A manufacturing method for a solid electrolytic capacitor of the present invention includes producing a terminal frame having aligned therein unit terminal areas each including an anode terminal portion and a cathode terminal portion, placing a rod-like piece on a surface of the terminal frame across a plurality of aligned anode terminal portions, and fixing the rod-like piece to the terminal frame by welding. Thereafter, a solid electrolytic capacitor is provided through a placement of a capacitor element, charge of a mold resin, and a cutting process.
|
1. A solid electrolytic capacitor comprising a capacitor element including an anode portion and a cathode portion and having an anode lead member projected from the anode portion, an anode terminal electrically connected to the anode lead member, a cathode terminal placed on a reverse surface of the capacitor element and electrically connected to the cathode portion, and a mold resin portion coating the capacitor element, the anode terminal and the cathode terminal, the anode terminal and the cathode terminal being exposed from the mold resin portion,
wherein a bolster member between the anode lead member and the anode terminal makes an electrical connection between the anode lead member and the anode terminal, the bolster member and the anode terminal being joined to each other by laser welding with a laser beam irradiated from the cathode terminal side, the bolster member being formed so as to have a rectangular cross section, and having both ends thereof extended to both side surfaces of the mold resin portion to expose both end surfaces thereof from both the side surfaces of the mold resin portion.
2. A manufacturing method for a solid electrolytic capacitor comprising a capacitor element including an anode portion and a cathode portion and having an anode lead member projected from the anode portion, an anode terminal electrically connected to the anode lead member, a cathode terminal placed on a reverse surface of the capacitor element and electrically connected to the cathode portion, and a mold resin portion coating the capacitor element, the anode terminal and the cathode terminal, the method for manufacturing the solid electrolytic capacitor comprising:
a terminal frame producing step of producing a metal terminal frame having aligned in one or more lines unit terminal areas each including an anode terminal portion and a cathode terminal portion to serve as an anode terminal and a cathode terminal of one solid electrolytic capacitor;
a united frame producing step of placing a metal rod-like piece with a rectangular cross section on a surface of the produced terminal frame along a plurality of aligned anode terminal portions across these anode terminal portions, and fixing the rod-like piece to the terminal frame to thereby produce a united frame;
an element complex producing step of placing capacitor elements in the respective unit terminal areas of the produced united frame, and covering these capacitor elements by a mold resin, with an anode lead member of each capacitor element being joined to the rod-like piece of the united frame and with a cathode portion thereof being joined to the cathode terminal portion, to thereby produce an element complex; and
a cutting step of cutting the produced element complex for each capacitor element to provide a plurality of solid electrolytic capacitors.
3. The manufacturing method for a solid electrolytic capacitor according to
4. The manufacturing method for a solid electrolytic capacitor according to
5. The manufacturing method for a solid electrolytic capacitor according to
6. The manufacturing method for a solid electrolytic capacitor according to
7. The manufacturing method for a solid electrolytic capacitor according to
|
The priority application Number 2005-104955 upon which this patent application is based is hereby incorporated by reference.
1. Field of the Invention
The present invention relates to a solid electrolytic capacitor having an anode terminal exposed from a mold resin portion coating a capacitor element and being capable of being surface-mounted, and to a manufacturing method therefor.
2. Description of Related Art
A solid electrolytic capacitor having a structure shown in
However, there has been a problem that the capacitor element 27 cannot be sufficiently large in overall size relative to a solid electrolytic capacitor finished product because the solid electrolytic capacitor of the above-described structure needs to have an entire periphery of the capacitor element 27 coated with a mold resin. Accordingly, there has been proposed a technique, as shown in
In the above-described solid electrolytic capacitor, an ESR (Equivalent Series Resistance) and an ESL (Equivalent Series Inductance) in the solid electrolytic capacitor finished product can be reduced because it is unnecessary to provide a lead frame bent along a surface of an enclosure resin part as conventionally, so that a current path from the capacitor element to a circuit board can be shortened.
However, in the manufacturing process for the solid electrolytic capacitor shown in
An object of the present invention is to provide a structure of a solid electrolytic capacitor capable of providing high productivity, and a manufacturing method therefor.
A solid electrolytic capacitor of the present invention includes a capacitor element including an anode portion and a cathode portion and having an anode lead member projected from the anode portion, an anode terminal electrically connected to the anode lead member, a cathode terminal placed on a reverse surface of the capacitor element and electrically connected to the cathode portion, and a mold resin portion coating the capacitor element, the anode terminal and the cathode terminal, the anode terminal and the cathode terminal being exposed from the mold resin portion. A bolster member between the anode lead member and the anode terminal makes an electrical connection between the anode lead member and the anode terminal, the bolster member being formed so as to have a rectangular cross section, and having both ends thereof extended to both side surfaces of the mold resin portion to expose both end surfaces thereof from both the side surfaces of the mold resin portion.
Specifically, the bolster member and the anode terminal are irradiated with a laser beam from the cathode terminal side and joined to each other by laser welding.
The above-described solid electrolytic capacitor of the present invention may be produced by a manufacturing method of the present invention described below.
The manufacturing method for a solid electrolytic capacitor of the present invention includes a terminal frame producing step of producing a metal terminal frame having aligned in one or more lines unit terminal areas each including an anode terminal portion and a cathode terminal portion to serve as an anode terminal and a cathode terminal of one solid electrolytic capacitor, a united frame producing step of placing a metal rod-like piece on a surface of the produced terminal frame along a plurality of aligned anode terminal portions across these anode terminal portions, and fixing the rod-like piece to the terminal frame to thereby produce a united frame, an element complex producing step of placing capacitor elements in the respective unit terminal areas of the produced united frame, and covering these capacitor elements by a mold resin, with an anode lead member of each capacitor element being joined to the rod-like piece of the united frame and with a cathode portion thereof being joined to the cathode terminal portion, to thereby produce an element complex, and a cutting step of cutting the produced element complex for each capacitor element to provide a plurality of solid electrolytic capacitors.
According to the above-described manufacturing method for a solid electrolytic capacitor of the present invention, the element complex produced by the element complex producing step is cut for each capacitor element at the cutting step, so that the rod-like piece is cut into the bolster member for each capacitor element, while the terminal frame is cut to allow the anode terminal portion and the cathode terminal portion to serve as the anode terminal and the cathode terminal, respectively, to provide the solid electrolytic capacitor of the present invention.
Because the mold resin and the rod-like piece are cut at a time in the cutting step for the element complex, the solid electrolytic capacitor provided through the cutting step will have the bolster member having both the end surfaces thereof exposed to both the side surfaces of the mold resin portion.
In the above-described manufacturing method for a solid electrolytic capacitor of the present invention, the rod-like piece is placed on the surface of the terminal frame at the united frame producing step, so that the rod-like piece is placed across a plurality of aligned anode terminal portions of the terminal frame. Therefore, accurate positioning of the rod-like piece relative to the terminal frame will result in accurate positioning of the rod-like piece relative to the plurality of anode terminal portions.
Therefore, the positioning is easier and more efficient than that of the conventional manufacturing method in which bolster members are positioned one by one relative to the respective anode terminal portions of the terminal frame having a plurality of unit terminal areas formed therein.
Specifically, the terminal frame producing step includes producing a terminal frame having a plurality of unit terminal areas arranged in rows and columns in a matrix form, and the united frame producing step includes preparing a metal bolster frame having rod-like pieces arranged parallel at row spacings of the unit terminal areas, and laying the bolster frame on a surface of the terminal frame to fix the rod-like pieces to respective surfaces of a plurality of anode terminal portions aligned in columns.
According to the specific process, the bolster frame is placed on the surface of the terminal frame, so that the plurality of rod-like pieces of the bolster frame are placed across all anode terminal portions aligned in a matrix form in the terminal frame. Therefore, accurate positioning of the bolster frame relative to the terminal frame will result in accurate positioning of each rod-like piece relative to the plurality of anode terminal portions. This allows easier positioning to improve positioning accuracy.
More specifically, the united frame producing step includes fixing the bolster frame to the terminal frame by laser welding.
If laser welding is used as a method for fixing the bolster frame to the terminal frame as described, poor welding caused by dissipation of heat of welds through the rod-like pieces can be more effectively prevented than in the case of using resistance welding.
More specifically, the united frame producing step includes irradiating a laser beam from the cathode terminal portion side to joints of the rod-like pieces and the anode terminal portions when the bolster frame is fixed to the terminal frame by laser welding.
As a result, welded fixed portions are formed at ends of the cathode terminal portion side in the joints of the rod-like pieces and the anode terminal portions. Therefore, the welded fixed portions between the rod-like pieces and the anode terminal portions are not cut even if a minor error occurs in a cutting position when the element complex is cut for each solid electrolytic capacitor at the cutting step.
Further specifically, the bolster frame is provided by providing a plurality of rectangular openings at constant intervals in a metal plate, and the rod-like piece is defined between two adjacent rectangular openings. The terminal frame and the bolster frame have formed thereon a positioning portion and a positioning receiving portion to engage each other for positioning both the frames.
As described above, according to the solid electrolytic capacitor and manufacturing method therefor of the present invention, the positioning at the united frame producing step is easy and efficient, and therefore can provide higher productivity than conventionally.
An embodiment of the present invention will be specifically described below with reference to the drawings.
As shown in
The above-described solid electrolytic capacitor 1 of the present invention is produced by a manufacturing process shown in
Next, as shown in
Next, as shown in
In the above-described manufacturing method for the solid electrolytic capacitor 1 of the present invention, the bolster frame 8 is placed on the surface of the terminal frame 9 as shown in
Patent | Priority | Assignee | Title |
8400758, | Aug 06 2009 | Sanyo Electric Co., Ltd. | Solid electrolytic capacitor and a method for manufacturing the same |
8562695, | Aug 27 2009 | Sanyo Electric Co., Ltd. | Solid electrolytic capacitor and a method for manufacturing the same |
Patent | Priority | Assignee | Title |
5608602, | Apr 07 1992 | Rohm Co., Ltd. | Circuit incorporating a solid electrolytic capacitor |
5850332, | Oct 31 1994 | Rohm Co. Ltd. | Process for making solid electrolyic capacitor |
6188566, | Aug 14 1998 | ROHM CO , LTD | Solid electrolytic capacitor having a second lead with a throughhole filled with an arc-extinguishing material |
6262878, | Jun 18 1999 | Matsuo Electric Company Limited | Chip capacitor |
6430034, | Apr 07 2000 | Tokin Corporation | Chip capacitor having external resin packaging |
6625009, | Apr 05 2001 | KYOCERA AVX COMPONENTS BANGKOK LTD | Solid electrolytic capacitor and method of making the same |
JP1064761, | |||
JP2001244145, | |||
JP200368588, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Feb 28 2006 | IHARA, HAYATOSHI | SANYO ELECTRIC CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 017739 | /0109 | |
Mar 30 2006 | Sanyo Electric Co., Ltd. | (assignment on the face of the patent) | / |
Date | Maintenance Fee Events |
Mar 03 2008 | ASPN: Payor Number Assigned. |
Apr 14 2011 | M1551: Payment of Maintenance Fee, 4th Year, Large Entity. |
Mar 04 2015 | ASPN: Payor Number Assigned. |
Mar 04 2015 | RMPN: Payer Number De-assigned. |
Apr 19 2015 | M1552: Payment of Maintenance Fee, 8th Year, Large Entity. |
Jul 01 2019 | REM: Maintenance Fee Reminder Mailed. |
Dec 16 2019 | EXP: Patent Expired for Failure to Pay Maintenance Fees. |
Date | Maintenance Schedule |
Nov 13 2010 | 4 years fee payment window open |
May 13 2011 | 6 months grace period start (w surcharge) |
Nov 13 2011 | patent expiry (for year 4) |
Nov 13 2013 | 2 years to revive unintentionally abandoned end. (for year 4) |
Nov 13 2014 | 8 years fee payment window open |
May 13 2015 | 6 months grace period start (w surcharge) |
Nov 13 2015 | patent expiry (for year 8) |
Nov 13 2017 | 2 years to revive unintentionally abandoned end. (for year 8) |
Nov 13 2018 | 12 years fee payment window open |
May 13 2019 | 6 months grace period start (w surcharge) |
Nov 13 2019 | patent expiry (for year 12) |
Nov 13 2021 | 2 years to revive unintentionally abandoned end. (for year 12) |