A reinforced chip package structure includes a light emitting element, a base, and a package member. The base has a base deck and a jutting bearing deck on the base deck to hold the light emitting element. The base deck and the bearing deck are interposed by an elevation difference section. On the elevation difference section, there is an annular retaining structure. The package member is located on the base and covers at least the bearing deck and the retaining structure. The package member has an anchor structure corresponding to the retaining structure. The retaining structure and the anchor structure are coupled together to harness the base and the package member from moving against each other. Thus the base and package member form a reinforced bonding between them without separating from each other when subject to external forces, therefore provide improved protection for the light emitting element.
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1. A reinforced chip package structure, comprising:
a light emitting element;
a base which has a base deck and a jutting bearing deck on the base deck to hold the light emitting element, the base deck and the bearing deck being interposed by an elevation difference section, the elevation difference section integrally forming an annular retaining structure on the vertical surface thereof, and
a package member which is located on the base and encompasses the bearing deck and the retaining structure and has an anchor structure corresponding to and latching the retaining structure to harness the base and the package member from moving relative to each other.
2. The reinforced chip package structure of
3. The reinforced chip package structure of
4. The reinforced chip package structure of
5. The reinforced chip package structure of
6. The reinforced chip package structure of
7. The reinforced chip package structure of
8. The reinforced chip package structure of
9. The reinforced chip package structure of
10. The reinforced chip package structure of
11. The reinforced chip package structure of
12. The reinforced chip package structure of
13. The reinforced chip package structure of
14. The reinforced chip package structure of
15. The reinforced chip package structure of
16. The reinforced chip package structure of
17. The reinforced chip package structure of
18. The reinforced chip package structure of
19. The reinforced chip package structure of
20. The reinforced chip package structure of
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The present invention relates to a chip package structure and particularly to a chip package structure that has a reinforced bonding between package material and a base.
Lighting-emitting diode (LED) is a solid state light emitting element. By applying a positive voltage to a semiconductor chip to create an electroluminescent effect, the monochromatic and discrete light can be generated. At the beginning, the LED was mostly used for signal light or display panels. With advance of technology on white light LED, now it can also be used on illumination. Incorporated with technology progress of material and manufacturing process, now the LED can compete with conventional lighting devices (such as incandescent lamps, fluorescent lamps, cold cathode fluorescent lamps and the like), and increasingly displaces them in many applications.
In the conventional LED technologies, such as U.S. Pat. No. 6,975,513 and U.S. patent application No. 20070228387, a light emitting chip is soldered on a heat dissipating base. In addition to holding the light emitting chip in a contact manner, the heat dissipating base also disperses heat generated by the light emitting chip. The bonded chip and base have to go through a packaging process to protect the chip and conductive wires connecting externally. The package material generally is transparent such as Epoxy or Silicone gel. It has to meet bonding and light penetration requirements, and also has to be solidified easily to form a curved surface to control light radiation direction and angle. However, the package material and heat dissipating base are two different types of materials with different characteristics, their contact surfaces are parallel, hence the package material and the base are separated easily and result in package defects. In serious conditions, the chip could be damaged and product yield drops.
U.S. Pat. Nos. 6,943,433 and 6,501,156 also provide other package techniques that have a heat dissipating base with a boss formed thereon to bond package material. The boss is formed in one direction on the heat dissipating base. While it can harness the package material from separating the heat dissipating base, it does not provide turning resistance of the package material relative to the base when a torsional force is applied. As the chip and conductive wires are fixedly held in the package material, in the event that a relative turning occurs to the package material and base, the structure of the chip and conductive wires could be damaged and also result in product defects.
The primary object of the present invention is to solve the aforesaid disadvantages by providing a reinforced chip package structure to enhance bonding of the package material and the base.
To achieve the foregoing object, the package structure according to the invention includes a light emitting element, a base and a package member. The base has a base deck and a jutting bearing deck on the base deck to hold the light emitting element. There is an elevation difference section formed between the base deck and the bearing deck. The elevation difference section has an annular retaining structure formed thereon. The package member is located on the base and covers at least the bearing deck and the retaining structure. The package member also has an anchor structure corresponding to the retaining structure. The retaining structure and the anchor structure are coupled together to harness the base and the package member from moving against each other.
With the retaining structure and the anchor structure coupled together, a firm bonding is formed between the package member and the base in the reinforced chip package structure of the invention.
The foregoing, as well as additional objects, features and advantages of the invention will be more readily apparent from the following detailed description, which proceeds with reference to the accompanying drawings.
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The invention also provides other types of embodiments.
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While the preferred embodiments of the invention have been set forth for the purpose of disclosure, modifications of the disclosed embodiments of the invention as well as other embodiments thereof may occur to those skilled in the art. Accordingly, the appended claims are intended to cover all embodiments which do not depart from the spirit and scope of the invention.
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Mar 11 2009 | Sung Jung Minute Industry Co., Ltd. | (assignment on the face of the patent) | / |
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