The present invention relates to a sheet for mounting a polishing workpiece. The sheet comprises a substrate, a surface layer and a slightly rough layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interior thereof, and has a surface. The slightly rough layer is located on the surface of the surface layer to carry and mount the polishing workpiece, with no hole structure existing in the interior thereof. Accordingly, when the polishing workpiece contacts the slightly rough layer, the air therebetween is easily vented out via the slightly rough layer, without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and the sheet.
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1. A sheet for mounting a workpiece to be polished, comprising:
a substrate, having a surface;
a surface layer, located on the surface of the substrate, having no hole structure in the interior thereof, and having a surface; and
a rough layer, located on the surface of the surface layer, and for carrying and mounting the workpiece to be polished, and having no hole structure in the interior thereof, the rough layer including a plurality of periodic protrusions to define a rough surface of the rough layer, wherein the periodic protrusions are regularly repeated, wherein each protrusion has a height and the heights of the protrusions are equal, and wherein the periodic protrusions define periodic and regularly spaced vent spaces therebetween, wherein air is vented out via the vent spaces when the workpiece to be polished contacts the rough surface of the rough layer.
2. The sheet as claimed in
5. The sheet as claimed in
6. The sheet as claimed in
7. The sheet as claimed in
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1. Field of the Invention
The present invention relates to a sheet for mounting a workpiece to be polished (herein referred to as a “polishing workpiece”) and the method for making the same, and more particularly, to a sheet for mounting a workpiece to be polished and the method for making the same which are used in the chemical mechanical polishing process.
2. Description of the Related Art
Polishing generally refers to a wear control for a preliminary coarse surface in the process of chemical mechanical polishing (CMP), which makes the slurry containing fine particles evenly dispersed on the upper surface of a polishing pad, and at the same time places a polishing workpiece (i.e., a workpiece to be polished) against the polishing pad and then rubs the workpiece repeatedly with a regular motion. The polishing workpiece may be objects such as a semiconductor, a storage medium substrate, an integrated circuit, an LCD flat-panel glass, an optical glass and a photoelectric panel. During the polishing, a sheet must be used for carrying and mounting the polishing workpiece, and the quality of the sheet directly influences the polishing effect of the polishing workpiece.
Referring to
The operation mode of the polishing device 1 is as follows. First, the polishing workpiece 13 is mounted on the sheet 12, and then both the upper and lower base plates 14 and 11 are rotated and the upper base plate 14 is simultaneously moved downwards, such that the polishing pad 15 contacts the surface of the polishing workpiece 13. A polishing operation for the polishing workpiece 13 may be performed by continuously supplementing the slurry 16 and using the polishing pad 15.
Referring to
Consequently, there is an existing need for a sheet for mounting a polishing workpiece and the method for making the same to solve the above-mentioned problems.
The objective of the present invention is to provide a sheet for mounting a polishing workpiece. The sheet of the present invention comprises a substrate, a surface layer and a slightly rough layer. The substrate has a surface. The surface layer is located on the surface of the substrate, with no hole structure existing in the interior thereof, and has a surface. The slightly rough layer is located on the surface of the surface layer to carry and mount the polishing workpiece, with no hole structure existing in the interior thereof. Accordingly, when the polishing workpiece contacts the slightly rough layer, the air therebetween is easily vented out via the slightly rough layer, without the phenomenon of air wrapping, which increases the adsorption force between the polishing workpiece and the sheet, thereby improving the polishing effect of the polishing workpiece. Additionally, since no hole structure exists in the interior of both the surface layer and the slightly rough layer, the slurry will not be inhaled during the polishing, thus prolonging the lifetime of the sheet.
Another objective of the present invention is to provide a method for making the sheet for mounting a polishing workpiece, which comprises the following steps:
Referring to
The surface layer 22 is located on the first surface 211 of the substrate 21, and has a surface 221. The surface layer has no hole structure in the interior thereof. The material of the surface layer 22 is a polymeric elastomer without foam (for example PU, acrylic resin or another kind of resin). The surface layer 22 has a uniform thickness which is less than that of the substrate 21. The materials of the surface layer 22 and substrate 21 may be the same or different.
The slightly rough layer 23 is located on the surface 221 of the surface layer 22, and is used for carrying and mounting a polishing workpiece (not shown). No hole structure exists in the interior of the slightly rough layer 23, and the material of the slightly rough layer 23 is a polymeric elastomer without foam (for example PU, acrylic resin or another kind of resin). The materials of the slightly rough layer 23 and surface layer 22 may be the same or different. As shown in
The present invention further relates to a method for making the sheet for mounting a polishing workpiece, which comprises the following steps.
At first, referring to
Then, referring to
Then, the substrate 21 and surface layer 22 are dried for one day. After that, the release paper 30 is removed.
At last, referring to
Preferably, a water repellent treatment may also be performed for the slightly rough layer 23 to prolong the lifetime of the sheet 2.
While several embodiments of the present invention have been illustrated and described, various modifications and improvements can be made by those skilled in the art. The embodiments of the present invention are therefore described in an illustrative but not restrictive sense. It is intended that the present invention may not be limited to the particular forms as illustrated, and that all modifications which maintain the spirit and scope of the present invention are within the scope as defined in the appended claims.
Feng, Chung-Chih, Yao, I-Peng, Chao, Chen-Hsiang
Patent | Priority | Assignee | Title |
Patent | Priority | Assignee | Title |
3345206, | |||
3449870, | |||
3453783, | |||
3617702, | |||
3650880, | |||
3860399, | |||
4115683, | Dec 16 1974 | International Business Machines Corporation | Laser piercing of materials by induced shock waves |
4132037, | Feb 28 1977 | CYBEQ NANO TECHNOLOGIES, INC | Apparatus for polishing semiconductor wafers |
4239567, | Oct 16 1978 | AT & T TECHNOLOGIES, INC , | Removably holding planar articles for polishing operations |
4276341, | May 02 1979 | Kabushiki Kaisha Asahi Gomu | Wet suit material and wet suit made thereof |
4306573, | Jan 09 1978 | Hauni Maschinenbau Aktiengesellschaft | Method and apparatus for producing rod-like tobacco fillers |
4328410, | Aug 24 1978 | Laser skiving system | |
4466852, | Oct 27 1983 | AT & T TECHNOLOGIES, INC , | Method and apparatus for demounting wafers |
4850093, | Feb 09 1987 | VOUGHT AIRCRAFT INDUSTRIES, INC | Method of making an acoustic attenuating liner |
4851061, | Mar 16 1987 | RAM PRODUCTS, INC | Method and apparatus for patterned cut of thermoplastics |
5058413, | Nov 07 1989 | ZOOK CANADA INC | Rupture disc |
5109638, | Mar 13 1989 | MICROSURFACE FINISHING PRODUCTS, INC , A CORP OF IA | Abrasive sheet material with non-slip backing |
5212910, | Jul 09 1991 | Intel Corporation | Composite polishing pad for semiconductor process |
5336554, | May 14 1993 | Stretchable tear resistant porous elastomeric film elements and processes | |
5424813, | May 23 1994 | Xerox Corporation | Apparatus and method for improved blotter roller permeability |
5539182, | May 20 1993 | SETON GMBH LINDGENS LEDERFABRIK | Process for increasing moisture permeability of leather, especially for seating in the automobile industry |
5584146, | Apr 10 1995 | Applied Materials, Inc. | Method of fabricating chemical-mechanical polishing pad providing polishing uniformity |
5632914, | May 24 1995 | Ford Global Technologies, LLC | Motor vehicle air bag cover having a skin with a virtually invisible tear seam formed by miniature holes |
5707385, | Nov 16 1994 | Advanced Cardiovascular Systems, Inc. | Drug loaded elastic membrane and method for delivery |
5781393, | Apr 16 1996 | ERICO International Corporation | Surge arrester |
5820448, | Dec 27 1993 | Applied Materials, Inc. | Carrier head with a layer of conformable material for a chemical mechanical polishing system |
5830806, | Oct 18 1996 | Round Rock Research, LLC | Wafer backing member for mechanical and chemical-mechanical planarization of substrates |
5871393, | Mar 25 1996 | Chiyoda Co., Ltd. | Mounting member for polishing |
5906887, | Aug 19 1992 | P.C.I.Paper Conversions, Inc. | Composite elastomeric article for adhesive cushioning and mounting means |
5935683, | Apr 24 1996 | Mitsui Chemicals, Inc | Waterproof material and method for applying it |
5975999, | Jan 06 1997 | 3M Innovative Properties Company | Hand tool having a cushioned laminate attachment surface |
5989470, | Sep 30 1996 | U S BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT | Method for making polishing pad with elongated microcolumns |
5993293, | Jun 17 1998 | SpeedFam-IPEC Corporation | Method and apparatus for improved semiconductor wafer polishing |
6074287, | Apr 12 1996 | Nikon Corporation | Semiconductor wafer polishing apparatus |
6089965, | Jul 15 1998 | NIPPON PILLAR PACKING CO., LTD. | Polishing pad |
6095900, | Mar 23 1998 | SpeedFam-IPEC Corporation | Method for manufacturing a workpiece carrier backing pad and pressure plate for polishing semiconductor wafers |
6117776, | May 30 1997 | Siltronic AG | Wafer holder and method of producing a semiconductor wafer |
6172330, | Feb 28 1997 | MURATA MANUFACTURING CO , LTD , A CORPORATION OF JAPAN | Method and apparatus for forming a through hole in a ceramic green sheet |
6217434, | Apr 04 1997 | Rohm and Haas Electronic Materials CMP Holdings, Inc | Polishing pads and methods relating thereto |
6344414, | Apr 30 1999 | International Business Machines Corporation | Chemical-mechanical polishing system having a bi-material wafer backing film assembly |
6346036, | Oct 28 1999 | REVASUM, INC | Multi-pad apparatus for chemical mechanical planarization |
6367529, | May 01 1998 | Fujikoshi Kikai Kogyo Kabushiki Kaisha | Method of adhering wafers and wafer adhering device |
6371833, | Sep 13 1999 | Polaris Innovations Limited | Backing film for chemical mechanical planarization (CMP) of a semiconductor wafer |
6454633, | Apr 04 1997 | Rohm and Haas Electronic Materials CMP Holdings, Inc | Polishing pads of flocked hollow fibers and methods relating thereto |
6566426, | Nov 22 2001 | Nippon Shokubai Co., Ltd. | Aqueous resin composition |
6575821, | Aug 01 2000 | Abrasive belt for a belt grinding machine | |
6657158, | Jun 03 2002 | THE BANK OF NEW YORK MELLON, AS ADMINISTRATIVE AGENT | Method of processing a laser scored instrument panel with an invisible seam airbag opening |
6726541, | Oct 09 2001 | NIHON MICROCOATING CO , LTD ; International Business Machines Corporation | Cleaning sheet |
6739040, | Oct 28 1999 | AJINOMOTO CO , INC | Method of manufacturing multilayered printed wiring board using adhesive film |
6824456, | Sep 29 2000 | Polaris Innovations Limited | Configuration for polishing disk-shaped objects |
6855043, | Jul 09 1999 | Applied Materials, Inc | Carrier head with a modified flexible membrane |
7241408, | Nov 19 2002 | I.V. Technologies Co., Ltd. | Method of fabricating polishing pad having detection window thereon |
7295425, | Jun 27 2002 | DAINIPPON INK AND CHEMICALS, INC | Molding for electrolytic capacitor anode element, molding with substratum, production methods therefor, and production method for electrolytic capacitor anode element |
7316605, | Jul 03 2006 | SAN FANG CHEMICAL INDUSTRY CO., LTD. | Sheet for mounting polishing workpiece and method for making the same |
7384061, | Jul 14 2005 | International Automotive Components Group North America, Inc | Trim panel and a method of manufacture |
20030068967, | |||
20060116059, | |||
20080003927, | |||
20080003933, | |||
20080003934, | |||
CN2470953, | |||
DE10128745, | |||
EP2465, | |||
FR2679526, | |||
JP1199479, | |||
JP2001352861, | |||
JP2004306195, | |||
JP200474301, | |||
JP2005116948, | |||
JP2006167835, | |||
JP7235050, | |||
KR20030020784, | |||
KR20040048464, | |||
TW200616084, | |||
TW508284, |
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Jun 21 2006 | YAO, I-PENG | SAN FANG CHEMICAL INDUSTRY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 018069 | /0944 | |
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