An land grid array (lga) or hybrid land grid array (HLGA) includes a socket housing and a plurality of electrical contacts. The socket housing is made of a first material that defines a first dielectric constant. The plurality of electrical contacts extends through the socket housing to electrically couple a printed circuit board on a first side of the socket housing to a processor on a second side of the socket housing. A coating of a second material that defines a second dielectric constant that is higher than the first dielectric constant covers surfaces of a subset of the plurality of electrical contacts.
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11. A land grid array (lga) comprising:
a socket housing made of a first material that defines a first dielectric constant;
a plurality of electrical contacts that extend through the socket housing; and
a coating of a second material that defines a second dielectric constant higher than the first dielectric constant that covers a subset of the plurality of electrical contacts such that a localized capacitance of the lga is increased in order to supplement power supply decoupling at a load to provide additional parallel capacitance.
1. A chip component comprising:
a socket housing made of a first material that defines a first dielectric constant;
a plurality of electrical contacts that extend through the socket housing to electrically couple a printed circuit board on a first side of the socket housing to a processor on a second side of the socket housing; and
a coating of a second material that defines a second dielectric constant higher than the first dielectric constant that covers respective surfaces of a subset of the plurality of electrical contacts that are configured to supplement power supply decoupling at a load to provide additional parallel capacitance.
18. A method comprising:
applying a coating that defines a first dielectric constant to some portion of a sheet of a conductive material that defines a second dielectric constant that is lower than the first dielectric constant;
cutting a plurality of shapes from the sheet of conductive material such that the coating is on some surfaces of the shapes;
folding the plurality of shapes into a plurality of electrical contacts; and
assembling the plurality of electrical contacts into a socket housing of a land grid array (lga) such that each of the plurality of electrical contacts extend through the socket housing and a localized capacitance of the chip component is increased as a result of the coating on some surfaces of the plurality of electrical contacts.
4. The chip component of
5. The chip component of
6. The chip component of
7. The chip component of
a first type of electrical contact of the subset of electrical contacts that includes the coating on an outside surface; and
a second type of electrical contact of the subset of electrical contacts that includes the coating on an inside surface, wherein the first type of electrical contact is alternated with the second type of electrical contact.
8. The chip component of
9. The chip component of
10. The chip component of
12. The lga of
13. The lga of
14. The lga of
a first type of electrical contact of the subset of electrical contacts that includes the coating on an outside surface; and
a second type of electrical contact of the subset of electrical contacts that includes the coating on an inside surface, wherein the first type of electrical contact is alternated with the second type of electrical contact.
15. The lga of
16. The lga of
17. The lga of
a second type of electrical contact of the subset of electrical contacts that includes the coating on an inside surface, wherein the first type of electrical contact is alternated with the second type of electrical contact.
19. The method of
the coating is applied and the plurality of electrical contacts are cut such that external surfaces of a subset of the plurality of the electrical contacts are substantially entirely coated in the coating; and
the assembling the plurality of electrical contacts into the socket housing includes arranging the subset of electrical contacts among the plurality of electrical contacts to define a pattern to supplement a property of the lga.
20. The method of
the coating is applied and the plurality of electrical contacts are cut such that select predetermined surfaces of a subset of the plurality of the electrical contacts are coated in the coating; and
the assembling the plurality of electrical contacts into the socket housing includes arranging the subset of electrical contacts among the plurality of electrical contacts to define a pattern to supplement a property of the lga.
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Within modern computer design, components are increasingly modular, such that most and/or each of the individual components within computers may be individually replaced and/or upgraded over time. Part of this modularity is provided by various sockets that define a manner in which components are electrically and/or physically coupled together. For example, central processing unit (CPU) sockets come in a variety of formats. Some primary conventions of CPU sockets are pin grid array (PGA), ball grid array (BGA), and land grid array (LGA) (as well as the subtype of hybrid land grid array (HLGA)).
BGA permanently couples a processor to a motherboard (such that BGA is arguably not a socket, though it is frequently categorized as one for purposes of identification), therein reducing cost but functionally eliminating the chance of upgrading the processor over time. Assemblies that utilize PGA sockets have pins on the processor itself which are inserted into respective holes of the PGA socket. LGA sockets may be thought of as an inverse of PGA sockets, where the pins are internal to the LGA socket rather than external when in a disassembled state. Specifically, LGA sockets have pins within a socket housing, where the pins have springs on both ends, one of which is coupled to the processor and the other of which is coupled to the motherboard. HLGA sockets are substantially similar to LGA sockets (such as by having pins within the socket housing) but have a spring on one end and a solder ball on the other end of respective pin. By virtue of having pins contained within the socket housing rather than exposed as required by PGA sockets, LGA and HLGA sockets may be more durable (e.g., as PGA sockets may be damaged by bending or deforming one or more pins during storage or assembly), and further the pins may be fit into a smaller space (such that LGA and HLGA sockets may be easier to make more space efficient than respective PGA sockets).
Aspects of the present disclosure relate to systems and methods for creating localized capacitance within a land grid array (LGA) and/or hybrid LGA (HLGA). For example, a chip component (e.g., an LGA or HLGA) includes a socket housing. The chip component also includes a plurality of electrical contacts that extend through the socket housing to electrically couple a printed circuit board (PCB) on a first side of the socket housing to a processor on a second side of the socket housing. The chip component also includes a coating of a second material on some surfaces of a subset of the plurality of electrical contacts. This coating may render a dielectric within the socket housing that is adjacent a conductor.
Other aspects of the disclosure relate to a land grid array (LGA) that includes a socket housing made of a first material that defines a first dielectric constant. The LGA also includes a plurality of electrical contacts that extend through the socket housing. The LGA also includes a coating of a second material that defines a second dielectric constant higher than the first dielectric constant that covers a subset of the plurality of electrical contacts such that a localized capacitance of the LGA is increased.
Other aspects of the disclosure relate to a method of creating localized capacitance within a LGA. The method includes extruding a sheet of a conductive material that defines a first dielectric constant. The method also includes applying a coating that defines a second dielectric constant higher than the first constant to some portion of the sheet. The method also includes cutting a plurality of shapes from the sheet such that the coating is on some surfaces of the shapes. The method also includes folding the shapes into the plurality of electrical contacts. The method also includes assembling the plurality of electrical contacts into a socket housing of a land grid array (LGA) such that each of the plurality of electrical contacts extend through the socket housing and a localized capacitance of the chip component is increased due to the coating on some surfaces of the plurality of electrical contacts.
The above summary is not intended to describe each illustrated embodiment or every implementation of the present disclosure.
The drawings included in the present application are incorporated into, and form part of, the specification. They illustrate embodiments of the present disclosure and, along with the description, serve to explain the principles of the disclosure. The drawings are only illustrative of certain embodiments and do not limit the disclosure.
While the invention is amenable to various modifications and alternative forms, specifics thereof have been shown by way of example in the drawings and will be described in detail. It should be understood, however, that the intention is not to limit the invention to the particular embodiments described. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.
Aspects of the present disclosure relate to coating select surfaces of at least some electrical contacts of a land grid array (LGA) or hybrid LGA (HLGA) with a coating that defines a higher dielectric constant than a socket housing of the LGA/HLGA, while more particular aspects of the present disclosure relate to generating patterns of coated and uncoated surfaces of respective electrical contacts to create a localized capacitance and therein supplement a property of the LGA/HLGA. While the present disclosure is not necessarily limited to such applications, various aspects of the disclosure may be appreciated through a discussion of various examples using this context.
As modern computers become more robust, processing units of these computers are experiencing increased demands for power, input/out capacity, and the like. To satisfy these demands, processing units may be designed with additional capacitor components to provide decoupling capacitance. At the same time, there is an increasing demand for modern computers to be smaller, and to do more within smaller packages. As such, it is become increasingly difficult to fit a desired number of capacitors on a processing unit such that the processing unit can operate as desired.
This may be further complicated for processing units that utilize printed circuit boards (PCBs), as it may be a requirement that capacitors be placed on a “back” side of the main PCB. Due to capacitators being placed on a back side of the main PCB, the capacitors may be functionally underneath the body of the module. Such configurations may necessitate that the capacitance is located far away from the load of the processing unit, thus requiring more capacitance to compensate, compounding the issue.
Aspects of this disclosure may solve or otherwise address some or all of these problems. For example, aspects of the disclosure may relate to coating some surfaces of some electrical contacts of an LGA or HLGA with a coating that has a higher dielectric constant than a socket housing of the LGA or HLGA. Due to only some surfaces of some electrical contacts of the LGA or HLGA being coated, a localized capacitance is created. Further, aspects of the disclosure relate to coating predetermined surfaces of predetermined electrical contacts to supplement a property of the LGA or HLGA, such as a property to provide parallel capacitance, a property to compensate for inductance, or the like.
Put differently, by adding dielectric material to portions of electrical contacts contained within a socket of an LGA/HLGA, a parallel capacitor array for power pins may be created. Such an array may provide improved performance, and may be configured to provide sufficient parallel capacitance for power decoupling at the load to reduce the total number of capacitor components required. Additionally, or alternatively, this array may provide additional parallel capacitance without adding additional components. Further, by applying dielectric to select contact surfaces, the contact construction may be used to provide additional capacitance between differential signal pairs to improve signal integrity.
For example,
Though HLGAs and electrical contact 100 for an HLGA are depicted and discussed predominantly throughout this disclosure for purposes of clarity, one of ordinary skill in the art would understand substantially all of this disclosure to relate equally to an LGA version of electrical contact 100, such that throughout this disclosure LGA and HLGA (and electrical contacts thereof) can be interpreted as interchange throughout this disclosure (with the understanding that an LGA electrical contact would replace solder ball 106 with a second spring 104)
As discussed herein, surfaces of electrical contact 100 that are coated may be surfaces of shaft 102. Shaft 102 in
Electrical contact 100 may be configured to electrically couple one component contacting spring 104 to another component contacting solder ball 106. For example,
Electrical contacts 100 may be substantially contained within socket housing 134, such that only a terminal end of each electrical contact 100 extends out of socket housing 134 to contact (and therein electrically couple to) first and second components 130, 132. For example, substantially all of shaft 102 of electrical contact 100 may be contained within socket housing 134, such that only some of spring 104 and solder ball 106 extend outside of socket housing 134. Electrical contacts 100 may be nearly fully physically constrained within socket housing 134, such that it is difficult or impossible for any shaft 102 of a respective electrical contact 100 to move within socket housing 134 relative to socket housing 134 (though spring 104 and/or solder ball 106 of a respective electrical contact 100 may be deformed as the respective electrical contact 100 couples together a respective first and second component 130, 132). Further, electrical contacts 100 may each be electrically insulated from each other within socket housing 134, such that, e.g., an electrical impulse between first component 130A and second component 132A does not interfere with an electrical impulse between first component 130B and second component 132B.
A plurality of electrical contacts 100 may be arranged across a full HLGA socket to couple a package to a PCB or the like. For example,
As discussed herein, different surfaces of electrical contacts 100 may be coated with a coating that defines a higher dielectric constant than a material of socket housing 134. For example,
To continue this example, all external surfaces 170 of electrical contact 100B are coated, all internal surfaces 172 of electrical contact 100C are coated, all external and internal surfaces 170, 172 of electrical contact 100D are coated, and a select external surface 170A of electrical contact 100E are coated (though in other examples a select internal surface 172 of electrical contact 100E is coated as described herein). As would be understood in the art (and as discussed below), arranging a plurality of electrical contacts 100 with different surfaces coated in predetermined patterns relative to each other may create localized capacitance and improve one or more properties of HLGA 150.
As described herein, socket housing 134 may be made of any material that is consistent with this disclosure. For example, socket housing 134 may be made of FR-4, liquid crystal polymer (LCP), or the like. In some examples, socket housing 134 may be made of LCP with glass fiber to improve structural properties of socket housing 134. Similarly, the coating on one or more external surface 170 and/or internal surface 172 may be any material that defines a dielectric constant greater than the housing material. For example, the coating may be Barium Titanate (BaTiO3) Titanium Dioxide, Conjugated polymers, Barium Strontium Titanate, or the like.
It should be noted that different coating materials have different values of relative permittivity. Additionally, the relative permittivity of a given material may vary based on various factors, such as temperature and pressure. For example, BaTiO3 can have a relative permittivity in the range of 1000-7000 farads per meter (F/m). Thus, by modulating the relative permittivity and/or the number of coated electrical contacts 100 along with selectively placing the coated electrical contacts 100 as described herein, a wide range of capacitance can be achieved through embodiments of the present disclosure.
This coating may be applied in any way, such as via plasma spray, metal spray, epoxy powder coating, or the like.
A subset of electrical contacts 100 that are coated in different ways as described above may define a pattern within socket housing 134 of HLGA 150 to supplement a property of HLGA 150. For example, electrical contacts 100 may be coated and then arranged in such a way to increase overall capacitance of different pairs of electrical contacts 100. This may improve an ability of HLGA 150 to compensate for inductance overall within HLGA 150.
For example,
In other examples, electrical contacts 100 may be coated and then arranged in such a way as to provide additional parallel capacitance within electrical contacts 100. For example,
Alternatively,
In certain examples, electrical contacts 100 may be coated and then arranged in such a way to supplement multiple properties of HLGA 150. For example,
Specifically, as depicted in
Further, pattern 230 of
Electrical contacts 100 may be created and coated in any way that is consistent with this disclosure. Some methods of manufacturing electrical contacts 100 may result in a more predictable uniform coat of the dielectric material across the intended surface as described herein. For example, if a coating is not applied until after electrical contacts 100 are in a final shape (e.g., a shape similar to what is depicted in
For example,
In some examples, shapes 304 may substantially correspond to shaft 102 of electrical contacts 100. In such examples, once shaft 102 is formed from sheet 300, both spring 104 and solder ball 106 may be securely fastened (e.g., fastened in a pseudo-permanent fashion, such as via soldering) to respective shafts 102. In other examples (not depicted), spring 104 (and/or two springs 104, for HLGAs) may also be part of each respective shape 304, such that once shapes 304 are cut from sheet 300 that there is no need to secure springs 104 to respective shafts 102.
Shapes 304 may not be viewable when coating 302 is applied to sheet 300, but rather shapes 304 may be cut (or otherwise removed) from sheet 300 after coating 302 is applied to sheet 300. Though coating 302 is depicted as being applied to only one side of sheet 300, it is to be understood that coating 302 can be applied to either and/or both sides of sheet 300 through any means consistent with this disclosure (such as the means described herein).
Coating 302 may be applied to sheet 300 such that, once shapes 304 are cut from sheet 300, shapes may be folded along seams 306 to become one type of electrical contacts 100A-100E based on what surfaces (if any) of the respective electrical contact 100 was coated. For example,
A sheet of conductive material is received (402). The sheet may be a sheet of metal or the like. The material of the sheet defines a first dielectric constant. Coating 302 is applied to sheet 300 (404). Coating 302 may define a second dielectric constant that is higher than the first dielectric constant. Coating 302 may be applied at one or more predetermined locations of sheet 300 that correspond to shapes 304 (which may themselves may be predetermined by a manufacturing device and not visible prior to coating 302 being applied).
Shapes 304 may be cut from sheet 300 (406). Though shapes 304 of sheet 300 are shaped to correspond to electrical contacts 100 depicted herein, shapes 304 may be any shape that is consistent with this disclosure. Shapes 304 may be cut at predetermined locations such that coating 302 is on at least some surfaces of shapes 304. In some examples (not depicted), one or more shapes 304 may be coated with coating 302 after being cut (rather than prior).
Shapes 304 may be folded into the plurality of electrical contacts 100 (408). Some shapes 304 (e.g., such as shapes 304B, 304C, and 304F of sheet 300) may be folded into standard electrical contacts 100A as a result of these shapes 304 not being coated with coating 302, while other shapes 304 (e.g., such as shapes 304A, 304D, 304E, and 304G) may be folded into electrical contacts 100 that include some coating 302 on one or more external surfaces 170 or internal surfaces 172. For example, as depicted, shapes 304A, 304D, 304E, and 304G are folded to create electrical contacts 100E (e.g., as shapes 304A, 304D, 304E, and 304G have coating 302 on select surfaces 170, 172). Shapes 304 may be folded along seams 306 (e.g., which may not be visible but are depicted as dotted lines for purposes of illustration). One or more manufacturing machines as known by one of skill in the art may be configured to extrude, coat, cut, and/or form electrical contacts 100 from sheet 300 in this way.
Electrical contacts 100 as folded are assembled into socket housing 134 to create HLGA 150 (410). Electrical contacts 100 are assembled into socket housing 134 to create a pattern, such as one of patterns 200, 210, 220, 230, or 240. As a result of being folded into this pattern, electrical contacts 100 may generate a localized capacitance as described herein to supplement one or more properties of HLGA 150, therein increasing a performance of HLGA 150.
For example,
The calculations were executed with a coating of Barium Titanate (BaTiO3), which can range from defining a dielectric constant (where this dielectric constant, otherwise referred to as a relative permittivity, is represented by Ea) between 1000 and 7000. Results 500A were executed assuming a current design (which is similar to that with electrical contact 100) and a maximum contact area coated with BaTiO3 Ea=1000, while results 500B were executed with a coating of BaTiO3 Ea=3000, and results 500C were executed with a coating of BaTiO3 Ea=7000. As shown in results 500, modulating Ea and a number of contacts resulted in a wide range of capacitance being achieved.
As would be understood by one of ordinary skill in the art, to calculate capacitance, the following equation is used (where C is capacitance, E is the absolute permittivity of the dielectric material, A is area, and d is distance): C=EaEo*A/d. As used in this calculation, Eo=8.85E-12 Farads/minute, and pi=3.14159. To achieve around ˜300 picofarads (pF) for a contact body width of 40 thousands of an inch (where a thousandth of an inch is a mil) requires 10 contacts. Results 500 indicate that a proposed contact such as depicted in
The descriptions of the various embodiments of the present disclosure have been presented for purposes of illustration, but are not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein was chosen to explain the principles of the embodiments, the practical application or technical improvement over technologies found in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
The flowchart and block diagrams in the Figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present invention. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of instructions, which comprises one or more executable instructions for implementing the specified logical function(s). In some alternative implementations, the functions noted in the blocks may occur out of the order noted in the Figures. For example, two blocks shown in succession may, in fact, be accomplished as one step, executed concurrently, substantially concurrently, in a partially or wholly temporally overlapping manner, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems that perform the specified functions or acts or carry out combinations of special purpose hardware and computer instructions.
O'Connell, Kevin, Hoffmeyer, Mark K., Doyle, Matthew
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