A fluid ejection device includes a fluid chamber, a fluid restriction communicated with the fluid chamber, and a fluid channel communicated with the fluid restriction. The fluid restriction has a fluid restriction parameter defined as (2*W+2*H)*L/(H*W), wherein W is a width of the fluid restriction, H is a height of the fluid restriction, and L is a length of the fluid restriction. As such, the fluid restriction parameter is in a range of 1.5 to 5.75.
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1. A fluid ejection device, comprising:
a fluid chamber;
a fluid restriction communicated with the fluid chamber;
a fluid channel communicated with the fluid restriction; and
a fluid feed slot communicated with the fluid channel,
wherein a distance from an edge of the fluid feed slot to a center of the fluid chamber is in a range of approximately 45 microns to approximately 58 microns, #14#
wherein the fluid restriction has a fluid restriction parameter defined as (2*W+2*H)*L/(H*W), wherein W is a width of the fluid restriction, H is a height of the fluid restriction, and L is a length of the fluid restriction, and wherein the fluid restriction parameter is in a range of 1.5 to 5.75.
#17#
7. A fluid ejection device, comprising:
a substrate having a fluid feed slot formed therein;
a barrier layer formed on the substrate, wherein the barrier layer defines a fluid chamber, a fluid restriction communicated with the fluid chamber, and a fluid channel communicated with the fluid feed slot of the substrate and the fluid restriction; and
an orifice layer provided over the barrier layer and having an orifice formed therein communicated with the fluid chamber, wherein the orifice layer has a thickness of approximately 14 microns, and the barrier layer has a thickness of approximately 14 microns,
wherein the fluid restriction has a fluid restriction parameter defined as (2*W+2*H)*L/(H*W), wherein W is a width of the fluid restriction, H is a height of the fluid restriction, and L is a length of the fluid restriction, and wherein the fluid restriction parameter is in a range of 1.5 to 5.75.
14. A fluid ejection device, comprising:
a substrate having a fluid feed slot formed therein;
a barrier layer formed on the substrate, wherein the barrier layer defines a fluid chamber, a fluid restriction communicated with the fluid chamber, and a fluid channel communicated with the fluid feed slot of the substrate and the fluid restriction; and
an orifice layer provided over the barrier layer and having an orifice formed therein communicated with the fluid chamber, wherein the orifice layer has a thickness of approximately 20 microns, and the barrier layer has a thickness of approximately 17 microns,
wherein the fluid restriction has a fluid restriction parameter defined as (2*W+2*H)*L/(H*W), wherein W is a width of the fluid restriction, H is a height of the fluid restriction, and L is a length of the fluid restriction, and wherein the fluid restriction parameter is in a range of 1.5 to 5.75.
2. The fluid ejection device of
3. The fluid ejection device of
a resistor formed within the fluid chamber, wherein the resistor has an area in a range of approximately 200 square microns to approximately 625 square microns.
4. The fluid ejection device of
an orifice communicated with the fluid chamber, wherein the orifice has a diameter in a range of approximately 12 microns to approximately 18.5 microns.
5. The fluid ejection device of
an orifice communicated with the fluid chamber, wherein a contour of the fluid chamber follows a profile of the orifice.
6. The fluid ejection device of
8. The fluid ejection device of
9. The fluid ejection device of
a resistor formed on the substrate and communicated with the fluid chamber, wherein the resistor has an area in a range of approximately 200 square microns to approximately 625 square microns.
10. The fluid ejection device of
11. The fluid ejection device of
12. The fluid ejection device of
a supply of fluid communicated with the fluid channel, wherein the fluid has a surface tension in a range of approximately 21 dynes per centimeter to approximately 35 dynes per centimeter, and a viscosity in a range of approximately 1.5 centipoises to approximately 4.0 centipoises.
13. The fluid ejection device of
15. The fluid ejection device of
16. The fluid ejection device of
a resistor formed on the substrate and communicated with the fluid chamber, wherein the resistor has an area in a range of approximately 200 square microns to approximately 625 square microns.
17. The fluid ejection device of
18. The fluid ejection device of
19. The fluid ejection device of
a supply of fluid communicated with the fluid channel, wherein the fluid has a surface tension in a range of approximately 21 dynes per centimeter to approximately 35 dynes per centimeter, and a viscosity in a range of approximately 1.5 centipoises to approximately 4.0 centipoises.
20. The fluid ejection device of
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This application is a Continuation-In-Part of U.S. patent application Ser. No. 11/140,802, filed on May 31, 2005, now U.S. Pat. No. 7,431,434 assigned to the Assignee of the present invention, and incorporated herein by reference.
An inkjet printing system, as one embodiment of a fluid ejection system, may include a printhead, an ink supply which supplies liquid ink to the printhead, and an electronic controller which controls the printhead. The printhead, as one embodiment of a fluid ejection device, ejects drops of ink through a plurality of nozzles or orifices and toward a print medium, such as a sheet of paper, so as to print onto the print medium. Typically, the orifices are arranged in one or more columns or arrays such that properly sequenced ejection of ink from the orifices causes characters or other images to be printed upon the print medium as the printhead and the print medium are moved relative to each other.
In one arrangement, the printhead may accommodate different color inks, such as black ink and/or one or more colored inks. The different color inks, however, may have different properties and, therefore, different performance characteristics. Accordingly, to optimize performance of the printhead, it is desirable to select or tune parameters of the printhead to accommodate one or more different inks.
One aspect of the present invention provides a fluid ejection device. The fluid ejection device includes a fluid chamber, a fluid restriction communicated with the fluid chamber, and a fluid channel communicated with the fluid restriction. The fluid restriction has a fluid restriction parameter defined as (2*W+2*H)*L/(H*W), wherein W is a width of the fluid restriction, H is a height of the fluid restriction, and L is a length of the fluid restriction. As such, the fluid restriction parameter is in a range of 1.5 to 5.75.
In the following detailed description, reference is made to the accompanying drawings which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology, such as “top,” “bottom,” “front,” “back,” “leading,” “trailing,” etc., is used with reference to the orientation of the Figure(s) being described. Because components of embodiments of the present invention can be positioned in a number of different orientations, the directional terminology is used for purposes of illustration and is in no way limiting. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.
Printhead assembly 12, as one embodiment of a fluid ejection device, is formed according to an embodiment of the present invention and ejects drops of ink, including one or more colored inks, through a plurality of orifices or nozzles 13. While the following description refers to the ejection of ink from printhead assembly 12, it is understood that other liquids, fluids, or flowable materials may be ejected from printhead assembly 12.
In one embodiment, the drops are directed toward a medium, such as print media 19, so as to print onto print media 19. Typically, nozzles 13 are arranged in one or more columns or arrays such that properly sequenced ejection of ink from nozzles 13 causes, in one embodiment, characters, symbols, and/or other graphics or images to be printed upon print media 19 as printhead assembly 12 and print media 19 are moved relative to each other.
Print media 19 includes, for example, paper, card stock, envelopes, labels, transparent film, cardboard, rigid panels, and the like. In one embodiment, print media 19 is a continuous form or continuous web print media 19. As such, print media 19 may include a continuous roll of unprinted paper.
Ink supply assembly 14, as one embodiment of a fluid supply, supplies ink to printhead assembly 12 and includes a reservoir 15 for storing ink. As such, ink flows from reservoir 15 to printhead assembly 12. In one embodiment, ink supply assembly 14 and printhead assembly 12 form a recirculating ink delivery system. As such, ink flows back to reservoir 15 from printhead assembly 12. In one embodiment, printhead assembly 12 and ink supply assembly 14 are housed together in an inkjet or fluidjet cartridge or pen. In another embodiment, ink supply assembly 14 is separate from printhead assembly 12 and supplies ink to printhead assembly through an interface connection, such as a supply tube (not shown).
Mounting assembly 16 positions printhead assembly 12 relative to media transport assembly 18, and media transport assembly 18 positions print media 19 relative to printhead assembly 12. As such, a print zone 17 within which printhead assembly 12 deposits ink drops is defined adjacent to nozzles 13 in an area between printhead assembly 12 and print media 19. Print media 19 is advanced through print zone 17 during printing by media transport assembly 18.
In one embodiment, printhead assembly 12 is a scanning type printhead assembly, and mounting assembly 16 moves printhead assembly 12 relative to media transport assembly 18 and print media 19 during printing of a swath on print media 19. In another embodiment, printhead assembly 12 is a non-scanning type printhead assembly, and mounting assembly 16 fixes printhead assembly 12 at a prescribed position relative to media transport assembly 18 during printing of a swath on print media 19 as media transport assembly 18 advances print media 19 past the prescribed position.
Electronic controller 20 communicates with printhead assembly 12, mounting assembly 16, and media transport assembly 18. Electronic controller 20 receives data 21 from a host system, such as a computer, and includes memory for temporarily storing data 21. Typically, data 21 is sent to inkjet printing system 10 along an electronic, infrared, optical or other information transfer path. Data 21 represents, for example, a document and/or file to be printed. As such, data 21 forms a print job for inkjet printing system 10 and includes one or more print job commands and/or command parameters.
In one embodiment, electronic controller 20 provides control of printhead assembly 12 including timing control for ejection of ink drops from nozzles 13. As such, electronic controller 20 defines a pattern of ejected ink drops which form characters, symbols, and/or other graphics or images on print media 19. Timing control and, therefore, the pattern of ejected ink drops, is determined by the print job commands and/or command parameters. In one embodiment, logic and drive circuitry forming a portion of electronic controller 20 is located on printhead assembly 12. In another embodiment, logic and drive circuitry forming a portion of electronic controller 20 is located off printhead assembly 12.
In one embodiment, each drop ejecting element 30 includes a thin-film structure 50, a barrier layer 60, an orifice layer 70, and a drop generator 80. Thin-film structure 50 has a fluid (or ink) feed opening 52 formed therein which communicates with fluid feed slot 42 of substrate 40 and barrier layer 60 has a fluid ejection chamber 62 and one or more fluid channels 64 formed therein such that fluid ejection chamber 62 communicates with fluid feed opening 52 via fluid channels 64.
Orifice layer 70 has a front face 72 and an orifice or nozzle opening 74 formed in front face 72. Orifice layer 70 is extended over barrier layer 60 such that nozzle opening 74 communicates with fluid ejection chamber 62. In one embodiment, drop generator 80 includes a resistor 82. Resistor 82 is positioned within fluid ejection chamber 62 and is electrically coupled by leads 84 to drive signal(s) and ground.
While barrier layer 60 and orifice layer 70 are illustrated as separate layers, in other embodiments, barrier layer 60 and orifice layer 70 may be formed as a single layer of material with fluid ejection chamber 62, fluid channels 64, and/or nozzle opening 74 formed in the single layer. In addition, in one embodiment, portions of fluid ejection chamber 62, fluid channels 64, and/or nozzle opening 74 may be shared between or formed in both barrier layer 60 and orifice layer 70.
In one embodiment, during operation, fluid flows from fluid feed slot 42 to fluid ejection chamber 62 via fluid feed opening 52 and one or more fluid channels 64. Nozzle opening 74 is operatively associated with resistor 82 such that droplets of fluid are ejected from fluid ejection chamber 62 through nozzle opening 74 (e.g., substantially normal to the plane of resistor 82) and toward a print medium upon energization of resistor 82.
In one embodiment, printhead assembly 12 is a fully integrated thermal inkjet printhead. As such, substrate 40 is formed, for example, of silicon, glass, or a stable polymer, and thin-film structure 50 includes one or more passivation or insulation layers formed, for example, of silicon dioxide, silicon carbide, silicon nitride, tantalum, poly-silicon glass, or other material. Thin-film structure 50 also includes a conductive layer which defines resistor 82 and leads 84. The conductive layer is formed, for example, by aluminum, gold, tantalum, tantalum-aluminum, or other metal or metal alloy. In addition, barrier layer 60 is formed of one or more layers of material including, for example, a photoimageable epoxy resin, such as SU8, and orifice layer 70 is formed of one or more layers of material including, for example, a photopolymer, such as SU8, or a metallic material, such as nickel, copper, iron/nickel alloys, palladium, gold, or rhodium. Other materials, however, may be used for barrier layer 60 and/or orifice layer 70.
In one embodiment, fluid restriction 120 communicates with and is provided in a fluid flow path between fluid channel 130 and fluid ejection chamber 110. Parameters of fluid restriction 120 and fluid channel 130 are defined to optimize operation or performance of fluid ejection device 100, as described below.
In one embodiment, fluid restriction 120 includes sidewalls 122 and 124, and fluid channel 130 includes sidewalls 132 and 134. In one embodiment, sidewalls 122 and 124 are substantially linear and oriented substantially parallel with each other. In addition, sidewalls 122 and 124 are each oriented substantially perpendicular to fluid ejection chamber 110 and, more specifically, end wall 112 of fluid ejection chamber 110. In addition, in one embodiment, sidewalls 132 and 134 of fluid channel 130 are substantially linear and are each oriented at an angle to fluid restriction 120 and, more specifically, sidewalls 122 and 124 of fluid restriction 120.
In one embodiment, fluid channel 130 communicates with a supply of fluid via a fluid feed slot 104 (only one edge of which is shown in the figures) formed in a substrate 102 of fluid ejection device 100. As described above, fluid channel 130 communicates with fluid restriction 120 and, as such, supplies fluid from fluid feed slot 104 to fluid ejection chamber 110 via fluid restriction 120.
In one embodiment, one or more islands 106 are formed on substrate 102 of fluid ejection device 100 within fluid channel 130. Islands 106 provide a particle tolerant architecture which helps to prevent particles which may be present in the fluid from entering fluid channel 130 and, therefore, fluid restriction 120 and fluid ejection chamber 110.
In one embodiment, a resistor 140, as one embodiment of a drop generator, is communicated with fluid ejection chamber 110 such that droplets of fluid are ejected from fluid ejection chamber 110 by activation of resistor 140, as described above with reference to resistor 82 and
In one embodiment, as illustrated in
In one embodiment, a contour of fluid ejection chamber 110 follows a profile of orifice 162. For example, sidewalls 114 and 116 of fluid ejection chamber 110 are contoured to follow the profile of orifice 162. As such, in one embodiment, sidewalls 114 and 116 of fluid ejection chamber 110 each include an arcuate portion having a radius of curvature greater than that of orifice 162. In one exemplary embodiment, the radius of curvature of the arcuate portions or “cheeks” of fluid ejection chamber 110 is equal to a radius of orifice 162 plus three microns.
In one embodiment, fluid restriction 220 communicates with and is provided in a fluid flow path between fluid ejection chamber 210 and fluid channel 230. Similar to fluid restriction 120 and fluid channel 130 of fluid ejection device 100, parameters of fluid restriction 220 and fluid channel 230 are defined to optimize operation or performance of fluid ejection device 200, as described below. In one embodiment, fluid restriction 220 and fluid channel 230 include respective sidewalls 222 and 224, and sidewalls 232 and 234 arranged in a manner similar to that of fluid ejection device 100.
In one embodiment, fluid channel 230 communicates with a supply of fluid via a fluid feed slot 204 (only one edge of which is shown in the figures) formed in a substrate 202 of fluid ejection device 200. In addition, similar to that described above, a resistor 240, as one embodiment of a drop generator, is communicated with fluid ejection chamber 210 such that droplets of fluid are ejected from fluid ejection chamber 210 by activation of resistor 240.
As illustrated in the embodiment of
In one embodiment, a plurality of fluid ejection devices 100 and/or 200 are formed on a common substrate and are arranged to substantially form one or more columns of drop ejecting elements. As such, drop ejecting elements of respective fluid ejection devices 100 and/or 200 may be used for ejecting different color inks from printhead 12. In one exemplary embodiment, fluid ejection device 100 is optimized for use with black ink and fluid ejection device 200 is optimized for use with a colored ink, as described below.
In one embodiment, as illustrated in
In one exemplary embodiment, as illustrated in the tables of
In one embodiment, width W of fluid restrictions 120 and 220 is substantially constant and is measured between respective sidewalls 122 and 124 and sidewalls 222 and 224. In addition, length L of fluid restrictions 120 and 220 is measured along respective sidewalls 122 and 124 and sidewalls 222 and 224 between sidewalls 132 and 134 and sidewalls 232 and 234 of respective fluid channels 130 and 230 and end walls 118 and 119 and 218 and 219 of respective fluid ejection chambers 110 and 210.
In one embodiment, barrier layers 150 and 250 each have a thickness defining a height H (see
In one embodiment, the feed rate of fluid ejection chambers 110 and 210 is directly proportional to the cross-sectional area of respective fluid restrictions 120 and 220. Accordingly, the cross-sectional area of fluid restrictions 120 and 220 is defined by the height or depth of fluid restrictions 120 and 220 and the width of fluid restrictions 120 and 220. As such, in one embodiment, the cross-sectional area of fluid restrictions 120 and 220 is substantially rectangular in shape. The cross-sectional area of fluid restrictions 120 and 220, however, may be other shapes.
In one embodiment, the total impedance to flow through fluid restrictions 120 and 220 to respective fluid ejection chambers 110 and 210 is optimized so as to avoid overfilling of fluid ejection chambers 110 and 210. As such, fluid ejection devices 100 and 200 are optimized so as to maintain a substantially constant impedance to flow of fluid to respective fluid ejection chambers 110 and 210 over a desired operating range. In one exemplary embodiment, fluid ejection devices 100 and 200 are each optimized so as to maintain a substantially constant impedance to flow of fluid to respective fluid ejection chambers 110 and 210 over an operating range up to at least approximately 48 kilohertz.
In one embodiment, fluid restrictions 120 and 220 each have a fluid restriction parameter. In one embodiment, the fluid restriction parameter is defined by the following equation:
(2*W+2*H)*L/(H*W),
wherein W is the width of respective fluid restrictions 120 and 220, H is the height of respective fluid restrictions 120 and 220, and L is the length of respective fluid restrictions 120 and 220. As such, the fluid restriction parameter of fluid restrictions 120 and 220 is optimized to optimize operation or performance of respective fluid ejection devices 100 and 200.
In one embodiment, as outlined in the table of
In another embodiment, as outlined in the table of
Accordingly, as noted with the above examples, the thickness of barrier layers 150 and 250 and, therefore, height H of respective fluid restrictions 120 and 220, as well as width W and length L of fluid restrictions 120 and 220 are selected to optimize the fluid restriction parameter. Various combinations of height H, width W, and length L of fluid restrictions 120 and 220, therefore, may be selected to optimize the fluid restriction parameter.
In one embodiment, in addition to optimizing parameters of fluid ejection devices 100 and 200, as described above, properties of fluid ejected from fluid ejection devices 100 and 200 are also optimized to optimize performance of fluid ejection devices 100 and 200. For example, properties of fluid ejected from fluid ejection devices 100 and 200 are optimized to optimize drop weight and drop velocity of droplets ejected from fluid ejection devices 100 and 200, as well as optimize a high frequency response of fluid ejection devices 100 and 200.
In one embodiment, for example, surface tension and/or viscosity of fluid ejected from fluid ejection devices 100 and 200 is optimized to optimize performance of fluid ejection devices 100 and 200. In one exemplary embodiment, surface tension of the fluid ejected from fluid ejection devices 100 and 200 is in a range of approximately 21 dynes/centimeter to approximately 35 dynes/centimeter, and viscosity of the fluid ejected from fluid ejection devices 100 and 200 is in a range of approximately 1.5 centipoises to approximately 4.0 centipoises.
In one embodiment, fluid ejection devices 100 and 200 are optimized to produce droplets of substantially uniform or constant drop weight. In one exemplary embodiment, a drop weight of droplets ejected from fluid ejection devices 100 and 200 is in a range of approximately 3.5 nanograms to approximately 10.5 nanograms. In addition, in one embodiment, a frequency at which droplets of fluid are ejected from fluid ejection devices 100 and 200 is also optimized to optimize performance of fluid ejection devices 100 and 200.
In one embodiment, as described above, fluid ejection device 100 is tuned to optimize performance with one fluid (or ink), such as a black ink, and fluid ejection device 200 is tuned to optimize performance with another fluid (or ink), such as a colored ink. Parameters of fluid ejection devices 100 and 200, such as width W and length L of respective fluid restrictions 120 and 220, therefore, are selected to optimize the respective performance. Parameters of fluid ejection devices 100 and 200, however, remain within the overall system ranges. Accordingly, fluid ejection devices 100 and 200 may accommodate one or more different inks while being designed within the same system parameters.
Although specific embodiments have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art that a variety of alternate and/or equivalent implementations may be substituted for the specific embodiments shown and described without departing from the scope of the present invention. This application is intended to cover any adaptations or variations of the specific embodiments discussed herein. Therefore, it is intended that this invention be limited only by the claims and the equivalents thereof.
Prakash, Satya, Agarwal, Arun K, Fellner, Elizabeth A., Feinn, James A, Pingel, James, Yildirim, Ozgur, Cox, Julie J, Moritz, Jules G, Jenkins, David W, Giere, Matthew David
Patent | Priority | Assignee | Title |
8177338, | Dec 10 2009 | Xerox Corporation | High frequency mechanically actuated inkjet |
Patent | Priority | Assignee | Title |
4882595, | Oct 30 1987 | HEWLETT-PACKARD COMPANY, PALO ALTO, CALIFORNIA, A CORP OF CALIFORNIA | Hydraulically tuned channel architecture |
4967208, | Aug 10 1987 | Hewlett-Packard Company | Offset nozzle droplet formation |
5124716, | Jan 08 1990 | Xerox Corporation | Method and apparatus for printing with ink drops of varying sizes using a drop-on-demand ink jet print head |
5519423, | Jul 08 1994 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Tuned entrance fang configuration for ink-jet printers |
5898448, | Feb 17 1995 | Brother Kogyo Kabushiki Kaisha | Ink ejecting device having ink chambers of differing shapes |
5912685, | Jul 29 1994 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Reduced crosstalk inkjet printer printhead |
5946012, | Apr 02 1992 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Reliable high performance drop generator for an inkjet printhead |
6042222, | Aug 27 1997 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Pinch point angle variation among multiple nozzle feed channels |
6158846, | Aug 08 1997 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Forming refill for monolithic inkjet printhead |
6193347, | Oct 30 1997 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Hybrid multi-drop/multi-pass printing system |
6247798, | May 13 1997 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Ink compensated geometry for multi-chamber ink-jet printhead |
6259463, | Oct 30 1997 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Multi-drop merge on media printing system |
6309052, | Apr 30 1999 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | High thermal efficiency ink jet printhead |
6409318, | Nov 30 2000 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Firing chamber configuration in fluid ejection devices |
6443564, | Nov 13 2000 | Oregon State University; HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Asymmetric fluidic techniques for ink-jet printheads |
6447104, | Mar 13 2001 | Oregon State University; HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Firing chamber geometry for inkjet printhead |
6467882, | Oct 28 1991 | Canon Kabushiki Kaisha | Liquid jet recording method and apparatus and recording head therefor |
6489084, | Jul 22 1998 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Fine detail photoresist barrier |
6491377, | Aug 30 1999 | HP INC | High print quality printhead |
6502915, | Oct 30 1997 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Apparatus for generating high frequency ink ejection and ink chamber refill |
6536878, | Apr 30 1999 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Ink jet drop generator and ink composition printing system for producing low ink drop weight with high frequency operation |
6561632, | Jun 06 2001 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Printhead with high nozzle packing density |
6565195, | May 04 2001 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Feed channels of a fluid ejection device |
6719405, | Mar 25 2003 | SLINGSHOT PRINTING LLC | Inkjet printhead having convex wall bubble chamber |
6729715, | Aug 14 2002 | HEWLETT-PACKARD DEVELOPMENT COMPANY, L P | Fluid ejection |
20030202046, | |||
EP705695, |
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