ASSIGNOR S HEREBY CONFIRMS THE SECURITY INTEREST | 066372 | /0590 | |
Feb 01 2022 | Litecontrol Corporation | ATLANTIC PARK STRATEGIC CAPITAL FUND, L P , AS COLLATERAL AGENT | CORRECTIVE ASSIGNMENT TO CORRECT THE PATENT NUMBER PREVIOUSLY RECORDED AT REEL: 059034 FRAME: 0469 ASSIGNOR S HEREBY CONFIRMS THE SECURITY INTEREST | 066372 | /0590 | |
Feb 01 2022 | CURRENT LIGHTING SOLUTIONS, LLC | ATLANTIC PARK STRATEGIC CAPITAL FUND, L P , AS COLLATERAL AGENT | CORRECTIVE ASSIGNMENT TO CORRECT THE PATENT NUMBER PREVIOUSLY RECORDED AT REEL: 059034 FRAME: 0469 ASSIGNOR S HEREBY CONFIRMS THE SECURITY INTEREST | 066372 | /0590 | |
Feb 01 2022 | DAINTREE NETWORKS INC | ATLANTIC PARK STRATEGIC CAPITAL FUND, L P , AS COLLATERAL AGENT | CORRECTIVE ASSIGNMENT TO CORRECT THE PATENT NUMBER PREVIOUSLY RECORDED AT REEL: 059034 FRAME: 0469 ASSIGNOR S HEREBY CONFIRMS THE SECURITY INTEREST | 066372 | /0590 | |
Feb 01 2022 | FORUM, INC | ALLY BANK, AS COLLATERAL AGENT | SECURITY AGREEMENT | 058982 | /0844 | |
Feb 01 2022 | DAINTREE NEETWORKS INC | ALLY BANK, AS COLLATERAL AGENT | SECURITY AGREEMENT | 058982 | /0844 | |
Feb 01 2022 | CURRENT LIGHTING SOLUTIONS, LLC | ALLY BANK, AS COLLATERAL AGENT | SECURITY AGREEMENT | 058982 | /0844 | |
Feb 01 2022 | ALLY BANK | CURRENT LIGHTING SOLUTIONS, LLC | RELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS | 059392 | /0079 | |
Feb 01 2022 | ALLY BANK | FORUM, INC | RELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS | 059392 | /0079 | |
Feb 01 2022 | HUBBELL LIGHTING, INC | ATLANTIC PARK STRATEGIC CAPITAL FUND, L P , AS COLLATERAL AGENT | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 059034 | /0469 | |
Feb 01 2022 | Litecontrol Corporation | ATLANTIC PARK STRATEGIC CAPITAL FUND, L P , AS COLLATERAL AGENT | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 059034 | /0469 | |
Feb 01 2022 | CURRENT LIGHTING SOLUTIONS, LLC | ATLANTIC PARK STRATEGIC CAPITAL FUND, L P , AS COLLATERAL AGENT | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 059034 | /0469 | |
Feb 01 2022 | DAINTREE NETWORKS INC | ATLANTIC PARK STRATEGIC CAPITAL FUND, L P , AS COLLATERAL AGENT | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 059034 | /0469 | |
Feb 01 2022 | FORUM, INC | ATLANTIC PARK STRATEGIC CAPITAL FUND, L P , AS COLLATERAL AGENT | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 059034 | /0469 | |
Feb 01 2022 | HUBBELL LIGHTING, INC | ALLY BANK, AS COLLATERAL AGENT | SECURITY AGREEMENT | 058982 | /0844 | |
Feb 01 2022 | Litecontrol Corporation | ALLY BANK, AS COLLATERAL AGENT | SECURITY AGREEMENT | 058982 | /0844 | |
Feb 01 2022 | FORUM, INC | ATLANTIC PARK STRATEGIC CAPITAL FUND, L P , AS COLLATERAL AGENT | CORRECTIVE ASSIGNMENT TO CORRECT THE PATENT NUMBER PREVIOUSLY RECORDED AT REEL: 059034 FRAME: 0469 ASSIGNOR S HEREBY CONFIRMS THE SECURITY INTEREST | 066372 | /0590 |
Date | Maintenance Fee Events |
Apr 16 2018 | BIG: Entity status set to Undiscounted (note the period is included in the code). |
Jul 24 2024 | M1551: Payment of Maintenance Fee, 4th Year, Large Entity. |
Date | Maintenance Schedule |
Feb 16 2024 | 4 years fee payment window open |
Aug 16 2024 | 6 months grace period start (w surcharge) |
Feb 16 2025 | patent expiry (for year 4) |
Feb 16 2027 | 2 years to revive unintentionally abandoned end. (for year 4) |
Feb 16 2028 | 8 years fee payment window open |
Aug 16 2028 | 6 months grace period start (w surcharge) |
Feb 16 2029 | patent expiry (for year 8) |
Feb 16 2031 | 2 years to revive unintentionally abandoned end. (for year 8) |
Feb 16 2032 | 12 years fee payment window open |
Aug 16 2032 | 6 months grace period start (w surcharge) |
Feb 16 2033 | patent expiry (for year 12) |
Feb 16 2035 | 2 years to revive unintentionally abandoned end. (for year 12) |