A fluid delivery module that produces direct fluid-contact cooling of a computer processor, while mating with common processor accessory mounting specifications. computer processors are commonly packaged and installed on printed circuit boards. The fluid module delivers cooling fluid directly to at least a surface of the processor package. The fluid module forms a fluid-tight seal against the surface of the processor package. By delivering fluid to the surface of the processor package, the module cools the computer processor. The module does not mechanically fasten to the processor. Instead, the module fastens to a variety of processor accessory mounting patterns commonly found on printed circuit boards. The printed circuit board typically carries the processor. This minimizes stress on the processor package, and allows greater modularity between different processors. In one embodiment, the fluid delivery is done with integral microjets, producing very high heat transfer cooling of the computer processor.
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13. A cooling module for a computer processor package, comprising:
(a) an inlet port to admit into the cooling module a liquid coolant delivered from an external source;
(b) an inlet plenum to receive and hold the liquid coolant admitted into the cooling module through the inlet port;
(c) a reservoir that is bounded on one side by an upper surface of the computer processor package and bounded on an opposite side by a lower surface of the microjet nozzle plate, the reservoir being further configured so that, after mounting to the computer processor package, the reservoir will be in direct contact with the upper surface of the computer processor package; and
(d) a microjet nozzle plate, disposed between the inlet plenum and the reservoir, the microjet nozzle plate defining a plurality of orifices extending from the inlet plenum to the reservoir to permit a portion of the liquid coolant held by the inlet plenum to pass out of the inlet plenum and into the reservoir, the plurality of orifices being formed to create a plurality of microjet nozzles, respectively;
(e) wherein at least some of the microjet nozzles in the microjet nozzle plate are arranged into two or more arrays spaced apart from one another on the lower surface on the microjet nozzle plate;
(f) whereby, as the portion of liquid coolant passes into the reservoir via the plurality of orifices in the microjet nozzle plate, the plurality of microjet nozzles produces a plurality of liquid coolant microjets, respectively, and directs the plurality of liquid coolant microjets to enter the reservoir in a direction that is substantially perpendicular to both the lower surface of the microjet nozzle plate and the upper surface of the computer processor package, thereby causing the plurality of liquid coolant microjets to strike the upper surface of the computer processor package in a direction that is substantially perpendicular to the upper surface of the computer processor package.
1. A cooling module for a computer processor package, comprising:
(a) an inlet port to admit into the cooling module a liquid coolant delivered from an external source;
(b) an inlet plenum to receive and hold the liquid coolant admitted into the cooling module through the inlet port;
(c) a reservoir that is bounded on one side by an upper surface of the computer processor package and bounded on an opposite side by a lower surface of the microjet nozzle plate, the reservoir being further configured so that, after mounting to the computer processor package, the reservoir will be in direct contact with the upper surface of the computer processor package; and
(d) a microjet nozzle plate, disposed between the inlet plenum and the reservoir, the microjet nozzle plate defining a plurality of orifices extending from the inlet plenum to the reservoir to permit a portion of the liquid coolant held by the inlet plenum to pass out of the inlet plenum and into the reservoir, the plurality of orifices being formed to create a plurality of microjet nozzles, respectively;
(e) wherein at least some of the microjet nozzles in the plurality of orifices defined by the microjet nozzle plate are arranged in a non-uniform pattern across the lower surface of the microjet nozzle plate;
(f) whereby, as the portion of liquid coolant passes into the reservoir via the plurality of orifices in the microjet nozzle plate, the plurality of microjet nozzles produces a plurality of liquid coolant microjets, respectively, and directs the plurality of liquid coolant microjets to enter the reservoir in a direction that is substantially perpendicular to both the lower surface of the microjet nozzle plate and the upper surface of the computer processor package, thereby causing the plurality of liquid coolant microjets to strike the upper surface of the computer processor package in a direction that is substantially perpendicular to the upper surface of the computer processor package.
2. The cooling module of
3. The cooling module of
4. The cooling module of
5. The cooling module of
6. The cooling module of
(a) the computer processor package is mounted to a printed circuit board (PCB); and
(b) the cooling module further comprises a reservoir cap and a microjet mount plate for mechanically fixing the reservoir cap to the PCB;
(c) wherein the inlet port, the inlet plenum, the microjet nozzle plate, the outlet plenum and the exit port are all integral components of the reservoir cap.
7. The cooling module of
8. The cooling module of
9. The cooling module of
10. The cooling module of
11. The cooling module of
(a) some sections of the upper surface of the computer processor package experience higher temperatures relative to other sections of the upper surface of the computer processor package; and
(b) the microjet nozzle plate contains a relatively higher concentration of microjet nozzles near the sections of the upper surface computer processor package that experience the higher temperatures and a relatively lower concentration of microjet nozzles near the other sections of the upper surface of the computer processor package.
12. The cooling module of
14. The cooling module of
15. The cooling module of
(a) some sections of the surface of the computer processor package experience higher temperatures relative to other sections of the upper surface of the computer processor package; and
(b) the microjet nozzle plate contains a relatively higher concentration of microjet nozzles near the sections of the upper surface computer processor package that experience the higher temperatures and a relatively lower concentration of microjet nozzles near the other sections of the upper surface of the computer processor package.
16. The cooling module of
17. The cooling module of
18. The cooling module of
19. The cooling module of
20. The cooling module of
21. The cooling module of
(a) the computer processor package is mounted to a printed circuit board (PCB); and
(b) the cooling module further comprises a reservoir cap and a microjet mount plate for mechanically fixing the reservoir cap to the PCB;
(c) wherein the inlet port, the inlet plenum, the microjet nozzle plate, the outlet plenum and the exit port are all integral components of the reservoir cap.
22. The cooling module of
23. The cooling module of
24. The cooling module of
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This application claims the benefit under 35 U.S.C. § 120 as a continuation of U.S. application Ser. No. 15/931,220, filed May 13, 2020, which claims the benefit under 35 U.S.C. § 120 as a continuation of International Patent Application Number PCT/US20/27589 filed on Apr. 10, 2020, which claims the benefit under 35 U.S.C. § 119(e) of U.S. Provisional Patent Application 62/833,745, filed on Apr. 14, 2019. The entire disclosures of each application are incorporated herein by reference for all purposes.
This disclosure relates to cooling of electronic components.
Fueled by data, machine learning, virtual reality, and artificial intelligence, the demand for processing power continues to increase. Modern data centers, for instance, host racks of hundreds or thousands of individual processors (e.g., CPUs, GPUs, or ASICs). In this quest for greater computational power, advances in fabrication processes have allowed chip designers to build smaller processors with higher power density. With this increase in power density comes the need to remove the heat that is dissipated from these devices.
Current approaches to cooling computer processors involve the attachment of a metal heat sink (liquid- or air-cooled) to the processor package by using a thermal paste and then fastening the metal heat sink to standard mounting patterns located on the circuit board that hosts the processor. These strategies have been effective but suffer from performance that cannot keep pace with processor power advancements. Further, these solutions require large, heavy, expensive metal heat sinks to help dissipate the heat. Their large size and weight can stress the processor package and circuit board. Continued growth of these heat sinks further limits the achievable packing density of processors in data centers, computer cases, and application-specific printed circuit boards.
Traditional approaches also use a thermal paste to thermally attach these large heat sinks. Using thermal paste to attach heat sinks to electronic devices produces an assembly with an overall effectiveness that hinges on the durability and lifetime of the thermal paste that connects the heat sink to the processor's package. Degradation of this thermal paste over time can lead to reduced performance, or device failure.
It would, therefore, be useful to have a processor heat sink that: had greater thermal performance; came in a compact package size; eliminated the need for thermal paste; and could be used with existing and future processor mechanical mount specifications.
In one aspect, a direct-contact single-phase fluid-based cooling module includes a manifold comprising a fluid inlet that is fluidly coupled to a fluid outlet and manifold mounting structures that are configured to fix the manifold to a separate structure such that the manifold is configured to form a fluid-tight seal against a surface of an electronic component, such that direct contact is established between the fluid and the electronic component.
Some examples include one of the above and/or below features, or any combination thereof. In an example the manifold mounting structures are located outside the extent of the adjacent electronic component to be cooled. In an example fluid contacts only exterior surfaces of the electronic component. In an example the fluid passes from the inlet, within the electronic component, and to the outlet, for purposes of better heat transfer. In some examples the manifold mounting structures are configured to fix the manifold to a printed circuit board. In an example the manifold mounting structures are configured to fix the manifold to a processor accessory mount pattern of the printed circuit board.
Some examples include one of the above and/or below features, or any combination thereof. In an example the manifold mounting structures comprise a pre-loading component to produce a robust seal on the electronic component. In an example the direct-contact fluid-based cooling module further includes a compressible sealing element between the manifold and the electronic component, to facilitate the fluid-tight seal. In an example the manifold further comprises internal ribs or fins that increase a surface area of the manifold that is exposed to the fluid or enhance fluid flow, for enhancing heat transfer. In an example the inlet and outlet are in fluid communication with fluid fittings. In an example the inlet and outlet are in fluid communication with fluid conduits.
Some examples include one of the above and/or below features, or any combination thereof. In some examples the manifold further comprises a fluid plenum that fluidly couples the inlet and the outlet, and wherein fluid in the plenum contacts the surface of the electronic component. In an example the manifold further comprises a nozzle plate that defines a plurality of orifices that are configured to create jets that are directed at the surface of the electronic component. In an example the nozzle plate divides the fluid plenum into an inlet plenum and an outlet plenum, wherein the fluid pressure is lower in the outlet plenum than it is in the inlet plenum. In an example the nozzle plate further defines at least one outlet fluid passageway that is configured to conduct fluid from the outlet plenum toward the fluid outlet of the manifold. In an example a perimeter can be drawn around the plurality of orifices without enclosing any of the outlet fluid passageways. In some examples the orifices contain chamfers on a surface of the plate. In an example the orifices form microjet nozzles. In an example the microjet nozzles direct the fluid in a direction substantially perpendicular to a surface of the nozzle plate, to create fluid flow with substantially high momentum in the perpendicular direction. In an example the orifices are configured non-uniformly across the nozzle plate, to provide more effective cooling for reduction of temperature gradients in the electronic component.
For a better understanding of the present disclosure, reference is made to the accompanying drawings, in which:
This disclosure describes the use of a structure (e.g., a mounting plate) with an integral fluid module designed to deliver coolant fluid in direct contact with the surface of a computer processor package. In an example the structure is a mounting plate that is configured to form a leak-free seal against the processor package, while fastening to common accessory mounting features on a host printed circuit board for the processor. The disclosure further describes several non-limiting embodiments of the direct contact fluid-based cooling modules, including those for cooling the exterior surface of a computer processor package. Commonly available accessory mounts found on printed circuit boards can be used to introduce a compact way to deliver cooling fluid in direct contact with the exterior surface of a computer processor package, while maintaining modularity across many types of processor packages.
Many computer processor assemblies involve a packaged semiconductor device that is installed onto a printed circuit board. Encapsulating this semiconductor device is a cover that may serve several purposes including mechanical protection and heat transfer. Regarding heat transfer, this cover is oftentimes insufficient by itself to dissipate the heat from the processor, and a large, finned, metal heat sink is then attached. This approach leads to complex, low performance, large overall implementations.
Yet other approaches involve liquid cooling of the computer processor. Here, the greater heat transfer abilities of liquids are exploited, traditionally by passing the cooling liquid through a finned, conductive metal heat exchanger that is attached to the processor by a thermal paste or epoxy. These approaches, too, include the separate, large heat sinks of other approaches, but use a pressurized liquid instead of air as the cooling medium. This leads to more capable thermal solutions, but still uses a large, expensive, metal package that relies on thermal paste to couple the thermal management solution to the device.
As opposed to a separate liquid heat exchanger, direct contact cooling as disclosed herein can provide high performance cooling without the need for thermal pastes. Microjet cooling, for example, is a technique for cooling high-power devices that is characterized by fluid moving through a nozzle to form a small jet of fluid with substantially greater momentum in one direction than another. When this high-momentum fluid impacts a surface, it suppresses the thermal boundary layer at that surface, producing very high heat transfer at that spot. Microjet cooling technology has been demonstrated to produce heat transfer coefficients in excess of 200,000 W/m2K, more than ten times that of competing approaches (e.g., microchannels 20,000 W/m2K). This allows the fluid to collect more heat, without the need for additional metal heat spreaders or thermal pastes. Microjet cooling is further described in US Patent Application Publication 2019/0013258 and International Patent Application Publication WO 2019/018597, the disclosures of which are incorporated herein by reference in their entireties for all purposes.
In one non-limiting aspect of the present disclosure, direct contact microjet cooling is configured within a fluid module, with modular mounts for computer CPUs. In an example the assembly is fastened not to the processor, but to the printed circuit board that hosts the processor. During the installation, a leak-free seal is formed between the fluid module and the processor, where direct contact fluid cooling by microjet impingement is produced on the surface of the processor package. This approach yields high-performance cooling in a compact size, eliminates the need for thermal pastes, and does not fasten to the individual processor but instead to existing mounting features on many printed circuit boards, thus achieving greater modularity.
This disclosure is not limited to the use of microjet cooling. Rather, the disclosure describes direct contact fluidic cooling of computer processors (CPUs, GPUs, FPGAs, ASICs, etc.) using a fluid module with modular mounts that fasten to the processor motherboard, while also forming a leak-free seal against at least one surface of the processor package.
The specific method of fastening the manifold (101) to the printed circuit board (102) is carefully selected to mate with existing circuit board features (103) for each processor technology. For example, threaded screws (106) or quarter-turn fasteners may be used as the fastening method. The fastener may also include features to pre-load the manifold against the processor package, for example with compression springs (107) disposed between the manifold surface and the fastener bearing surface.
When fastened to the printed circuit board (102), the manifold forms one or more leak-free seals (108) against a surface of the processor package. In
In operation, a source of pressurized fluid is supplied to the manifold. The manifold includes one or more fluid inlets (109) to accept this source of pressurized fluid. The fluid fills and traverses internal cavity (110) before exiting the manifold through one or more exit ports (112). While flowing from inlet (109) to outlet (112), the fluid is in direct contact with, and flows over, processor surface (111). Heat is then transferred between the device surface and the fluid. This heat transfer may be used to cool the processor, without a need for thermal pastes or greases, or an additional large, finned heat sink. Manifold (101) may also include internal ribs or fins (113) for increased heat transfer area or fluid flow control. Such ribs or fins (113) may extend from the manifold into the fluid, or all the way to the device surface.
In use, a single-phase fluid is administered. This fluid may be any suitable coolant, including air, water, ethylene glycol, propylene glycol, ethanol, R134A, ammonia, or any other fluid. A combination of two or more of these fluids may also be used.
The inlet (109) and outlet (112) may be of any type. They may also, for example, provide transmission to/from other components that require cooling. Such other components may be in neighboring parts of the assembly and may utilize transmission via tubing to other parts of the system. The inlet and outlet may interface with a fitting (e.g. barb, quick disconnect, compression), tubing, a manifold, or any other suitable method of interfacing fluids.
In a volume between the fluid manifold (201) and the printed circuit board (202), there exists a processor package (203). The fluid manifold is in contact with at least one surface of the processor package and forms a leak-free seal. However, the fluid manifold does not mechanically fasten or affix to the processor package. This minimizes mechanical stress on the electrical component and simplifies the mounting architecture by instead leveraging standard mechanical mounting specifications for processor accessories that are found on many circuit boards.
Other features may be included to aid the mechanical fastening of the fluid manifold to the circuit board. For example, compression springs (303) may be disposed between the mount plate and the fastener to provide a compressive pre-load between the fluid manifold and the processor package, without requiring bearing of the fastener head (302) against the fluid manifold flange (301). This may be useful to prevent over-stressing the processor package by over-torqueing mechanical fasteners. Of course, other features may also be used including, for example, spacers, standoffs, shoulder screws, or binding barrels.
Because the cooling is accomplished through direct contact between the fluid and the device to be cooled, effective heat transfer can be achieved even with manifolds constructed from materials that are not thermally conductive. Modular, direct contact fluid manifolds may be built from a variety of materials including, for example, metals, ceramics, and plastics.
In operation, fluid is supplied to the fluid manifold by one or more fluid inlets (304), while the fluid is exhausted through one or more fluid outlets (305). Fluid inlets/outlets may be of any typical form including, for example, barbed fittings, quick disconnects, press-to-connect fittings, or tubing pigtails.
A single-phase fluid is administered to the fluid manifold. This fluid may be any suitable coolant, including air, water, ethylene glycol, propylene glycol, ethanol, R134A, ammonia, or any other fluid. A combination of two or more of these fluids may also be used.
Cooling fluid is supplied by an external source of pressurized fluid. Fluid enters the manifold through one or more inlet ports (304) and fills the inlet plenum (406). Fluid then travels to a reservoir in contact with a surface (407) on the packaged processor (402). This reservoir is bounded by some combination of the manifold (401), one or more surface (407) of the processor, and seals (403). At the surface (407) of the processor (402), heat is transferred from the processor to the fluid. Cooling fluid then exits the manifold by traversing the exit plenum (408) and exiting the manifold through one or more exit ports (305).
While the fluid path between the inlet and outlet have been shown as a continuous reservoir in
As shown in
Seals (704) form a barrier between the inlet plenum (703) and the outlet plenum (705). To traverse between the inlet plenum (703) and the outlet plenum (705), the fluid passes through flow channels or conduits within the processor package, for example the channels (607) shown in
The direct contact fluid manifold does not have to be a monolithic part. Assemblies may allow for the addition of heat transfer enhancing features to be included within the manifold. Such heat transfer enhancing features may include, for example, microjet cooling.
The multiple-part assembly (800) of
A microjet mount plate (801) forms part of the assembly along with a reservoir cap (803). The microjet mount plate and reservoir cap may be attached, for example, with mechanical fasteners (804). At least two internal volumes are formed by the reservoir cap and the microjet mount plate. At least one internal volume is filled with fluid from an inlet (1008). This inlet plenum (1009) contains higher-pressure inlet fluid. A microjet nozzle plate (1010) separates the higher-pressure inlet plenum (1009) from a lower-pressure outlet plenum (1012). The microjet nozzle plate (1010) is comprised of one or more orifices. The size of these orifices is carefully designed to balance pressure drop with heat transfer performance but may be, for example, 200 micrometers in diameter. The orifices may be circular in cross section or may be other shapes.
As fluid passes through the microjet nozzle plate (1010), the cooling fluid forms microjets directed at the surface (1011) of the packaged processor (1002). Fluid strikes the heat transfer surface (1011) of the packaged processor and fills the outlet plenum (1012). During this impingement, heat is transferred from the processor to the fluid. This process provides direct contact between the cooling fluid and an outer surface of the processor package. This approach eliminates the need for thermally conductive greases, a smooth heat transfer surface, and any additional conductive layers.
Seals (1005 and 904) are disposed on and within the fluid module assembly. These seals separate inlet from outlet fluid and serve to create a leak-free barrier between fluid contained within the fluid module and the exterior. Seals may be of several types, including O-rings, gaskets, or elastomeric compounds. In this embodiment, the fluid directly contacts the surface of the processor package (1002) but does not penetrate within the processor package, as it may in other embodiments.
In all embodiments, the microjet mount plate (801) is affixed outside the extents of the processor (1002). Such installation may be by bolts (802) with pre-loading elements (903) or by other techniques. Mechanical fastening may be done to a printed circuit board, for example, to the board's accessory mounts. In all embodiments, the microjet mount plate (801) does not mechanically fasten to the processor package (1002) but does form a leak-free seal against at least one surface (1011) of the processor package (1002).
Within the extent of the microjet mount plate (801) exists an inlet plenum (1203), which may be supplied fluid from, for example, the reservoir cap (803). The inlet plenum (1203) contains higher-pressure fluid. One or more orifices on a microjet nozzle plate (1303) separate the inlet plenum from the outlet plenum. These orifices form the fluid microjets to produce direct contact fluid cooling on the processor located in proximity to the fluid module. After the transfer of heat to the microjet fluid, the fluid traverses the outlet plenum (1204). Seals (1005) create a leak-free barrier between the microjet mount plate and the adjacent processor surface.
Seals (904) separate the inlet plenum (1203) from the outlet plenum (1204) and form a leak-free seal to the exterior. Multiple seals may be used, as shown in
In
Direct contact cooling modules (1601) and (2001) are example embodiments, of which the present invention is not limited to specific features or forms described. There may be direct contact cooling modules containing different methods of: forming the fluidic seal, attaching to the PCB or substrate, administering fluid onto the heat generating component, forming direct contact cooling modules, administering fluid in and out of the direct contact cooling module, establishing fluid communication within different parts of the direct contact cooling module, and others.
Direct contact fluid modules may be of multiple pieces, or may be of a single unitary structure. Seals may be formed via o-rings, gaskets, adhesives, soldering, brazing, welding, or other permanent and non-permanent sealing mechanisms. PCB attachment may be done via fasteners, brackets, clamps, threaded rods and wingnuts, rivets, or other attachment mechanisms. Fluid may be administered directly onto the device surface to which the seal is made in a variety of different ways, including external contact of the surface, penetration into the surface, passing through the surface entirely, or other fluid disposing mechanisms to accomplish cooling. Fluidic supply and exhaust may be accomplished by way of fluid fittings, fluid conduits, direct tube attachment, an accompanying fluid manifold, or other fluid delivery techniques. There may be different layouts of inlet passageways and outlet passageways to deliver and exhaust fluid from the surface of the heat generating device, such as microjet nozzles, large non-restrictive inlet passageways, circular exit passageways, non-circular exit passageways, single exit passageways, a plurality of exit passageways, and other fluidic passageway configurations. Differences are not limited to those listed, and will be apparent to those skilled in the art without departing from the scope of the present invention.
In certain embodiments, the microjet nozzles may be disposed in arrays so as to provide cooling for electronic devices of a range of different sizes. Such devices may contain length scales that range from 5-50 mm, for example. Therefore, the size, location, and distribution of nozzles are carefully chosen to provide adequate cooling of the entire device. The nozzles may be disposed in linear arrays, circular arrays, or any other pattern that serves to help cover the surface of the heat-generating devices. The nozzles may be far apart or close together, details of which are carefully chosen in balancing thermofluidic considerations such as, for example, heat transfer and pressure drop.
In certain electronic devices, the heat may not be generated uniformly across the device surface to be cooled. Such sections of the surface where more heat is being generated are therefore more prone to increases in temperature, sometimes referred to as “hot spots”. In these cases, it may be advantageous to concentrate nozzles nearer to the hot spots of higher heat generation, while having more sparsity in the array where there is lower or no heat generation. This allows for improved cooling efficiency, as better cooling occurs using the same amount of fluid flow, compared to a case where nozzles are uniformly disposed on the nozzle plate.
In addition to the distribution of nozzles, the size and shape of each individual nozzle may vary across the array to balance tradeoffs of, for example, pressure, flow rate, and heat transfer, with the heat generating character of the electronic device. For example, a set of jets with lower heat transfer capability may be administered around areas of low heat generation, while jets with high heat transfer capability may be administered near hot spots.
In these and other embodiments, the shape of the nozzle specifically can be carefully chosen to optimize thermofluidic properties, such as pressure drop, flow rate, and heat transfer capability.
As part of this disclosure, a fluid module provides direct fluid contact cooling of processors. The fluid module features mounts that are configured to avoid mechanical fastening to the processor package while still forming a leak-free seal with a surface on the processor package. Mechanical fastening is done outside the extents of the processor, for example with existing circuit board mounts. This approach provides direct contact fluid cooling, minimizes mechanical stress on the processor package, and leverages common printed circuit board accessory mounting features. The direct contact fluid module reduces the thermal path for heat that is generated by the processor, using the processor's own surface or surfaces as the heat transfer interface. Direct contact fluid modules are designed to be used with many commonly available processor packages on printed circuit boards with accessory mounting patterns.
In one embodiment, the present disclosure discusses a method of thermal management of computer processors by direct fluid-contact cooling. First, the fluid module is disposed over a computer processor. The module attachment produces a leak-free seal between the module and a surface of the processor but does not mechanically fasten to the processor. Coolant fluid passes within the module, making direct contact with at least one surface of the processor. In certain embodiments, fluid contact with the processor may be in the form of impinging microjets formed by the module. In certain other embodiments, fluid contact may not be limited to an external processor surface, but may occur with coolant flowing through passages within the processor. In every embodiment, heat is transferred from the processor to the fluid making direct contact with the surface(s) of the packaged processor. The fluid then exits the module.
The present disclosure is not to be limited in scope by the specific embodiments described herein. Indeed, other various embodiments of and modifications to the present disclosure, in addition to those described herein, will be apparent to those or ordinary skill in the art from the foregoing description and accompanying drawings. Thus, such other embodiments and modifications are intended to fall within the scope of the present disclosure. Furthermore, although the present disclosure has been described herein in the context of a particular implementation in a particular environment for a particular purpose, those of ordinary skill in the art will recognize that its usefulness is not limited thereto and that the present disclosure may be beneficially implemented in any number of environments for any number of purposes. Accordingly, the claims set forth below should be construed in view of the full breadth and spirit of the present disclosure as described herein.
Mizerak, Jordan, Malouin, Bernard
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