A microfilled dental composite containing from about 30% to about 60% filler. The filler being sub-micron hydrophobic silica particles of about 0.01-0.04 micrometers in diameter. The filler is dispersed in ethoxylated bisphenol A dimethacrylate resin containing suitable aliphatic dimethacrylate diluents up to about 40% by weight and curing agents effecting curing.

Patent
   4859716
Priority
Nov 06 1987
Filed
Nov 06 1987
Issued
Aug 22 1989
Expiry
Nov 06 2007
Assg.orig
Entity
Small
19
2
all paid
5. A microfilled dental composite, comprising:
______________________________________
Component Parts by Weight
______________________________________
Ethoxylated bisphenol A
dimethacrylate 67.75-36.00
Triethylene glycol
dimethacrylate 11.00-16.94
Anti-oxidant (e.g., butyl
hydroxy toluene) 0.002-0.02
Curing agent 0.05-0.20
Cure accelerator 0.05-0.20
Sub-micron hydrophobic
silica particles 15.00-55.00
______________________________________
9. A dental composite consisting essentially of: a light-cured paste as follows:
Ethoxylated bisphenol A dimethacrylate: 80.00 pbw
Triethylene glycol dimethacrylate: 20.00
Butylated hydroxytoluene: 0.0125
2,3-Bornanedione: 0.18
Ethyl-4-dimethyl amino benzoate: 0.18
Sub-micron hydrophobic silica, particle size range 0.01-0.04 microns: 50.00.
1. A microfilled dental composite containing from about 30% to about 60% filler, said filler being sub-micron hydrophobic silica particles of about 0.01-0.04 micrometers in diameter,
dispersed in ethoxylated bisphenol A dimethacrylate resin containing suitable aliphatic dimethacrylate diluents up to about 40% by weight and curing agents effecting curing.
2. The composite of claim 1 including means for effecting a one-component light-cured material.
3. The composite of claim 1 containing a two-component self-cured material.
4. The composite of claim 1 in the form of a single, light-cured paste that is applied, and shaped and then cured by exposure to a dental curing visible light.
6. The composite of claim 5 wherein the sub-micron hydrophobic silica has a particle range of 0.01 to 0.04 microns, with an average particle size of approximately 0.02 micron (20×10-7 cm) and is based on hydrophobic very pure silicon dioxide aerosol obtained by flame hydrolysis, the particles varying in diameter between 10 and 40μ having on each 100 sq. meters of surface area about 0.5 millimol silanol groups so that it is hydrophilic and on its surface, one silanol group per 28-33 Å2 (--Si--OH) so that with 200 square meters per gram specific surface area, there are about 6.2×1020 silanol groups per gram, i.e., one millimol and therefrom about 2000 silanol groups per particle.
7. The composite of claim 5 wherein the curing agent is 2,3-bornanedione and ethyl-4-dimethyl amino benzoate.
8. The composite of claim 5 wherein the curing agents and cure accelerators are chosen from the following pairs:
2,3-Bornanedione with ethyl-2-dimethyl amino benzoate
Benzil with ethyl-4-dimethyl amino benzoate
Benzil with ethyl-2-dimethyl amino benzoate
2-Isopropyl thioxanthone with ethyl-4-dimethyl amino benzoate
2-Isopropyl thioxanthone with ethyl-2-dimethyl amino benzoate
Dibenzyl ketone with ethyl-4-dimethyl amino benzoate
Dibenzyl ketone with ethyl-2-dimethyl amino benzoate
2-Hydroxy-2-methyl-1-phenyl-propan-1-one with ethyl-2-dimethyl amino benzoate
2-Hydroxy-2-methyl-1-phenyl-propan-1-one with ethyl-4-dimethyl amino benzoate
Benzil dimethyl acetal with ethyl-4-dimethyl amino benzoate
Benzil dimethyl acetal with ethyl-2-dimethyl amino benzoate
Dimethoxy acetophenone with ethyl-4-dimethyl amino benzoate
Dimethoxy acetophenone with ethyl-4-dimethyl amino benzoate
Benzoin methyl ether with ethyl-4-dimethyl amino benzoate
Benzoin methyl ether with ethyl-2-dimethyl amino benzoate.

This invention relates to a microfilled dental composite and to a method employing it.

Heretofore the fillers in dental composites have been composed of particles from about 0.56 micron to about 150 microns in diameter. These relatively large particles have resulted in a rougher type of finish than many practitioners desired. Yet, although some manufacturers used a small amount of submicron filler particles, which are typically 0.02 to 0.04 micron in diameter (to eliminate settling, for example), they have used them only up to about 5% by weight of the composite, and most of the particles remained relatively large.

Recently, various manufacturers have placed on the market "microfilled" composites in which all of the filler was in the 0.02 to 0.04 micron range, and a smoother finish was thereby obtained. However, when using these small particle fillers, only about 25% to 50% of the composite could be filler.

When such a relatively small percentage of filler was added to the typical dental resin, the result was that physical properties, such as tensile strength and water sorption, were severely compromised.

The present invention provides a microfilled dental composite containing from about 30% to about 60% filler, said filler being sub-micron hydrophobic silica particles of about 0.01-0.04 micrometers in diameter. The filler is dispersed in a resin, the main component of which is ethoxylated bisphenol A dimethacrylate, with suitable aliphatic dimethacrylate diluents up to about 40% by weight. Curing agents are added to effect a one-component light-cured restorative or a two-component self-cured material. A three-part curing system can be used to produce a two-component light-cured material with infinite cure, as in U.S. Pat. No. 4,297,266, issued Oct. 27, 1981 to Ibsen, et al.

The resultant cured material exhibits the smooth finish of a microfilled restorative, but has physical properties in the same range as conventional "small particle" restorative.

The system is preferably a single, light-cured paste which is applied, shaped, etc. by the dentist, then cured by exposure to a special dental curing light.

A formulation system embodying this invention comprises the following illustrative ranges:

______________________________________
Component Parts by Weight
______________________________________
Ethoxylated bisphenol A
dimethacrylate 67.75-36.00
Triethylene glycol
dimethacrylate 11.00-16.94
Anti-oxidant (e.g., butyl
hydroxy toluene) 0.002-0.02
Curing agent (e.g.,
2,3-Bornanedione) 0.05-0.20
Cure accelerator (e.g., Ethyl-
4-dimethylamino benzoate)
0.05-0.20
Sub-micron hydrophobic
silica particles 15.00-55.00
______________________________________

The submicron hydrophobic silica may be Degussa's Aerosil R 972 which has a particle range of 0.01 to 0.04 microns, with an average particle size of approximately 0.02 micron (20×10-7 cm). The basis for the manufacture of hydrophobic silica is a very pure form of silicon dioxide aerosol obtained by flame hydrolysis. Its particles vary in diameter between 10 and 40μ. On each 100 sq. meters of surface area, it has about 0.5 millimol silanol groups; hence it is hydrophilic. On its surface, there is a one silanol group per 28-33 Å2 (--Si--OH). Hence, with 200 square meters per gram specific surface area, there are about 6.2×1020 silanol groups per gram, i.e., one millimol. This gives a figure of about 2000 silanol groups per particle.

In a continuous process, some 75% of these silanol groups can be chemically reacted with dimethyl dichlorosilane, the resultant product having about 0.7 millimol of chemically combined methyl groups per 100 square meters of surface area. The silica when thus reacted becomes hydrophobic and behaves differently in organic liquids from the hydrophilic material. For this purpose, freshly obtained hydrophilic silica is separated from the bulk of the hydrochloric acid formed in the flame hydrolysis. Then, this silica, dimethyl dichlorosilane, and steam are pneumatically fed in parallel flow into a fluidized bed reactor heated to about 400°C by means of an inert gas such as nitrogen. Besides the chemical reaction of the chlorosilane with the silanol groups of the surface, the desorption of the hydrochloric acid resulting from the reaction takes place in the reactor in a continuous stream, so that there is an analytically assessable chlorine content of below 0.03%. The main quantity of hydrochloric acid is removed from the freshly manufactured SiO2 and the material does not yet contain any absorbed water. Moreover, siloxane bridges still exist on the surface of the particles, these having formed at the high temperatures used in the process. These bridges break up in the presence of water vapor and chlorosilane in the reaction zone, whereupon the reaction can take place in the nascent state of the silanol group formation.

Analytical data and moisture absorption data of hydrophobic silica are given in Tables 1 and 2 respectively.

TABLE 1
______________________________________
Analytical Data on Hydrophobic AEROSIL R 972
______________________________________
SiO2 + (--CH3)
99.8%
Surface area
(acc. to Bruneuer, Emmet & Teller)
120 ± 30 m2 /g
Average particle size 20 ± 10-7 cm
Carbon 1.1 ± 0.2%
pH value (4% dispersion
methanol/water 1:1) 3.8 ± 0.2%
Chlorine content 0.04 ± 0.01%
Heavy metals 0.003%
As 0.0001%
Fe2 O3 0.003%
Al2 O3 0.05%
TiO2 0.03%
Na2 O 0.01%
Bulk density about 40-60 g/l
Compacted volume about 10 ml/g .
______________________________________
TABLE 2
______________________________________
Moisture Absorption in mg/100 m2
Relative air humidity in %
20 40 60 80
______________________________________
Hydrophilic silica
1.3 4.0 10 30
Hydrophobic silica
0.3 0.4 0.9 1.5.
______________________________________

2,3-Bornanedione and Ethyl-4-dimethyl amino benzoate are exiplex-forming photo initiators. Other suitable photo initiators include:

2,3-Bornanedione with ethyl-2-dimethyl amino benzoate

Benzil with ethyl-4-dimethyl amino benzoate

Benzil with ethyl-2-dimethyl amino benzoate

2-Isopropyl thioxanthone with ethyl-4-dimethyl amino benzoate

2-Isopropyl thioxanthone with ethyl-2-dimethyl amino benzoate

Dibenzyl ketone with ethyl-4-dimethyl amino benzoate

Dibenzyl ketone with ethyl-2-dimethyl amino benzoate

2-Hydroxy-2-methyl-1-phenyl-propan-1-one with ethyl-2-dimethyl amino benzoate

2-Hydroxy-2-methyl-1-phenyl-propan-1-one with ethyl-4-dimethyl amino benzoate

Benzil dimethyl acetal with ethyl-4-dimethyl amino benzoate

Benzil dimethyl acetal with ethyl-2-dimethyl amino benzoate

Dimethoxy acetophenone with ethyl-4-dimethyl amino benzoate

Dimethoxy acetophenone with ethyl-4-dimethyl amino benzoate

Benzoin methyl ether with ethyl-4-dimethyl amino benzoate

Benzoin methyl ether with ethyl-2-dimethyl amino benzoate.

A light-cured paste was made as follows:

Ethoxylated bisphenol A dimethacrylate: 80.00 pbw

Triethylene glycol dimethacrylate: 20.00

Butylated hydroxytoluene: 0.0125

2,3-Bornanedione: 0.18

Ethyl-4-dimethyl amino benzoate: 0.18

Sub-micron hydrophobic silica: 50.00

This paste was compared with one excellent non-microfilled dental composite and with two competing microfilled composites. The test results are shown in Table 3.

TABLE 3
__________________________________________________________________________
Tensile
Cure Thermal
Water
Strength
Shrinkage
Expansion
Sorption
Water
(psi) (%) (ppm/°C.)*
(mg/cm2)
Stability
__________________________________________________________________________
An excellent non-
microfilled dental
composite 7000 0.50 17 0.45 Excellent
The dental
composite of this
invention 6114 0.71 29 0.47 Excellent
1st competing
microfilled
composite (Silux)
3890 1.29 55 1.33 Poor
2nd competing
microfilled
composite (Durafil)
3485 1.16 62 1.05 Medium
__________________________________________________________________________
*Over range of 5° to 55°C

As these tests show, the tensile strength of the dental composite of this invention is substantially greater than that of the two competing microfilled composites and almost equal to that of an excellent non-microfilled composite. The cure shrinkage is lower than that of any of the microfilled composites. Thermal expansion is not much greater than that of the tested non-microfilled composite and much less than that of any of the microfilled composite. Water sorption is equal to that of the non-microfilled composite and very much less than that of the competing microfilled composites. Furthermore, color stability is excellent.

Water sorption with the system is below 0.5 mg/cm2, even with only 30% filler. It remains low throughout the filler range at every concentration tested up to 55% total filler.

Two pastes were prepared as followed:

Ethoxylated bisphenol A dimethacrylate: 80.00 pbw

Triethylene glycol dimethacrylate: 20.00

Butylated hydroxytoluene: 0.0125

Benzoyl Peroxide: 1.50

Sub-micron hydrophobic silica: 50.00

Ethoxylated bisphenol A dimethacrylate: 80.00 pbw

Triethylene glycol dimethacrylate: 20.00

Butylated hydroxytoluene: 0.0125

2-hydroxy ethyl p-toluidine: 4.25

Sub-micron hydrophobic silica: 50.00

These pastes comprised a "self-cured" version of the present invention. When these two parts were mixed together, the material cured in 21/2 minutes and exhibited the following properties:

Tensile strength: 6100 psi

Water sorption: 0.47

Thermal Expansion: 29 ppm/°C.

Two pastes were prepared as followed:

Ethoxylated bisphenol A dimethacrylate: 80.00 pbw

Triethylene glycol dimethacrylate: 20.00

Butylated hydroxytoluene: 0.0125

Benzoyl Peroxide: 0.55

Sub-micron hydrophobic silica: 50.00

Ethoxylated bisphenol A dimethacrylate: 80.00 pbw

Triethylene glycol dimethacrylate: 20.00

Butylated hydroxytoluene: 0.0125

2,3-Bornanedione: 0.18

Ethyl-4-dimethyl amino benzoate: 20.00

Sub-micron hydrophobic silica: 50.00.

When these two parts were mixed together in equal portions, they did not react; however, when activated with a dental curing unit, the material hardened immediately to a depth of about 31/2 mm. The material was placed in the absence of light for one hour and again checked for depth of cure. Cure had extended to the depth of the sample, i.e., 12 mm.

This example illustrates the use of the present invention in the form of a continuous cure two-part system.

A paste was prepared as follows:

Ethoxylated bisphenol A dimethacrylate: 67.75 pbw

Triethylene glycol dimethacrylate: 16.94

Butylated hydroxytoluene: 0.02

2,3-Bornanedione: 0.20

Ethyl-4-dimethyl amino benzoate: 0.20

Sub-micron hydrophobic silica: 15.00.

When exposed to a dental curing light for 30 seconds, the material cured to a depth of 5.35 mm, and had a tensile strength of 5800 psi.

A pste was prepared as followed:

Ethoxylated bisphenol A dimethacrylate: 36.00 pbw

Triethylene glycol dimethacrylate: 11.00

Butylated hydroxytoluene: 0.002

2,3-Bornanedion: 0.05

Ethyl-4-dimethyl amino benzoate: 0.05

Sub-micron hydrophobic silica: 55.00.

When exposed to a dental curing light for 30 seconds, the material cured to a depth of 4.85 mm, and had a tensile strength of 7800 psi.

To those skilled in the art to which this invention relates, many changes in construction and widely differing embodiments and applications of the invention will suggest themselves without departing from the spirit and scope of the invention. The disclosures and the descriptions herein are purely illustrative and are not intended to be in any sense limiting.

Ibsen, Robert L., Glace, William R.

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Nov 05 1987IBSEN, ROBERT L DEN-MAT CORPORATION, 3130 SKYWAY DRIVE, UNIT 501, SANTA MARIA, CALIFORNIA 93455, A CORP OF DEASSIGNMENT OF ASSIGNORS INTEREST 0047900822 pdf
Nov 05 1987GLACE, WILLIAM R DEN-MAT CORPORATION, 3130 SKYWAY DRIVE, UNIT 501, SANTA MARIA, CALIFORNIA 93455, A CORP OF DEASSIGNMENT OF ASSIGNORS INTEREST 0047900822 pdf
Nov 06 1987Den-Mat Corporation(assignment on the face of the patent)
Aug 22 2007Den-Mat CorporationDen-Mat Holdings LLCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0197810024 pdf
Dec 13 2007Den-Mat Holdings, LLCDYMAS FUNDING COMPANY, LLC, AS ADMINISTRATIVE AGENTSECURITY AGREEMENT0202990955 pdf
Nov 14 2011DYMAS FUNDING COMPANY, LLCDen-Mat Holdings, LLCRELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS 0272260873 pdf
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