A heat-curable composition is disclosed comprising a hydroxyl-bearing polymer; a liquid, polyglycol hemi-formal diluent; and an aminoplast or phenolic resin capable of curing the hydroxyl-bearing polymer. Optionally, a pigment may be added to the composition.
|
1. A curable composition comprising:
(A) x parts by weight of a hydroxyl-bearing polymer; (B) about 0.05x to about 3.0x parts by weight, which represents y-moles, of a liquid polyglycol hemi-formal diluent of the formula ##STR8## wherein R is a hydrocarbyl group of 1 to about 20 carbon atoms, R' is independently each occurrence hydrogen or methyl, and n is a positive number; and (C) an aminoplast or phenolic resole resin, capable of curing component (A) to a tack-free state, present in a quantity of from about (0.20x+z) to about (2.5x+5z) parts by weight, z being equal to y multiplied by the equivalent weight of said aminoplast or phenolic resole resin.
2. The composition of
3. The composition of
7. The composition of
9. The composition of
10. The composition of
12. The composition of
|
|||||||||||||||||||||||||||||||||||||||
This application is a continuation-in-part of our copending application Ser. No. 081,295, filed Oct. 2, 1979, now allowed.
The invention relates to the use of a reactive diluent in common coating compositions made up of hydroxy-functional resins which are curable, by means of an aminoplast or phenolic resin, upon heating. Presently, low boiling diluents are employed as solvents for coating compositions and are removed upon heating said compositions in the curing process.
The instant invention comprises standard coating mixtures of hydroxy-functional resins in admixture with aminoplastic or phenolic curing agents therefor and, as a reactive diluent, a liquid, polyglycol hemi-formal of the formula ##STR1## Preferred because of the decreased amount of volatiles produced during the heat curing step are hemi-formal diluents of the above formula having a normal boiling point greater than 150°C The diluents of the instant invention, surprisingly, may be formulated into heat-curable compositions which do not require the presence of a catalyst such as a strong acid in order to effect reaction between the hydroxy-functional resin and the aminoplast or phenolic curing agent. The invention composition differs from the solvent-based coatings previously employed in the art in that it may be permanently incorporated in the final coating instead of being evaporated out as is commonly the case and the resultant coatings do not suffer losses in their physical properties as might be expected.
The invention comprises a curable composition comprising component (A) x parts by weight of a hydroxyl-bearing polymer; about 0.05x to about 3.0x parts by weight, which represents y-moles of component (B) a liquid, polyglycol hemi-formal diluent of the formula ##STR2## wherein R is a hydrocarbyl group of 1 to about 20 carbon atoms, R' is independently each occurrence hydrogen or methyl, and n is a positive number; component (C) an aminoplast or phenolic resole capable of curing component (A) to a tack-free state, present in from about (0.20x+z) to about (2.5x+5z) parts by weight, z being equal to y multiplied by the equivalent weight of component (C). Optionally, component (D), a catalytic amount of a strong acid or weak acid catalyst for the reaction between components (A) and (C), may be added, however such catalyst is not necessary in order to adequately cure the instant composition. The invention further comprises the above composition which has been heated at a temperature and for a length of time sufficient to cure same to a tack-free finish. The invention composition optionally comprises a pigment of the nature commonly employed in paints and other compositions.
Component (A) of the invention is suitably any hydroxyl-bearing polymer which is commonly cured with an aminoplast or phenolic resin to form films and coatings. Component (A) suitably has at least two and preferably three or more free-hydroxyl groups. Such polymers are the free-hydroxyl containing polyesters such as are obtained by condensing di- or polycarboxylic acids with diols, glycols, triols or higher polyols in such a fashion and ratios that free-hydroxyls remain unreacted for further curing by means of the aminoplast resin. Solid epoxy resins, such as extended diglycidyl ethers of bisphenols, for example: ##STR3## wherein n>1, are also suitable as component (A).
Another class of polymers suitably employed as component (A) are those obtained by polymerization of the unsaturated portion of vinyl monomers which bear or may be modified to bear free-hydroxyl groups which are ultimately pendant from the polyethylenic backbone. Examples of such polymers are poly(vinyl alcohols) which may be obtained by the hydrolysis of polymers derived from the polymerization of vinyl acetate with or without other vinylic unsaturated comonomers, from poly(hydroxyalkylacrylates) such as hydroxyethylacrylate and hydroxypropylacrylate with or without other comonomers and poly(α,β-unsaturated acids) derived from the polymerization of α,β-unsaturated monomeric acids with or without other comonomers or by the polymerization and subsequent hydrolysis of esters thereof. Such monomeric acids are acrylic acid, methacrylic acid, itaconic acid, maleic acid, citraconic acid, cinnamic acid and the like.
Component (A) polymers are employed in some arbitrary amount, hereafter designated as x parts by weight.
Component (B) comprises about 0.05x to about 3.0x parts by weight, preferably about 0.10x to about 2.0x of a liquid polyglycol hemi-formal of the formula ##STR4## wherein R, R' and n are defined as above.
Preferably, Component (B) has a normal boiling point of about 150° C. or greater. Because the hemi-formal is essentially the reaction product of a polyglycol monoether with formaldehyde, the product may decompose into polyglycol monoether and formaldehyde at higher temperatures, e.g., temperatures of about 250°C or more. This is not detrimental to performance of the hemi-formal in the invented composition, however, measurements of the normal boiling point of such compounds may not be possible because of this decomposition.
Component (C) is an aminoplast or phenolic resole resin, capable of curing component (A) to a tack-free state, and is unreactive in the composition under normal conditions but becomes reactive with component (A) at elevated temperatures on the order of 100°C-250°C, preferably 120°C-200°C for a time sufficient to create the desired tack-free state, usually about 5-60 minutes or more. Suitable curing agents are aminoplast resins such as melamine-formaldehyde condensation products or urea-formaldehyde condensation products commonly available for this purpose and phenolic resole resins derived from the condensation of phenols and aldehydes and which are commonly used to cure the hydroxy-bearing solid epoxy resins previously described.
The quantity of component (C) to be employed is such that from about the sum of 0.20x+z up to about the sum of 2.5x+5z parts by weight of the aminoplast or phenolic resin are present in the invention composition, z being equal to y multiplied by the equivalent weight of component (C). The equivalent weights of aminoplast and phenolic resins are commonly available from the manufacturers thereof. Preferably, component (C) is present in at least about the sum of 0.20x+1.25z and is more preferably at least about the sum of 0.20x+1.5z. Preferably, it is present in less than about the sum of 2.5x+3z; and most preferably in less than about the sum of 2.5x+2.5z.
As previously mentioned, it is preferred not to employ a catalyst in the invented composition as adequate cure times and good handling characteristics of the uncured resin, e.g., good pot life, etc. are obtained without use of a catalyst. However, no harm is caused by the presence of a catalyst and one may optionally be employed. Typical catalysts are the strong acids such as organosulfonic acids or their amine salts, sulfuric acid or its amine salts, zinc fluoroborate, phosphoric acid, boron trifluoride, (or its etherate), and the like. Also suitable are weak acid catalysts such as alkylphosphoric acid or chloroacetic acid. Also suitable are strong or weak acid ion-exchange resins. The catalysts may be employed in amounts from 0.0005x to about 0.05x part by weight, wherein x is as previously defined, as is already known in the art.
The curable composition of the invention is suitably prepared by simply mixing the components in any order at ambient temperature or slightly elevated temperatures less than the temperature required for the curing reaction. The curable composition of the invention may suitably be heated to about 50°C-75°C without effecting a premature cure. This facilitates handling, mixing and application of the invention composition. If desired, standard pigments such as titanium oxides, chromium oxides, zinc oxides and the like may be added in suitable amounts to impart a desired color to the invention composition. Similarly, surfactants or wetting agents may optionally be added to the composition as is common in the art.
The invention composition is applied to a substrate by any suitable means to form a film or coating thereon and the film or coating is then heated to the curing temperature by means commonly used in the art such as a hot air oven, a bank of infrared heat lamps or the like.
The following examples serve to illustrate the composition of the invention, the curing and employment thereof for the preparation of films and coatings. Unless otherwise designated, the term "parts" when employed herein means parts by weight.
PAC Preparation of Hemi-formalOne mole (275 g) of the monomethyl ether of polypropylene glycol of the formula ##STR5## was combined with 91 percent paraformaldehyde (33.0 g, 1 mole) in the presence of 0.6 g paratoluene sulfonic acid catalyst. The reagents were mixed and heated to 100°C with stirring. A clear solution resulted. Filtration to remove unreacted paraformaldehyde produced the desired hemi-formal of the formula ##STR6## in 98 percent purity and about 94 percent yield.
PAC Preparation of CoatingsThe hemi-formal prepared above was combined with an acrylic resin and a melamine resin in the proportions indicated by Table I. The reactants were mixed until homogeneous and the coating formulation applied in a thin film to a preweighed aluminum panel. The panel was then reweighed and placed in a forced-air oven for 30 minutes at 150°C The panel was then removed from the oven, cooled and reweighed. The difference (loss) in weight of the cured panels in percent is a measure of the volatiles in the composition. The percent volatiles is taken as a measure of the effectiveness of the diluent's incorporation into the cured coating composition.
| TABLE I |
| ______________________________________ |
| Wt. |
| Wt. Mel- Wt. |
| Acrylic Wt. amine Cata- % |
| Resin1 Solvent |
| resin2 |
| lyst3 |
| Vola- |
| Run (g) Solvent (g) (g) (g) tiles |
| ______________________________________ |
| Ex.1 |
| 1 2.75 hemi- 2.60 4.48 <0.0024 |
| 30.8 |
| formal |
| 2 2.75 Ex.1 |
| 2.60 5.60 <0.002 30.9 |
| hemi- |
| formal |
| 3* 2.75 PGM5 |
| 2.60 4.98 0.04 33.9 |
| 4 2.75 PGM5 |
| 2.60 6.23 0.04 31.9 |
| 5 2.75 PGM5 |
| 2.60 7.48 0.04 33.9 |
| 6 2.75 PGM5 |
| 2.60 6.23 -- 39.3 |
| 7 2.75 PGM5 |
| 2.60 7.48 -- 39.5 |
| Ethoxy- |
| 8 2.75 ethyl 2.18 1.48 -- 50.85 |
| Acetate |
| ______________________________________ |
| *Runs 3-8 are comparative examples. |
| 1 The acrylic resin was a commercially available resin marketed as |
| Acryloid AT400. |
| 2 The melamine resin was trimethoxymethyl melamine having equivalent |
| weight of 86 g sold commercially as Cymel 325. |
| 3 pToluene sulfonic acid. |
| 4 Present only as an impurity from hemiformal production. |
| 5 Monomethyl ether of polypropylene glycol of the approximate formul |
| ##STR7## |
The coatings prepared according to Example 2 were then tested. Where applicable in the succeeding examples the following test procedures were employed. Hardness was determined using a Tukon hardness tester and is reported as a Knoop hardness number. Reverse Impact was tested according to the procedures of ASTM D2794-69. Water resistance was determined by immersing cured panels in boiling water for one hour and examining the coating for damage such as blistering or delamination. Adhesion was tested according to ASTM D3359-74.
The coatings prepared in Example 2 above were tested according to the preceding methods. The results are summarized in Table II.
| TABLE II |
| ______________________________________ |
| Physical properties for |
| coatings in Table I |
| Reverse |
| Knoop Impact, % |
| Run Hardness in-lbs Adhesion |
| ______________________________________ |
| 1 6.4 >10,<20 95 |
| 2 13.5 >20,<30 100 |
| 3 17.3 <4 0 |
| 4 19.4 <4 2 |
| 5 16.6 <4 0 |
| 6 15.2 <4 99 |
| 7 12.6 <4 100 |
| 8 16.8 <4 10 |
| ______________________________________ |
A second sample of hemi-formal was prepared according to the procedure of Example 1 except that a strong acid resin was employed as the catalyst. Removal by filtration resulted in a highly pure product uncontaminated with residual catalyst. Tables III and IV indicate compositions and physical properties of the resulting cured coatings after formulation, curing and testing according to the procedures employed in Examples 2 and 3.
| TABLE III |
| ______________________________________ |
| Wt. |
| Wt. Mel- |
| Acrylic Wt. amine % |
| Resin1 Solvent resin2 |
| Vola- |
| Run (g) Solvent (g) (g) tiles |
| ______________________________________ |
| 1 2.75 hemi-formal |
| 2.60 4.48 29.4 |
| 2 2.75 " 2.60 5.60 28.6 |
| 3 2.75 " 2.60 6.72 29.3 |
| ______________________________________ |
| 1 Acryloid® AT-400 |
| 2 Cymel® 325 |
| TABLE IV |
| ______________________________________ |
| Physical properties for |
| coatings in Table III |
| Reverse |
| Knoop Impact, % |
| Run Hardness in-lbs Adhesion |
| ______________________________________ |
| 1 4.9 20 100 |
| 2 5.0 30 100 |
| 3 2.9 >20,<30 100 |
| ______________________________________ |
A coating composition was prepared utilizing an epoxy resin, a melamine/formaldehyde resin, a reactive diluent and a catalyst. Panels were coated and cured according to the procedure of Examples 2 and 3. The results are contained in Tables V and VI.
| TABLE V |
| ______________________________________ |
| Wt. |
| Wt. Mel- Wt. |
| Epoxy Wt. amine Cata- % |
| Resin1 Solvent |
| resin2 |
| lyst3 |
| Vola- |
| Run (g) Solvent (g) (g) (g) tiles |
| ______________________________________ |
| 1 1.35 Ethoxy- 3.50 0.15 0.007 72.0 |
| ethyl |
| acetate |
| 2 1.35 PGM 3.50 4.43 0.007 30.8 |
| 3 1.35 " 3.50 5.54 0.007 29.9 |
| 4 1.35 " 3.50 6.65 0.007 26.6 |
| hemi- |
| 5 1.35 formal 350 4.21 0.02 28.4 |
| hemi- |
| 6 1.35 formal 3.50 5.26 0.02 26.6 |
| ______________________________________ |
| 1 A commercially available high molecular weight diglycidyl ether of |
| bisphenol A sold as DER® 667 epoxy resin. |
| 2 Hexamethoxy methyl melamine, equivalent weight = 65 g, available a |
| Cymel® 303. |
| 3 p-Toluene sulfonic acid. |
| TABLE VI |
| ______________________________________ |
| Physical properties for |
| coatings in Table V |
| Reverse |
| Knoop Impact, % |
| Run Hardness in-lbs Adhesion |
| ______________________________________ |
| 1 12.7 40 100 |
| 2 <2.8 >30,<40 100 |
| 3 5.3 >40 100 |
| 4 <2.8 40 100 |
| 5 11.0 >4,<10 99 |
| 6 17.0 >4,<10 99 |
| ______________________________________ |
A coating composition was prepared utilizing an epoxy resin, a urea-formaldehyde resin, a reactive diluent and a catalyst. Results are contained in Tables VII and VIII.
| TABLE VII |
| ______________________________________ |
| Wt. |
| Urea- |
| Wt. Formal- |
| Wt. |
| Epoxy Wt. dehyde Cata- % |
| Resin1 Solvent |
| resin2 |
| lyst3 |
| Vola- |
| Run (g) Solvent (g) (g) (g) tiles |
| ______________________________________ |
| 1 2.34 EE-Ace- 4.35 1.64 -- 58.2 |
| tate/- |
| xylene |
| 2* 2.34 PGM 4.35 8.92 0.01 49.7 |
| 3* 2.34 " 4.35 9.91 0.01 51.9 |
| 4 2.34 hemi- 4.35 9.56 0.05 36.6 |
| formal |
| 5 2.34 hemi- 4.35 10.76 0.05 36.3 |
| formal |
| 6 2.34 hemi- 4.35 11.95 0.05 35.6 |
| formal |
| ______________________________________ |
| *Cured at 175°C |
| 1 A low melting resin of diglycidyl ether of Bisphenol A sold as |
| DER® 661 epoxy resin. |
| 2 A urea/formaldehyde resin sold commercially as Cargill® 2156 |
| having equivalent weight of 59. |
| 3 p-Toluene sulfonic acid. |
| TABLE VIII |
| ______________________________________ |
| Physical properties for |
| coatings in Table VII |
| Reverse |
| Knoop Impact, Water % |
| Run Hardness in-lbs Resistance |
| Adhesion |
| ______________________________________ |
| 1 4.8 >10,<20 5% blush, |
| 100 |
| blister |
| 2 10.5 >4,<10 5% delam. |
| 100 |
| 3 11.1 >4,<10 100% delam. |
| 100 |
| 4 7.4 20 no effect |
| 90 |
| 5 5.5 >20,<30 1% blush 90 |
| 6 4.8 20 2% blush 50 |
| ______________________________________ |
Smith, Harry A., Berazosky, Sandra
| Patent | Priority | Assignee | Title |
| 6133403, | Dec 27 1995 | WILMINGTON SAVINGS FUND SOCIETY, FSB, AS THE CURRENT COLLATERAL AGENT | Reactive diluents for acid curable phenolic compositions |
| 6355307, | Jun 18 1997 | Dupont Performance Coatings GmbH & Co. | Transparent coating agents and the use thereof to produce multi-layered coatings |
| Patent | Priority | Assignee | Title |
| 4256622, | Oct 25 1977 | The Dow Chemical Company | Curable hydroxy resin compositions |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Feb 25 1981 | BERAZOSKY, SANDRA | DOW CHEMICAL COMPANY, THE | ASSIGNMENT OF ASSIGNORS INTEREST | 003920 | /0968 | |
| Feb 25 1981 | SMITH, HARRY A | DOW CHEMICAL COMPANY, THE | ASSIGNMENT OF ASSIGNORS INTEREST | 003920 | /0968 | |
| Feb 26 1981 | The Dow Chemical Company | (assignment on the face of the patent) | / |
| Date | Maintenance Fee Events |
| May 16 1985 | M170: Payment of Maintenance Fee, 4th Year, PL 96-517. |
| May 12 1989 | M171: Payment of Maintenance Fee, 8th Year, PL 96-517. |
| May 18 1989 | ASPN: Payor Number Assigned. |
| Apr 22 1993 | M185: Payment of Maintenance Fee, 12th Year, Large Entity. |
| Date | Maintenance Schedule |
| Feb 09 1985 | 4 years fee payment window open |
| Aug 09 1985 | 6 months grace period start (w surcharge) |
| Feb 09 1986 | patent expiry (for year 4) |
| Feb 09 1988 | 2 years to revive unintentionally abandoned end. (for year 4) |
| Feb 09 1989 | 8 years fee payment window open |
| Aug 09 1989 | 6 months grace period start (w surcharge) |
| Feb 09 1990 | patent expiry (for year 8) |
| Feb 09 1992 | 2 years to revive unintentionally abandoned end. (for year 8) |
| Feb 09 1993 | 12 years fee payment window open |
| Aug 09 1993 | 6 months grace period start (w surcharge) |
| Feb 09 1994 | patent expiry (for year 12) |
| Feb 09 1996 | 2 years to revive unintentionally abandoned end. (for year 12) |