An image sensor includes a substrate having a plurality of photosensitive sites for capturing an image and a plurality of additional photosensitive sites adjacent the image capturing photosensitive sites in which there is no image capture; and a digital signal embedded in one or more of the additional photosensitive sites for the purpose of identification.
|
1. An image sensor, comprising:
a plurality of photosensitive sites arranged into an active area and a non-active area, wherein the photosensitive sites in the active area are used to capture an image; and
a metal plate covering at least a portion of the photosensitive sites in the non-active area, wherein the metal plate includes one or more openings positioned at predetermined locations over respective photosensitive sites in the non-active area to form a unique pattern that is associated with the image sensor.
2. The image sensor of
3. The image sensor of
|
The invention relates generally to the field of image sensors and, more particularly, to such image sensors having an embedded signal therein for identifying the particular manufacturer, die location and the like.
As is well known in the art, image sensors include a plurality of pixels for capturing an electronic representation of an image. Typically, a plurality of sensors is manufactured on one wafer, and the wafer is then cut so that each sensor has its own individual silicon substrate.
During manufacturing, it is desirable to know the spatial location of the wafer of one sensor in relation to the original uncut wafer since performance can be affected by location. In this regard, manufacturers typically test the sensors after the cutting process and knowing the precise location assists test personnel in calibration, future manufacturing, and the like. Obviously, manual tagging is labor intensive, prone to error due to misplaced and lost tags and the like.
Consequently, a need exists for having a sensor in which the sensor location in relation to the original uncut wafer is embedded in the sensor for efficient testing and manufacturing.
The present invention is directed to overcoming one or more of the problems set forth above. Briefly summarized, according to one aspect of the present invention, the invention resides in an image sensor comprising a substrate having a plurality of photosensitive sites for capturing an image and a plurality of additional photosensitive sites; and a digital signal embedded in one or more of the additional photosensitive sites for the purpose of identifying individually or in any combination particular manufacturer, lot, wafer, and/or position on the wafer during manufacture of the image sensor.
These and other aspects, objects, features and advantages of the present invention will be more clearly understood and appreciated from a review of the following detailed description of the preferred embodiments and appended claims, and by reference to the accompanying drawings.
The present invention has the advantage of having an embedded signal in the sensor that identifies lot location and the like.
Referring to
It is instructive to note at this point that the manufacture of the active area will not be described in detail herein since it can be done by any well-known method and apparatus. Now referring to
The substrate 20 is then exposed to light for embedding a signal in the non-active area 40. As illustrated in the graph of
Referring to
Referring to
The invention has been described with reference to a preferred embodiment. However, it will be appreciated that variations and modifications can be effected by a person of ordinary skill in the art without departing from the scope of the invention.
Fabinski, Robert P., Lobel, Laurence J.
Patent | Priority | Assignee | Title |
8280098, | May 19 2005 | UTI Limited Partnership | Digital watermarking CMOS sensor |
8797411, | Sep 17 2009 | Apparatus and method used to evaluate and optimize image quality in high color gamut imaging systems |
Patent | Priority | Assignee | Title |
20020114526, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Oct 01 2003 | Eastman Kodak Company | (assignment on the face of the patent) | / | |||
Oct 01 2003 | FABINSKI, ROBERT P | Eastman Kodak Company | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014577 | /0417 | |
Oct 01 2003 | LOBEL, LAURENCE J | Eastman Kodak Company | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014577 | /0417 | |
Apr 15 2011 | Eastman Kodak Company | OmniVision Technologies, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 026227 | /0213 |
Date | Maintenance Fee Events |
Sep 07 2012 | ASPN: Payor Number Assigned. |
Sep 27 2012 | M1551: Payment of Maintenance Fee, 4th Year, Large Entity. |
Sep 26 2016 | M1552: Payment of Maintenance Fee, 8th Year, Large Entity. |
Sep 15 2020 | M1553: Payment of Maintenance Fee, 12th Year, Large Entity. |
Date | Maintenance Schedule |
Apr 21 2012 | 4 years fee payment window open |
Oct 21 2012 | 6 months grace period start (w surcharge) |
Apr 21 2013 | patent expiry (for year 4) |
Apr 21 2015 | 2 years to revive unintentionally abandoned end. (for year 4) |
Apr 21 2016 | 8 years fee payment window open |
Oct 21 2016 | 6 months grace period start (w surcharge) |
Apr 21 2017 | patent expiry (for year 8) |
Apr 21 2019 | 2 years to revive unintentionally abandoned end. (for year 8) |
Apr 21 2020 | 12 years fee payment window open |
Oct 21 2020 | 6 months grace period start (w surcharge) |
Apr 21 2021 | patent expiry (for year 12) |
Apr 21 2023 | 2 years to revive unintentionally abandoned end. (for year 12) |