An illumination unit includes a thin and flexible substrate and flexible electrical tracks formed on the flexible substrate. A number of solid-state light generating sources are arranged on the flexible substrate along the electrical tracks and are electrically connected to the electrical tracks. A flexible and optically transparent encapsulant is provided to encapsulate the light generating sources on the substrate such that the illumination unit is both thin and flexible.
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1. An illumination unit, comprising:
a thin and flexible substrate;
a plurality of flexible electrical tracks formed on the flexible substrate;
a plurality of solid-state light source packages arranged on the flexible substrate along the electrical tracks and being electrically connected to the electrical tracks, the light source packages having light generating sources, each light source package having at least one light generating source to generate light, a reflector cup to reflect the light, and an optically designed shape to channel out the light at a predetermined viewing angle; and
a flexible and optically transparent encapsulant to encapsulate the light generating sources on the substrate without leaving any void such that the illumination unit is both thin and flexible.
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This application is a continuation-in-part of U.S. patent application Ser. No. 10/434,818, filed May 9, 2003, now U.S. Pat. No. 6,860,620.
The invention relates to an illumination unit. More particularly, the present invention relates to a thin and flexible illumination unit that includes a solid-state light generating source, a flexible substrate, and a flexible and optically transparent encapsulant.
Light Emitting Diodes (LEDs) are one type of solid-state light generating devices that have found their way in lighting applications, display applications, photo-therapeutic applications, and other applications where a compact, low voltage, rugged, and high efficiency light source is advantageous. In many such applications, a number of LEDs are arranged into an array or other pre-determined arrangement having similar or dissimilar LED types.
In display applications, LEDs emitting in the red, green, and blue colors are closely packed to form a color “pixel” that blends the three colors. In this manner white light can be generated. Alternatively, by selectively varying the optical output intensity of the three colored LEDs, a selected color can be generated. An array of such “pixels” can form a color display or an illuminating surface emitting white light. In lighting or photo-therapeutic applications, an illumination unit or panel containing LEDs arranged in an array can be formed.
The LEDs can also emit only red, blue or green color, not from the combination of the red, green and blue dies as stated above, but having the individual dies on the package itself emitting the different specific colors.
However, several hurdles remain in the use of LEDs in those applications. One problem associated with the prior LED illumination panel or display is its thickness. This means that the unit must be of the appropriate thickness. For example, a relatively thick LED illumination unit typically affects the therapeutic effectiveness of the unit due to reduced optical intensity. On the other hand, patient safety and comfort may be adversely affected if the unit is made too thin.
The other problem is the rigidity (i.e., not flexible to be bent) of the prior LED illumination unit. As is known, many of the above mentioned applications require that the illumination unit to be flexible. For example, in the lighting application where the LED illumination unit is used as a vehicle lamp, the illumination unit needs to be flexible or soft enough to form a desired shape or contour to follow the contour of a vehicle lamp. In the photo-therapeutic applications, the unit must be flexible enough so that it can follow the contour of the human body part in order to provide safe but effective phototherapy to that body part.
Therefore, what is needed is a thin, flexible, and safe illumination unit.
One feature of the present invention is to provide an illumination unit having a solid-state light generating source, a flexible substrate, and a flexible and optically transparent encapsulant.
In accordance with one embodiment of the present invention, an illumination unit is provided that includes a thin and flexible substrate and flexible electrical tracks formed on the flexible substrate. A number of solid-state light generating sources are arranged on the flexible substrate along the electrical tracks and are electrically connected to the electrical tracks. A flexible and optically transparent encapsulant is provided to encapsulate the light generating sources on the substrate such that the illumination unit is both thin and flexible.
This thin and flexible illumination unit 100 can be used in a wide range of applications (e.g., photo-therapeutic, display, or lighting) where a compact, low voltage, rugged, and high efficiency light source is advantageous. For example, the illumination unit 100 can be employed to is build a motor vehicle lamp. In a further example, the illumination unit 100 can be a display panel or a photo-therapeutic unit. In one embodiment, the illumination unit 100 has a thickness of less than 8 mm.
In addition, as the whole illumination unit 100 is flexible, it can be bent to a desired shape or contour, i.e. it can be easily formed to follow the contour of a transparent part of a corresponding lamp. The illumination unit 100 in accordance with one embodiment of the present invention will be described in more detail below, also in conjunction with
Referring to
The substrate 103 is a thin and flexible substrate. This means that the substrate 103 can be made of a film or foil material, and can be easily bent by hand. The substrate 103 may be made of an electrically insulating material.
In one embodiment, the flexible substrate 103 is made of a synthetic material (e.g., polyamide). A substrate made of the above-mentioned polyamide can provide for a sufficient electrical insulation as well as for a sufficient flexibility and strength. In another embodiment, the flexible substrate 103 is made of any electrically non-conductive but thermally conductive material (e.g., silicone or plastic sheet).
In one embodiment, the flexible substrate 103 is a flexible printed circuit board. In another embodiment, the flexible substrate 103 has a thickness of about 25.4 micrometers. Alternatively, the substrate 103 may have other thickness.
In addition, the illumination unit 100 may also include a heat sink frame 108 on the substrate 103. In one embodiment, the heat sink frame 108 surrounds the substrate 103. In another embodiment, the heat sink frame 108 is on the top and bottom surfaces of the substrate 103. In a further embodiment, the heat sink frame 108 is on one of the top and bottom surfaces of the substrate 103. The heat sink frame 108 may be made of metal.
The heat sink plate 105 that may serve both as heat sink and base support for the substrate 103. Alternatively, the illumination unit 100 may not include the heat sink frame 108 or the plate 105. In one embodiment, the plate 105 is a heat conducting metal plate or sheet attached to the substrate 103 via a thermally conductive adhesive. This means that the adhesive tape 104 can be thermally conductive adhesive. In another embodiment, the plate 105 is replaced with a heat conducting ceramic plate or sheet.
The flexible tracks (e.g., the tracks 121–126 in
Referring to
The electrical tracks (e.g., the tracks 121, 123–124, and 126) include at least an anode track or trace (e.g., the track 121 or 124) and a cathode track or trace (e.g., the track 123 or 126) extending parallel to each other. An anode terminal and a cathode terminal of a corresponding light generating source are attached to the corresponding tracks. Therefore, various light patterns having light spots and dark zones can be formed in accordance with the form of a light or lamp to be created.
In one embodiment, each of the tracks 121–126 is formed of a single material, such as a special metal. In another embodiment, each of the tracks 121–126 is formed of a multi-layer metal structure (not shown). In this embodiment, the track structure may include a copper layer, a nickel layer on top of the copper layer, and a gold layer on top of the nickel layer. Alternatively, some of the tracks may have the multi-layer structure while others may have a single metal layer.
In the multi-layer structure, the copper layer provides a good material for forming the circuit shape, the nickel layer helps preventing copper migration and provides additional strength, and the gold layer is preferable in wire bonding and both electrical and heat conduction and thereby is very suitable for having the light generating source's attached thereto. According to one embodiment, the copper layer is approximately 17.78 micrometer thick, the nickel layer is between 2.54 to 7.62 micrometer in thickness and the gold layer is at least 0.76 micrometer in thickness. The relatively thick copper layer provides for a sufficient cross-section for corresponding electrical energy supply, the nickel layer is kept relatively thinner in comparison to the copper layer. The gold layer is also kept thinner than the nickel layer in order to save costs.
The heat sink tracks or traces 122 and 125 are between the electrical tracks such that they are parallel to the corresponding anode and cathode tracks. The heat sink tracks 122 and 125 are connected to heat sink frame 108. With the frame 108, the heat from the light generating sources 102–102n is transported to the metal frame 108 via the corresponding heat sink tracks.
The electrical tracks include a global anode track or trace 141 and a global cathode track or trace 142. The anode track 141 is connected to all anode terminal tracks (e.g., the terminal track 144) and the cathode track 142 is connected to all cathode terminal tracks (e.g., the terminal track 143). An anode terminal and a cathode terminal of a corresponding light generating source are attached to the corresponding tracks. Therefore, various light patterns having light spots and dark zones can be formed in accordance with the form of a light or lamp to be created.
Referring to
The solid-state light generating sources 102–102n can be implemented in various ways. Each of the solid-state light generating sources 102–102n can be a high power surface mountable light generating source. In one embodiment, each of the light generating sources 102–102n is a LED. In another embodiment, each of the light generating sources 102–102n is a laser diode. In a further embodiment, each of the light generating sources 102–102n is an organic LED. In a yet further embodiment, the light generating sources 102–102n can be a combination of LEDs, laser diodes, and organic LEDs.
When each of the light generating sources 102–102n is a LED or laser diode, the diode can be a diode chip or a diode package. If the diode is a diode package, it can be a PCB (Printed Circuit Board)-based diode package, a ceramic-based diode package, a leadframe-based diode package, a model-based diode package, or a metal-based diode package. Each of the diode packages has a built-in heat sink to enhance heat dissipation generated by a diode within the diode package. In one embodiment, the diode package also includes a reflector cup that reflects light and an optically designed dome shape to channel out the light at a predetermined viewing angle. Moreover, the diode within a diode package may be covered with luminescent material (e.g., phosphor) to convert the light generated by the diode in certain wavelength to light of other certain wavelength or wavelengths.
In one embodiment, each of the solid-state light generating sources 102–102n is a High Flux SMT (Surface Mounting Technology) LED manufactured by Agilent Technologies, Inc. of Palo Alto, Calif. (part number HSMZ-C4A0-TW001). This SMT LED is a PCB based LED package having a built-in heat sink copper pad at the bottom. Alternatively, other types of light generating sources can be used.
In another embodiment, each of the light generating sources 102–102n represents a color pixel that includes at least three light generating sources emitting in the red, green, and blue colors. The three light generating sources are closely packed to form the color pixel. In this case, the optical output intensity of the three colored light generating sources can be controlled to generate any desired color.
The flexible encapsulant 101 encapsulates the light generating sources 102–102n on the substrate 103 such that the illumination unit 100 is both thin and flexible. The encapsulant 101 is optically transparent and can be clear in color or tinted with a color (e.g., red). The encapsulant 101 is low thermal conductive.
In one embodiment, the encapsulant 101 is made of silicone. In this case, the silicon encapsulant can be biocompatible silicone. In another embodiment, the encapsulant 101 is an epoxy.
In one embodiment, the encapsulant 101 is body compatible. In another embodiment, the encapsulant 101 is not body compatible.
Moreover, the illumination unit 100 may include other electrical or electronic components (not shown) mounted on the substrate 103. These components may include resistors, capacitors, transistors, current regulators, and other integrated circuit chips. In one embodiment, when the solid-state light generating sources 102–102n are LEDs, the components may include LED drivers that are capable of controlling the brightness of LEDs in certain areas of the illumination unit 100.
Referring to
In one embodiment, each of the light generating sources 102–102n is attached to the corresponding electrical tracks using the Surface Mounting Technology (SMT). This makes the illumination unit 100 an SMT-light generating source-package-on-flexible-substrate assembly.
Referring back to
In one embodiment, the thickness of the plate 105 is about 0.64 mm (millimeter), the thickness of the substrate 103 is about 0.15 mm, the thickness of each of the light generating sources 102–102n is about 2.20 mm and the thickness of the encapsulant 101 is about 2.55 mm. This means that the assembled illumination unit 100 has a thickness of about 7.0 mm.
In the foregoing specification, the invention has been described with reference to specific exemplary embodiments thereof. The specification and drawings are, accordingly, to be regarded in an illustrative sense rather than a restrictive sense.
Chua, Janet Bee Yin, Lee, Kian Shin, Kuan, Yew Cheong, Ou, Wen Ya
Patent | Priority | Assignee | Title |
10036549, | Oct 24 2008 | iLumisys, Inc. | Lighting including integral communication apparatus |
10054270, | Feb 11 2000 | iLumisys, Inc. | Light tube and power supply circuit |
10161568, | Jun 01 2015 | iLumisys, Inc. | LED-based light with canted outer walls |
10176689, | Oct 24 2008 | iLumisys, Inc. | Integration of led lighting control with emergency notification systems |
10177283, | Mar 16 2012 | Advanced Semiconductor Engineering, Inc. | LED packages and related methods |
10182480, | Oct 24 2008 | iLumisys, Inc. | Light and light sensor |
10260686, | Jan 22 2014 | iLumisys, Inc. | LED-based light with addressed LEDs |
10278247, | Jul 09 2012 | iLumisys, Inc. | System and method for controlling operation of an LED-based light |
10286226, | Sep 18 2013 | EQUALIZE HEALTH | Phototherapy device for the treatment of hyperbilirubinemia |
10342086, | Oct 24 2008 | iLumisys, Inc. | Integration of LED lighting with building controls |
10458627, | Oct 07 2016 | Grote Industries, LLC | Thin film sheet including power lines, lights, and sensors |
10557593, | Feb 11 2000 | iLumisys, Inc. | Light tube and power supply circuit |
10560992, | Oct 24 2008 | iLumisys, Inc. | Light and light sensor |
10571115, | Oct 24 2008 | iLumisys, Inc. | Lighting including integral communication apparatus |
10690296, | Jun 01 2015 | iLumisys, Inc. | LED-based light with canted outer walls |
10713915, | Oct 24 2008 | iLumisys, Inc. | Integration of LED lighting control with emergency notification systems |
10765882, | Sep 05 2010 | MADRYN HEALTH PARTNERS, LP | Self operated esthetic device with a substrate |
10932339, | Oct 24 2008 | iLumisys, Inc. | Light and light sensor |
10966295, | Jul 09 2012 | iLumisys, Inc. | System and method for controlling operation of an LED-based light |
10973094, | Oct 24 2008 | iLumisys, Inc. | Integration of LED lighting with building controls |
11028972, | Jun 01 2015 | iLumisys, Inc. | LED-based light with canted outer walls |
11073275, | Oct 24 2008 | iLumisys, Inc. | Lighting including integral communication apparatus |
11333308, | Oct 24 2008 | iLumisys, Inc. | Light and light sensor |
11428370, | Jun 01 2015 | iLumisys, Inc. | LED-based light with canted outer walls |
11738207, | Apr 08 2021 | NIRAXX, INC | Photobiomodulation therapy garment, methods and uses |
11857800, | Apr 08 2021 | NIRAXX, INC | Photobiomodulation therapy garment, methods and uses |
11944840, | Apr 08 2021 | NIRAXX, INC | Photobiomodulation therapy garment, methods and uses |
7237932, | Oct 18 2004 | The Artak Ter-Hovhanissian Patent Trust | Vehicle and trailer lighting system |
7712933, | Mar 19 2007 | INNOTEC, CORP | Light for vehicles |
7815339, | Jan 09 2008 | Innotec Corporation | Light module |
7832913, | Apr 13 2007 | Veleo Vision | Equipped flexible electronic support, supporting at least one light emitting diode, and the associated manufacturing method |
7909482, | Aug 21 2006 | Innotec Corporation | Electrical device having boardless electrical component mounting arrangement |
7926975, | Dec 21 2007 | Ilumisys, Inc | Light distribution using a light emitting diode assembly |
7938562, | Oct 24 2008 | Ilumisys, Inc | Lighting including integral communication apparatus |
7946729, | Jul 31 2008 | Ilumisys, Inc | Fluorescent tube replacement having longitudinally oriented LEDs |
7976196, | Jul 09 2008 | Ilumisys, Inc | Method of forming LED-based light and resulting LED-based light |
8044420, | Jan 15 2009 | Advanced Semiconductor Engineering, Inc. | Light emitting diode package structure |
8093823, | Feb 11 2000 | Ilumisys, Inc | Light sources incorporating light emitting diodes |
8118447, | Dec 20 2007 | Ilumisys, Inc | LED lighting apparatus with swivel connection |
8214084, | Oct 24 2008 | Ilumisys, Inc | Integration of LED lighting with building controls |
8220980, | Sep 23 2008 | Tyco Electronics Corporation | Socket assembly for light-emitting devices |
8230575, | Dec 12 2007 | Innotec Corporation | Overmolded circuit board and method |
8251544, | Oct 24 2008 | Ilumisys, Inc | Lighting including integral communication apparatus |
8256924, | Sep 15 2008 | Ilumisys, Inc | LED-based light having rapidly oscillating LEDs |
8299695, | Jun 02 2009 | Ilumisys, Inc | Screw-in LED bulb comprising a base having outwardly projecting nodes |
8324817, | Oct 24 2008 | Ilumisys, Inc | Light and light sensor |
8330381, | May 14 2009 | Ilumisys, Inc | Electronic circuit for DC conversion of fluorescent lighting ballast |
8360599, | May 23 2008 | Ilumisys, Inc | Electric shock resistant L.E.D. based light |
8362710, | Jan 21 2009 | Ilumisys, Inc | Direct AC-to-DC converter for passive component minimization and universal operation of LED arrays |
8408773, | Mar 19 2007 | INNOTEC, CORP | Light for vehicles |
8421366, | Jun 23 2009 | Ilumisys, Inc | Illumination device including LEDs and a switching power control system |
8444292, | Oct 24 2008 | Ilumisys, Inc | End cap substitute for LED-based tube replacement light |
8454193, | Jul 08 2010 | Ilumisys, Inc | Independent modules for LED fluorescent light tube replacement |
8482212, | Feb 11 2000 | Ilumisys, Inc | Light sources incorporating light emitting diodes |
8523394, | Oct 29 2010 | Ilumisys, Inc | Mechanisms for reducing risk of shock during installation of light tube |
8540401, | Mar 26 2010 | Ilumisys, Inc | LED bulb with internal heat dissipating structures |
8541958, | Mar 26 2010 | Ilumisys, Inc | LED light with thermoelectric generator |
8556452, | Jan 15 2009 | Ilumisys, Inc | LED lens |
8587956, | Feb 05 2010 | Luxera, Inc.; LUXERA, INC | Integrated electronic device for controlling light emitting diodes |
8596813, | Jul 12 2010 | Ilumisys, Inc | Circuit board mount for LED light tube |
8637887, | May 08 2012 | Advanced Semiconductor Engineering, Inc. | Thermally enhanced semiconductor packages and related methods |
8653984, | Oct 24 2008 | Ilumisys, Inc | Integration of LED lighting control with emergency notification systems |
8664880, | Jan 21 2009 | Ilumisys, Inc | Ballast/line detection circuit for fluorescent replacement lamps |
8674626, | Sep 02 2008 | Ilumisys, Inc | LED lamp failure alerting system |
8764240, | Aug 21 2006 | Innotec Corp. | Electrical device having boardless electrical component mounting arrangement |
8807785, | May 23 2008 | iLumisys, Inc. | Electric shock resistant L.E.D. based light |
8813399, | Feb 04 2010 | CSE, Inc. | Compact LED light module |
8840282, | Mar 26 2010 | iLumisys, Inc. | LED bulb with internal heat dissipating structures |
8870415, | Dec 09 2010 | Ilumisys, Inc | LED fluorescent tube replacement light with reduced shock hazard |
8894430, | Oct 29 2010 | iLumisys, Inc. | Mechanisms for reducing risk of shock during installation of light tube |
8901823, | Oct 24 2008 | Ilumisys, Inc | Light and light sensor |
8928025, | Dec 20 2007 | iLumisys, Inc. | LED lighting apparatus with swivel connection |
8946996, | Oct 24 2008 | iLumisys, Inc. | Light and light sensor |
9013119, | Mar 26 2010 | iLumisys, Inc. | LED light with thermoelectric generator |
9022631, | Jun 13 2012 | Innotec Corp.; INNOTEC CORP | Flexible light pipe |
9057493, | Mar 26 2010 | Ilumisys, Inc | LED light tube with dual sided light distribution |
9059379, | Oct 29 2012 | Advanced Semiconductor Engineering, Inc. | Light-emitting semiconductor packages and related methods |
9072171, | Aug 24 2011 | Ilumisys, Inc | Circuit board mount for LED light |
9101026, | Oct 24 2008 | iLumisys, Inc. | Integration of LED lighting with building controls |
9163794, | Jul 06 2012 | Ilumisys, Inc | Power supply assembly for LED-based light tube |
9184518, | Mar 02 2012 | Ilumisys, Inc | Electrical connector header for an LED-based light |
9267650, | Oct 09 2013 | Ilumisys, Inc | Lens for an LED-based light |
9271367, | Jul 09 2012 | iLumisys, Inc. | System and method for controlling operation of an LED-based light |
9285084, | Mar 14 2013 | iLumisys, Inc.; Ilumisys, Inc | Diffusers for LED-based lights |
9328911, | Sep 02 2013 | LEDIAMOND OPTO CORPORATION | LED lamp with a heat dissipation structure capable of omnidirectionally emitting light |
9353939, | Oct 24 2008 | Ilumisys, Inc | Lighting including integral communication apparatus |
9395075, | Mar 26 2010 | iLumisys, Inc. | LED bulb for incandescent bulb replacement with internal heat dissipating structures |
9398661, | Oct 24 2008 | iLumisys, Inc. | Light and light sensor |
9510400, | May 13 2014 | Ilumisys, Inc | User input systems for an LED-based light |
9574717, | Jan 22 2014 | Ilumisys, Inc | LED-based light with addressed LEDs |
9585216, | Oct 24 2008 | iLumisys, Inc. | Integration of LED lighting with building controls |
9618191, | Mar 07 2013 | Advanced Semiconductor Engineering, Inc. | Light emitting package and LED bulb |
9634206, | Apr 30 2015 | CSE, Inc.; CSE, INC | LED luminaire |
9635727, | Oct 24 2008 | iLumisys, Inc. | Light and light sensor |
9653656, | Mar 16 2012 | Advanced Semiconductor Engineering, Inc. | LED packages and related methods |
9739428, | Feb 11 2000 | iLumisys, Inc. | Light tube and power supply circuit |
9746139, | Feb 11 2000 | iLumisys, Inc. | Light tube and power supply circuit |
9752736, | Feb 11 2000 | iLumisys, Inc. | Light tube and power supply circuit |
9759392, | Feb 11 2000 | iLumisys, Inc. | Light tube and power supply circuit |
9777893, | Feb 11 2000 | iLumisys, Inc. | Light tube and power supply circuit |
9803806, | Feb 11 2000 | iLumisys, Inc. | Light tube and power supply circuit |
9807842, | Jul 09 2012 | iLumisys, Inc. | System and method for controlling operation of an LED-based light |
9970601, | Feb 11 2000 | iLumisys, Inc. | Light tube and power supply circuit |
Patent | Priority | Assignee | Title |
3821847, | |||
5285352, | Jul 15 1992 | Freescale Semiconductor, Inc | Pad array semiconductor device with thermal conductor and process for making the same |
5362679, | Jul 26 1993 | VLSI Packaging Corporation | Plastic package with solder grid array |
5399903, | Aug 15 1990 | LSI Corporation | Semiconductor device having an universal die size inner lead layout |
5698866, | Sep 19 1994 | PDT Systems, Inc. | Uniform illuminator for phototherapy |
6045575, | Sep 10 1997 | AMT, INC | Therapeutic method and internally illuminated garment for the management of disorders treatable by phototherapy |
6290713, | Aug 24 1999 | MEDICAL LIGHT TECHNOLOGY, LLC | Flexible illuminators for phototherapy |
6641284, | Feb 21 2002 | Whelen Engineering Company, Inc. | LED light assembly |
6743249, | Feb 25 2000 | ADVANCED PHOTODYNAMIC TECHNOLOGIES, INC | Treatment device for photodynamic therapy and method for making same |
6806658, | Mar 07 2003 | BENCH WALK LIGHTING LLC | Method for making an LED |
20030179548, |
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