A magnetic memory cell is provided. The magnetic memory cell includes at least one fixed magnetic layer and a plurality of free magnetic layers, separated from the at least one fixed magnetic layer by at least one barrier layer. The free magnetic layers include a first free magnetic layer adjacent to the barrier layer, a second free magnetic layer separated from the first free magnetic layer by at least one spacer layer, and a third free magnetic layer separated from the second free magnetic layer by at least one anti-parallel coupling layer. A magnetic moment of the first free magnetic layer is greater than both a magnetic moment of the second free magnetic layer and a magnetic moment of the third free magnetic layer. The magnetic memory cell may be used in conjunction with a magnetic random access memory device.
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1. A magnetic memory cell comprising:
at least one fixed magnetic layer; and
a plurality of free magnetic layers, separated from the at least one fixed magnetic layer by at least one barrier layer, comprising:
a first free magnetic layer adjacent to the barrier layer;
a second free magnetic layer separated from the first free magnetic layer by at least one spacer layer; and
a third free magnetic layer separated from the second free magnetic layer by at least one anti-parallel coupling layer,
wherein a magnetic moment of the first free magnetic layer is greater than both a magnetic moment of the second free magnetic layer and a magnetic moment of the third free magnetic layer.
12. A magnetic random access memory device, comprising:
a plurality of word lines oriented orthogonal to a plurality of bit lines; and
a plurality of magnetic memory cells configured in an array between the word lines and bit lines, at least one of the plurality of magnetic memory cells comprising:
at least one fixed magnetic layer; and
a plurality of free magnetic layers, separated from the at least one fixed magnetic layer by at least one barrier layer, comprising:
a first free magnetic layer adjacent to the barrier layer;
a second free magnetic layer separated from the first free magnetic layer by at least one spacer layer; and
a third free magnetic layer separated from the second free magnetic layer by at least one anti-parallel coupling layer,
wherein a magnetic moment of the first free magnetic layer is greater than both a magnetic moment of the second free magnetic layer and a magnetic moment of the third free magnetic layer.
2. The magnetic memory cell of
3. The magnetic memory cell of
4. The magnetic memory cell of
5. The magnetic memory cell of
6. The magnetic memory cell of
7. The magnetic memory cell of
8. The magnetic memory cell of
9. The magnetic memory cell of
10. The magnetic memory cell of
an anti-ferromagnetic layer;
a first fixed magnetic layer adjacent to the anti-ferromagnetic layer; and
a second fixed magnetic layer separated from the first fixed magnetic layer by at least one anti-parallel coupling layer.
11. The magnetic memory cell of
13. The magnetic random access memory device of
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This application is a continuation of U.S. application Ser. No. 11/481,541 filed on Jul. 6, 2006 now U.S. Pat. No. 7,433,225, the disclosure of which is incorporated by reference herein.
The present invention relates to data storage, and more particularly, to data storage devices and techniques for use thereof.
Semiconductor devices, such as magnet random access memory (MRAM) devices, use magnetic memory cells to store information. Information is stored in the magnetic memory cells as an orientation of the magnetization of a free layer in the magnetic memory cell as compared to an orientation of the magnetization of a fixed (e.g., reference) layer in the magnetic memory cell. The magnetization of the free layer can be oriented parallel or anti-parallel relative to the fixed layer, representing either a logic “1” or a logic “0.” The orientation of the magnetization of a given layer (fixed or free) may be represented by an arrow pointing either to the left or to the right. When the magnetic memory cell is sitting in a zero applied magnetic field, the magnetization of the magnetic memory cell is stable, pointing either left or right. The application of a magnetic field can switch the magnetization of the free layer from left to right, and vice versa, to write information to the magnetic memory cell.
One of the objectives of MRAM is to have a low operating power and small area. This objective requires a low switching field for the magnetic memory cell, because a low switching field uses a low switching current, which uses less power, and because smaller currents require smaller switches, which occupy less space. However, as the area of the magnetic memory cells becomes increasingly smaller, a process referred to as “scaling” due to the fact that the area of the magnetic memory cell is scaled down to allow for more magnetic memory cells in the same area, the switching field actually increases.
U.S. Pat. No. 6,545,906 issued to Savtchenko, et al., entitled “Method of Writing to Scalable Magnetoresistance Random Access Memory Element” (hereinafter “Savtchenko”) describes a toggle free layer for use in MRAM devices. Prior to Savtchenko, MRAM devices employed a single free layer design. Both of these approaches, however, are prone to the problems associated with scaling that are described above. Namely, as the size of the magnetic memory cell is scaled down, an increased amount of power is required to switch the magnetic memory cell. For example, as much as 80 Oersteds (Oe) can be required to switch a 150 nanometer (nm) toggle magnetic memory cell.
Thus, scalable magnetic memory devices having reduced switching fields would be desirable.
The present invention provides techniques for reducing the switching fields in magnetic memory devices. In one aspect of the invention, a magnetic memory cell is provided. The magnetic memory cell comprises at least one fixed magnetic layer and a plurality of free magnetic layers, separated from the at least one fixed magnetic layer by at least one barrier layer. The free magnetic layers include a first free magnetic layer adjacent to the barrier layer, a second free magnetic layer separated from the first free magnetic layer by at least one spacer layer, and a third free magnetic layer separated from the second free magnetic layer by at least one anti-parallel coupling layer. A magnetic moment of the first free magnetic layer is greater than both a magnetic moment of the second free magnetic layer and a magnetic moment of the third free magnetic layer.
In another aspect of the invention, a magnetic random access memory (MRAM) device is provided. The MRAM device comprises a plurality of word lines oriented orthogonal to a plurality of bit lines, and a plurality of magnetic memory cells configured in an array between the word lines and bit lines. At least one of the plurality of magnetic memory cells comprises at least one fixed magnetic layer, and a plurality of free magnetic layers, separated from the at least one fixed magnetic layer by at least one barrier layer. The free magnetic layers include a first free magnetic layer adjacent to the barrier layer, a second free magnetic layer separated from the first free magnetic layer by at least one spacer layer, and a third free magnetic layer separated from the second free magnetic layer by at least one anti-parallel coupling layer. A magnetic moment of the first free magnetic layer is greater than both a magnetic moment of the second free magnetic layer and a magnetic moment of the third free magnetic layer.
In yet another aspect of the invention, a method of writing data to an MRAM device having a plurality of word lines oriented orthogonal to a plurality of bit lines, and a plurality of magnetic memory cells configured in an array between the word lines and bit lines, comprises the following steps. A word line current is provided to a given one of the word lines to select all of the magnetic memory cells along the given word line. At least one of the selected magnetic memory cells comprises at least one fixed magnetic layer and a plurality of free magnetic layers, separated from the at least one fixed magnetic layer by at least one barrier layer. The free magnetic layers include a first free magnetic layer adjacent to the barrier layer, a second free magnetic layer separated from the first free magnetic layer by at least one spacer layer, and a third free magnetic layer separated from the second free magnetic layer by at least one anti-parallel coupling layer. A magnetic moment of the first free magnetic layer is greater than both a magnetic moment of the second free magnetic layer and a magnetic moment of the third free magnetic layer. A bit line current is provided to each of the bit lines corresponding to the selected magnetic memory cells. The word line current is removed. The bit line current is removed.
In still another aspect of the invention, a magnetic memory cell is provided. The magnetic memory cell comprises at least one fixed magnetic layer, and a plurality of free magnetic layers, separated from the at least one fixed magnetic layer by at least one barrier layer. The free magnetic layers include a first free magnetic layer adjacent to the barrier layer, a second free magnetic layer separated from the first free magnetic layer by at least one first parallel coupling layer, and a third free magnetic layer separated from the second free magnetic layer by at least one second parallel coupling layer. A magnetic moment of the second free magnetic layer is greater than both a magnetic moment of the first free magnetic layer and a magnetic moment of the third free magnetic layer.
A more complete understanding of the present invention, as well as further features and advantages of the present invention, will be obtained by reference to the following detailed description and drawings.
According to the exemplary embodiment depicted in
As shown in
Each of magnetic layers 108, 112 and 116 can comprise any suitable ferromagnetic material, including, but not limited to, one or more of a nickel/iron alloy (NiFe alloy) and alloys containing one or more of Ni, Fe, Cobalt (Co) and a rare earth element. Further, any one of magnetic layers 108, 112 and 116 can have a same, or a different, composition as any of the other magnetic layers 108, 112 and 116. For example, according to one exemplary embodiment, all three magnetic layers 108, 112 and 116 comprise the same NiFe alloy.
Each of magnetic layers 108, 112 and 116 has a magnetic moment μ associated therewith, wherein μ equals the product of a magnetization of the layer Ms, a thickness of the layer T and an area of the layer A, i.e.,
μ=Ms·T·A. (1)
As will be described below, μ points in a particular direction, i.e., a direction of magnetization. Magnetic layers 108, 112 and 116 have magnetic moments μ1, μ2, and μ3, respectively, associated therewith. According to the present teachings, μ1 is greater than both μ2 and μ3, i.e., μ1>μ2 and μ1>μ3. Further, according to one exemplary embodiment, μ2 is equal to μ3, i.e., μ2=μ3.
When magnetic layers 108, 112 and 116 are configured to have a circular shape, as described above, it can be assumed that each of magnetic layers 108, 112 and 116 occupies the same area, i.e., magnetic layers 108, 112 and 116 have areas A1, A2 and A3, respectively, associated therewith wherein A1=A2=A3. Further, when magnetic layers 108, 112 and 116 have the same composition, as described above, it can be assumed that each of magnetic layers 108, 112 and 116 has the same magnetization, i.e., magnetic layers 108, 112 and 116 have magnetizations Ms1, Ms2 and Ms3, respectively, associated therewith wherein Ms1=Ms2=Ms3. Accordingly, when both of the above conditions apply, i.e., when magnetic layers 108, 112 and 116 are circular and each layer has the same composition, T is the sole variable in μ differences between the layers. According to this exemplary embodiment, magnetic layer 108 is adapted to have a greater thickness than either magnetic layer 112 or magnetic layer 116, i.e., magnetic layers 108, 112 and 116 have thicknesses T1, T2 and T3, respectively, associated therewith wherein T1>T2 and T1>T3. See, for example,
Magnetic layers 108 and 112 are separated by spacer layer 114. Spacer layer 114 mediates zero coupling between magnetic layers 108 and 112. According to an exemplary embodiment, spacer layer 114 comprises one or more of tantalum nitride (TaN), Ta, titanium (Ti), tungsten (W) and niobium (Nb). Materials that can give zero coupling, such as ruthenium (Ru), can also be used if the thickness of the layer is adjusted to give zero coupling.
Magnetic layers 112 and 116 are separated by AP-coupling layer 110. AP-coupling layer 110 mediates anti-parallel magnetic coupling between magnetic layers 112 and 116. According to an exemplary embodiment, AP-coupling layer 110 comprises one or more of Ru, osmium (Os), copper (Cu), chromium (Cr), molybdenum (Mo), rhodium (Rh), rhenium (Re) and iridium (Ir).
As described above, tunnel barrier 106 separates free layer 102 from fixed layer 104. Tunnel barrier 106 comprises any suitable tunnel barrier material, including, but not limited to, one or more of aluminum oxide (AlOx) and magnesium oxide (MgO).
As shown in
Each of magnetic layers 118 and 120 can comprise any suitable ferromagnetic material, including, but not limited to, one or more of an alloy containing Ni, Fe or Co, and can have a same, or a different, composition as the other of magnetic layers 118 and 120. AP-coupling layer 122 mediates anti-parallel magnetic coupling between magnetic layers 118 and 120, and can comprise one or more of Ru, Os, Cu, Cr, Mo, Rh, Re and Ir.
AF layer 124 serves to pin the direction of magnetization of magnetic layers 118 and 120. AF layer 124 can comprise a metal alloy, including, but not limited to, one or more of a platinum/manganese alloy (PtMn) and an iridium/manganese alloy (IrMn).
While
Magnetic memory cell array 200 comprises bit lines 202 and word lines 204 running orthogonal to each other above and below a plurality of magnetic memory cells 100. The configuration of magnetic memory cell array 200 shown in
Methods for writing data to magnetic memory cell array 200 will be described in detail below. In general, however, each word line 204 applies a magnetic field Hword along a y-axis of each magnetic memory cell 100, and each bit line 202 applies a magnetic field Hbit along an x-axis of each magnetic memory cell 100. The y-axis comprises a hard switching axis of each magnetic memory cell 100 and the x-axis comprises an easy switching axis of each magnetic memory cell 100.
The dipole fields from each of magnetic layers 108, 112 and 116 make μ1, μ2 and μ3 spread out in a triangle. See
As shown in
It is notable that in the two stable magnetic states shown in
Free layer 402 is a multiple-layer structure. Namely, free layer 402 includes three magnetic layers 408, 412 and 416, each of which can comprise a ferromagnetic material, including, but not limited to, one or more of a NiFe alloy and alloys containing one or more of Ni, Fe, Co and a rare earth element. Further, any one of magnetic layers 408, 412 and 416 can have a same, or a different, composition as any one of the other magnetic layers 408, 412 and 416.
Magnetic layer 412 is separated from, and is parallel coupled (P-coupled) to both magnetic layers 408 and 416 by P-coupling layers 410 and 414, respectively. Each of P-coupling layers 410 and 414 can comprise any suitable P-coupling materials, including, but not limited to, one or more of Ru, Os, Cu, Cr, Mo, Rh, Re and Ir, and may have a same, or a different, composition as each other.
Each of magnetic layers 408, 412 and 416 has a magnetic moment μ associated therewith. The value of μ can be calculated according to Equation 1, above. Magnetic layers 408, 412 and 416 have magnetic moments μ4, μ5 and μ6, respectively, associated therewith. According to the present teachings, μ5 is greater than μ4 and μ6, i.e., μ5>μ4 and μ5>μ6. Further, according to one exemplary embodiment, μ4 is equal to μ6, i.e., μ4=μ6. As described in detail above, if magnetic layers 408, 412 and 416 occupy the same area A and have the same magnetization Ms, then layer thickness T is the sole variable in moment μ differences between the magnetic layers. Such an instance is depicted in
Fixed layer 404 is a multiple-layer structure. Namely fixed layer 404 comprises magnetic layer 418 adjacent to tunnel barrier 406 and separated from magnetic layer 420 by AP-coupling layer 422. AF layer 424 is adjacent to a side of magnetic layer 420 opposite AP-coupling layer 422. Magnetic layers 418 and 420 can have a same, or a different, composition as each other, and can comprise any suitable ferromagnetic material, including, but not limited to, one or more of a NiFe alloy and alloys containing one or more of Ni, Fe, Co and a rare earth element. AP-coupling layer 422 mediates anti-parallel magnetic coupling between magnetic layers 418 and 420 and can comprise one or more of Ru, Os, Cu, Cr, Mo, Rh, Re and Ir.
AF layer 424 serves to pin the direction of magnetization of magnetic layers 418 and 420. AF layer 424 can comprise a metal alloy, including, but not limited to, one or more of a PtMn alloy and an IrMn alloy.
A plurality of magnetic memory cells 400 may be used in a magnetic memory cell array. For example, a plurality of magnetic memory cells 400 can be used in magnetic memory cell array 200, described in conjunction with the description of
As shown in
In step 602, a current is passed along a given one of the word lines (a word line current) thereby selecting all of the magnetic memory cells on that given word line (i.e., the word line current destabilizes the magnetic memory cells, which essentially erases all pre-existing data and makes the magnetic memory cells easier to write). Namely, all of the magnetic memory cells on that given word line are selected to be written together at the same time. According to one exemplary embodiment, there are 128 magnetic memory cells per word line.
In step 604, each of the magnetic memory cells selected in step 602, above, is written by sending a small current through each corresponding bit line (a bit line current). For example, if 128 magnetic memory cells are selected in step 602 above, then a bit line current is sent through each of the 128 corresponding bit lines to write data to those 128 magnetic memory cells.
The bit line current can be either a positive current or a negative current. A positive current will write a logic “1” to the corresponding magnetic memory cell, and a negative current will write a logic “0” to the corresponding magnetic memory cell.
In step 606, the word line current is removed. In step 608, the bit line current is removed. As a result, data (i.e., either a logic “1” or a logic “0”) is written to each of the magnetic memory cells selected in step 602, above.
Referring to
Referring to
For magnetic fields inside curve 800, magnetic memory cell 100 is stable. For magnetic fields outside of curve 800, magnetic memory cell 100 can be written.
Switching curve 800 was calculated with a single domain model using the following parameters for magnetic memory cell 100. Magnetic layer 108 has a thickness of six nanometers (nm); magnetic layer 112 has a thickness of five nm; and magnetic layer 116 has a thickness of five nm. Each of magnetic layers 108, 112 and 116 has a Ms equal to 1,500 electromagnetic units/cubic centimeter (emu/cc), an intrinsic anisotropy Hi of 25 Oe, and a diameter of 150 nm. The exchange coupling J between magnetic layers 112 and 116 equals −0.05 erg/square centimeter (erg/cm2), wherein a negative J value denotes AP-coupling.
From switching curve 800 it is notable that the bit and word line fields, e.g., Hbit and Hword, respectively, required to write magnetic memory cell 100 are very small, for example, less than 50 Oe for the word line (which, as described above, may be distributed over 128 magnetic memory cells per word line), and less than 10 Oe for the bit line. Thus, for an exemplary array having 128 magnetic memory cells per word line, the total field per magnetic memory cell is 10+50/128˜10 Oe.
By comparison, for toggle switching devices, such as those described in Savtchenko, one needs Hbit=Hword=80 Oe. Thus, the total field per toggle switching device is 80+80/128=81 Oe. Therefore, magnetic memory cell 100 uses eight times less power than a typical toggle switching device.
Another important feature of magnetic memory cell 100 is that when Hword is zero, a very large bit line field is required to switch magnetic memory cell 100. See, for example, switching curve 800 wherein an Hbit of greater than 300 Oe is needed to switch magnetic memory cell 100 when Hword is zero. Thus, magnetic memory cell 100 is very stable under half select. It is only when the word line is selected that it is then easy to write magnetic memory cell 100 with a small bit line field, as described above.
The graphs shown in
In
First, a 50 Oe word line field is applied. As the word line field is applied, μ1 rotates up to point along the hard axis direction. A small negative bit line field is then applied. This negative bit line field rotates μ1 slightly to the left. As the word line field is then decreased, the negative bit line field keeps μ1 biased to the left, so that when Hword has been decreased to zero again, μ1 points to the left. μ1 stays pointing to the left as the bit line field is reduced to zero.
In
First, a 50 Oe word line field is applied. As the word line field is applied, μ1 rotates up to point along the hard axis direction. A small positive bit line field is then applied. This positive bit line field rotates μ1 slightly to the right. As the word line field is then decreased, the positive bit line field keeps μ1 biased to the right, so that when Hword has been decreased to zero again, μ1 points to the right. μ1 stays pointing to the right as the bit line field is reduced to zero.
In
First, a 50 Oe word line field is applied. As the word line field is applied, μ1 rotates up to point along the hard axis direction. A small negative bit line field is then applied. This negative bit line field rotates μ1 slightly to the left. As the word line field is then decreased, the negative bit line field keeps μ1 biased to the left, so that when Hword has been decreased to zero again, μ1 points to the left. μ1 stays pointing to the left as the bit line field is reduced to zero.
In
First, a 50 Oe word line field is applied. As the word line field is applied, μ1 rotates up to point along the hard axis direction. A small positive bit line field is then applied. This positive bit line field rotates μ1 slightly to the right. As the word line field is then decreased, the positive bit line field keeps μ1 biased to the right, so that when Hword has been decreased to zero again, μ1 points to the right. μ1 stays pointing to the right as the bit line field is reduced to zero.
In general, the three moments μ1, μ2, and μ3 bodily rotate together, largely maintaining their original triangular relative orientation. The purpose of the AP-coupling between magnetic layers 112 and 116 is to promote this bodily rotation.
Thus, in conclusion, when magnetic memory cell 100 starts in either a “0” or “1” logic state, a word line field followed by a small negative bit line field will write a logic “0.” Similarly, when magnetic memory cell 100 starts in either a “0” or “1” logic state, a word line field followed by a small positive bit line field will write a logic “1.”
The progression of the magnetic moment rotations occurs in the sequence indicated by arrow 1002. For example, starting at Heasy equals −400 Oe and following the sequence indicated by arrow 1002, it is shown that μ1 starts pointing to the left, and subsequently flips to pointing to the right, near +400 Oe, and then as the field is reversed the moment initially stays pointing to the right and then flips to pointing to the left near −400 Oe.
The graphs in
As can be seen from
The progression of the magnetic moment rotations occurs in the sequence indicated by arrow 1102. For example, starting at Hhard equals −50 Oe and following the sequence indicated by arrow 1102, it is shown that μ1 starts pointing down, and subsequently flips to pointing up, near +30 Oe, and then as the field is reversed the moment initially stays pointing up and then flips to pointing down near −30 Oe.
The graphs in
By way of comparison with
Although illustrative embodiments of the present invention have been described herein, it is to be understood that the invention is not limited to those precise embodiments, and that various other changes and modifications may be made by one skilled in the art without departing from the scope of the invention.
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