A printed board includes: an impedance matching member disposed along the periphery of a plurality of connecting pins for connecting a connector to signal lines on the printed board, the plurality of connecting pins being arranged in row and column directions; and a connecting portion for connecting the impedance matching member to a ground line of the printed board. The printed board according to the present invention is capable of suppressing the impedance mismatching of an ordinary connector having no special shield or the like for impedance matching.
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1. A printed board comprising:
an impedance matching member disposed along the periphery of a plurality of connecting pins for connecting a connector to signal lines on the printed board, the plurality of connecting pins being arranged in row and column direction, the entirety of the impedance matching member disposed external to the connector; and
a connecting portion for connecting the impedance matching member to a ground line of the printed board.
2. The printed board of
3. The printed board of
4. The printed board of
wherein Z0 is an impedance of the outermost connecting pin when the impedance matching member is used,
t is a dimension in vertical direction of the outermost connecting pin, and
w is a dimension in horizontal direction of the outermost connecting pin.
5. The printed board of
6. The printed board of
7. The printed board of
8. The printed board of
9. The printed board of
10. The printed board of
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This application is related to Japanese Patent Application No. 2004-273809 filed on Sep. 21, 2004, whose priority is claimed and the disclosure of which is incorporated by reference in its entirety.
1. Field of the Invention
The present invention relates to a printed board having an impedance matching member between the printed board and connecting pins for connecting the printed board and a connector.
2. Description of Related Art
As the operating frequency of the electronic circuits increases, it becomes more important to provide characteristic impedance matching between circuits and between nodes in order to maintain excellent transmission characteristics of high-frequency signals and high-speed signals. Circuits, devices or components inside the devices are connected to each other using connectors and cables. It is therefore necessary that a design of signal lines between a connector and a printed board be made in view of the impedance matching. Signal lines such as microstrip lines, strip lines and coplanar lines provided on a printed board are designed to match impedances in accordance with the configuration of the signal lines and the positional relationship with a ground line. However, in some cases, connecting pins between a connector and signal lines on a printed board are exposed in the air with no ground line corresponding thereto. This makes it difficult to provide sufficient impedance matching.
For example, in a horizontal connector mounted on a printed board so that connecting pins extends horizontally, the connecting pins extending from the connector are bent at an almost right angle to be connected to the printed board and exposed in the air. Such exposed portions of the pins have high impedance, causing impedance mismatches to occur between the pins and the signal lines on the printed board. This results in a problem that transmission characteristics of high-frequency signals and high-speed signals significantly degrade due to signal loss, pulse distortion or the like caused by the impedance mismatching.
The connecting pins bent at an almost right angle have different impedances at inside and outside of the bent portions.
When the connecting pins 15a, 15b and so on of the connector 14 are thus connected to the printed board 11, the pins are exposed in the air except for the portions covered with the shield case 16. Such exposed portions have various impedances, and variations in impedance are greater in the outermost pin having the largest exposed portion than in the inner pins. Particularly, there is a variation in common mode impedance (impedance with respect to the ground line), and thereby common mode reflection occurs.
Japanese Unexamined Patent Publication No. 2002-270307 solves such problems by disposing a shielding member near the exposed portions of the connecting pins 15a, 15b and so on to prevent impedance mismatching.
The structure disclosed by the aforementioned patent publication has the shielding member disposed inside the connector, which limits portions where the shielding member can be disposed and makes molding of the shielding member complicated because the shape of the shielding member needs to conform to the shape inside the connector. This results in production of waste during the preparation of shielding member, an increase in time for attachment of the shielding member and an increase in cost.
According to an aspect of the invention, provided is a printed board comprising: an impedance matching member disposed along the periphery of a plurality of connecting pins for connecting a connector to signal lines on the printed board, the plurality of connecting pins being arranged in row and column directions; and a connecting portion for connecting the impedance matching member to a ground line of the printed board. The printed board according to the present invention is capable of suppressing the impedance mismatching of an ordinary connector having no special shield or the like for impedance matching.
The present invention will become more fully understood from the detailed description given hereinbelow and the accompanying drawings which are given by way of illustration only, and thus are not limitative of the present invention and wherein:
A printed board according to the present invention comprises: an impedance matching member disposed along the periphery of a plurality of connecting pins for connecting a connector to signal lines on the printed board, the plurality of connecting pins being arranged in row and column directions; and a connecting portion for connecting the impedance matching member to a ground line of the printed board.
According to the present invention, the impedance matching member is preferably in the form of a conductive plate, rod or net. Furthermore, the signal lines on the printed board are preferably microstrip lines, strip lines or coplanar lines.
In accordance with the present invention, the distance s between the impedance matching member and an outermost connecting pin may be defined by the following equation 1:
wherein Z0 is an impedance of the outermost connecting pin when the impedance matching member is used, t is a dimension in vertical direction of the outermost connecting pin, and w is a dimension in horizontal direction of the outermost connecting pin.
In the printed board according to the present invention, the ground line may be provided on a surface of the printed board on which the connector is mounted and the signal lines may be provided on the opposite surface of the printed board. Furthermore, the impedance matching member may be disposed with respect to some of the connecting pins.
According to the present invention, the connector may include a shield case connected to the ground line of the printed board, and the impedance matching member may be connected to a side of the shield case opposite to the side connected to the ground line.
The signal lines may be provided on a side of the printed board on which the connector is mounted, and when disposed above the signal lines, the impedance matching member may straddle the signal lines.
The connector may be a horizontal connector mounted in a horizontal orientation so that a cable line connected to the connector is parallel to the printed board.
Furthermore, the plurality of connecting pins may be bent between the connector and the printed board, and the impedance matching member may be bent along the bend of outermost connecting pins.
According to the present invention, the impedance matching member connected to the ground line of the printed board is disposed along the periphery of the plurality of connecting pins for connecting the connector and the signal lines on the printed board. This eliminates the impedance mismatching of the connecting pins and further eliminates signal loss and degradation in transmission characteristics caused by the impedance mismatching. Particularly, the impedance mismatching of the outermost connecting pins is eliminated, and the difference in impedance between outer and inner pins can be reduced.
In the printed board according to the invention, the impedance matching member is in the simple form of a conductive plate, rod or net, and attachment of the impedance matching member is easy. Thus, the impedance matching member can be fabricated at low cost, allowing inexpensive, high-quality products to be provided to consumers. Furthermore, the impedance matching member can be disposed for only the essential connecting pins.
Since the signal lines on the printed board are microstrip lines, strip lines or coplanar lines, the present invention can be used as a connector for superhigh frequency signals.
According to the present invention, the distance s between the impedance matching member and the outermost connecting pin can be defined by the aforementioned equation 1, and thereby designing of the printed board is easy.
On a printed board 1, the connector 4 is disposed in a horizontal orientation so that it is connected to a cable line in parallel relationship to the printed board surface. The connector 4 has a protrusion on a side surface thereof. By putting a screw through screw holes provided in the protrusion and in the printed board, the connector 4 is secured to the printed board 1. Alternatively, the connector 4 may be secured to the printed board by directly soldering the connector 4 to the printed board 1 or by soldering the protrusion on the side of the connector 4 to the printed board 1. Though
The present invention is also applicable to a case where a connector is secured to a frame of a device and connecting pins between the connector and a printed board are exposed in the air. Furthermore, the present invention is applicable to a case where a connector is secured to a case or a cabinet (not shown) of devices for providing connection between the devices and connecting pins between the connector and a printed board are exposed in the air. In these cases, the connecting pins are not necessarily bent.
The printed board 1 has a ground line 2 provided on a side on which the connector 4 is mounted and signal lines 3 such as microstrip lines, strip lines and coplanar lines provided on the opposite side. The ground line 2 and the signal lines 3 are designed to have impedance matching. A plurality of connecting pins 5a, 5b and so on are extending in row and column directions from a connection of the connector 4 to a cable line and are bent at an almost right angle so that they are connected to the signal lines 3 by soldering. Portions of the connecting pins 5a, 5b and so on extending out from the connector 4 are exposed in the air. A shield case 6 is disposed at a portion where the connecting pins 5a, 5b and so on are connected to the cable line. The shield case 6 is in contact with the ground line 2.
An impedance matching member 7, which is a feature of the present invention, is disposed between the connector 4 and the printed board 1 along the exposed portions of the plurality of connecting pins 5a, 5b and so on so as to shield the exposed portions in parallel relationship to the outermost pins. The impedance matching member 7 is preferably a rectangular plate bent along the bend of the outermost pin 5a of the bent pins as shown in
Thus, the presence of the impedance matching member 7 allows the ground line to be substantially extended to the air, whereby the lines of electric force from the connecting pins 5a, 5b and so on of the connector 4 are terminated and the impedance can be reduced. Usually, the outermost pin 5a is higher in impedance than the inner pins. The impedance matching member 7 of the invention is disposed so as to be closest to the outermost pin 5a, and thus, is highly effective in reducing the impedance of the outermost pin 5a. Impedances of the connecting pins 5a, 5b and so on are determined by the distance between the respective pins and the impedance matching member 7.
An impedance Z0 of a microstrip line can roughly be determined from the following equation 2:
where ∈ is a dielectric constant of the printed board and is set to 1, h is a distance between the respective signal lines and the ground layer, and w and t are cross-sectional dimensions of the outermost connecting pins 5a, 5d and so on. As shown in
Where the impedance matching member 7 is in a plate form and is sufficiently large with respect to the connecting pins 5a, 5b and so on, the distance s between the impedance matching member 7 and the outermost connecting pins 5a, 5d and so on can approximately be determined by modifying the distance h between the signal lines and the ground line to the distance s between the impedance matching member 7 and the outermost connecting pins 5a, 5d and so on from the aforementioned equation 2. In other words, the distance s can be determined by the following equation 1.
Shown in
According to the constitution of the present invention, the impedance matching member of simple shape, for example, of rectangular shape, which is fixed to the ground line 2 by soldering or the like technique can be situated outside the connecting pins 5a, 5b and so on. This allows the present invention be simpler in shape and mounting of the impedance matching member 7 than Japanese Unexamined Patent Publication No. 2002-270307 in which the impedance matching member is disposed inside the connector 4. Thus, the impedance matching member of the present invention can be fabricated at low cost. Since the impedance matching member 7 can be disposed at very low cost, inexpensive, high-quality products can be provided to ultimate consumers.
Instead of the plate-like impedance matching member 7 illustrated in the first embodiment, a rod-like impedance matching member 7a shown in
The impedance matching member 7 does not have to be bent along the bend of the connecting pins of the connector and may be a plate-like impedance matching member 7c standing straight as shown in
The effect of suppressing the impedance mismatching is smaller in the printed board described in this embodiment than in the printed board illustrated in the first embodiment. Still, it is possible to provide the impedance matching member 7 of an appropriate shape in view of the required precision of transmission lines, the cost, and the space on the printed board.
Thus, the shape, material and position of the impedance matching member may be selected in accordance with how the connector is mounted on the printed board, the configurations of the connector and a device to which the printed board is mounted. Furthermore, the shape, material and position may be selected in accordance with the lines of electric force of the connecting pins, the signal intensity of the connector, printed board and other peripheral devices.
In the third embodiment, an impedance matching member 7d has such a shape that only the connecting pins 5a, 5b, 5c, 5d and 5e which require stable transmission characteristics are covered as shown in
When it is desired to bring an impedance matching member 7e closer to the connecting pins of the connector, the impedance matching member 7e can be bent between the connector and the printed board so that the impedance matching member can be used closer to the connecting pins 5a, 5b and so on. This allows for further reduction of impedance. The distance s can be defined by the aforementioned equation 1.
As shown in
Where the signal lines 3 are disposed on a side of the printed board 1 on which the connector is mounted and it is necessary to place an impedance matching member 7g above the signal lines 3, the impedance matching member 7g is provided which has such a shape that it straddles the signal lines 3 so as not to cover the signal lines 3 as shown in
As described hereinabove, the impedance matching member can be disposed on the printed board to reduce the impedance mismatches. Furthermore, the impedance matching member can be modified in accordance with the required precision of the transmission lines or the circumstances so that the impedance matching member can be adapted to various purposes.
The invention thus described, it will be obvious that the same may be varied in many ways. Such variations are not to be regarded as a departure from the spirit and scope of the invention, and all such modifications as would be obvious to one skilled in the art are intended to be included within the scope of the following claims.
Patent | Priority | Assignee | Title |
Patent | Priority | Assignee | Title |
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