A multi-protocol communication circuit, for example, a serializer-deserializer (serdes) circuit for communicating between an internal logic circuit and an external link includes a select terminal configured to accept a select signal representing a plurality of mode select signal. A serdes core is coupled to the select terminal and configured to transmit outbound data conforming with a first communication protocol in response to a first mode select signal and conforming with a second communication protocol in response to a second mode select signal. The serdes core is also configured to receive inbound data respective to a first communication protocol in response to a first mode select signal and respective to a second communication protocol in response to a second mode select signal. Advantages of the invention include the ability to provide high bandwidth communications between integrated circuits that employ different serdes protocols.
|
12. A method of communicating between an internal logic circuit and an external link, comprising the steps of:
accepting a mode select signal representing a plurality of different communication protocols at a serdes circuit comprising a single serdes core configured to handle each of said plurality of different communication protocols and an external communication terminal configured to transmit outbound information to the external link and receive inbound information from the external link, said communication protocols differing in communication signaling and format and not only in communication speed; and at least one of:
(a) transmitting outbound data conforming with one of said plurality of communication protocols in response to the mode select signal; and
(b) receiving inbound data respective to one of said plurality of communication protocols in response to the mode select signal.
23. A multi-protocol communication circuit for communicating between an internal logic circuit and an external link comprising:
a plurality of internal communication terminals configured to receive outbound information from the logic circuit and transmit inbound information to the logic circuit;
an external communication terminal configured to transmit outbound information to the external link and receive inbound information from the external link;
a select terminal configured to accept a mode select signal representing a plurality of different communication protocols, said communication protocols differing in communication signaling and format and not only in communication speed; and
a single serdes core configured to handle each of said plurality of different protocols, said serdes core coupled to the select terminal and configured to transmit outbound data conforming with one of said plurality of communication protocols in response to the mode select signal, and to receive inbound data respective to one of said plurality of communication protocols in response to the mode select signal.
1. A multi-protocol serializer/deserializer (serdes) circuit for communicating between an internal logic circuit and an external link, comprising:
a plurality of internal communication terminals configured to receive outbound information from the logic circuit and transmit inbound information to the logic circuit;
an external communication terminal configured to transmit outbound information to the external link and receive inbound information from the external link;
a select terminal configured to accept a mode select signal representing a plurality of different communication protocols, said communication protocols differing in communication signaling and format and not only in communication speed; and
a single serdes core configured to handle each of said plurality of different protocols, said serdes core coupled to the select terminal and configured to transmit outbound data conforming with one of said plurality of communication protocols in response to the mode select signal, and to receive inbound data respective to one of said plurality of communication protocols in response to the mode select signal.
2. The multi-protocol serdes of
said external communication terminal is a plurality of external communication terminals.
3. The multi-protocol serdes of
each of the communication protocols include a number of communication parameters; and
the serdes core is configured to transmit outbound data conforming with a combination of more stringent communication parameters of the communication protocols.
4. The multi-protocol serdes of
the serdes core is adapted to receive inbound data respective to a combination of less stringent communication tolerances of the communication protocols.
5. The multi-protocol serdes of
the serdes core is adapted to receive inbound data respective to a combination of less stringent communication tolerances of the communication protocols.
6. The multi-protocol serdes of
each of the communication protocols includes a number of communication parameters; and
the serdes core is adapted to communicate within communication parameters and tolerances conforming with the selected protocol.
7. The multi-protocol serdes of
a second select terminal configured to accept a mode select signal representing a second plurality of protocols; and
a second serdes core coupled to the second select terminal and configured to transmit outbound data conforming with one of said second plurality of communication protocols in response to the mode select signal, and to receive inbound data respective to one of said second plurality of communication protocols in response to the mode select signal.
8. The multi-protocol serdes of
the communication protocols include the set of PCI-Express protocol and XAUI protocol.
9. The multi-protocol serdes of
the communication protocols include the set of PCI-Express protocol, XAUI protocol, GigE protocol, and GigE SGMII protocol.
10. The multi-protocol serdes of
the communication protocols include the set of PCI-Express protocol and XAUI protocol.
11. The multi-protocol serdes of
the communication protocols include the set of PCI-Express protocol, XAUI protocol, GigE protocol, and GigE SGMII protocol.
13. The method of
14. The method of
the transmitting step transmits outbound data conforming with a combination of more stringent communication parameters of the communication protocols.
15. The method of
the receiving step receives inbound data respective to a combination of less-stringent communication tolerances of the communication protocols.
16. The method of
the receiving step receives inbound data respective to a combination of less-stringent communication tolerances of the communication protocols.
17. The method of
each of the communication protocols includes a number of communication parameters;
the transmitting step transmits outbound data conforming with a combination of more-stringent communication parameters of the communication protocols;
the receiving step receives inbound data respective to a combination of less-stringent communication tolerances of the communication protocols.
18. The method of
each of the communication protocols includes a number of communication parameters;
the transmitting step transmits outbound data conforming with communication parameters conforming with the selected protocol; and
the receiving step receives inbound data conforming with communication tolerances conforming with the selected protocol.
19. The method of
the communication protocols include the set of PCI-Express protocol and XAUI protocol.
20. The method of
the communication protocols include the set of PCI-Express protocol, XAUI protocol, GigE protocol, and GigE SGMII protocol.
21. The method of
22. The method of
the communication protocols include the set of PCI-Express protocol, XAUI protocol, GigE protocol, and GigE SGMII protocol.
24. The multi-protocol communication circuit of
said external communication terminal is a plurality of external communication terminals.
25. The multi-protocol communication circuit of
the communication core is configured to transmit outbound data conforming with a combination of more-stringent communication parameters of the communication protocols.
26. The multi-protocol communication circuit of
the communication core is adapted to receive inbound data respective to a combination of less-stringent communication tolerances of the communication protocols.
27. The multi-protocol communication circuit of
the communication core is adapted to receive inbound data respective to a combination of less-stringent communication tolerances of the communication protocols.
28. The multi-protocol communication circuit of
each of the communication protocols includes a number of communication parameters; and
the communication core is adapted to communicate within communication parameters and tolerances conforming with the selected protocol.
29. The multi-protocol communication circuit of
a second select terminal configured to accept a second mode select signal representing a second plurality of protocols; and
a second communication core coupled to the second select terminal and configured to transmit outbound data conforming with one of said second plurality of communication protocols in response to the mode select signal, and to receive inbound data respective to one of said second plurality of communication protocols in response to the mode select signal.
30. The multi-protocol serdes of
|
This application claims priority to U.S. Provisional Application No. 60/426,691 filed Nov. 15, 2002, incorporated herein by reference.
The invention relates to the field of electronic circuitry, and more particularly to an intelligent multi-protocol communication circuit, which in one example is a serializer-deserializer referred to as a SerDes.
Advances in computer network communication and switching provide an improved experience for users who wish to store, retrieve and use information. The advent of a number of communication technologies has proven very useful to society, but the interoperability of these technologies has become an engineering challenge. There is a strong desire to support past, present and future device interoperability, and to improve the efficiency, use and deployment of circuits and systems in the electronics marketplace. The present invention provides useful novel techniques for achieving these goals.
One of the high-speed communications technologies that has been employed in electronic circuits is a serializer-deserializer, or SerDes, which supports the serial communication between circuits while using a parallel internal bus.
What is needed is a circuit with the ability to communicate using a number of different communications protocols.
The invention provides an intelligent multi-protocol communication circuit, for example, a serializer-deserializer (SerDes) that helps electronic circuits communicate with one another. The inventive SerDes is a circuit with the ability to communicate using a number of different SerDes protocols.
A multi-protocol SerDes circuit for communicating between an internal logic circuit and an external link includes a plurality of internal communication terminals configured to receive outbound information from the logic circuit and transmit inbound information to the logic circuit, and at least one external communication terminal configured to transmit outbound information to an external link and receive inbound information from the external link. The SerDes circuit includes a select terminal configured to accept a mode select signal representing a plurality of protocol modes. A SerDes core is coupled to the select terminal and configured to transmit outbound data conforming with one of a plurality of communication protocols in response to the mode select signal. The SerDes core is also configured to receive inbound data respective to one of a plurality of communication protocols in response to the mode select signal. While several protocols are described herein, any number of protocols can be implemented in the invention.
In one aspect of the invention, each of the communication protocols includes a number of communication parameters, and the SerDes core is configured to transmit outbound data conforming with the more-stringent combined communication parameters.
In another aspect of the invention, each of the communication protocols includes a number of communication tolerances, and the SerDes core is adapted to receive inbound data respective to the less-stringent combined communication tolerances.
In yet another aspect of the invention, each of the communication protocols includes a number of communication parameters and tolerances, and the SerDes core is adapted to communicate within communication parameters and tolerances conforming with the selected protocol.
In another aspect, the invention can include a number of additional SerDes groups that replicate the SerDes core functions. In this context, a group includes a channel, link or other communication conduit. In one implementation, each group is independently controlled with an independent mode select signal. In another implementation, multiple groups are controlled with a common mode select signal. In either event, the SerDes cores are configured to transmit outbound data conforming with one of a plurality of communication protocols in response to the mode select signal. Likewise, the SerDes cores are configured to receive inbound data respective to one of a plurality of communication protocols in response to the mode select signal. As stated above, while several protocols are described, any number of protocols can be implemented in the invention.
In aspects of the invention, the first communication protocol is a PCI-Express protocol, and the second communication protocol is a XAUI protocol. Other protocols can also be employed, for example, Gigabit Ethernet (GigE) Serdes mode, and GigE SGMII mode. In the case of the GigE SGMII mode, the communication is a parallel synchronous communication and not necessarily a Serdes functional protocol. Furthermore, several of the PCI-Express parameters and functions are exemplary of PCI-Express version 1, and compliance with future versions is anticipated.
Advantages of the invention include the ability to provide high bandwidth communications between integrated circuits that employ different SerDes protocols. This provides greater flexibility for engineers to design new circuits that are less dependent on the specific protocol of other circuits. In addition, the invention decreases the number of external pins required on a per instance basis since dedicated pins for dedicated protocols are no longer needed, and the final configuration can be chosen after the chip is designed. The invention may decrease the logic area needed inside the chip because the SerDes circuit is capable of performing functions that previously required multiple instances of dedicated circuitry. The invention enhances system design options and supports the system designer's choices to use the limited number of pins for more than one communication protocol. The invention promotes flexibility in product definition since the same chip may be used for many different configurations of SerDes protocol ports. These features provide circuit designers with greater options while simultaneously reducing costs.
The invention is described with reference to the Figures, in which:
The invention is described with reference to specific architectures and protocols. Those skilled in the art will recognize that the description is for illustration and to provide the best mode of practicing the invention. The description is not meant to be limiting. For example, reference is made to Ethernet protocol, PCI-Express protocol, XAUI protocol, Gigabit Ethernet (GigE) Serdes protocol, and GigE SGMII protocol but the invention may be applicable to other protocols as well. Moreover, reference is made to chips that contain integrated circuits while other hybrid or meta-circuits combining those described in chip form is anticipated. While several protocols are described by example, any number of protocols can be implemented in the invention.
The SerDes circuit 110 includes a mode select terminal 120 configured to accept a mode select signal representing a plurality of modes. These modes control the data type and SerDes protocol communication with the external communication terminals 114a-114d.
The SerDes circuit 110 includes a SerDes transmit core 130 coupled to the select terminal 120 and configured to transmit outbound data conforming with one of a plurality of communication protocols in response to the mode select signal. The SerDes core 130 is also configured to receive inbound data respective to one of a plurality of communication protocols in response to the mode select signal.
For example, in one aspect of the invention, the two SerDes protocols are PCI-Express and XAUI. Certain of the functions, parameters and tolerances shown in Tables 1 and 2 are specific to PCI-Express and others are specific to XAUI. Furthermore, several of the PCI-Express parameters and functions are exemplary of PCI-Express version 1, and compliance with future versions is anticipated. The selection of these functions is controlled by the mode select signal 120. Tables 1 and 2 show the relationship between the PCI-Express and XAUI protocols. For example, the reference clock RefCLK for the PCI-Express protocol is 250 MHz while the RefCLK for the XAUI protocol is 312.5 MHz. Control and status bits shown in Table 1 designated as (a)-(g) are specific to the PCI-Express protocol. When the mode select signal is 0, these bits are incorporated when transmitting and expected when receiving, for example. Other bits may exist for these and other protocols.
TABLE 1
SIGNAL
PCI-EXPRESS
XAUI
Mode Select Signal
0
1
RefCLK
250 MHz
312.5 MHz
Misc. Control
Control Signal
Control Signal
(a) Enable Electrical Idle
(b) Enable Beacon Detect
(c) Low Power Mode
(d) Tristate Enable
Misc. Status
Status Signal
Status Signal
(e) Electrical Idle Detect
(f) Beacon Detected
(g) Receiver Detected
TxData[9:0]
Transmit Data
Transmit Data
RxData[9:0]
Receive Data
Receive Data
The physical differences are identified in Table 2 below.
TABLE 2
FEATURE
PCI-EXPRESS
XAUI
Clock Dependencies
+/− 300 ppm
+/− 100 ppm
Spread Spectrum
0 to −0.5% Modulation
NA
Clock
Coupling
AC couple, Cap 75-500 nF
AC coupled
Receiver Detection
Transmitter has to be able to
NA
detect is a receiver exists
Surprise Removal
Detect if one end of the link
LOS
Detection
has been disabled or
disconnected
Electrical Idle
Tx has to go to an electrical
NA
idle state where the differential
output voltage is less than
20 mV
Link Loss (medium)
13.2 dB
12 dB
Tx Jitter
0.3 UI
0.35 UI
Rx Jitter Tolerance
0.6 UI
0.65 UI
Tx Differential
800 mV − 1.2 V
800 mV − 1.6 V
Amplitude
De-emphasis
Specified at −3.5 dB
Not specified,
can be optimized
according to
transmission
medium
Beacon
Tx has to transmit a valid
NA
beacon signal, and received has
to be able to detect it while the
Rx is L2 Power saving mode
Electrical Idle
Tx has to be able to go to an
NA
electrical idle state where the
differential output voltage is
less than 20 mV
Initial DC Rx High
Min 200K Ohms
NA
Impedance
As shown in Tables 1 and 2, a number of differences are apparent between the PCI-Express and XAUI SerDes protocols including logical differences and physical differences. In one aspect of the invention, the SerDes is configured to transmit outbound data conforming with the more-stringent combined communication parameters. The communication protocols includes a number of communication parameters, for example, a first communication protocol may employ a jitter limit of 0.3UI (PCI-Express), while a second communication protocol may employ a jitter limit of 0.35UI (XAUI). In this aspect of the invention, the SerDes core is configured to transmit outbound data conforming with the more-stringent combined communication parameters, for example 0.3UI.
In another aspect of the invention, the communication protocols includes a number of communication tolerances, for example, a first communication protocol may employ a clock dependency of +/−300 ppm (PCI-Express), while a second communication protocol may employ a clock dependency of +/−100 ppm (XAUI). In this aspect of the invention, the SerDes is adapted to receive inbound data respective to the less-stringent combined communication tolerances, for example +/−300 ppm.
In yet another aspect of the invention, each of the communication protocols includes a number of communication parameters and tolerances, and the SerDes core is adapted to communicate within communication parameters and tolerances conforming with the selected protocol. For example, a first communication protocol includes a number of communication parameters and tolerances and a second communication protocol includes a number of communication parameters and tolerances. In this aspect, the SerDes core is adapted to communicate within communication parameters and tolerances conforming with the selected protocol.
As shown in
Advantages of the invention include the ability to provide high bandwidth communications between integrated circuits that employ different SerDes protocols. This provides greater flexibility for engineers to design new circuits that are less dependent on the specific protocol of other circuits. In addition, the invention decreases the number of external pins required on a per instance basis since dedicated pins for dedicated protocols are no longer needed, and the final configuration can be chosen after the chip is designed. The invention may decrease the logic area needed inside the chip because the SerDes circuit is capable of performing functions that previously required multiple instances of dedicated circuitry. The invention enhances system design options and supports the system designer's choices to use the limited number of pins for more than one communication protocol. The invention promotes flexibility in product definition since the same chip may be used for many different configurations of SerDes protocol ports. These features provide circuit designers with greater options while simultaneously reducing costs.
Having disclosed exemplary embodiments and the best mode, modifications and variations may be made to the disclosed embodiments while remaining within the subject and spirit of the invention as defined by the following claims.
Singh, Gaurav, Forrest, Craig S., Kattel, Kiran B.
Patent | Priority | Assignee | Title |
10445273, | Oct 19 2017 | Seagate Technology LLC | Systems, apparatus and methods for managing connectivity of networked devices |
9471484, | Sep 19 2012 | NOVACHIPS CANADA INC | Flash memory controller having dual mode pin-out |
Patent | Priority | Assignee | Title |
6542096, | Aug 24 2001 | QuickLogic Corporation | Serializer/deserializer embedded in a programmable device |
6650141, | Dec 14 2001 | Lattice Semiconductor Corporation | High speed interface for a programmable interconnect circuit |
6653957, | Oct 08 2002 | AVAGO TECHNOLOGIES GENERAL IP SINGAPORE PTE LTD ; AVAGO TECHNOLOGIES GENERAL IP PTE LTD | SERDES cooperates with the boundary scan test technique |
6944152, | Aug 22 2000 | NetApp, Inc | Data storage access through switched fabric |
6990549, | Nov 09 2001 | Texas Instruments Incorporated | Low pin count (LPC) I/O bridge |
7099424, | Aug 28 2001 | RAMPART ASSET MANAGEMENT, LLC | Clock data recovery with selectable phase control |
20020194415, | |||
20030039168, | |||
20030061341, | |||
20030179709, | |||
20040019707, | |||
20040019729, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
May 29 2003 | FORREST, CRAIG S | Raza Microelectronics, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014144 | /0269 | |
May 29 2003 | SINGH, GAURAY | Raza Microelectronics, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014144 | /0269 | |
May 29 2003 | KATTEL, KIRAN B | Raza Microelectronics, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014144 | /0269 | |
May 30 2003 | NetLogic Microsystems, Inc. | (assignment on the face of the patent) | / | |||
Dec 26 2006 | Raza Microelectronics, Inc | VENTURE LENDING & LEASING IV, INC | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 019224 | /0254 | |
Dec 17 2007 | Raza Microelectronics, Inc | RMI Corporation | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 022312 | /0833 | |
May 06 2009 | KATTEL, KIRAN B | RMI Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022717 | /0590 | |
May 06 2009 | SINGH, GAURAV | RMI Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022717 | /0590 | |
May 06 2009 | FORREST, CRAIG S | RMI Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022717 | /0590 | |
Dec 29 2009 | RMI Corporation | NetLogic Microsystems, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 023926 | /0338 | |
Sep 02 2011 | VENTURE LENDING & LEASING, INC | NetLogic Microsystems, Inc | RELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS | 026855 | /0108 | |
Jan 23 2013 | NetLogic Microsystems, Inc | NETLOGIC I LLC | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 035443 | /0824 | |
Mar 27 2015 | NETLOGIC I LLC | Broadcom Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 035443 | /0763 | |
Feb 01 2016 | Broadcom Corporation | BANK OF AMERICA, N A , AS COLLATERAL AGENT | PATENT SECURITY AGREEMENT | 037806 | /0001 | |
Jan 19 2017 | BANK OF AMERICA, N A , AS COLLATERAL AGENT | Broadcom Corporation | TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS | 041712 | /0001 | |
Jan 20 2017 | Broadcom Corporation | AVAGO TECHNOLOGIES GENERAL IP SINGAPORE PTE LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 041706 | /0001 | |
May 09 2018 | AVAGO TECHNOLOGIES GENERAL IP SINGAPORE PTE LTD | AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE LIMITED | MERGER SEE DOCUMENT FOR DETAILS | 047230 | /0133 | |
Sep 05 2018 | AVAGO TECHNOLOGIES GENERAL IP SINGAPORE PTE LTD | AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE LIMITED | CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF MERGER TO 09 05 2018 PREVIOUSLY RECORDED AT REEL: 047230 FRAME: 0133 ASSIGNOR S HEREBY CONFIRMS THE MERGER | 047630 | /0456 |
Date | Maintenance Fee Events |
Mar 06 2012 | ASPN: Payor Number Assigned. |
Oct 05 2015 | M1551: Payment of Maintenance Fee, 4th Year, Large Entity. |
Oct 03 2019 | M1552: Payment of Maintenance Fee, 8th Year, Large Entity. |
Nov 20 2023 | REM: Maintenance Fee Reminder Mailed. |
May 06 2024 | EXP: Patent Expired for Failure to Pay Maintenance Fees. |
Date | Maintenance Schedule |
Apr 03 2015 | 4 years fee payment window open |
Oct 03 2015 | 6 months grace period start (w surcharge) |
Apr 03 2016 | patent expiry (for year 4) |
Apr 03 2018 | 2 years to revive unintentionally abandoned end. (for year 4) |
Apr 03 2019 | 8 years fee payment window open |
Oct 03 2019 | 6 months grace period start (w surcharge) |
Apr 03 2020 | patent expiry (for year 8) |
Apr 03 2022 | 2 years to revive unintentionally abandoned end. (for year 8) |
Apr 03 2023 | 12 years fee payment window open |
Oct 03 2023 | 6 months grace period start (w surcharge) |
Apr 03 2024 | patent expiry (for year 12) |
Apr 03 2026 | 2 years to revive unintentionally abandoned end. (for year 12) |