A duplexer includes a transmit filter connected between a common terminal and a transmission terminal, a receive filter connected between the common terminal and a reception terminal, a capacitor connected in parallel with one of the transmit filter and the receive filter and provided between two terminals of the common terminal, the transmission terminal, and the reception terminal, and a package. The package includes an insulating layer, foot pads that include the common terminal, the transmission terminal and the reception terminal and are formed on one surface of the insulating layer, and interconnections formed on another surface opposite to the one surface of the insulating layer. The capacitor is composed of two capacitor forming units that are connected in parallel with each other and are formed with at least one foot pad of the foot pads and two of the interconnections that overlap with two opposing sides of the at least one food pad respectively.
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10. A duplexer comprising:
a transmit filter connected between a common terminal and a transmission terminal;
a receive filter connected between the common terminal and a reception terminal;
a capacitor connected in parallel with one of the transmit filter and the receive filter and provided between two terminals of the common terminal, the transmission terminal, and the reception terminal;
an insulating layer;
foot pads that include the common terminal, the transmission terminal and the reception terminal and are formed on one surface of the insulating layer; and
an interconnection formed on another surface opposite to the one surface of the insulating layer,
wherein:
the capacitor includes a capacitor forming unit formed with at least one foot pad of the foot pads and the interconnection formed to be included in an area where the at least one foot pad is formed; and
an area of the interconnection is smaller than an area of the at least one foot pad.
1. A duplexer comprising:
a transmit filter connected between a common terminal and a transmission terminal;
a receive filter connected between the common terminal and a reception terminal;
a capacitor connected in parallel with one of the transmit filter and the receive filter and provided between two terminals of the common terminal, the transmission terminal, and the reception terminal; and
a package including:
an insulating layer;
foot pads that include the common terminal, the transmission terminal and the reception terminal and are formed on one surface of the insulating layer; and
interconnections formed on another surface opposite to the one surface of the insulating layer,
wherein the capacitor includes two capacitor forming units that are connected in parallel with each other and are formed with at least one foot pad of the foot pads and two of the interconnections that overlap with two opposing sides of the at least one foot pad respectively.
13. A substrate for a duplexer comprising:
an insulating layer;
a mounting unit that mounts a transmit filter connected between a common terminal and a transmission terminal, and a receive filter connected between the common terminal and a reception terminal;
a capacitor connected in parallel with one of the transmit filter and the receive filter and provided between two terminals of the common terminal, the transmission terminal, and the reception terminal;
foot pads that include the common terminal, the transmission terminal and the reception terminal and are formed on one surface of the insulating layer; and
interconnections formed on another surface opposite to the one surface of the insulating layer,
wherein the capacitor includes two capacitor forming units that are formed with at least one foot pad of the foot pads and two of the interconnections that overlap with two opposing sides of the at least one foot pad, and are connected in parallel with each other.
14. A substrate for a duplexer comprising:
an insulating layer;
a mounting unit that mounts a transmit filter connected between a common terminal and a transmission terminal, and a receive filter connected between the common terminal and a reception terminal;
a capacitor connected in parallel with one of the transmit filter and the receive filter and provided between two terminals of the common terminal, the transmission terminal and the reception terminal;
foot pads that include the common terminal, the transmission terminal, and the reception terminal and are formed on one surface of the insulating layer; and
an interconnection formed on another surface opposite to the one surface of the insulating layer,
wherein:
the capacitor includes a capacitor forming unit formed with at least one foot pad and the interconnection formed to be included in an area where the at least one foot pad is formed; and
an area of the interconnection is smaller than an area of the at least one foot pad.
15. An electronic apparatus including a duplexer, the duplexer comprising:
a transmit filter connected between a common terminal and a transmission terminal;
a receive filter connected between the common terminal and a reception terminal;
a capacitor connected in parallel with one of the transmit filter and the receive filter and provided between two terminals of the common terminal, the transmission terminal, and the reception terminal; and
a package including:
an insulating layer;
foot pads that include the common terminal, the transmission terminal and the reception terminal and are formed on one surface of the insulating layer; and
interconnections formed on another surface opposite to the one surface of the insulating layer,
wherein the capacitor includes two capacitor forming units that are connected in parallel with each other and are formed with at least one foot pad of the foot pads and two of the interconnections that overlap with two opposing sides of the at least one foot pad respectively.
2. The duplexer according to
3. The duplexer according to
4. The duplexer according to
5. The duplexer according to
6. The duplexer according to
7. The duplexer according to
8. The duplexer according to
9. The duplexer according to
12. The duplexer according to
another insulating layer provided on said another surface of the insulating layer;
a via material that connects the interconnection and another interconnection formed on a surface of said another insulating layer opposite to said another surface of the insulating layer.
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This application is based upon and claims the benefit of priority of the prior Japanese Patent Application No. 2008-332671, filed on Dec. 26, 2008, the entire contents of which are incorporated herein by reference.
A certain aspect of the embodiments discussed herein is related to a duplexer, a substrate for a duplexer, and an electronic apparatus.
A duplexer is used for a wireless communication such as a mobile phone.
The transmit filter 10 and the receive filter 20 include surface acoustic wave (SAW) resonators, or film bulk acoustic wave resonators (FBAR). It is preferable that the transmit filter 10 and the receive filter 20 are hermetically sealed. Additionally, it is preferable to downsize the duplexer. For these reasons, packages such as laminated ceramic packages are used as packages for mounting the transmit filter 10 and the receive filter 20. These packages include a substrate for mounting chips such as filter chips. Foot pads for connecting the signal to the external are installed on an outer surface of the substrate. The foot pads behave as the common terminal, the transmission terminal, and the reception terminal.
Japanese Patent Laid-Open Publication No. 60-126809 discloses a capacitor of which a lower electrode and an upper electrode are polygonally-shaped, and are rotated so that they do not overlap each other. Japanese Patent Laid-Open Publication No. 60-43808 discloses a capacitor of which a lower electrode and an upper electrode are rectangular, and of which longer directions are at right angles each other. Japanese Patent Laid-Open Publication No. 2005-45099 discloses a capacitor of which a lower electrode's area is larger than an upper electrode's area.
According to an aspect of the present invention, there is provided A duplexer including: a transmit filter connected between a common terminal and a transmission terminal; a receive filter connected between the common terminal and a reception terminal; a capacitor connected in parallel with one of the transmit filter and the receive filter and provided between two terminals of the common terminal, the transmission terminal, and the reception terminal; and a package including: an insulating layer; foot pads that include the common terminal, the transmission terminal and the reception terminal and are formed on one surface of the insulating layer; and interconnections formed on another surface opposite to the one surface of the insulating layer, wherein the capacitor is composed of two capacitor forming units that are connected in parallel with each other and are formed with at least one foot pad of the foot pads and two of the interconnections that overlap with two opposing sides of the at least one food pad respectively.
The object and advantages of the invention will be realized and attained by means of the elements and combinations particularly pointed out in the claims.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of the invention, as claimed.
In the duplexer, it is preferable to improve isolation characteristics between the transmission terminal Tx and the reception terminal Rx. Especially, it is preferable to suppress the transmission signal leaking from the reception terminal Rx. To prevent the leakage of the transmission signal to the reception terminal Rx, there is a method installing a filter that suppresses the transmission signal and passes the reception signal at the reception terminal side. However, this method makes the duplexer bigger, higher in cost, and more complex.
Additionally, there is another method adding a capacitor or an LC circuit to the filter. Because the frequency for mobile phones is very high from hundreds of megahertz (MHz) to several gigahertz (GHz), a C and an L need to be highly precise. The precisions of the C and the L are high in the integrated passive device (IPD) fabricated with the process same as the process of a semiconductor device. But it prevents the downsizing and cost reducing because an IPD is a separate chip from the filter. To solve this problem, there is a method forming the capacitor by forming interconnections on both surfaces of the insulating layer such as ceramics in the package. Because this method can form the capacitor in the package, the downsizing and the cost reduction are possible. But the capacitance values of the capacitors vary widely, and this prevents high precisions.
A description will now be given of embodiments of the present invention with reference to the accompanying drawings.
The phase shifting circuit 30 includes inductors 32 and capacitors 34. The indictors 32 are connected in series, and the capacitors 34 are connected in parallel. A shifting angle can be set by changing the number of the inductor 32 and the capacitor 34. A matching circuit 80 is connected between the common terminal Ant, and the transmit filter 10 and the receive filter 20. The matching circuit 80 includes an inductor 82 connected between the common terminal Ant and the ground.
An insertion loss and an isolation of the duplexer for W-CDMA (Wideband Code Division Multiple Access) are simulated under the condition that the pass band of the transmit filter 10 is 1920 to 1980 MHz, and the pass band of the receive filter 20 is 2110 to 2170 MHz. The capacitance value of the capacitor 40 is assumed as 15 fF, and the shifting angle of the phase shifting circuit 30 is assumed as 191 degrees.
As described above, the transmission signal from the common terminal Ant to the reception terminal Rx via the receive filter 20 and the phase shifting circuit 30 and the transmission signal from the common terminal Ant to the reception terminal Rx via the capacitor 40 have almost opposite phases. Additionally, the capacitance value of the capacitor 40 is set so that the strengths of the transmission signals via each path are almost same. Accordingly, because the transmission signals via each path balance are canceled, isolation characteristics are improved.
An interconnection 60 connected to the common foot pad Antf is formed on the upper surface (a surface opposite to the one surface) of the foot pad layer 51. The interconnection 60 and the common foot pad Antf are coupled through a via 62 that pierces the foot pad layer 51 and is embedded with a conducting material. The interconnection 60 is formed so that a part of the interconnection 60 overlaps with the reception foot pad Rxf. More specifically, two interconnections 60a and 60b overlap with two opposing sides 65a and 65b of the reception foot pad Rxf, respectively. The reception foot pad Rxf and the two interconnections 60a and 60b form two capacitor forming units 64a and 64b connected each other in parallel. Thus, the capacitor 40 includes the two capacitor forming units 64a and 64b. It should be noted that other interconnections except the interconnection 60 are not illustrated in
Now, the advantage of the first embodiment is described. A capacitance C of a parallel plate type capacitor is C=(εrε0S)/d where ε0 is a permittivity in a vacuum, εr is a relative permittivity, S is an electrode area, and d is a distance between electrodes. When alumina ceramic of which a film thickness is 100 μm is used as the foot pad layer 51, εr is 9.8, and d is 100 μm. S is 1.73×10−8 m2 to make the capacitance value C of the capacitor 40 equal to 15 fF.
As illustrated in the third comparative example of
According to the first embodiment, because the capacitor 40 is connected in parallel with the receive filter 20 between the reception foot pad Rxf and the common foot pad Antf (more specifically, between the reception terminal Rx and the common terminal Ant), the isolation characteristics of the duplexer 100 are improved. The capacitor 40 is formed with the one surface on which the foot pad 56 is formed, and the interconnection 60 formed on the surface opposite to the surface of the foot pad layer 51 (an insulating layer). As described above, because the capacitor is formed with the foot pad 56 which is a terminal to which the capacitor 40 is coupled, the downsizing and the cost reduction of the duplexer are possible. Additionally, the capacitor forming units 64a and 64b are formed with the foot pad 56 and the two interconnections 60a and 60b that overlap with the two opposing sides 65a and 65b of the foot pad 56 respectively, and are connected in parallel each other. Accordingly, as described in
A second embodiment is an example that the number of the capacitor forming units is three.
A third embodiment is an example that the number of capacitor forming units is four.
It is preferable that the other sides 65c and 65d are perpendicular to the sides 65a and 65b in the second and third embodiments. Additionally, it is preferable that the shapes of the capacitor forming units 64c and 64d are rectangles or squares. Accordingly, it is possible to make the capacitance value of the capacitor 40 more precise.
A fourth embodiment is an example that the foot pad includes the interconnection.
As illustrated in
According to the fourth embodiment, the interconnection 60e is formed so as to be included in the foot pad 56. Accordingly, even though the interconnection 60e is not in the correct position to the foot pad 56, the area of the capacitor forming unit 64e does not change. Therefore, it is possible to provide the precise capacitance.
Another interconnection 66 is formed on the opposite side to the reception foot pad Rxf. The interconnection 60e and the another interconnection 66 are coupled with the via (a via metal). As described above, by forming a lead from the interconnection 60e with the via material and the another interconnection 66, the interconnection 60e does not overlap with the peripheral sides of the reception foot pad Rxf, and the interconnection 60e can be coupled to the common foot pad Antf.
Additionally, it is preferable that the interconnection 60e has a circular shape. When the interconnection 60 is formed as the rectangle for example, corners of the interconnection 60 are not formed accurately if the interconnection 60 is formed with the printing method. Accordingly, the capacitance precision of the capacitor forming unit 64e is reduced. In the fourth embodiment, it is possible to make the capacitance value more precise by shaping the interconnection 60e in a circle.
As described in the fifth embodiment, the capacitor 40 in the first to fourth embodiments is connected between the two terminals of the common terminal Ant, the transmission terminal Tx, and the reception terminal Rx. Additionally, the capacitor 40 is coupled in parallel with at least one of the transmit filter 10 and the receive filter 20. Furthermore, the capacitor forming unit is formed with the one foot pad of two foot pads of the common foot pad Antf, the transmission foot pad Txf, and the reception foot pad Rxf, and the interconnection 60 connected to another foot pad.
It is preferable that the phase shifting circuit 30 that shifts the phase of the passband signal of the transmit filter 10 (or the receive filter 20) is installed in series with the receive filter 20 (or the transmit filter 10) with which the capacitor 40 is coupled in parallel. This enables to make the phase difference between the signal via the capacitor 40 and the signal via the receive filter 20 (or the transmit filter 10) large. It is preferable that the signal transmitted from one of two terminals to another via the capacitor 40 and the signal transmitted from the one of two terminals to another via the transmit filter 10 and the receive filter 20 have opposite phase with each other. This enables to improve the isolation characteristics.
If the phase difference between the signal via the transmit filter 10 or the receive filter 20 and the signal via the capacitor 40 falls in a desirable range, the phase shifting circuit 30 may be omitted. It is preferable that one of the terminals to which the capacitor 40 is coupled is the reception terminal Rx, because a problem often occurs in the isolation from the transmission terminal Tx to the reception terminal Rx.
As simulated in the first embodiment, the insertion loss and the isolation of the duplexer for W-CDMA are simulated under the condition that the pass band of the transmit filter 10 is 1920 to 1980 MHz, and the pass band of the receive filter 20 is 2110 to 2170 MHz. In the sixth embodiment, the capacitance value of the capacitor 40 is 0.8 fF, the capacitance value of each of the capacitors 42 is 0.37 pF, the inductance of the inductor 44 is 0.14 nH, and the shifting angle of the phase shifting circuit 30 is 158 degrees. In the sixth comparative example, the capacitors 40 and 42, and the inductor 44 are not installed.
In the sixth embodiment, the reception terminal Rx is capacitively coupled to the two terminals, which are the common terminal Ant and the transmission terminal Tx. There is a small phase difference between the transmission signal of the transmission terminal Tx and the transmission signal of the common terminal Ant. This is because a phase shift takes place in the transmission signal passing through the transmit filter 10 and the matching circuit 80. There is a small phase difference between the transmission signal from the transmission terminal Tx to the reception terminal Rx via the capacitors 42 and the transmission signal from the common terminal Ant to the reception terminal Rx via the capacitor 40. As mentioned above, canceling the transmission signal leaking from the receive filter 20 with the two signals having a small phase difference enables to improve the isolation characteristics for the transmission signal of which phase width is wide. Therefore, it becomes possible to improve the isolation characteristics in the whole transmission band.
One of the capacitors 40 and 42 in the sixth embodiment may be the capacitance described in the first to fourth embodiments. Additionally, all of the capacitors 40 and 42 may be the capacitors described in the first to fourth embodiments. Accordingly, the downsizing, the cost reduction, and the higher precision of the duplexer become possible.
The seventh embodiment is an example that the reception terminal is an unbalance terminal.
The filter 20a is connected between the output terminal 24a of the balun 70 and the reception terminal Rx1, and the filter 20b is connected between the output terminal 24b and the reception terminal Rx2. Each of the filters 20a and 20b is the ladder type filter including the series resonators S1 to S4 and the parallel resonators P1 to P4. By making the phase shifts of the filters 20a and 20b be almost same, the reception signal inputted to the common terminal Ant is balance-outputted from the reception terminals Rx1 and Rx2. The capacitor 40 is connected between the reception terminal Rx1 that is one of the balance reception terminals, and the common terminal Ant. The transmit filter 10 is a ladder type filter including the series resonators S1 to S4 and the parallel resonators P1 to P4.
The passing characteristics of the duplexer in the seventh embodiment are simulated. In the simulation, the inductances of the inductors 72 and 76 of the balun 70 are 5.7 nH, the capacitance values of the capacitors 74 and 78 are 1.15 pF, and the capacitance value of the capacitor 40 is 0.05 pF. In the seventh comparative example, the capacitor 40 is not installed.
According to the seventh embodiment, the receive filter 20 includes the balun 70, and the reception terminal Rx is a pair of the balance terminals. The capacitor 40 is connected to one of a pair of the balance terminals. Even though the phase shifting circuit in the first embodiment is not used, it is possible to make the transmission signal from the common terminal Ant to the reception terminal Rx1 via the balun 70 and the filter 20a, and the transmission signal from the common terminal Ant to the reception terminal Rx1 via the capacitor 40 have opposite phases with each other, because the balun 70 shifts the phase. Therefore, the phase shifting circuit described in the first embodiment becomes unnecessary. The transmit filter 10 may include balun and the transmission terminal Tx may be the balance terminal.
The eighth embodiment is an example of the mobile phone unit as an electronic apparatus using the duplexer of any of the first to seventh embodiments.
The W-CDMA unit 192 includes a duplexer 173, a low noise amplifier 174, a power amplifier 175 and a signal processing unit 176. The signal processing unit 176 generates a W-CDMA transmission signal. The power amplifier 175 amplifies the transmission signal. A receive filter 173a of the duplexer 173 passes the transmission signal, and outputs it to the antenna switch 172. The receive filter 173 a passes the W-CDMA reception signal that the antenna switch 172 outputs, and outputs it to the low noise amplifier 174. The low noise amplifier 174 amplifies the reception signal. The signal processing unit 176 down-converts the reception signal, and outputs it to follow-on processing units.
The GSM unit 194 includes filters 177 to 180, power amplifiers 181 and 182, and a signal processing unit 183. The signal processing unit 183 generates the GSM transmission signal. When the signal is a signal of GSM850 or GSM900, the power amplifier 181 amplifies the transmission signal. When the signal is a signal of GSM1800 or GSM1900, the power amplifier 182 amplifies the transmission signal. The antenna switch 172 selects the power amplifier 181 or 182 based on the type of GSM signal. The antenna switch 172 selects the filter from the filters 177 to 180 based on GSM signal received from the antenna 171. The filters 177 to 180 filter the reception signal, and output it to the signal processing unit 183. The signal processing unit 183 down-converts the reception signal, and outputs it to follow-on processing units. In the eighth embodiment, the duplexer can be the duplexer described in the first to sixth embodiment.
All examples and conditional language recited herein are intended for pedagogical purposes to aid the reader in understanding the invention and the concepts contributed by the inventor to furthering the art, and are to be construed as being without limitation to such specifically recited examples and conditions, nor does the organization of such examples in the specification relate to a showing of the superiority and inferiority of the invention. Although the embodiment of the present invention has been described in detail, it should be understood that the various change, substitutions, and alterations could be made hereto without departing from the spirit and scope of the invention.
Inoue, Kazunori, Matsuda, Takashi, Inoue, Shogo
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