A heat dissipation device for cooling an electronic device mounted on a printed circuited board, comprises a heat spreader contacting the electronic device, a fin assembly comprising a plurality of fins, a supporting bracket contacting the heat spreader and supporting the fin assembly, and a heat pipe extending through the fin assembly and the supporting bracket and attached to the heat spreader, wherein a lowermost fin of the fin assembly has a plurality of clasps extending near two opposite ends thereof and towards the supporting bracket. The clasps are bent to press against a bottom of the supporting bracket after the clasps extend through the supporting bracket.
|
12. A heat dissipation device comprising:
a heat spreader;
a fin assembly comprising a plurality of fins;
a supporting bracket thermally contacting with the heat spreader and located below the fin assembly; and
a heat pipe extending through the fin assembly and the supporting bracket and attached to the heat spreader, wherein a lowermost fin of the fin assembly has a plurality of clasps formed thereon, the lowermost fin connecting the supporting bracket via the plurality of clasps deformed to engage with the supporting bracket;
wherein the supporting bracket includes a connecting portion located at a middle thereof, two U-shaped supporting portions integrally formed at two opposite ends of the connecting portion, two arms respectively extending outwardly from two free ends of the two supporting portions and two flanges extending downwardly from two distal ends of the arms.
1. A heat dissipation device adapted for cooling an electronic device mounted on a printed circuited board, comprising:
a heat spreader contacting the electronic device;
a fin assembly comprising a plurality of fins;
a supporting bracket contacting the heat spreader and supporting the fin assembly; and
a heat pipe extending through the fin assembly and the supporting bracket, and attached to the heat spreader, wherein a lowermost fin of the fin assembly has a plurality of clasps extending towards the supporting bracket, the clasps being bent and pressing a bottom of the supporting bracket after the clasps extending through the supporting bracket;
wherein each of the clasps comprises a body and a hook extending from a distal end of the body, the supporting bracket defining a plurality of clasp holes near two ends thereof, the hooks of the clasps being bent and pressing a bottom of the supporting bracket after the hooks of the clasps extending through the clasp holes of the supporting bracket;
wherein each of the fins includes a main body and two flanges extending at two opposite ends of the main body and towards the supporting bracket, the clasps being formed at the main body and near the two flanges; and
wherein the supporting bracket includes a connecting portion located at a middle thereof, two supporting portions integrally formed at two opposite ends of the connecting portion, two arms respectively extending outwardly from two free ends of the two supporting portions and two flanges extending downwardly from two distal ends of the arms.
2. The heat dissipation device as claimed in
3. The heat dissipation device as claimed in
4. The heat dissipation device as claimed in
5. The heat dissipation device as claimed in
6. The heat dissipation device as claimed in
7. The heat dissipation device as claimed in
8. The heat dissipation device as claimed in
9. The heat dissipation device as claimed in
10. The heat dissipation device as claimed in
11. The heat dissipation device as claimed in
13. The heat dissipation device as claimed in
14. The heat dissipation device as claimed in
15. The heat dissipation device as claimed in
|
1. Field of the Invention
The disclosure relates to heat dissipation devices, and more particularly to a heat dissipation device which has a strengthened structure.
2. Description of Related Art
Nowadays, numerous heat dissipation devices are used to dissipate heat generated by electronic devices. A tower type heat dissipation device is a common structure of the heat dissipation devices. Conventionally, the heat dissipation device comprises a heat spreader thermally contacting with an electronic device, a fin assembly, a supporting bracket located on the heat spreader and contacting with the fin assembly, and a heat pipe extending through the fin assembly and the supporting bracket and connecting the heat spreader. The heat pipe, the fin assembly and the supporting bracket are soldered together in a manner such that the supporting bracket supports the fin assembly thereon. However, since the fin assembly comprises so many fins stacked together, the tower type heat dissipation device is relatively heavy, whereby the fin assembly is prone to disengage from the supporting bracket when subjected to shock or vibration during transportation or use.
What is needed, therefore, is a heat dissipation device which can overcome the limitation described.
Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
The heat dissipation device comprises a heat spreader 10 contacting with the electronic device 62, a heat pipe 20 thermally contacting with the heat spreader 10, a fixing plate 30 fixing the heat pipe 20 on the heat spreader 10, a fin assembly 40 and a supporting bracket 50 supporting the fin assembly 40.
Also referring to
The heat pipe 20 has a U-shaped configuration and comprises two vertical sections functioning as condensing sections 24, a horizontal section functioning as an evaporating section 22 and two arced connecting sections interconnecting the two condensing sections 24 and the evaporating section 22 and employed as adiabatic sections 26. The two adiabatic sections 26 are curved beyond a plane defined by the two condensing sections 24 so that the evaporating section 22 is not coplanar with the two condensing sections 24. The evaporating section 22 of the heat pipe 20 is accommodated and soldered in the slot 14 of the heat spreader 10. The two condensing sections 24 of the heat pipe 20 extend through the fin assembly 40 and the supporting bracket 50.
The fixing plate 30 defines a channel 32 corresponding to the slot 14 of the heat spreader 10 for receiving the evaporating section 22 of the heat pipe 20 therein. Two opposite ends of the fixing plate 30 each define a through hole 34. A lower portion of the fixing plate 30 is received in the groove 12 of the heat spreader 10. A pair of screws 36 extends through the through holes 34 of the fixing plate 30 and threadedly engages in the threaded holes 120 of the heat spreader 10 for fixing the heat pipe 20 onto the heat spreader 10.
The fin assembly 40 comprises a plurality of spaced and parallel fins 42. The fins 42 each are made of metal such as aluminum, copper or an alloy thereof and have a flat main body 422 and a pair of flanges 424 extending perpendicularly from two opposite ends of the main body 422. The pair of flanges 424 extends downwardly from the two opposite ends of the flat main body 422 towards the supporting bracket 50. The pair of flanges 424 of each fin 42 extends along the same direction and abuts against the flat main body 422 of an adjacent lower fin 42. The flanges 424 of the fins 42 form two planes at two lateral sides of the fin assembly 40. Two neighboring ones of the fins 42 of the fin assembly 40 are spaced from each other with a uniform interval. All the flanges 424 of the fins 42, except a lowermost fin 42, form buckles (not labeled) projecting downwardly from the flanges 424. By the buckles, the fins 42 are connected together. The lowermost fin 42 of the fin assembly 40 has two clasps 426 punched near the two opposite ends of the main body 422 thereof. The two clasps 426 extend downwardly towards the supporting bracket 50. Two corresponding punching holes 421 are formed in the main body 422 of the lowermost fin 42 after the two clasps 426 are punched. The two clasps 426 each include a rectangular body 4260 perpendicular to the main body 422 and a hook 4262 extending inwardly from a center of a distal end of the body 4260 along a horizontal orientation parallel to the main body 422. The hook 4262 is bent from an originally formed vertical orientation to the horizontal orientation of
The supporting bracket 50 is made of metal such as aluminum, copper or an alloy thereof. The supporting bracket 50 is located below the fin assembly 40 and contacts with the heat spreader 10. The supporting bracket 50, the fin assembly 40 and the heat spreader 10 are soldered together. The supporting bracket 50 has a thickness larger than that of each fin 42 of the fin assembly 40. The supporting bracket 50 is for supporting the fin assembly 40 and reinforcing the whole strength of the fin assembly 40, in addition to its original function of heat dissipation. The supporting bracket 50 includes a connecting portion 52 located at a middle thereof, two U-shaped supporting portions 54 integrally formed at two ends of the connecting portion 52, two arms 56 respectively extending outwardly from two free ends of the two supporting portions 54 and two flanges 58 extending vertically and downwardly from two distal ends of the two arms 56. The two supporting portions 54 each have a bottom surface contacting with a top surface of the heat spreader 10 and define a recess 57 in a bottom thereof for receiving the adiabatic section 26 of the heat pipe 20. The recess 57 penetrates through the supporting portion 54 of the supporting bracket 50. The two arms 56 of the supporting bracket 50 define two clasp holes 59 near two ends thereof for extension of the two clasps 426 of the lowermost fin 42 of the fin assembly 40 therethrough. The two hooks 4262 of the two clasps 426 are able to be bent from the vertical orientation to the horizontal orientation to thereby press tightly against a bottom surface of the supporting bracket 50, after the two hooks 4262 of the two clasps 426 extend downwardly through the two clasp holes 59 of the supporting bracket 50. Thus, the lowermost fin 42 and the supporting bracket 50 can be securely connected together.
In assembly, the evaporating section 22 of the heat pipe 20 is received and soldered in the slot 14 of the heat spreader 10. The fixing plate 30 is received in the groove 12 of the heat spreader 10 to thereby fix the heat pipe 20 on the heat spreader 10. The two hooks 4262 of the two clasps 426 of the lowermost fin 42 extend downwardly through the two clasp holes 59 of the supporting bracket 50. Then the two hooks 4262 of the two clasps 426 are bent to press against the bottom surface of the supporting bracket 50 to thereby securely connect the fin assembly 40 and the supporting bracket 50 together. The condensing sections 24 of the heat pipe 20 are brought to extend through the supporting bracket 50 and the fin assembly 40 till the supporting portions 54 of the supporting bracket 50 abut against the heat spreader 10. Thus, the heat dissipation device is assembled together.
According to the previous disclosure, in addition to be soldered to the supporting bracket 50, the lowermost fin 42 is further locked with the supporting bracket 50 via the clasps 426 thereof, thus, the fin assembly 40 can maintain its reliable attachment on the supporting bracket 50 without disengagement, even when the fin assembly 40 is subjected to vibration or shock.
For preventing an operator from injury by the buckles when carelessly touching the lateral sides of the fin assembly 40, it can be understood that the buckles formed on the two opposite sides of each fin 42 can be replaced by the structures shown in
It is believed that the disclosure and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.
Li, Wei, Chen, Chun-Chi, Wu, Yi-Qiang
Patent | Priority | Assignee | Title |
8800639, | Aug 31 2011 | CHAMP TECH OPTICAL FOSHAN CORPORATION | Heat dissipation apparatus with heat pipe |
9136201, | Dec 16 2011 | Delta Electronics (Shanghai) Co., Ltd.; DELTA ELECTRONICS SHANGHAI CO , LTD | Hybrid heat sink and hybrid heat sink assembly for power module |
Patent | Priority | Assignee | Title |
6625021, | Jul 22 2002 | Intel Corporation | Heat sink with heat pipes and fan |
6785140, | Aug 28 2002 | Dell Products L.P. | Multiple heat pipe heat sink |
6880621, | Feb 14 2003 | Radiator | |
7121327, | Dec 28 2000 | Hon Hai Precision Ind. Co., Ltd. | Heat sink assembly |
7215548, | Mar 20 2006 | CHAMP TECH OPTICAL FOSHAN CORPORATION | Heat dissipating device having a fin also functioning as a fan duct |
7661466, | Apr 18 2007 | FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD ; FOXCONN TECHNOLOGY CO , LTD | Heat sink assembly having a fin also functioning as a supporting bracket |
20030218849, | |||
20050115702, | |||
20060272799, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Feb 16 2009 | LI, WEI | FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022334 | /0277 | |
Feb 16 2009 | WU, YI-QIANG | FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022334 | /0277 | |
Feb 16 2009 | CHEN, CHUN-CHI | FU ZHUN PRECISION INDUSTRY SHEN ZHEN CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022334 | /0277 | |
Feb 16 2009 | LI, WEI | FOXCONN TECHNOLOGY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022334 | /0277 | |
Feb 16 2009 | WU, YI-QIANG | FOXCONN TECHNOLOGY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022334 | /0277 | |
Feb 16 2009 | CHEN, CHUN-CHI | FOXCONN TECHNOLOGY CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 022334 | /0277 | |
Mar 03 2009 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | (assignment on the face of the patent) | / | |||
Mar 03 2009 | Foxconn Technology Co., Ltd. | (assignment on the face of the patent) | / |
Date | Maintenance Fee Events |
Feb 26 2016 | REM: Maintenance Fee Reminder Mailed. |
Jul 17 2016 | EXP: Patent Expired for Failure to Pay Maintenance Fees. |
Date | Maintenance Schedule |
Jul 17 2015 | 4 years fee payment window open |
Jan 17 2016 | 6 months grace period start (w surcharge) |
Jul 17 2016 | patent expiry (for year 4) |
Jul 17 2018 | 2 years to revive unintentionally abandoned end. (for year 4) |
Jul 17 2019 | 8 years fee payment window open |
Jan 17 2020 | 6 months grace period start (w surcharge) |
Jul 17 2020 | patent expiry (for year 8) |
Jul 17 2022 | 2 years to revive unintentionally abandoned end. (for year 8) |
Jul 17 2023 | 12 years fee payment window open |
Jan 17 2024 | 6 months grace period start (w surcharge) |
Jul 17 2024 | patent expiry (for year 12) |
Jul 17 2026 | 2 years to revive unintentionally abandoned end. (for year 12) |