A row redundancy circuit for use in a semiconductor memory device of the present invention having a fuse box independent of banks so as to improve repair efficiency. The row redundancy circuit includes a fuse box coupled to a row address and a bank address from an address buffer in which a fuse corresponding to an address of a word line to be repaired blows-out, a row fuse decoder for AND-operating two outputs of the fuse box, and a bank row address latch coupled to the output of the row fuse decoder for determining a location of a redundant word line in a block to be repaired.
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1. In a semiconductor memory device, a row redundancy circuit comprising:
a fuse box receiving a row address and a bank address from an address buffer in which a fuse corresponding to an address of a word line to be repaired blows-out; a row fuse decoder for AND-operating two outputs of the fuse box; and a bank row address latching means coupled to an output of the row fuse decoder for determining a location of a redundant word line in a block to be repaired.
2. The row redundancy circuit as recited in
an NMOS transistor having a gate for receiving a fuse pre-charge signal and a source-drain formed between a first node and a ground; a plurality of parallel-coupled NMOS transistors, each having a gate for receiving a corresponding one of 0-th to 13-th row addresses and a source-drain formed between a second node and a third node; a PMOS transistor having a gate for receiving the fuse pre-charge signal and a source-drain formed between a power voltage and the second node; and a latch for latching a signal applied to the second node to output a fuse output signal.
3. The row redundancy circuit as recited in
a NAND gate for receiving a fuse output signal from the fuse box; and an inverter for inverting an output of the NAND gate.
4. The row redundancy circuit as recited in
a bank row fuse decoder for receiving a bank row fuse output signal from the row fuse decoder for selecting a bank to be activated; repair controlling means for receiving a bank row fuse output signal from the bank row fuse decoder for selecting the location of the word line to be repaired; redundant word line selecting means for receiving an upper selection signal and a lower selection signal from the repair controlling means for selecting a redundant word line in a sub-block; and sub-block selecting means for receiving a normal row enable signal and a normal row disable signal from the repair controlling means for selecting one of four sub-blocks in a bank.
5. The row redundancy circuit as recited in
two NMOS transistors with respective gates for respectively receiving a bank active pulse signal activating the bank and the bank row fuse output signal, source-drains of said NMOS transistors being serially coupled between a node and a ground; a PMOS transistor having a gate for receiving a bank pre-charge pulse signal for pre-charging the bank when the bank is deactivated and a source-drain formed between a power voltage and the node; and a latch for latching the bank row fuse output signal in response to the node.
6. The row redundancy circuit as recited in
summing means for OR-operating the bank row fuse output signal; a NOR gate for NOR-operating a first output signal and a second output signal of the summing means; two serially-coupled first inverters for delaying the first output signal to output an upper selection signal; two serially-coupled second inverters for delaying the second output signal to output a lower selection signal; a first pulse generating means coupled to an output of the NOR gate for generating a pulse; a third inverter for inverting an output of the first pulse generating means to output the normal row enable signal; a first NAND gate for receiving and NAND-operating the first output signal and an inverted second output signal; a second NAND gate for receiving and NAND-operating an inverted first output signal and the second output signal; a third NAND gate for NAND-operating outputs of first NAND gate and the second NAND gate; a second pulse generating means coupled to an output of the third NAND gate for generating a pulse; and a fourth inverter for inverting an output of the second pulse generating means to the normal row disable signal.
7. The row redundancy circuit as recited in
two first NMOS transistors having respective gates for respectively receiving a bank active pulse signal activating the bank and the upper selection signal, and having source-drains serially coupled between a second node and a ground; a first PMOS transistor having a gate for receiving a bank pre-charge pulse signal for pre-charging the bank when the bank is deactivated and a source-drain coupled between a power voltage and the second node; a first latch for latching the second node; two first inverters coupled to an output of the first latch to output an upper redundant word line signal; two second NMOS transistors having respective gates for respectively receiving the bank active pulse signal activating the bank and the lower selection signal, and having source-drains serially coupled between a third node and the ground; a second PMOS transistor having a gate for receiving the bank pre-charge pulse signal for pre-charging the bank when the bank is deactivated and a source-drain coupled between the power voltage and the third node; a second latch for latching the third node; and two inverters coupled to an output of the second latch to output a lower redundant word line signal.
8. The row redundancy circuit as recited in
three NMOS transistors having respective gates for respectively receiving the normal row enable signal, tenth row address and eleventh row address, and serially coupled between a second node and a ground; a PMOS transistor having a gate for receiving a bank pre-charge pulse signal and a source-drain formed between a power voltage and the second node; a NAND gate for NAND-operating the bank row fuse output signal; two NMOS transistors having respective gates for respectively receiving an output of the NAND gate and the normal row disable signal, and coupled serially between the second node and the ground; a latch for latching the second node; and two serially coupled inverters for delaying an output of the latch by a predetermined time delay to output a sub-block selection signal.
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The present invention relates to a semiconductor memory device and, more particularly, to a row redundancy circuit.
Generally, because the cost of a semiconductor memory device depends on its yield, redundancy memory cells are added to normal cells to improve the yield. To do this, a method for repairing defective memory cells by replacing them with the redundancy memory cells has been used. However, in highly integrated and large capacity devices higher than 256 Mb, power consumption is increased as a result of unexpected current paths generated during waiting state of the memory device due to bridges generated during processing as the size of a chip is increased. In addition, insufficiency of planer margin due to narrowed line width leads to frequent generation of defects.
In operation, after one of the four banks is selected by a bank selecting circuit, if there is no blown-out fuse in the fuse box of the fuse box array, the output of the fuse box activates a row decoder through a circuit for OR-operating the outputs of the fuses in the fuse box array. If the fuse corresponding to the address of the corresponding sub-memory cell block is blown-out, the output of the fuse box activates the redundancy word line through a circuit for detecting the output signal and deactivates normal word lines.
The fuse box array used with the structure of
In the conventional method for repairing the row word line of the failed bank by using only the fuse box associated with the bank, repair is impossible if the number of the redundancy word lines is larger than that of the word lines having fail bits in a bank.
If the number of the fuse boxes and the redundant word lines are included in the bank in order to solve this problem, repair efficiency is reduced because cost is increased and only the fuse boxes connected within the bank should be used for repairing.
Therefore, it is an object of the present invention to provide a row redundancy circuit capable of improving repair efficiency by repairing independently of banks.
In accordance with an aspect of the present invention, there is provided a row redundant circuit in a semiconductor memory device, the circuit comprising a fuse box coupled to a row address and a bank address from an address buffer in which a fuse corresponding to an address of a word line to be repaired blows-out; a row fuse decoder for AND-operating two outputs of the fuse box; and a bank row address latching unit coupled to the output of the row fuse decoder for determining the location of a redundant word line in a block to be repaired.
The above and other objects and features of the instant invention will become apparent from the following description of preferred embodiments taken in conjunction with the accompanying drawings, in which:
The present invention discloses a configuration in which information for a sub-memory cell block as well as information for a bank within which a word line to be repaired is located are applied to a fuse box. Therefore, the present invention is capable of repairing a failed word line with a fuse box because an arbitrary fuse box can repair the failed word line independently of the bank and the sub-memory cell block to which the failed word line belongs, so as to improve efficiency.
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Since the row address and the bank address are applied to the fuse box, an arbitrary fuse box can be used to repair when row fail happens.
Referring to
When the fuse pre-charge signal axp is activated as logic low, the common node is pre-charged to logic high and the fuse output signal xfout latches logic low. When the fuse pre-charge signal axp transits to logic high and the row address corresponding to a failure is activated, the fuse output signal xfout rises to logic high by pull-down operation of the first to fourth NMOS transistors if the fuse is not blown-out. In addition, the common node remains logic high by the PMOS transistor of the latch 460 to which the fuse output signal xfout is fed-back and the fuse output signal xfout remains logic low so as to notify that the row address corresponding to the failed word line is applied if the fuse is blown-out. After this, in word line deactivation operation, when the address signals at<0:13>, atz<0:13> are initialized to logic low and then the fuse pre-charge signal axp is initialized to logic low, the common node and the fuse output signal xfout are pre-charged.
Referring to
In operation, when the bank active pulse signal bxactvp and the row fuse output signal xfop are activated to logic high, the bank pre-charge pulse signal bxpcgp pre-charging the node b to logic high discharges the node b to the ground so as to activate the bank row fuse output signal bxfoz to logic high.
In normal operation, when the bank row fuse output signal bxfoz<0:15> is logic high, the normal row enable signal nre is activated to logic high and the first output signal sel0 and the second output signal sell are deactivated to logic low so that the normal row disable signal nrd is made as logic low to execute the normal operation. For repair operation, when some of the bank row fuse output signal bxfoz<0:15> are logic low, the normal row enable signal nre is deactivated to logic low and the first output signal sel0 or the second output signal sell is activated to logic high so that the normal row disable signal nrd is made as logic high to execute the repair operation.
The redundant word line selecting unit 620 receives the upper selection signal sel_up and the lower selection signal sel_dn and activates one of the upper redundant word line signal rw_up and the lower redundant word line signal rw_dn of the sub-block so as to select one of an upper word line and a lower word line of the sub-block.
In addition, there are shown three other circuits identical to the circuit as described above and, during the normal operation, each sub-block selection signal sbs<0:3> is determined depending on the tenth and eleventh row addresses.
The bank row fuse output signal bxfoz<0:15> for 16 banks is divided by four and then applied to the input of the NAND gate 1120 and, for the repair operation, one of the four sub-block selection signals sbs<0:3> is selected. For the normal operation, the normal row enable signal nre is logic high and, for the repair operation, the normal row disable signal nrd is logic high.
As described above, by using a bank-flexible row redundancy scheme independently of banks in the present invention, any arbitrary fuse box can repair the failed cell so that the number of fuse boxes can be reduced and, therefore, layout size can be reduced and repair efficiency can be increased.
While the present invention has been shown and described with respect to the particular embodiments, it will be apparent to those skilled in the art that many changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
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