A lead-free solder alloy comprising: from 1 to 9 wt. % copper, at least one of: from greater than 0 to 1 wt. % nickel, from greater than 0 to 10 wt. % germanium, from greater than 0 to 10 wt. % manganese, from greater than 0 to 10 wt. % aluminium, from greater than 0 to 10 wt. % silicon, from greater than 0 to 9 wt. % bismuth, from greater than 0 to 5 wt. % indium, from greater than 0 to 1 wt. % titanium, from greater than 0 to 2 wt. % lanthanum, from greater than 0 to 2 wt. % neodymium, optionally one or more of: up to 1 wt. % for: chromium, gallium, cobalt, iron, phosphorous, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium; up to 5 wt. % silver, up to 1 wt. % zinc, up to 2 wt. % rare earth metals, excluding lanthanum and neodymium, and the balance tin together with any unavoidable impurities.
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1. A lead-free solder alloy consisting essentially of:
from 1 to 3.5 wt. % copper,
from 0.001 to 0.05 wt. % nickel,
from 0.0005 to 0.08 wt. % germanium,
the balance tin together with any unavoidable impurities.
2. The solder alloy of
3. The solder alloy of
4. The solder alloy of
5. The solder alloy of
6. The solder alloy of
7. A soldered joint comprising a solder alloy of
8. A method of forming a solder joint comprising:
(i) providing two or more work pieces to be joined;
(ii) providing a solder alloy as defined in
(iii) heating the solder alloy in the vicinity of the work pieces to be joined.
9. Use of a solder alloy of
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The present invention relates generally to the field of metallurgy, and more particularly to a solder alloy. The solder alloy is particularly, though not exclusively, suitable for use in electronic soldering applications such as wave soldering, surface mounting technology, hot air leveling and ball grid arrays, land grid arrays, bottom terminated packages, LEDs and chip scale packages.
A typical packaging/assembly process of an LED or any other semiconductor device involves several steps in a series. At each of these steps, some kind of electrical/thermal interconnect material is used. The most common materials used in interconnects are conductive adhesives, sintered materials, soldering alloys, epoxies and polymers. Among them, conductive adhesives, sintering materials, epoxies and polymers go through an irreversible process phase transition during the contact formation process. However, solders go through a quasi-physical and mostly reversible phase transition during processing. Solders are the most common materials used in electronics assembly. A fixed and reproducible melting point of a solder is an advantage as far as formation of the interconnects is concerned. However, the same property of solders becomes a liability if the assembly process involves multiple steps using the same solder. Solder used in the first assembly process will go through repetitive melting and freezing cycles during secondary, ternary and so on process steps. Quality of the interconnect going through multiple melting/freezing cycles will degrade resulting in reduced life of the final product or the product with compromised reliability. Therefore, there is a need for soldering materials with different melting/freezing temperatures.
Before the electronics industry transitioned to Pb-free solders, different compositions of SnPb solders were being used to create a soldering temperatures hierarchy. For example, 10Sn90Pb or 05Sn95Pb or some of their variants with some Ag addition were used as die attach materials (also called level I interconnect in LED packaging and assembly terminology) because of their high melting temperatures (299° C. for 10Sn90Pb and 310° C. for 05Sn95Pb). 63Sn37Pb or some of its variants with melting temperature around 183° C. were used for circuit board assembly (also called Level II—V in the LED Industry). After restriction of Pb in solders, the most commonly used Pb-free solders were SnAg or SnAgCu (SAC) solders with melting temperature in the range 217-228° C. The only viable option for high-temperature Pb-free solder to replace high-Pb solders was 80Au20Sn. With 80% gold, Au20Sn is one of the most expensive solders. In addition, AuSn is a high modulus, relatively brittle material that results in interconnects with high stress. Similar material sets are being used in other semiconductor packaging and electronic assembly as well. Some of the properties, such as high thermal conductivity and high reliability, are even more important for packaging and assembly of high power electronics components, such as power diode, MOSFET and IGBT etc.
One of the lead-free alloy combinations currently being used in the electronics industry for the multilevel interconnections is the eutectic Sn—Cu alloy (Sn-0.7Cu) and Sn—Ag—Cu alloy (SAC305) system. However, a few drawbacks are inherently associated with the above alloy combination. The typical second reflow temperature is approximately 240 to 250° C., which is above the melting peak of Sn-0.7Cu system, i.e., 232° C. Since the Sn-0.7Cu solder joint is in a liquidus state during the second reflow it can lead to reliability issues with the reliability of the first level interconnect. Also, in this case die tilt or movement can occur also during secondary reflow or during rework processing of solder joints. Hence, there is a need for an alloy which can potentially overcome all the drawbacks mentioned above and partially or completely mitigate the reliability risks.
The present invention aims to solve at least some of the problems associated with the prior art or to provide a commercially acceptable alternative.
Accordingly, in a first aspect, the present invention provides a lead-free solder alloy comprising:
The present invention will now be further described. In the following passages different aspects of the invention are defined in more detail. Each aspect so defined may be combined with any other aspect or aspects unless clearly indicated to the contrary. In particular, any feature indicated as being preferred or advantageous may be combined with any other feature or features indicated as being preferred or advantageous.
The term “solder alloy” used herein encompasses a fusible metal alloy with a melting point in the range of from 90 to 400° C. The alloys are lead-free meaning that no lead is added intentionally. Thus, the lead contents are zero or at no more than accidental impurity levels. The alloys are also typically antimony-free meaning that no antimony is added intentionally. Thus, the antimony contents are typically zero or at no more than accidental impurity levels.
The solder alloy may have a melting peak at or above 232° C., may be capable of forming a robust first level interconnect (die attach), and may reduce the risk of die tilt or movement during secondary reflow.
The solder alloy may be suitably used in a Pb-free soldering hierarchy in multilevel, multi-step electronics assembly. The alloy may be suitable for reflowing as a first reflow alloy or I level interconnect alloy, and may be a better alternative to Sn—Cu, SAC or SnAg eutectic alloys. In a die attach process, the solder alloy may provide stability to a semiconductor die-attach layer due to a decrease in fluidity at the secondary reflow processing temperature.
Without being bound by theory, it is considered that the presence of the optimum volume fraction of different types of intermetallic compounds, and other alloying additions, enhances the viscosity of the solder melt during level 11 reflow processing of a printed circuit board (PCB), without compromising the solderability during the level I die attach process. As a result, die tilt may be reduced.
Advantageously, the solder alloy may melt in the temperature range of 225° C. to 260° C., thereby making it suitable for reflow in a typical electronic assembly process.
The solder alloy may exhibit similar or improved thermo-mechanical reliability in comparison to conventional lead-free solder alloys such as, for example, SnCu, SAC and SnAg. The solder alloy may exhibit similar or improved mechanical properties in comparison to conventional lead-free solder alloys such as, for example, SnCu, SAC and SnAg.
The solder alloy may exhibit favourable wetting characteristics, for example wetting characteristics substantially similar to or better than those of conventional solder alloys such as, for example, SAC solder alloys and Sn0.7Cu solder alloys.
The solder comprises from 1 to 9 wt. % copper. Preferably, the solder alloy comprises from 1.2 to 7 wt. % copper, more preferably from 1.5 to 3.5 wt. % copper, even more preferably from 2 to 3 wt. % copper. In a particularly preferred embodiment, the solder alloy comprises about 2.5 wt. % copper. The solubility of copper in tin is limited. Sn-0.7% wt. Cu forms a eutectic phase. Any further addition beyond 0.7 wt. % of copper will increase the volume fraction of intermetallic compounds such as, for example, Cu3Sn, and Cu6Sn5. These intermetallic compounds may serve to increase the viscosity of the alloy at a given temperature. These intermetallic compounds may also enhance the mechanical and thermal reliability of the alloy.
The solder alloy optionally (and preferably) comprises from greater than 0 to 1 wt. % nickel (e.g. from 0.001 to 1 wt. % nickel). Preferably, the solder alloy comprises from 0.001 to 0.2 wt. % nickel, more preferably from 0.005 to 0.02 wt. % nickel, even more preferably from 0.01 to less than 0.02 wt. % nickel. Nickel does not form a solid solution with tin. However, it forms intermetallic compounds that may result in improved mechanical properties of the alloy, and may increase the viscosity of the alloy at a given temperature. Nickel may serve to reduce copper dissolution.
The solder alloy optionally (and preferably) comprises from greater than 0 to 10 wt. % germanium (e.g. from 0.0005 to 10 wt. % germanium). Preferably, the alloy comprises from 0.0005 to 5 wt. % germanium, more preferably from 0.001 to 4.5 wt. % germanium, even more preferably from 0.001 to 0.005 wt. % germanium, still even more preferably from 0.002 to less than 0.005 wt. % germanium. In a preferred embodiment, the alloy comprises from 0.02 to 0.08 wt. % germanium. In another preferred embodiment, the alloy comprises from 3.5 to 4.5 wt. % germanium. Germanium may function as a deoxidiser, and may also improve wettability. Germanium also has good bonding characteristics with a semiconductor die. In a preferred embodiment, the alloy comprises both nickel and germanium. Such an alloy may provide a favourable combination of high viscosity, low copper dissolution and good wettability.
The solder alloy optionally (and preferably) comprises from greater than 0 to 1 wt. % manganese (e.g. from 0.001 to 1 wt. % manganese). Preferably, the alloy comprises from 0.005 to 0.5 wt. % manganese, more preferably from 0.01 to 0.3 wt. % manganese, even more preferably from 0.05 to 0.1 wt. % manganese. Manganese has limited solubility in tin and copper. Manganese, in the presence of only tin, forms intermetallic compounds such as, for example, Mn3Sn, Mn2Sn and MnSn2. In the presence of both copper and tin, manganese can also form intermetallic compounds such as, for example, MnCu5Sn2, MnCu2Sn and MnCu4Sn. These intermetallic compounds may increase the viscosity of the Sn—Cu alloy at a given temperature. These intermetallic compounds may also enhance the mechanical and thermal reliability of the alloy.
The solder alloy optionally (and preferably) comprises from greater than 0 to 10 wt. % aluminium (e.g. from 0.005 to 10 wt. aluminium). Preferably the solder alloy comprises from 0.01 to 5 wt. % aluminium, more preferably from 0.05 to 2 wt. % aluminium. In a preferred embodiment, the alloy comprises from 0.005 to 0.015 wt. % aluminium. In another preferred embodiment, the alloy comprises from 0.02 to 0.08 wt. % aluminium. In another preferred embodiment, the alloy comprises from 0.8 to 1.2 wt. % aluminium. In another preferred embodiment, the alloy comprises from 3.5 to 4.5 wt. % aluminium. Aluminium may function as a deoxidiser, and may also improve wettability. Aluminium also has good bonding characteristics with a semiconductor die. The alloy preferably contains both germanium and aluminium. Aluminium and germanium both have a very limited solubility in the tin, but aluminium and germanium have good mutual solubility and form a eutectic mixture at 28.4 atomic % (˜51.6 wt. %) of germanium.
The solder alloy optionally (and preferably) comprises from greater than 0 to 10 wt. % silicon (e.g. from 0.005 to 10 wt. % silicon). Preferably the solder alloy comprises from 0.01 to 8 wt. % silicon, more preferably from 0.02 to 6 wt. % silicon. In a preferred embodiment, the alloy comprises from 0.02 to 0.08 wt. % silicon. In another preferred embodiment, the alloy comprises from 3.5 to 4.5 wt. % silicon. Silicon may function as a deoxidiser, and may also improve wettability.
The solder alloy optionally (and preferably) comprises from greater than 0 to 9 wt. % bismuth (e.g. from 0.005 to 9 wt. % bismuth). Preferably, the solder alloy comprises from 0.01 to 7 wt. % bismuth, more preferably from 0.05 to 6 wt. % bismuth. In a preferred embodiment, the solder alloy comprises from 0.07 to 0.13 wt. % bismuth. In another preferred embodiment, the solder alloy comprises from 2 to 5 wt. % bismuth, preferably from 3.5 to 4.5 wt. % bismuth. Bismuth has some solubility in tin, which may provide improve mechanical properties via solid solution strengthening. Bismuth may also act to improve creep resistance. Bismuth may also improve wetting and spread.
The solder alloy optionally (and preferably) comprises from greater than 0 to 5 wt. % indium. Preferably, the solder alloy comprises from 0.2 to 3 wt. % indium, more preferably from 1.5 to 2.5 wt. % indium, even more preferably from 1.8 to 2.2 wt. % indium. Indium has some solubility in tin, which may provide an opportunity for improved mechanical properties via solid solution strengthening. In addition, indium may serve to reduce the liquidus temperature of the solder alloy, thereby allowing the alloy to be reflowed at a lower temperature than the base alloy. However, greater amounts of indium may decrease the favourable properties of the solder alloy, such as its mechanical strength, solderability and long-term thermo-mechanical stability. In addition, greater amounts of indium may render the solder alloy unfavourably susceptible to oxidation.
The solder alloy optionally (and preferably) comprises from greater than 0 to 1 wt. % titanium (e.g. from 0.01 to 1 wt. % titanium). Preferably, the solder alloy comprises from 0.015 to 0.5 wt. % titanium, more preferably from 0.02 to 0.08 wt. % titanium. Titanium has limited solubility in tin and may form intermetallic compounds, which can further reduce the fluidity of the solder melt during reflow processing. Titanium may improve strength and interfacial reactions. Titanium may also improve drop shock performance by controlling copper diffusion at the substrate/solder interface.
The solder alloy optionally (and preferably) comprises from greater than 0 to 2 wt. % lanthanum (e.g. from 0.01 to 2 wt. % lanthanum). Preferably, the solder alloy comprises from 0.05 to 1 wt. % lanthanum, more preferably from 0.1 to 0.5 wt. % lanthanum. Lanthanum may act to improve spread and wettability.
The solder alloy optionally (and preferably) comprises from greater than 0 to 2 wt. % neodymium (e.g. from 0.01 to 2 wt. % neodymium). Preferably, the solder alloy comprises from 0.05 to 1 wt. % neodymium, more preferably from 0.1 to 0.5 wt. % neodymium. Neodymium may act to improve spread and wettability.
The solder alloy comprises at least one of nickel, germanium, manganese, aluminium, silicon, bismuth, indium, titanium, lanthanum, neodymium. Preferably, the solder alloy comprises at least two of these elements. In a preferred embodiment, the solder alloy comprises two of these elements. In another preferred embodiment, the solder alloy comprises three of these elements. In another preferred embodiment, the solder alloy comprises four of these elements. In another preferred embodiment, the solder alloy comprises nickel and germanium. In another preferred embodiment, the solder alloy comprises nickel, manganese and phosphorous. In another preferred embodiment, the solder alloy comprises aluminium, germanium, nickel and bismuth. In another preferred embodiment, the solder alloy comprises indium, titanium, lanthanum and nickel.
The solder alloy optionally comprises one or more of: up to 1 wt. % chromium (e.g. from 0.01 to 1 wt. % chromium), up to 1 wt. % gallium (e.g. from 0.01 to 1 wt. % gallium), up to 1 wt. % cobalt (e.g. from 0.01 to 1 wt. % cobalt), up to 1 wt. % iron (e.g. from 0.01 to 1 wt. % iron), up to 1 wt. % phosphorous (e.g. from 0.01 to 1 wt. % phosphorous), up to 1 wt. % gold (e.g. from 0.01 to 1 wt. % gold), up to 1 wt. % tellurium (e.g. from 0.01 to 1 wt. % tellurium), up to 1 wt. % selenium (e.g. from 0.01 to 1 wt. % selenium), up to 1 wt. % calcium (e.g. from 0.01 to 1 wt. % calcium), up to 1 wt. % vanadium (e.g. from 0.01 to 1 wt. % vanadium), up to 1 wt. % molybdenum (e.g. from 0.01 to 1 wt. % molybdenum), up to 1 wt. % platinum (e.g. from 0.01 to 1 wt. % platinum), up to 1 wt. % magnesium (e.g. from 0.01 to 1 wt. % magnesium), up to 5 wt. % silver (e.g. from 0.01 to 5 wt. % silver), up to 1 wt. % zinc (e.g. from 0.01 to 1 wt. % zinc), and up to 2 wt. % rare earth metals, excluding lanthanum and neodymium (e.g. from 0.01 to 2 wt. % rare earth metals). Gallium and zinc have some solubility in tin, which can provide an opportunity for solid solution strengthening. However, higher levels of zinc may decrease the solderability of the solder alloy. Cobalt may be used for reducing copper dissolution. Calcium, magnesium, phosphorous, and vanadium are possible deoxidizers that can also be used for improving wettability. Gold, chromium, iron, molybdenum, platinum, selenium and tellurium and can be used for improved strength and interfacial reactions. Silver and rare earths can improve spread and wettability. The term rare earth element as used herein refers to one or more elements selected from Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb and Lu. Silver may serve to provide more favourable mechanical properties and may increase the viscosity of the solder alloy at a given temperature via the formation of intermetallic compounds.
The alloy will typically comprise at least 80 wt. % tin, more typically at least 85 wt. % tin, still more typically at least 90 wt. % tin, still more typically at least 95 wt. % tin. The alloy will typically comprise up to 98 wt. % tin, more typically up to 97 wt. % tin.
It will be appreciated that the alloys described herein may contain unavoidable impurities, although, in total, these are unlikely to exceed 1 wt. % of the composition. Preferably, the solder alloys contain unavoidable impurities in an amount of not more than 0.5 wt. % of the composition, more preferably not more than 0.3 wt. % of the composition, still more preferably not more than 0.1 wt. % of the composition, still more preferably not more than 0.05 wt. % of the composition, and most preferably not more than 0.02 wt. % of the composition.
The solder alloys described herein may consist of the recite elements. Alternatively, the solder alloys described herein may consist essentially of the recited elements. It will therefore be appreciated that in addition to those elements that are mandatory (i.e. tin, copper and at least one of nickel, germanium, manganese, aluminium, silicon, bismuth, indium, titanium, lanthanum and neodymium) other non-specified elements may be present in the composition provided that the essential characteristics of the composition are not materially affected by their presence.
In a particularly preferred embodiment, the solder alloy consists of from 2 to 3 wt. % copper, from 0.005 to 0.02 wt. % nickel, from 0.001 to 0.005 wt. % germanium, and the balance tin together with any unavoidable impurities. In comparison to conventional SAC305 and Sn0.7Cu solder alloys, such a solder alloy exhibits minimal die tilt between first and fourth reflows, a reduction in void percentage between first and fourth reflows, increased die shear strength and improved thermo-cycling behaviour.
In a particularly preferred embodiment, the solder alloy consists of from 1 to 7 wt. % copper, from 0.1 to 1 wt. % of nickel, from 0.05 to 0.5 wt. % of manganese, and from 0.05 to 0.1 wt. % of phosphorus, and the balance tin, together with unavoidable impurities. Such a solder alloy favourably has a melting peak at 232° C. In comparison to conventional SAC305 and Sn0.7Cu solder alloys, such a solder alloy exhibits minimal die tilt between first and fourth reflows, a reduction in void percentage between first and fourth reflows, increased die shear strength and improved thermos-cycling behaviour.
In a particularly preferred embodiment, the solder alloy consists of from 3 to 7 wt. % copper, from 0.1 to 1 wt. % aluminium, from 0.1 to 1 wt. % germanium, from 0.05 to 0.1 wt. % nickel, from 2 to 5 wt. % bismuth, and the balance tin, together with unavoidable impurities. Such a solder alloy favourably has a melting peak at 232° C. In comparison to conventional SAC305 and Sn0.7Cu solder alloys, such a solder alloy exhibits minimal die tilt between first and fourth reflows, a reduction in void percentage between first and fourth reflows, increased die shear strength and improved thermos-cycling behaviour.
In a particularly preferred embodiment, the solder alloy consists of from 4 to 7 wt. % copper, from 0.1 to 2 wt. % indium, from 0.1 to 0.5 wt. % titanium, and from 0.1 to 0.5 wt. % lanthanum, from 0.1 to 0.2 wt. % of nickel, and the balance tin, together with unavoidable impurities. Such a solder alloy favourably has a melting peak at 232° C. In comparison to conventional SAC305 and Sn0.7Cu solder alloys, such a solder alloy exhibits minimal die tilt between first and fourth reflows, a reduction in void percentage between first and fourth reflows, increased die shear strength and improved thermos-cycling behaviour.
The solder alloy may be in the form of a bar, a rod, a solid wire with or without flux, a foil or strip, a film, a preform, or a powder or paste (powder plus flux blend), or solder spheres for use in ball grid array joints, or a pre-formed solder piece or a reflowed or solidified solder joint, or pre-applied on any solderable material such as a copper ribbon for photovoltaic applications.
In a further aspect, the present invention provides a soldered joint comprising the solder alloy described herein.
In a further aspect, the present invention provides a solder paste comprising:
In a further aspect, the present invention provides a method of forming a solder joint comprising:
The work pieces may be components of a printed circuit board, such as a substrate and a die.
In a further aspect, the present invention provides use of a solder alloy as described herein in a soldering method. Preferably, the soldering method is selected from Surface Mount Technology (SMT) soldering, die attach soldering, thermal interface soldering, hand soldering, laser and RF induction soldering, and rework soldering.
In a further aspect, the present invention provides a solder alloy or solder joint comprising:
The advantages and preferred features of the first aspect apply equally to this aspect.
In a further aspect, the present invention provides a solder alloy or solder joint comprising:
The advantages and preferred features of the first aspect apply equally to this aspect.
In a further aspect, the present invention provides a solder alloy or solder joint comprising:
The advantages and preferred features of the first aspect apply equally to this aspect.
The present invention will now be described further, by way of few non-limiting examples of these alloys and a summary of their performance, with reference to the following drawings in which:
Alloys were prepared having the following compositions:
Such a solder alloy favourably has a melting peak at 232° C.
Such a solder alloy favorably has a melting peak at 232° C.
Such a solder alloy favourably has a melting peak at 232° C.
Alloys were prepared having the compositions set out in Table 1 below.
TABLE 1
Compositions of solder alloys.
Alloy ID
Sn
Cu
Co
Ni
Ti
AI
Si
Ge
P
Mn
In
Bi
Ce
HC4
Balance
1
0.1
0.05
0.005
HC5
Balance
3
0.1
0.05
0.05
0.005
HC6
Balance
5
0.1
0.05
0.1
HC7
Balance
7
0.1
0.05
0.1
HC8
Balance
5
0.1
0.1
0.05
HC9
Balance
7
0.1
0.1
0.05
0.01
HC10
Balance
3
0.1
0.1
0.05
0.005
2
HC11
Balance
5
0.1
0.1
0.05
0.005
2
HC12
Balance
7
0.1
0.1
0.05
0.005
2
HC13
Balance
3
0.1
0.1
0.05
2
HC14
Balance
5
0.1
0.1
0.05
2
HC15
Balance
7
0.1
0.1
0.05
2
HC16
Balance
3
0.1
0.05
0.005
0.05
HC17
Balance
5
0.1
0.05
0.005
0.05
HC18
Balance
7
0.1
0.05
0.005
0.05
HC19
Balance
3
0.1
0.05
0.01
0.005
HC20
Balance
3
0.05
0.05
0.01
0.005
HC21
Balance
5
0.05
0.05
0.01
0.005
HC22
Balance
7
0.05
0.05
0.01
0.005
HC23
Balance
4
0.05
0.01
0.005
HC24
Balance
5
0.05
0.01
0.005
HC25
Balance
7
0.05
0.01
0.005
HC26
Balance
3
0.05
0.05
0.05
0.1
HC27
Balance
5
0.05
0.05
0.05
0.1
HC28
Balance
7
0.05
0.05
0.05
0.1
HC29
Balance
5
0.1
0.05
0.05
HC30
Balance
7
0.1
0.05
0.05
HC31
Balance
6
0.1
0.05
0.005
HC32
Balance
3
0.1
0.05
0.01
0.1
HC33
Balance
4
0.1
0.05
0.01
0.1
HC34
Balance
7
0.1
0.05
0.01
0.1
HC35
Balance
3
0.1
0.05
0.01
HC36
Balance
5
0.1
0.05
0.01
HC37
Balance
7
0.1
0.05
0.01
HC38
Balance
3
0.1
0.05
0.01
2
HC39
Balance
5
0.1
0.05
0.01
2
HC40
Balance
7
0.1
0.05
0.01
2
HC41
Balance
3
0.1
0.005
2
0.1
HC42
Balance
5
0.1
0.005
2
0.1
HC43
Balance
7
0.1
0.005
2
0.1
HC44
Balance
3
0.05
0.01
0.05
HC45
Balance
5
0.05
0.01
0.05
HC46
Balance
7
0.05
0.01
0.05
HC47
Balance
3
0.05
0.05
1
5
0.1
HC48
Balance
5
0.05
0.05
1
5
0.1
HC49
Balance
7
0.05
0.05
1
5
0.1
HC50
Balance
3
0.05
4
4
HC51
Balance
5
0.05
0.05
4
4
HC52
Balance
7
0.05
0.05
4
4
HC53
Balance
3
0.1
0.005
4
HC54
Balance
5
0.1
0.005
4
HC55
Balance
7
0.1
0.005
4
HC56
Balance
3
0.1
0.05
0.05
0.005
4
HC57
Balance
5
0.1
0.05
0.05
0.005
4
HC58
Balance
7
0.1
0.05
0.05
0.005
2
0.1
HC59
Balance
5
0.1
0.05
0.05
0.05
0.005
2
0.1
HC60
Balance
7
0.1
0.05
0.05
0.05
0.005
2
0.1
Between 225 and 280° C., the alloys in Table 1 have a liquid fraction equal or higher than 50%. The liquid fraction is theoretically calculated as liquid fraction (%)=100−solid fraction (%)
An alloy having the following composition was prepared:
Die tilt analysis was carried out comparing the alloy with conventional SAC305 solder alloy. The results are shown in
Void Analysis:
Void analysis was carried out comparing the alloy with conventional SAC305 solder alloy. The results are shown in
Shear and Thermal Testing:
The following tests and conditions were employed:
As can be seen in
The foregoing detailed description has been provided by way of explanation and illustration, and is not intended to limit the scope of the appended claims. Many variations in the presently preferred embodiments illustrated herein will be apparent to one of ordinary skill in the art, and remain within the scope of the appended claims and their equivalents.
Kumar, Anil, Sarkar, Siuli, Pandher, Ranjit, Ribas, Morgana de Avila, Nagarajan, Niveditha, Dutt, Gyan, Bilgrien, Carl
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