An overcurrent protection circuit using a shunt resistor and the voltage drop across a switch to program a user-defined current limiting level. This protects the switch and the input power supply, as well as the load. The shunt resistor is connected to the input or output of the switch, and a temperature dependent current source, so that a voltage drop is generated across the shunt resistor. An amplifier is used to sense the voltage across the shunt resistor and the voltage drop across the switch. When the voltage drop across the switch exceeds the voltage drop across the shunt resistor, the amplifier will regulate the switch so that a voltage drop across the switch is equal to the voltage drop across the shunt resistor. In this way, a constant current through the switch can be achieved. A constant ratio between the current limiting level to the shunt resistor value can be achieved with this method, so the current limiting level is programmable by selecting the resistor value.
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11. A current limiting circuit for a MOS transistor switch for a hot swap board application comprising:
a. a switch connected to a power supply and a load;
b. a shunt resistor having a first and second terminal, with the first terminal connected to the switch; and
c. a control circuit connected to the second terminal of the resistor and to the load side of the switch;
d. wherein the control circuit monitors the voltage across the switch and the voltage across the shunt resistor and limits the current through the switch to a predetermined maximum current set by the shunt resistance.
1. A current limiting circuit for a switch comprising:
a. a switch connected to a power supply and a load;
b. a shunt resistor having a first and second terminal, with the first terminal connected to the switch; and
c. a control circuit connected to the second terminal of the resistor and to the load side of the switch;
d. wherein the control circuit monitors the voltage across the switch and the voltage across the shunt resistor and limits the current through the switch to a predetermined maximum current as determined by the voltage across the shunt resistor and the voltage across the switch.
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This invention relates to current limiting and more particularly to programmable current limiting using a shunt resistor and a field-effect transistor, particularly in current limiting for a hot swap board application.
When a short circuit or current surge occurs on the load of a powered switch, or a switch is powered into a short circuit or heavy load, there occurs an excessive current through the switch. This current can destroy the switch by exceeding the safe-operating area of the switch, and damage the input power supply or cause a voltage transient on the input power supply network which can result in the malfunction of other circuitry due to the undervoltage condition. This problem is often evident when inserting or removing a circuit board under operating conditions (“hot swapping”) into a powered backplane. Current limiting circuits are used to control the initial current and protect against voltage transients when hot swapping.
The present invention overcomes some problems and provides advantages over the described prior art current limiting circuits. In the present invention the voltage drop across the conducting switch is used to regulate the conduction current. In an embodiment, the circuit uses a temperature dependent current source, a shunt resistor to set a voltage threshold, and an amplifier to guarantee the voltage drop across the switch does not exceed the voltage across the shunt resistor.
In an embodiment of the present invention, overcurrent protection is provided using a shunt resistor and the voltage drop across the switch to program a user-defined current limiting level. This protects the switch and the input power supply, as well as the load. The shunt resistor is connected to the input or output of the switch, and a temperature dependent current source, so that a voltage drop is generated across the shunt resistor. The voltage across the shunt resistor and the voltage drop across the switch are fed to an amplifier that controls the gate voltage of the switch. When the voltage drop across the switch exceeds the voltage drop across the shunt resistor, an amplifier will regulate the switch so that a voltage drop across the switch is equal to the voltage drop across the shunt resistor. In this way, a constant current through the switch can be achieved. A constant ratio between the current limiting level to the shunt resistor value can be achieved with this method, so the current limiting level is programmable by selecting the resistor value.
The current source that sets the voltage drop across the shunt resistor is preferably a linear temperature dependent source, such as a PTAT (Proportional To Absolute Temperature) source, and can be adjusted by a resistor if so desired. The temperature dependency of the current source (presumably linear) which drives the shunt resistor largely compensates for variation of switch RDS(on) versus temperature, as neither the external power field-effect transistor (FET) switch nor the control chip dissipate large amounts of heat in normal operation.
An advantage of an embodiment of the present invention is no sense resistor or other sense element is needed in the power conduction path. The sense element of the prior art adds an undesirable extra voltage drop in the power conduction path and an appreciable addition to the board's cost.
Another advantage of an embodiment of the present invention is the current limiting level is programmable by one resistor external to the control circuit.
Another advantage of an embodiment of the present invention is the circuit is largely compensated for variations in ambient temperature.
The control circuit compares the voltage drop across the switch and the voltage drop on the shunt resistor 114 to control the input current through the switch 108. The current is held to a maximum current to charge the load capacitor on powerup or during an overload condition. In embodiments of the present invention, the RDS(on) will increase with increased current due to device self-heating. This will cause the current to fold back during an overcurrent condition.
In the preferred embodiment illustrated in
Again referring to
Other Embodiments
Although the present invention has been described in detail, it should be understood that various changes, substitutions, and alterations could be made hereto without departing from the spirit and scope of the invention as defined by the appended claims. For example,
In another embodiment, a P-type device may be substituted for the N-type device providing that the polarities of the inputs of amplifier 116 are reversed.
In another embodiment, the shunt resistor 114 may be placed in the control circuit connection to the output side of the switch rather than the supply side of the switch as shown in
In another embodiment, the adjustment resistor 120 can be located outside the IC for the control circuit so that the user may select the bias current of the shunt resistor.
Dai, Heping, Hastings, Alan, Arciniega, David A.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Oct 29 2003 | Texas Instruments Incorporated | (assignment on the face of the patent) | / | |||
Feb 10 2004 | HASTINGS, ALAN | Texas Instruments Incorporated | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015163 | /0954 | |
Feb 16 2004 | DAI, HEPING | Texas Instruments Incorporated | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015163 | /0954 | |
Feb 16 2004 | ARCINIEGA, DAVID A | Texas Instruments Incorporated | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015163 | /0954 |
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