The present invention provides for a receptacle printed circuit board assembly having a reduced profile of the entire assembly where the receptacle has a board receiving portion that mounts at a cut-out edge of a printed circuit board so that the majority of the receptacle is mounted within a cut-out area of the printed circuit board recessed below the upper face of the printed circuit board so that the overall profile of the receptacle assembly is reduced. A shield flap or metallic hood is provided that helps to attach the receptacle to the printed circuit board and completely enclose the shielded portion of the receptacle.
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9. A metallic receptacle for receiving and shielding an electronic component received therein and having a first end forming an opening for receiving the electronic device therethrough wherein the improvement comprises:
a board receiving portion formed at a second end of the receptacle by at least two sides of the receptacle recessed from a major body edge of the receptacle formed along a majority of the receptacle between the first end and the second end; and the receptacle includes a metallic hood attached to the receptacle adjacent the board receiving portion and the board receiving portion attaches to a first side of the printed circuit board and the metallic hood attaches to a second side of the printed circuit board and a first mounting tab of the board receiving portion is received in a first aperture on the first side of the printed circuit board and protrudes toward the second side of the printed circuit board and a second mounting tab of the metallic hood is received in a second aperture on the second side of the printed circuit board and protrudes toward the first side.
1. A receptacle assembly including a printed circuit board having a cut-out portion along an edge of the printed circuit board and a major upper surface and a receptacle mounted to the cut-out portion of the printed circuit board and the receptacle has an opening for receiving an electronic component therein and the printed circuit board and the receptacle assembly have a profile defined by a height that a top surface of the receptacle is above the major upper surface and the receptacle is recessed within the cut-out portion so that the profile is less than a total height between the top surface and a bottom surface of the receptacle and wherein the improvement comprises:
a board receiving portion formed in the receptacle between the top and bottom surfaces at the end opposed to the opening and the board receiving portion includes a mounting member therein; and the receptacle includes a shield flap attached to the receptacle adjacent the board receiving portion and the board receiving portion attaches to a first side of the printed circuit board and the shield flap attaches to a second side of the printed circuit board and a first mounting tab of the board receiving portion is received in a first aperture on the first side of the printed circuit board and protrudes toward the second side of the printed circuit board and a second mounting tab of the shield flap is received in a second aperture on the second side of the printed circuit board and protrudes toward the first side.
2. The receptacle assembly of
3. The receptacle assembly of
4. The receptacle assembly of
5. The receptacle assembly of
6. The receptacle assembly of
7. The receptacle assembly of
8. The receptacle assembly of
10. The metallic receptacle of
11. The metallic receptacle of
12. The metallic receptacle of
13. The metallic receptacle of
14. The metallic receptacle of
15. The metallic receptacle of
16. The metallic receptacle of
17. The metallic receptacle of
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The present invention pertains to a receptacle assembly for shielding electromagnetic interference (EMI) and in more particular an EMI receptacle for receiving an electronic component therein such as an electronic or optoelectronic transceiver device for mounting to the EMI receptacle of a host device.
Receptacles for receiving electronic devices are known by such terms as receptacles, guide rails, cages or sockets. In many applications, multiple receptacles are mounted to a motherboard in side-by-side orientation. Multiple motherboards may be mounted within a host device so that rows of receptacles are provided. Generally the motherboard forms a planer surface which abuts the exterior wall or chassis of the host device. A hole is made in the chassis or a separate faceplate is formed in the chassis in order to provide a port through with electronic devices may be inserted into the receptacle which is mounted on the motherboard. In some circumstances the end of the receptacle may protrude through the faceplate opening in order to guide the electronic component within the receptacle and into the host device.
Receptacles that are known include small form factor pluggable (SFP) transceiver receptacles as disclosed in Multi-Source Agreement (MSA) (SFF-80741) which discloses a receptacle to receive an SFP transceiver therein. The receptacle or receptacle disclosed in the MSA includes mounting posts along the bottom of the receptacle so that the mounting posts may be received in the upper surface of the motherboard so that the receptacle is mounted onto the motherboard and the entire receptacle protrudes above the upper surface of the motherboard. Likewise, the electrical connector which is surrounded by the receptacle is surface mounted to a land grid array pattern provided on the upper face of the motherboard.
In such devices, the receptacle may have a height and protrudes above the motherboard by approximately 0.385 inches. When multiple motherboards are stacked or aligned within a host device in order to provide rows of receptacles within the host device, the height of the receptacle provides a limiting factor and dictates the spacing between the motherboards. Therefore, in the above example, the motherboards of a host device could not be spaced closer than 0.385 inches. In fact, some clearance is desirable between the top of a receptacle and the bottom of a motherboard in order that no metal to metal contact or electrical interconnection is made between the top of the receptacle and the bottom of the adjacent motherboard and also to allow for air circulation for cooling. Due to such spacing limitations a host device such as a router, hub or switch can only accommodate a limited number of rows of receptacles. Since the width of a side of a host device has a limited size based on the location to which the host device will be oriented, such as on a rack in a computer room or in a wiring closet; only a limited amount of space is available on the host device for providing rows of receptacles.
As the bandwidth capacity of a host device is increased, it is desirable to have additional ports available for more and more electronic devices such as transceivers. One manner of increasing the number of ports available in a host device is to allow for additional motherboards to be stacked within the host device in order to provide additional rows of receptacles. However, due to the limitations discussed above, with regard to the height that the receptacle protrudes above the motherboard, additional rows or receptacles are difficult to add in the confined width of a host device. As well, relocating of the motherboard with respect to the cut-out opening in the bezel or faceplate of the host device provides for better cable management and cooling of the receptacles and for the electronic devices mounted therein. Therefore, it would be desirable to provide a receptacle and motherboard assembly which provides for a reduced profile of the receptacle above the motherboard so that additional motherboards may be stacked side by side in order to allow for additional rows of receptacles in a host device. Such a reduced profile receptacle and motherboard assembly is provided by the present invention.
A receptacle assembly is provided comprising a printed circuit board having a cut-out portion along an edge of the printed circuit board. The receptacle includes a receptacle opening for receiving an electronic component therein. At the end opposed to the receptacle opening a board receiving portion is located between a top surface and a bottom surface of the receptacle. The receptacle is mounted to the printed circuit board at the board receiving portion so that the receptacle is recessed within the cut-out and a height that the receptacle protrudes beyond a major surface of the printed circuit board is less than a total height of the receptacle. The printed circuit board may include a mounting footprint for receiving mounting members or tabs of the receptacle. The receptacle board receiving portion includes a cut-out area of the receptacle having a mounting member tab protruding therefrom for insertion into an aperture in the printed circuit board.
In an embodiment, the receptacle may include a shield flap attached to the receptacle adjacent the board receiving portion. The shield flap may include a mounting tab for insertion into the printed circuit board. The shield flap may be pivotally attached to the receptacle. In an embodiment, the shield flap may include a living hinge formed between the shield flap and the receptacle. The shield flap may substantially enclose the board receiving portion of the receptacle. The board receiving portion may attach to a first side of the printed circuit board and the shield flap may attach to a second side of the printed circuit board. In an embodiment, a first mounting tab of the board receiving portion may be received in a first aperture on the first side of the printed circuit board and protrude toward the second side of the printed circuit board and a second mounting tab of the shield flap may be received in a second aperture on the second side of the printed circuit board and protrude toward the first side. An electrical connector may be provided that straddle mounts to the printed circuit board at the cut-out and is adjacent the board receiving portion of the receptacle. A top frame and/or bottom frame for supporting the receptacle within the cut-out may be provided.
In another embodiment, a metallic receptacle is provided for receiving and shielding an electronic component received therein and the receptacle comprises a first end forming and opening for receiving the electronic device therethrough, a second end having a board mounting area formed by at least two sides of the receptacle recessed from a major body edge of the receptacle formed along a majority of the receptacle between the first end and the second end and a shield flap attached at the second end adjacent the board mounting area. The sides of the receptacle may include mounting tabs for mounting the receptacle to a first side of a printed circuit board. In an embodiment, the shield flap may include mounting tabs for attaching the shield flap to second side of the printed circuit board. The shield flap may substantially enclose the second end of the receptacle. The shield flap may be pivotally attached to the receptacle via a living hinge. In an embodiment, a top frame support may be provided at the first end of the receptacle in order to assist in supporting the first end of the receptacle within a cut-out portion of the printed circuit board within which the receptacle is mounted. The first end of the receptacle may be supported by a bottom support frame attached at the first end of the receptacle and supporting the first end within a cut-out portion of a printed circuit board within which the receptacle is mounted. The board mounting area may form an open area allowing for the insertion therethrough of an electrical connector. The electrical connector may be attached to a printed circuit board.
For the purpose of facilitating an understanding of the subject matter sought to be protected, there are illustrated in the accompanying drawings embodiments thereof, from an inspection of which, when considered in connection with the following description, the subject matter sought to be protected, its construction and operation, and many of its advantages should be readily understood and appreciated.
The present invention is described with reference to a preferred embodiment that is depicted in
The receptacle 11 may include mounting members, for example, tabs 33, 34 provided within a cut-out section which forms the board receiving portion 31 of the receptacle 11. Adjacent the board receiving portion 31 is a metallic hood or shield flap 60. The shield flap 60 in a preferred embodiment is attached to the bottom of the receptacle 11 via a living hinge which allows the shield flap 60 to pivotally rotate between an open position as shown in
A rectangular shaped cut-out area 55 is formed at the first edge 51 of the printed circuit board 50 forming an offset edge 56. Electrical connectors 71, 72, 73 are mounted to the printed circuit board 50 at the offset edge 56 of the cut-out area 55. In a preferred embodiment, straddle mount electrical connectors 71, 72, 73 are provided to mount to the offset edge 56 of the cut-out 55. A fourth electrical connector (not shown) is mounted next to the third electrical connector 73. Each electrical connector 71, 72, 73, 74 corresponds with each corresponding receptacle 11, 12, 13, 14 which is mounted to surround the electrical connectors 71, 72, 73. In a preferred embodiment the electrical connectors 71, 72, 73 receive a card edge connection of an electronic component, such as a transceiver which is mounted within the receptacle 11. It should be understood that although four receptacles 11, 12, 13, 14 and four electrical connectors 71, 72, 73, 74 are depicted in
A preferred method of assembling the present invention will be described with reference to
Each receptacle 11, 12, 13, 14 is then mounted within the cut-out 55 so that the mounting tabs 33, 34 are received in the apertures 533, 534. In a preferred embodiment the apertures 533, 534 are bores that are coated with solder paste. As the receptacle 11 is mounted to the printed circuit board 50 the shield flap 60 is inserted through the cut-out 55 and protrudes below the bottom face of the second side 250 of the printed circuit board 50. The shield flap 60 is then rotated up towards the second side 250 of the printed circuit board 50 so that the mounting tabs 64, 66 are engaged by mounting tabs 35, 37 (FIGS. 3 and 4). In an embodiment, the mounting tabs 35, 37 have formed latches that are received by holes in the mounting tabs 64, 66. The apertures 533, 534 for receiving mounting tabs 33, 34 in an alternate embodiment, may not be coated with solder paste. However, such apertures 533, 534 in an embodiment have a ground plane exposed therein to make electrical contact with the mounting tabs 33, 34 in order to ground the receptacle thereto. A top frame support 82 is then mounted over the receptacle opening ends 21 of the receptacles 11, 12, 13, 14. In an embodiment, fasteners such as thumb screws 83, 84 are inserted through apertures at the ends of the top frame and bottom frame supports 81, 82 in order to secure the frame supports 81, 82 to the printed circuit board 50 and secure the receptacle opening ends 21 of the receptacles 11, 12, 13, 14 to the printed circuit board 50. Each frame includes alignment tabs 85, 86 and 95, 96, respectively, in order to align each receptacle 11, 12, 13, 14 laterally on the frame support 81, 82 so that cut-out 121, 122 of the faceplate 120 will align with the end of the receptacle.
The entire assembly 100 may then be placed in a reflow oven in order to reflow the solder provided at the footprint of the pads for the contact tails 87 of the electrical connectors 71, 72, 73 and to reflow the solder paste (if present) within the apertures 533, 534 that receive the mounting tabs 33, 34. After the reflow process, the assembly 100 is allowed to cool and the solder to cure which helps secure the mounting tabs 33, 34 within the apertures in order to rigidly secure the receptacles 11, 12, 13, 14 to the printed circuit board 50.
In a further method of assembly in a preferred embodiment, the motherboard 50 is then mounted within a host device. Additional motherboards may also be stacked next to the motherboard 50 in order to provide rows of receptacles 11, 12, 13, 14 within a host device. A faceplate 120 (
Turning to
As may be understood in view of the above description, a portion of each receptacle 11, 12, 13, 14 is recessed below the upper major surface 150 of the printed circuit board 50. By recessing a portion of each receptacle 11, 12, 13, 14 below the major surface 150, the upper portions of the receptacles 11, 12, 13, 14 do not protrude above the major surface 150 of the printed circuit board 50 as much as if there were no cut-out 55 and the receptacles 11, 12, 13, 14 were mounted directly onto the top of the major surface 150 of the printed circuit board 50. Due to the recessed mounting, the profile or height h between the upper major surface 150 of the printed circuit board and the top of each receptacle 11, 12, 13, 14 is greatly reduced. In
As discussed above, the faceplate 120 in a preferred embodiment is a metallic material in order to provide for shielding of components mounted on the printed circuit board 50. Ground tabs 41 are provided at the receptacle opening end 21 of the receptacle 11 (see FIG. 1). The ground tabs 41 abut against the cut-outs 121, 122 of the faceplate 120. The ground tabs 41 in a preferred embodiment are also metallic and provide an electrical connection between the receptacle 11 and faceplate 120. Such an electrical connection between the ground tabs 41 and faceplate 120 helps to reduce EMI and provide for grounding of the receptacle 11, 12, 13, 14 to the same ground potential of the chassis faceplate 122, to generally earth or chassis ground. Therefore, it may be understood that upon insertion of an electrical device such as a transceiver through the cut-outs 121, 122 and into the receptacles 11, 12, 13, 14 the transceiver may provide for static discharge to the faceplate 120 or receptacles 11, 12, 13, 14 and upon operation, the transceiver's electromagnetic radiation from its high speed circuitry will be shielded and will not harm other components mounted on the printed circuit board 50 adjacent the cut-out area 55.
Turning to
As was discussed with regard to
As is shown in
The printed circuit board 50 includes apertures 534, 533, 535, 536, 537, 538 and 539 for receiving mounting tabs 34, 33, 35, 36, 37, 38 and 39 (see
Turning to
The matter set forth in the foregoing description and accompanying drawings is offered by way of illustration only and is not as a limitation. While particular embodiments have been shown and described, it will be obvious to those skilled in the art that changes and modifications may be made without departing from the broader aspects of applicant's contribution. The actual scope of the protection sought is intended to be defined in the following claims when viewed in their proper perspective based on the prior art.
Daly, John J., Skepnek, Robert V., Pirillis, Alex
Patent | Priority | Assignee | Title |
10276995, | Jan 23 2017 | FOXCONN INTERCONNECT TECHNOLOGY LIMITED | Electrical adaptor for different plug module and electrical assembly having the same |
11171443, | Nov 08 2011 | Molex, LLC | Connector system with thermal cooling |
6824429, | Oct 17 2002 | GOOGLE LLC | Transceiver cage assembly |
6866544, | Mar 25 2003 | Cisco Technology, Inc. | Methods and apparatus for mounting an electromagnetic interference shielding cage to a circuit board |
6872094, | Mar 01 2004 | TE Connectivity Solutions GmbH | Transceiver pluggable module |
7037136, | Feb 15 2005 | Hon Hai Precision Ind. Co., Ltd. | Connector module |
7037137, | Mar 19 2004 | GOOGLE LLC | Shielding cage assembly with reinforcing dividing walls |
7326067, | Oct 18 2005 | VADATECH INC | Method and apparatus for minimizing the installation height of electrical components |
7351107, | Jan 03 2007 | Delphi Technologies, Inc. | One-piece electromagnetic shield having mechanical attachment features |
7373031, | Sep 30 2004 | SUMITOMO ELECTRIC DEVICE INNOVATIONS, U S A , INC | Apparatus for an electro-optical device connection |
7660128, | Sep 30 2004 | SUMITOMO ELECTRIC DEVICE INNOVATIONS, U S A , INC | Apparatus for electrical and optical interconnection |
7661886, | Sep 30 2004 | SUMITOMO ELECTRIC DEVICE INNOVATIONS, U S A , INC | Apparatus for electro-optical device connection |
7845975, | Jan 30 2007 | PULSE ELECTRONICS, INC | Low-profile connector assembly and methods |
8007290, | Jun 01 2010 | Sony Ericsson Mobile Communications AB | Mounting device for a connector |
8033866, | Oct 14 2008 | Hon Hai Precision Ind. Co., Ltd. | Receptacle connector having reinforced bracket increasing overall rigidity |
8215995, | Jan 06 2011 | Hon Hai Precision Ind. Co., Ltd. | Connector attached to a bracket and mounted in a cutout in a substrate |
8684752, | Jan 05 2012 | Ant Precision Industry Co., Ltd. | Electrical connector and electronic apparatus using the same |
8932069, | Dec 06 2011 | LG Electronics Inc. | Socket module and terminal having the same |
9088095, | Jun 20 2012 | Japan Aviation Electronics Industry, Limited; JAE TAIWAN, LTD. | Connector and mating connector |
9136650, | Apr 02 2013 | Hon Hai Precision Industry Co., Ltd. | Electrical connector |
9391407, | Jun 12 2015 | TE Connectivity Solutions GmbH | Electrical connector assembly having stepped surface |
D496907, | Oct 17 2002 | Hon Hai Precision Ind. Co., Ltd. | Small form-factor pluggable transceiver cage |
Patent | Priority | Assignee | Title |
5316488, | Jun 04 1993 | Molex Incorporated | Connector apparatus for IC packs |
6109966, | Jul 28 1998 | Hon Hai Precision Ind. Co., Ltd. | Mini DIN connector having a reduced height above a circuit board |
6171148, | Sep 22 1998 | Hon Hai Precision Ind. Co., Ltd. | Electrical power connector |
6364708, | Dec 21 2000 | Hon Hai Precision Ind. Co., Ltd. | Electrical connector with improved supporting devices |
6368167, | Dec 22 2000 | Hon Hai Precision Ind. Co., Ltd. | Method of making an electrical connector |
6398587, | Dec 29 2000 | Hon Hai Precision Ind. Co., Ltd. | Universal serial bus connector |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 29 2002 | DALY, JOHN J | Methode Electronics, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013219 | /0884 | |
Jul 29 2002 | SKEPNEK, ROBERT V | Methode Electronics, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013219 | /0884 | |
Jul 29 2002 | PIRILLIS, ALEX | Methode Electronics, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013219 | /0884 | |
Aug 21 2002 | Methode Electronics, Inc. | (assignment on the face of the patent) | / |
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