A component carrier includes a baseboard, two sidewalls, and an ejector. The two sidewalls extend from opposite sides of the baseboard. The ejector includes a side plate, a handle, and a tab. The side plate is positioned in proximity to a first sidewall of the two sidewalls of the component carrier. The handle extends from a first end of the side plate in a first direction that is generally perpendicular to the side plate. The tab is positioned in proximity to the baseboard, and extends from a second opposing end of the side plate in a second direction that is generally perpendicular to the side plate and opposite to the first direction, the tab coupled to a first connector extending from the baseboard. The baseboard includes a first opening such that a portion of the tab of the ejector is configured to directly contact the electronic component therethrough.
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1. A component carrier configured to house an electronic component, the component carrier comprising:
a baseboard configured to interface the electronic component;
two sidewalls extending from opposite sides of the baseboard, the baseboard and the two sidewalls forming a slot for receiving the electronic component; and
an ejector including:
a side plate positioned in proximity to a first sidewall of the two sidewalls;
a handle extending from a first end of the side plate of the ejector in a first direction that is generally perpendicular to the side plate; and
a tab positioned in proximity to the baseboard and extending from a second end of the side plate opposite to the first end, the tab extending in a second direction that is (i) generally perpendicular to the side plate and (ii) opposite to the first direction, the tab coupled to a first connector extending from the baseboard,
wherein the baseboard includes a first opening such that a portion of the tab of the ejector is configured to directly contact the electronic component through the first opening.
19. An ejector for coupling to a component carrier, the ejector comprising:
a generally rectangular side plate positioned in proximity to a first sidewall of two sidewalls of the component carrier, the component carrier including a baseboard configured to interface an electronic component, the two sidewalls of the component carrier extending from opposite sides of the baseboard such that the baseboard and the two sidewalls form a slot for receiving the electronic component;
a handle extending from a first end of the side plate of the ejector in a first direction that is generally perpendicular to the side plate; and
a tab positioned in proximity to the baseboard and extending from a second end of the side plate opposite to the first end, the tab extending in a second direction that is (i) generally perpendicular to the side plate and (ii) opposite to the first direction, the tab coupled to a first connector extending from the baseboard of the component carrier, wherein the baseboard of the component carrier includes an opening such that a portion of the tab of the ejector is configured to directly contact the electronic component through the opening.
13. A component carrier comprising:
a baseboard configured to interface a component module;
a first sidewall and a second sidewall extending from opposite sides of the baseboard, the baseboard, the first sidewall, and the second sidewall forming a slot for receiving the component module; and
an ejector including:
a generally rectangular side plate;
a handle extending from a first end of the side plate of the ejector in a first direction that is generally perpendicular to the side plate; and
a tab positioned in proximity to the baseboard and extending from a second end of the side plate opposite to the first end, the tab extending in a second direction that is (i) generally perpendicular to the side plate and (ii) opposite to the first direction, the tab coupled to a first connector extending from the baseboard,
wherein the component module includes an external connector for coupling the component module to an electronic component outside the component carrier,
wherein the component carrier is configured to receive the component module such that the external connector of the component module is closer to the first sidewall than the second sidewall, and
wherein the baseboard includes an opening such that a portion of the tab of the ejector is configured to directly contact the component module through the opening.
2. The component carrier of
3. The component carrier of
4. The component carrier of
5. The component carrier of
6. The component carrier of
8. The component carrier of
10. The component carrier of
11. The component carrier of
12. The component carrier of
14. The component carrier of
15. The component carrier of
16. The component carrier of
17. The component carrier of
18. The component carrier of
20. The ejector of
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The present invention relates generally to component carriers within a computing or electronic system, and more particularly, to ejectors for aiding in removal of a component of a computing or electronic system.
Computing systems (e.g., desktop computers, blade servers, rack-mount servers, etc.) are employed in large numbers in various applications. High-demand applications, such as in network-based systems, data centers, or in high-density finite element simulations, can require hardware of a computing system to operate at maximum capacity, causing excess heat to be generated during operation of the hardware of the computing systems. For example, a hard drive of a server, memory modules installed in the server, and processors of the server, etc., operating at high capacity can generate excess heat. Heat generated by individual components in the computing system is generally dissipated to avoid damage or performance degradation of such components in the computing system. Absent an efficient heat dissipation system, operation of hardware may be impeded by excess heat. For example, excessive heat can melt interconnects of fragile electronics or can damage substrates of these electronics.
Networked computer devices such as servers often include a chassis with high heat generation components such as power supply, processors, and memories. Additional functions may be added with a modular housing holding components such as hard disk drives (HDDs) to increase storage capacity. As server operation is critical, such modular housings are designed so they can be serviced without the server being taken offline or removed from the rack on which they are placed. For example, modular component housings such as fan modules for cooling the various components, are designed to be pulled out from the chassis while the processor and other components of the server continue to operate.
The current method of replacing or servicing the fan module 10a is to first lift the fan module 10a out of the fan carrier 50. Due to limited operation space, the fan modules 10a, 10b, and 10c are positioned tightly adjacent to one another. As a result, there is little space for the user to grab the fan module 10a. Thus, a latch 30 and an opposing cutaway 32 are needed so that the user can pinch the latch 30 and the cutaway 32 to grab the fan module 10a. Nonetheless, it is still inconvenient for the user to rely on the latch 30 and the cutaway 32 when lifting the fan module 10a, as the center of gravity of the fan module 10a is much lower.
However, due to advancement of technology, the number of pins required for connection between the fan connector and the motherboard has steadily increased. As a result, the force required for disconnecting the fan connector from the motherboard has increased. Thus, the user has to use more force to release and lift the fan module (e.g., the fan module 10a). Further, fan module replacement or service occurs frequently in a data center. It takes time to break down all the pieces (as shown in
Accordingly, a need exists for a component carrier that offers convenient and cost-effective removal of the enclosed component. The present disclosure is directed to solving these problems.
The term embodiment and like terms, e.g., implementation, configuration, aspect, example, and option, are intended to refer broadly to all of the subject matter of this disclosure and the claims below. Statements containing these terms should be understood not to limit the subject matter described herein or to limit the meaning or scope of the claims below. Embodiments of the present disclosure covered herein are defined by the claims below, not this summary. This summary is a high-level overview of various aspects of the disclosure and introduces some of the concepts that are further described in the Detailed Description section below. This summary is not intended to identify key or essential features of the claimed subject matter. This summary is also not intended to be used in isolation to determine the scope of the claimed subject matter. The subject matter should be understood by reference to appropriate portions of the entire specification of this disclosure, any or all drawings, and each claim.
According to certain aspects of the present disclosure, a component carrier configured to house an electronic component is disclosed as follows. The component carrier includes a baseboard, two sidewalls, and an ejector. The baseboard is configured to interface the electronic component. The two sidewalls extend from opposite sides of the baseboard. The baseboard and the two sidewalls form a slot for receiving the electronic component. The ejector includes a side plate, a handle, and a tab. The side plate is positioned in proximity to a first sidewall of the two sidewalls of the component carrier. The handle extends from a first end of the side plate of the ejector in a first direction that is generally perpendicular to the side plate. The tab is positioned in proximity to the baseboard. The tab extends from a second end of the side plate that is opposite to the first end. The tab extends in a second direction that is (i) generally perpendicular to the side plate and (ii) opposite to the first direction, the tab coupled to a first connector extending from the baseboard. The baseboard includes a first opening such that a portion of the tab of the ejector is configured to directly contact the electronic component through the first opening.
In some implementations, the tab of the ejector includes a raised protrusion that is configured to directly contact the electronic component. In some such implementations, the raised protrusion is configured to directly contact the electronic component at a location adjacent to an external connector of the electronic component.
In some implementations, the tab is pivotably coupled to the first connector, which extends from the baseboard adjacent to the first sidewall of the component carrier. In some such implementations, the side plate of the ejector is integrated with the handle and the tab of the ejector, such that pulling the handle away from the first sidewall of the component carrier causes the tab to advance inside the slot through the first opening of the baseboard. In some other such implementations, the side plate of the ejector is integrated with the handle, and rotatably coupled to the tab of the ejector, such that pushing the handle towards the baseboard of the component carrier causes the tab to advance inside the slot through the first opening of the baseboard.
In some implementations, the electronic component is a fan module. In some such implementations, each of the two sidewalls of the component carrier includes a generally circular opening in a path of airflow generated by the fan module. In some implementations, the fan module includes a fan and a fan holder. In some implementations, the fan holder includes two opposing fan guards. The fan holder is configured to receive the fan such that the two opposing fan guards are disposed on two opposing sides of the fan and in a path of airflow generated by the fan. In some implementations, the side plate of the ejector includes a generally circular opening in the path of airflow generated by the fan. In some implementations, the fan holder further includes a bottom plate integrated with the two opposing fan guards.
According to certain aspects of the present disclosure, a component carrier includes a baseboard, a first sidewall, a second sidewall, and an ejector. The baseboard is configured to interface a component module. The first sidewall and the second sidewall extend from opposite sides of the baseboard. The baseboard, the first sidewall, and the second sidewall form a slot for receiving the component module. The ejector includes a generally rectangular side plate, a handle, and a tab. The handle extends from a first end of the side plate of the ejector in a first direction that is generally perpendicular to the side plate. The tab is positioned in proximity to the baseboard. The tab extends from a second end of the side plate that is opposite to the first end. The tab extends in a second direction that is (i) generally perpendicular to the side plate and (ii) opposite to the first direction. The tab is coupled to a first connector extending from the baseboard. The component module includes an external connector for coupling the component module to an electronic component outside the component carrier. The component carrier is configured to receive the component module such that the external connector of the component module is closer to the first sidewall than the second sidewall. The baseboard includes an opening such that a portion of the tab of the ejector is configured to directly contact the component module through the opening.
In some implementations, the side plate of the ejector is positioned in proximity to the first sidewall. The tab is pivotably coupled to the first connector, which extends from the baseboard adjacent to the first sidewall of the component carrier. In some such implementations, the side plate of the ejector is integrated with the handle and the tab of the ejector, such that pulling the handle away from the first sidewall causes the tab to advance inside the slot through the opening of the baseboard.
In some implementations, the side plate of the ejector is positioned in proximity to the second sidewall. The tab is pivotably coupled to the first connector, which extends from the baseboard adjacent to the second sidewall of the component carrier. In some such implementations, the side plate of the ejector is integrated with the handle and rotatably coupled to the tab of the ejector, such that pushing the handle towards the baseboard of the component carrier causes the tab to advance inside the slot through the opening of the baseboard. In some other such implementations, the side plate of the ejector is integrated with the handle and the tab of the ejector, such that pulling the handle away from the second sidewall causes the tab to advance inside the slot through the opening of the baseboard.
According to certain aspects of the present disclosure, an ejector for coupling to a component carrier is disclosed as follows. The ejector includes a generally rectangular side plate, a handle, and a tab. The side plate is positioned in proximity to a first sidewall of two sidewalls of the component carrier. The component carrier includes a baseboard and two sidewalls. The baseboard of the component carrier is configured to interface an electronic component. The two sidewalls of the component carrier extend from opposite sides of the baseboard, such that the baseboard and the two sidewalls form a slot for receiving the electronic component. The handle extends from a first end of the side plate of the ejector in a first direction that is generally perpendicular to the side plate. The tab is positioned in proximity to the baseboard. The tab extends from a second end of the side plate that is opposite to the first end. The tab extends in a second direction that is (i) generally perpendicular to the side plate and (ii) opposite to the first direction. The tab is coupled to a first connector, which extends from the baseboard of the component carrier. The baseboard of the component carrier includes an opening such that a portion of the tab of the ejector is configured to directly contact the electronic component through the opening.
In some implementations, the tab is pivotably coupled to the first connector, which extends from the baseboard adjacent to the first sidewall of the component carrier, such that actuation of the handle causes the tab to advance inside the slot through the opening of the baseboard of the component carrier.
The above summary is not intended to represent each embodiment or every aspect of the present disclosure. Rather, the foregoing summary merely provides an example of some of the novel aspects and features set forth herein. The above features and advantages, and other features and advantages of the present disclosure, will be readily apparent from the following detailed description of representative embodiments and modes for carrying out the present invention, when taken in connection with the accompanying drawings and the appended claims. Additional aspects of the disclosure will be apparent to those of ordinary skill in the art in view of the detailed description of various embodiments, which is made with reference to the drawings, a brief description of which is provided below.
The disclosure, and its advantages and drawings, will be better understood from the following description of representative embodiments together with reference to the accompanying drawings. These drawings depict only representative embodiments, and are therefore not to be considered as limitations on the scope of the various embodiments or claims.
The present disclosure relates to a system component carrier with an ejector, which is configured to house an electronic component. Actuation of the ejector causes a tab of the ejector to push the electronic component upwards relative to the system component carrier.
Various embodiments are described with reference to the attached figures, where like reference numerals are used throughout the figures to designate similar or equivalent elements. The figures are not necessarily drawn to scale and are provided merely to illustrate aspects and features of the present disclosure. Numerous specific details, relationships, and methods are set forth to provide a full understanding of certain aspects and features of the present disclosure, although one having ordinary skill in the relevant art will recognize that these aspects and features can be practiced without one or more of the specific details, with other relationships, or with other methods. In some instances, well-known structures or operations are not shown in detail for illustrative purposes. The various embodiments disclosed herein are not necessarily limited by the illustrated ordering of acts or events, as some acts may occur in different orders and/or concurrently with other acts or events. Furthermore, not all illustrated acts or events are necessarily required to implement certain aspects and features of the present disclosure.
For purposes of the present detailed description, unless specifically disclaimed, and where appropriate, the singular includes the plural and vice versa. The word “including” means “including without limitation.” Moreover, words of approximation, such as “about,” “almost,” “substantially,” “approximately,” and the like, can be used herein to mean “at,” “near,” “nearly at,” “within 3-5% of,” “within acceptable manufacturing tolerances of,” or any logical combination thereof. Similarly, terms “vertical” or “horizontal” are intended to additionally include “within 3-5% of” a vertical or horizontal orientation, respectively. Additionally, words of direction, such as “top,” “bottom,” “left,” “right,” “above,” and “below” are intended to relate to the equivalent direction as depicted in a reference illustration; as understood contextually from the object(s) or element(s) being referenced, such as from a commonly used position for the object(s) or element(s); or as otherwise described herein.
Referring to
In some implementations, the bottom plate 316 is integrated with the two opposing fan guards 314 and 318. As described in more detail herein, as compared to the prior art fan module 10a, the fan module 300 of the present disclosure does not require a top plate, such as the top plate 12 (
Referring to
The first sidewall 404 and the second sidewall 406 of the carrier housing 450 extend from opposite sides of the baseboard 402, such that the baseboard 402, the first sidewall 404, and the second sidewall 406 form a slot for receiving the fan module 300. In this example, two dividers 412 and 414 further separate the carrier housing 450 into having three slots 452, 454, and 456. Each of the slots 452, 454, and 456 is configured to receive one fan module, such as the fan module 300.
In some implementations, the first sidewall 404 and the second sidewall 406 of the carrier housing 450, for each of the slots 452, 454, and 456, includes a generally circular opening 470 in a path of airflow generated by the fan module 300. The first sidewall 404 and the second sidewall 406 are configured to be adjacent to the two opposing fan guards 314 and 318 of the fan module 300 shown in
Each ejector 460 includes a generally rectangular side plate 466, a handle 462, and a tab 464. The side plate 466 of the ejector 460 is positioned in proximity to and/or adjacent the first sidewall 404 of the carrier housing 450. The handle 462 of the ejector 460 extends from a first end of the side plate 466 of the ejector 460, in a first direction that is generally perpendicular to the side plate 466. In some implementations, the side plate 466 includes a generally circular opening 472 in the path of airflow generated by the fan module 300, mimicking the opening 470.
The tab 464 of the ejector 460 is positioned in proximity to and/or adjacent the baseboard 402 of the fan carrier 400. The tab 464 extends from a second opposing end of the side plate 466 of the ejector 460 in a second direction. The second direction is (i) generally perpendicular to the side plate 466 and (ii) opposite to the first direction described above. In some implementations, for each of the slots 452, 454, and 456, the baseboard 402 of the carrier housing 450 includes an opening 468, such that a portion of the tab 464 of the ejector 460 is configured to directly contact the fan module 300 through the opening 468.
Referring to
In some implementations, the tab 464 of the ejector 460 includes a raised protrusion 564 that is configured to directly contact the fan module 300. In some implementations, the raised protrusion 564 is configured to directly contact the fan module 300, adjacent to the external connector 520 of the fan module 300. The external connector 520 is configured to couple the fan 320 to a motherboard (or PCBA) that is external to the fan module 300. Positioning the raised protrusion 564 in proximity to and/or adjacent the external connector 520 aids in disconnecting the external connector 520 from the motherboard. For example, in some implementations, the external connector 520 includes a plurality of pins for connection between the fan 320 and the motherboard, which requires force to disconnect. Based on the law of the lever, a user can actuate the ejector 460 (e.g., by pulling the handle 462), and the fan module 300 will automatically disconnect from the connector 520 (e.g., connected to the motherboard) due to the transferred force.
In this example, the fan 320 is dimensioned as 60 mm×60 mm×56 mm (
Referring to
Referring to
Referring to
The ejector 860 includes a generally rectangular side plate 866, a handle 862, and a tab 864. The side plate 866 of the ejector 860 is positioned in proximity to and/or adjacent the second sidewall 406 of the carrier housing 450. The handle 862 of the ejector 860 extends from a first end of the side plate 866 of the ejector 860, in a first direction that is generally perpendicular to the side plate 866. In some implementations, the side plate 866 of the ejector 860 is integrated with the handle 862.
The tab 864 of the ejector extends from a second opposing end of the side plate 866 of the ejector 860 in a second direction. The second direction is (i) generally perpendicular to the side plate 866 and (ii) opposite to the first direction described above. In some implementations, the tab 864 includes two flanges 810 and 812 rotatably coupled to two corresponding flanges 820 and 822 respectively of the side plate 866. For example, the flange 810 of the tab 864 is rotatably coupled to the corresponding flange 820 of the side plate 866 via a hinge 970. In some implementations, the side plate 866 includes a generally circular opening 872 in the path of airflow generated by the fan module 300, mimicking the opening 470 in the second sidewall 406 of the carrier housing 450.
Referring to
In some implementations, the tab 864 of the ejector 860 includes a raised protrusion 964 that is configured to directly contact the fan module 300. In some implementations, the raised protrusion 964 is configured to directly contact the fan module 300, adjacent to the external connector 520 of the fan module 300. In this example, the external connector 520 is positioned in proximity to and/or adjacent the first sidewall 404 of the carrier housing 450.
In this example, the fan 320 is dimensioned as 60 mm×60 mm×56 mm (
Referring to
Referring to
The fan carriers 400 in
While the example fan carriers 400 and 800 are configured to house one or more fan modules 300, the corresponding ejectors 460 and/or 860 may be built into any component carriers configured to house any removable electronic components for any electronic system. Such electronic systems may include, for example, any type of server, storage devices, network switches, communications equipment, and the like.
Although the disclosed embodiments have been illustrated and described with respect to one or more implementations, equivalent alterations and modifications will occur or be known to others skilled in the art upon the reading and understanding of this specification and the annexed drawings. In addition, while a particular feature of the invention may have been disclosed with respect to only one of several implementations, such feature may be combined with one or more other features of the other implementations as may be desired and advantageous for any given or particular application.
While various embodiments of the present disclosure have been described above, it should be understood that they have been presented by way of example only, and not limitation. Numerous changes to the disclosed embodiments can be made in accordance with the disclosure herein, without departing from the spirit or scope of the disclosure. Thus, the breadth and scope of the present disclosure should not be limited by any of the above described embodiments. Rather, the scope of the disclosure should be defined in accordance with the following claims and their equivalents.
Chang, Chun, Chen, Wei-Pin, Chuang, Kai-Yuan, Hou, Jyue
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