A semiconductor light emitting device is combined with a wavelength converting material. The semiconductor light emitting device is configured to emit first light of a first peak wavelength. The wavelength converting material is configured to absorb at least a portion of the first light and emit second light of a second peak wavelength. In some embodiments, the first wavelength converting material is (Ba1-xSrx)2-y-0.5zSi5N8-zOz:Euy2+ where 0.2<x<0.3, (Ba1-xCax)2-y-0.5zSi5N8-zOz:Euy2+ where 0.01<x<0.2, or M2Si5-aAaN8-aOa:Eu2+ where M=Sr, Ba, Ca; A=Al, B, Ga, Sc; and 0.01<a<0.2.
|
1. A structure comprising:
a semiconductor light emitting device configured to emit first light of a first peak wavelength; and
a first wavelength converting material comprising (Ba1-xSrx)2-y-0.5zSi5N8-zOz:Euy2+ where 0.2<x<0.3, 0.002≦y≦0.04, and z≦0.5, the first wavelength converting material being configured to absorb at least a portion of the first light and emit second light of a second peak wavelength.
2. The structure of
3. The structure of
4. The structure of
5. The structure of
6. The structure of
7. The structure of
8. The structure of
|
1. Field of the Invention
The invention relates generally to wavelength-converted light emitting devices.
2. Description of Related Art
Light emitting devices including light emitting diodes are well known solid state devices that can generate light having a peak wavelength in a specific region of the light spectrum. LEDs are typically used as illuminators, indicators, and displays. LEDs based on the III-nitride materials system have been developed that can efficiently emit light in a relatively narrow band around a peak wavelength in the blue to UV range of the spectrum. Since blue-UV light has a higher photo energy relative to other colors of visible light, such light generated by III-nitride LEDs can be readily converted to produce light having a longer wavelength. It is well known in the art that light having a first peak wavelength (“primary light”) can be converted into light having a longer peak wavelength (“secondary light”) using a process known as luminescence. The luminescence process involves absorbing the primary light by a photoluminescent phosphor material, which excites the atoms of the phosphor material, and emits the secondary light. The peak wavelength and the band of wavelengths around it (in short wavelength) of the secondary light will depend on the phosphor material. The type of phosphor material can be chosen to yield secondary light having a particular peak wavelength. Needed in the art are wavelength-converting materials such as phosphors that efficiently convert light in desired wavelength ranges and can withstand the operating temperatures of III-nitride light emitting devices.
U.S. Pat. No. 6,649,946 to Bogner et al. describes, in the abstract, “[a] light source [that] uses a yellow to red emitting phosphor with a host lattice of the nitridosilicate type MxSiyNz:Eu, wherein M is at least one of an alkaline earth metal chosen from the group Ca, Sr, Ba and wherein z=⅔x+ 4/3y.” EP 1 433 831 A1 to Tamaki et al., describes, in the abstract a “nitride phosphor . . . represented by the general formula LXMYN((2/3)X+(4/3)Y):R or LXMYOZN((2/3)X+(4/3)Y−(2/3)Z):R (wherein L is at least one or more selected from the Group II Elements consisting of Mg, Ca, Sr, Ba and Zn, M is at least one or more selected from the Group IV Elements in which Si is essential among C, Si and Ge, and R is at least one or more selected from the rare earth elements in which Eu is essential among Y, La, Ce, Pr, Nd, Sm, Eu, Gd, Th, Dy, Ho, Er and Lu.)”
Embodiments of the invention include a semiconductor light emitting device combined with a wavelength converting material. The semiconductor light emitting device is configured to emit first light of a peak wavelength. The first wavelength converting material is configured to absorb at least a portion of the first light and emit second light of a second peak wavelength. In some embodiments, the first wavelength converting material is (Ba1-xSrx)2-y-0.5zSi5N8-zOz:Euy2+ where 0.2<x<0.3, (Ba1-xCax)2-y-0.5zSi5N8-zOz:Euy2+ where 0.01<x<0.2, or M2Si5-aAaN8-aOa:Eu2+ where M=Sr, Ba, Ca; A=Al, B, Ga, Sc; and 0.01<a<0.2.
Particularly useful are red- and orange-emitting phosphors. In the materials systems commonly used to make red and orange light emitting diodes, the efficiency of the diodes generally declines as the peak wavelength gets longer, or more red. The efficiency of such devices may further suffer in the temperature extremes experienced in such common applications as traffic lights and automotive lights. In such applications in particular, light emitting diodes that emit blue or UV light that is converted by a red-emitting phosphor may offer superior performance to red light emitting diodes. In addition, red- and orange-emitting phosphors are useful in applications requiring white light, such as illumination and backlighting applications.
In accordance with embodiments of the invention, new orange- and red-emitting phosphors are disclosed that perform well at high temperature and at high illumination from a pump source. Such phosphors may be pumped by, for example, blue or UV light emitting diodes, in systems that emit orange, red, or whitish light and include only the orange- or red-emitting phosphor, or in systems that emit white light and include one or more wavelength-converting materials in addition to the orange- or red-emitting phosphor.
The inventors have discovered that certain formulations of M2Si5N8:Eu2+ phosphors, where M is one or more of Sr, Ba, and Ca, exhibit poor performance at high temperature or high pump illumination.
The addition of Ba, resulting in a phosphor formulation of (Ba,Sr)2Si5N8:Eu2+, may increase the performance stability of the phosphor at high temperature and high pump light intensity.
Substituting Ba and Ca for Sr, resulting in a phosphor formulation of (Ba,Ca)2Si5N8:Eu2+, may also increase the performance stability of the phosphor at high temperature and high pump light intensity. Favorable stability and emission spectrum are observed in phosphors of the formulation (Ba1-xCax)2Si5N8:Eu2+ where 0.01<x<0.2. In embodiments including Ca, the composition of Ca may be limited to less than 50%, as Ca compositions greater than 50% may lead to different, undesirable crystal structures.
Including each of Ba, Ca, and Sr, resulting in a phosphor formulation of (Ba,Ca,Sr)2Si5N8:Eu2+, may also increase the performance stability of the phosphor at high temperature and high pump light intensity.
The stability of some of the M2Si5N8:Eu2+ phosphors described above may be improved by decreasing the Eu2+ doping level. As the Eu2+ doping level decreases, the emission spectrum peak undesirably shifts toward shorter wavelengths. Favorable stability and an acceptable emission spectrum under high temperature and high pump light intensity have been observed for Eu2+ concentrations between 0.2% and 4%, particularly between 0.75% and 4%.
In some embodiments, during processing, oxygen is unintentionally incorporated into the M2Si5N8:Eu2+ phosphors described above. These embodiments are more correctly described by, for example, the formulae (Ba1-xCax)2-y-0.5zSi5N8-zOz:Euy2+ and (Ba1-xSrx)2-y-0.5zSi5N8-zOz:Euy2+. These compositions may include up to about 5 atom % oxygen with respect to nitrogen, for which the oxygen substitutes. In some embodiments, z≦0.5.
In some embodiments, Al and O are added, resulting in a phosphor formulation of (Sr1-x-yBaxCay)2Si5-aAlaN8-aOa:Eu2+, to improve the stability and spectrum of the phosphor.
Some of the phosphors described above may be synthesized as follows.
Synthesis of (Ba0.75Sr0.25)1.96Si4.9Al0.1N7.9O0.1:Eu0.04: 100 g of Ba0.75Sr0.25O:Eu0.02 that is prepared by firing a mixture of BaCO3, SrCO3, Eu2O3 and an equimolar amount of carbon in a stream of forming gas (H2/N2=9/95) at 1000° C., 61.43 g amorphous silicon nitride (available from Alfa Aesar, 98%), 10.63 g graphite (Alfa Aesar, microcrystal grade), and 0.5 g AlN (Alfa Aesar) are wet mixed with 100 ml isopropanol, dried and homogenized in a dry atmosphere. The precursor mix is poured in a tungsten boat and then fired at 1450° C. in streaming forming gas (H2/N2=9/95) for 4 hours. The heating rate is 150 k/h up to 1400° C. and 10 k/h up to 1450° C. After cooling down, the phosphor is homogenized by grinding and fired again at 1450° C. for 2 hrs in streaming forming gas (H2/N2=9/95). The phosphor is then milled with yttria stabilized zirconia balls (2 mm diameter) in isopropanol for 1 hr. The milled phosphor is then subsequently washed with acetic acid, water and ethanol, and finally dried at 100° C.
Synthesis of (Ba0.75Sr0.25)1.96Si4.9B0.1N7.9O0.1:Eu0.04: 100 g of Ba0.75Sr0.25O:Eu0.02 that is prepared by firing a mixture of BaCO3, SrCO3, Eu2O3 and an equimolar amount of carbon in a stream of forming gas (H2/N2=9/95) at 1000° C., 61.43 g amorphous silicon nitride (Alfa Aesar, 98%), 10.63 g graphite (Alfa Aesar, microcrystal grade), and 0.88 g α-BN (Riedel de Haen) are wet mixed with 100 ml isopropanol, dried and homogenized in a dry atmosphere. The precursor mix is poured in a tungsten boat and then fired at 1450° C. in streaming forming gas (H2/N29/95) for 4 hours. The heating rate is 150 k/h up to 1400° C. and 10 k/h up to 1450° C. After cooling down the phosphor is homogenized by grinding and fired again at 1450° C. for 2 hrs in streaming forming gas (H2/N2=9/95). The phosphor is then milled with yttria stabilized zirconia balls (2 mm diameter) in isopropanol for 1 hr. The milled phosphor is then subsequently washed with acetic acid, water and ethanol, and finally dried at 100° C.
Synthesis of (Ba0.95Ca0.05)1.96Si5N8:Eu0.04: (Ba0.95Ca0.05)1.96Si5N8:Eu0.04 is synthesized using Ba3N2, which is obtained by nitridation of Ba metal (Aldrich, St. Louis, Mo., USA) at 700° C. in N2 atmosphere, Ca3N2 (Alfa Aesar, Karlsruhe, Germany), amorphous Si3N4 (98%, Alfa Aesar) and EuF3 (Aldrich). In a glove box 42.09 g Ba3N2, 0.763 g Ca3N2, 27.22 g SiN and 1.290 g EuF3 are mixed in a porcelain mortar. The mixture is fired at 1400° C. in streaming forming gas (H2/N2=9/95) for 4 h in a tungsten crucible, reground and fired a second time. The resulting orange colored powder is washed with acetic acid, water and 2-propanol removing unreacted components and fine particles.
The phosphors described above may offer several advantages. They may be more stable than conventional Sr2Si5N8:Eu2+ when operated at high temperature and/or high pump light intensity. For many of the above phosphors, any change in the spectrum caused by elevated temperature or pump light intensity is reversible, indicating that the color of light emitted by the phosphor is not expected to change significantly with use over time. Such phosphors are particularly useful for applications requiring precision in the color emitted by the phosphor, such as backlighting applications. In addition, many of the above phosphors have a wider excitation spectrum than conventional phosphors such as Y3Al5O12:Ce. For example, some of the phosphors described above have an excitation spectrum that extends to wavelengths shorter than 410 nm. Using a 410 nm device as a pump may be beneficial, particularly for applications requiring red or orange light, since at 410 nm, any light leaking through the phosphor layer will not change the color appearance of the composite light, and does not need to be completely removed from the spectrum, for example by complete absorption by the phosphor or by a filter, since light at 410 nm is not subject to many safety regulations governing leakage of UV light.
The one or more phosphors in phosphor layer 44 may be deposited as thin films by, for example, electron beam evaporation, thermal evaporation, rf-sputtering, chemical vapor deposition, or atomic layer epitaxy; or deposited as conformal layers over LED 1 by, for example, screen printing, stenciling as described in U.S. Pat. No. 6,650,044, or by electrophoretic deposition as described in U.S. Pat. No. 6,576,488. Thin films are described in more detail in U.S. Pat. No. 6,696,703. Each of U.S. Pat. No. 6,696,703, U.S. Pat. No. 6,650,044 and U.S. Pat. No. 6,576,488 are incorporated herein by reference. In contrast to a thin film, which typically behaves as a single, large phosphor particle, the phosphor in a conformal layer generally behaves as multiple phosphor particles. In addition a thin film typically contains no materials other than phosphor. A conformal layer often includes materials other than phosphor, such as, for example, silica.
The back plane and the sidewalls of the backlight 26 are covered with highly reflective materials. Good results have been obtained with a white diffuse reflective film on the back (e.g., E60L, produced by Toray, Japan), and a specular reflecting material on the sidewalls (e.g., Miro material, as produced by Alanod, Germany), but other configurations work as well. The materials used should have a high coefficient of reflection, preferably >90%. By using these high reflective materials, a high recycling efficiency is achieved. This is in particular important when Brightness Enhancement Films are used, as mentioned above, as these films reflect the light which can not be used in the first pass, and which needs to be recycled in order to contribute to the output of the LCD during a second or third pass.
LCD panel 14 is placed in front of the backlight 26. The LCD panel 14 may be a conventional LCD, having a first polarizing filter, a thin film transistor array for developing an electric field across selected areas of the liquid crystal layer, a liquid crystal layer, an RGB color filter array, and a second polarizing filter. The color filter array has red, green and blue subpixels. Between the LCD panel 14 and the backlight 26, additional films can be used, such as a brightness enhancement film (BEF) or polarization recovery film (DBEF).
LEDs 26 are generally blue or UV-emitting LEDS. A phosphor layer 39, which may include one or more of the phosphors described above, is formed on the cover plate 40, rather than directly on LEDs 26. In some embodiments, different phosphor layers are formed on different surfaces of cover plate 40. The cover plate 40 may or may not be a diffuser, depending on the amount of diffusing performed by the phosphor. Spacing phosphor layer 39 apart from LEDs 26 is attractive because light emitted from the phosphor to the rear of the backlight 26 has a larger recycling efficiency than into the LED chips, due to the high reflectivity of the films used in the backlight 26. In addition to the recycling efficiency, the phosphors are not required to withstand the high temperatures near the LEDs and are not required to be chemically compatible with the LEDs, increasing the number of possible suitable phosphors and potentially improving the efficiency and lifetime of the device. From a logistics point of view, this solution is attractive as well, as the blue backlight can be used for a large range of different displays, with different types of color filters, and only the phosphor layer thickness and phosphor concentration has to be optimized to fit a particular LCD.
In some embodiments of the devices illustrated in
In some embodiments of the devices illustrated in
In another example, a UV light emitting diode may be combined with a blue-emitting phosphor, a yellow- or green-emitting phosphor and a red-emitting phosphor. Examples of suitable yellow- or green-emitting phosphors and suitable red-emitting phosphors are listed above. Examples of suitable blue-emitting phosphors include, for example, MgSrSiO4:Eu2+; (Sr1-x-yCaxBay)3MgSi2O8:Eu2+ including, for example Ba3MgSi2O8:Eu2+; and BaMgAl10O17:Eu2+.
In devices with more than one phosphor, the individual phosphors may be mixed together and applied as a mixture, or separated into discrete layers or discrete regions.
Having described the invention in detail, those skilled in the art will appreciate that, given the present disclosure, modifications may be made to the invention without departing from the spirit of the inventive concept described herein. Therefore, it is not intended that the scope of the invention be limited to the specific embodiments illustrated and described.
Mueller, Gerd O., Meyer, Joerg, Schmidt, Peter J., Mueller-Mach, Regina B., Wiechert, Detlef Uwe
Patent | Priority | Assignee | Title |
10240086, | Jul 22 2010 | OSRAM Opto Semiconductors GmbH | Garnet material, method for its manufacturing and radiation-emitting component comprising the garnet material |
8088304, | Mar 06 2007 | Merck Patent Gesellschaft | Luminophores made of doped garnet for pcLEDs |
8534901, | Sep 13 2010 | SEOUL SEMICONDUCTOR COMPANY, LTD | Collimating waveguide apparatus and method |
8597545, | Jul 18 2012 | Intematix Corporation | Red-emitting nitride-based calcium-stabilized phosphors |
8608328, | May 06 2011 | FAIRLIGHT INNOVATIONS, LLC | Light source with secondary emitter conversion element |
8663502, | Dec 30 2011 | Intematix Corporation | Red-emitting nitride-based phosphors |
8951440, | May 19 2008 | Intematix Corporation | Nitride-based red-emitting phosphors in RGB (red-green-blue) lighting systems |
8951441, | Dec 30 2011 | Intematix Corporation | Nitride phosphors with interstitial cations for charge balance |
9133392, | Jul 22 2010 | OSRAM Opto Semiconductors GmbH | Garnet material, method for its manufacturing and radiation-emitting component comprising the garnet material |
9157024, | Dec 22 2012 | ALPAD CORPORATION | Phosphor and light emitting device |
9257607, | Dec 01 2010 | Lumileds LLC | Red emitting luminescent materials |
9260659, | Jul 18 2012 | Intematix Corporation | Red-emitting nitride-based calcium-stablized phosphors |
9397272, | Mar 27 2013 | Chi Mei Corporation | Phosphor and light emitting device |
9422472, | Dec 30 2011 | Intematix Corporation | Red-emitting nitride-based phosphors |
9580649, | Jul 13 2012 | Merck Patent GmbH | Process for production of phosphors |
9695357, | Dec 30 2011 | Intematix Corporation | Nitride phosphors with interstitial cations for charge balance |
9829757, | Oct 28 2011 | AU Optronics Corporation | Transparent display device and display method thereof |
Patent | Priority | Assignee | Title |
5847507, | Jul 14 1997 | PHILIPS LIGHTING NORTH AMERICA CORPORATION | Fluorescent dye added to epoxy of light emitting diode lens |
5959316, | Sep 01 1998 | Lumileds LLC | Multiple encapsulation of phosphor-LED devices |
6351069, | Feb 18 1999 | Lumileds LLC | Red-deficiency-compensating phosphor LED |
6417019, | Apr 04 2001 | Lumileds LLC | Phosphor converted light emitting diode |
6501102, | Sep 27 1999 | LumiLeds Lighting, U.S., LLC | Light emitting diode (LED) device that produces white light by performing phosphor conversion on all of the primary radiation emitted by the light emitting structure of the LED device |
6603258, | Apr 24 2000 | Lumileds LLC | Light emitting diode device that emits white light |
6630691, | Sep 27 1999 | Lumileds LLC | Light emitting diode device comprising a luminescent substrate that performs phosphor conversion |
6649946, | Nov 30 1999 | OSRAM Opto Semiconductors GmbH | Light source using a yellow-to-red-emitting phosphor |
6680569, | Feb 18 1999 | Lumileds LLC | Red-deficiency compensating phosphor light emitting device |
6682207, | Jan 29 1999 | Lumileds LLC | Green phosphor converted light emitting diode |
6686691, | Sep 27 1999 | Lumileds LLC | Tri-color, white light LED lamps |
6696703, | Sep 27 1999 | Lumileds LLC | Thin film phosphor-converted light emitting diode device |
6717353, | Oct 14 2002 | Lumileds LLC | Phosphor converted light emitting device |
6740262, | May 09 2000 | MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD | Light-transmitting sintered body, light-emitting tube and electric discharge lamp using same |
6956247, | May 26 2004 | Lumileds LLC | Semiconductor light emitting device including photonic band gap material and luminescent material |
20040256974, | |||
EP1433831, | |||
JP2004161806, | |||
WO2004042834, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Dec 10 2004 | Philips Lumileds Lighting Company, LLC | (assignment on the face of the patent) | / | |||
Jan 10 2005 | WIECHERT, DETLEF UWE | LUMILEDS LIGHTING U S LLC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015930 | /0528 | |
Jan 10 2005 | SCHMIDT, PETER | LUMILEDS LIGHTING U S LLC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015930 | /0528 | |
Jan 10 2005 | MEYER, JOERG | LUMILEDS LIGHTING U S LLC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015930 | /0528 | |
Mar 07 2005 | MUELLER-MACH, REGINA B | LUMILEDS LIGHTING U S LLC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015930 | /0528 | |
Mar 07 2005 | MUELLER, GERD O | LUMILEDS LIGHTING U S LLC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 015930 | /0528 | |
Feb 11 2011 | LUMILEDS LIGHTING U S , LLC | Philips Lumileds Lighting Company LLC | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 025850 | /0770 | |
Mar 26 2015 | Philips Lumileds Lighting Company, LLC | Lumileds LLC | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 046111 | /0261 | |
Jun 30 2017 | Lumileds LLC | DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 043108 | /0001 | |
Dec 30 2022 | LUMILEDS HOLDING B V | SOUND POINT AGENCY LLC | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 062299 | /0338 | |
Dec 30 2022 | Lumileds LLC | SOUND POINT AGENCY LLC | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 062299 | /0338 |
Date | Maintenance Fee Events |
Mar 14 2013 | M1551: Payment of Maintenance Fee, 4th Year, Large Entity. |
Aug 28 2017 | M1552: Payment of Maintenance Fee, 8th Year, Large Entity. |
Aug 17 2021 | M1553: Payment of Maintenance Fee, 12th Year, Large Entity. |
Date | Maintenance Schedule |
Mar 02 2013 | 4 years fee payment window open |
Sep 02 2013 | 6 months grace period start (w surcharge) |
Mar 02 2014 | patent expiry (for year 4) |
Mar 02 2016 | 2 years to revive unintentionally abandoned end. (for year 4) |
Mar 02 2017 | 8 years fee payment window open |
Sep 02 2017 | 6 months grace period start (w surcharge) |
Mar 02 2018 | patent expiry (for year 8) |
Mar 02 2020 | 2 years to revive unintentionally abandoned end. (for year 8) |
Mar 02 2021 | 12 years fee payment window open |
Sep 02 2021 | 6 months grace period start (w surcharge) |
Mar 02 2022 | patent expiry (for year 12) |
Mar 02 2024 | 2 years to revive unintentionally abandoned end. (for year 12) |