A method for manufacturing a semiconductor device, includes: preparing a semiconductor substrate with a first notch; preparing a supporting substrate with a second notch; laminating the semiconductor substrate with the supporting substrate so that the first notch can be matched with the second notch; and processing a second main surface of the semiconductor substrate opposite to a first main surface thereof facing to the supporting substrate to reduce a thickness of the semiconductor substrate to a predetermined thickness.
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3. A semiconductor chip package, comprising:
a semiconductor substrate with a first notch;
a supporting substrate with a second notch laminated with said semiconductor substrate so that said first notch can be matched with said second notch;
an active element region formed on said first main surface of said semiconductor substrate;
a first wiring layer formed on said first main surface of said semiconductor substrate so as to be electrically connected with said active element region;
a through hole formed at said semiconductor substrate so as to connect said first main surface and said second main surface;
a second wiring layer formed on said second main surface of said semiconductor substrate so as to be electrically connected with said first wiring layer via a conductive layer formed in a through hole formed at said semiconductor substrate so as to connect said first main surface and said second main surface;
a protective layer formed so as to cover said second main surface of said semiconductor substrate; and
an external connection terminal formed in an opening formed so as to expose said second wiring layer to electrically connect said second wiring layer.
1. A method for detecting a semiconductor substrate, comprising:
preparing a semiconductor substrate with a first notch;
preparing a supporting substrate with a second notch;
laminating said semiconductor substrate with said supporting substrate so that said first notch can be matched with said second notch;
detecting said first notch so as to detect a position of said semiconductor substrate;
processing a second main surface of said semiconductor substrate opposite to a first main surface thereof facing to said supporting substrate to reduce a thickness of said semiconductor substrate to a predetermined thickness after the laminating of said semiconductor substrate;
forming an active element region on said first main surface of said semiconductor substrate;
forming a first wiring layer on said first main surface of said semiconductor substrate so as to be electrically connected with said active element region;
forming a through hole at said semiconductor substrate so as to connect said first main surface and said second main surface;
forming a second wiring layer on said second main surface of said semiconductor substrate so as to be electrically connected with said first, wiring layer via a conductive layer formed in said through hole before the detecting of the said first notch, wherein
a size of said second notch is smaller than a size of said first notch so that edges of said second notch are located inside from edges of said first notch when said first notch is matched with said second notch, wherein said first notch is detected by a pin.
2. A method for detecting a semiconductor substrate, comprising:
preparing a semiconductor substrate with a first notch;
preparing a supporting substrate with a second notch;
laminating said semiconductor substrate with said supporting substrate so that said first notch can be matched with said second notch;
detecting said first notch so as to detect a position of said semiconductor substrate;
processing a second main surface of said semiconductor substrate opposite to a first main surface thereof facing to said supporting substrate to reduce a thickness of said semiconductor substrate to a predetermined thickness after the laminating of said semiconductor substrate;
forming an active element region on said first main surface of said semiconductor substrate;
forming a first wiring layer on said first main surface of said semiconductor substrate so as to be electrically connected with said active element region;
forming a through hole at said semiconductor substrate so as to connect said first main surface and said second main surface;
forming a second wiring layer on said second main surface of said semiconductor substrate so as to be electrically connected with said first wiring layer via a conductive layer formed in said through hole before the detecting of the said first notch, wherein
a size of said second notch is larger than a size of said first notch so that edges of said second notch are located outside from edges of said first notch when said first notch is matched with said second notch, wherein said first notch is detected by a light passing through said first notch.
4. The semiconductor chip package as set forth in
5. The semiconductor chip package as set forth in
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This is a Division of application Ser. No. 12/236,567 filed on Sep. 24, 2008, which is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2007-251655, filed on Sep. 27, 2007; the entire contents of both of which are incorporated herein by reference.
1. Field of the Invention
The present invention relates to a method for manufacturing a semiconductor device, a method for detecting a semiconductor substrate and a semiconductor chip package.
2. Description of the Related Art
A semiconductor device such as a CCD or a CMOS image sensor using semiconductor integration circuit technique is widely available for a digital camera or a cellular phone with camera function. In order to realize the downsizing and lightening in weight of the parts to be mounted on the semiconductor device, it is proposed that the sensor chip (semiconductor element) is constructed as a CSP (Chip Size Package). With a FBAR (Film Bulk Acoustic Resonator) or a MEMS (Micro Electro Mechanical Systems), it is also proposed that the sensor chip (semiconductor element) is constructed as a CSP.
With the fabrication of the sensor chip as the CSP, through holes are formed so as to connect the main surface and the rear surface of the semiconductor element (semiconductor substrate) so that the integrated circuits formed on the main surface of the semiconductor substrate are electrically connected with the external connection terminals formed on the rear surface of the semiconductor substrate by the conductive layers (penetrating wirings) formed in the through holes. Moreover, a protective member is provided so as to protect the sensor formed on the main surface of the semiconductor substrate against dirt, dust and external disturbance (References 1 and 2). The protective member is provided above the sensor so that the surface of the protective member becomes parallel to the main surface of the semiconductor substrate.
When the sensor functions as a light receiving sensor, a light transmission protective member such as glass substrate may be employed as the protective member. When the sensor does not function as the light receiving sensor, the light transmission protective member such as glass substrate is employed in view of the position detection of the semiconductor substrate. The light transmission protective member functions as a supporting substrate to mechanically reinforce the semiconductor substrate. In this point of view, the glass substrate is laminated with the glass substrate shaped in wafer to realize the thickening process of the semiconductor substrate (Reference 2).
In the case of the formation of the penetrating wirings at the semiconductor substrate, the through holes are formed at the semiconductor substrate laminated with the supporting substrate so that the inner walls of the through holes and the rear surface of the semiconductor substrate are covered with respective insulating films. This subsequent process is carried out for the semiconductor substrate shaped in wafer. Therefore, after the wafer process is finished, the semiconductor substrate is cut off into sensor chips (semiconductor devices) with the glass substrate. When the glass substrate is employed only as the supporting substrate, the semiconductor substrate is cut off into sensor chips (semiconductor devices) after the glass substrate is peeled off from the semiconductor substrate.
By the way, with the position detection of a semiconductor substrate, a notch is formed at the periphery of the semiconductor substrate and a light is irradiated at the periphery of the semiconductor substrate so as to detect the light passed through the notch, and thus, detect the position of the semiconductor substrate. When the light transmission member such as the glass substrate is employed as the supporting substrate, the position detection of the semiconductor substrate can be conducted using the notch at the initial stage.
However, since the supporting substrate is laminated with the semiconductor substrate so as to cover the semiconductor substrate, if some insulating films and some conductive layers are formed on the semiconductor substrate, some debris originated from the films are stuck at the notch. Therefore, the light for detecting the position of the semiconductor substrate can not be passed through the notch due to the debris stuck on the notch so that the position of the semiconductor substrate can not be detected. On the other hand, the periphery or the notch of the semiconductor substrate are detected by means of image processing using an optical system such as a camera, but the image processing system is expensive so that the device cost and thus, the manufacturing cost of the semiconductor device results in being increased.
An aspect of the present invention relates to a method for manufacturing a semiconductor device, including: preparing a semiconductor substrate with a first notch; preparing a supporting substrate with a second notch; laminating the semiconductor substrate with the supporting substrate so that the first notch can be matched with the second notch; and processing a second main surface of the semiconductor substrate opposite to a first main surface thereof facing to the supporting substrate to reduce a thickness of the semiconductor substrate to a predetermined thickness.
Another aspect of the present invention relates to a method for detecting a semiconductor substrate, including: preparing a semiconductor substrate with a first notch; preparing a supporting substrate with a second notch; laminating the semiconductor substrate with the supporting substrate so that the first notch can be matched with the second notch; and detecting the first notch so as to detect a position of the semiconductor substrate.
Still another aspect of the present invention relates to a semiconductor chip package, including: a semiconductor substrate with a first notch; a supporting substrate with a second notch laminated with the semiconductor substrate so that the first notch can be matched with the second notch; an active element region formed on the first main surface of the semiconductor substrate; a first wiring layer formed on the first main surface of the semiconductor substrate so as to be electrically connected with the active element region; a through hole formed at the semiconductor substrate so as to connect the first main surface and the second main surface; a second wiring layer formed on the second main surface of the semiconductor substrate so as to be electrically connected with the first wiring layer via a conductive layer formed in a through hole formed at the semiconductor substrate so as to connect the first main surface and the second main surface; a protective layer formed so as to cover the second main surface of the semiconductor substrate; and an external connection terminal formed in an opening formed so as to expose the second wiring layer to electrically connect the second wiring layer.
Then, some embodiments will be described with reference to the drawings.
The semiconductor substrate 1 is made of, e.g., silicon (Si). Then, an active element region with a light receiving unit 3 is defined on a first main surface 1a of the semiconductor substrate 1. The light receiving unit 3 includes a light receiving element such as a photodiode which is configured so as to receive a light or an energy beam irradiated onto the first main surface 1a and collect the received light or energy beam therein. Moreover, a first wiring layer 4 is provided on the first main surface 1a of the semiconductor substrate 1 so as to be electrically connected with the light receiving unit 3 within the active element region, other elements and wirings. The light receiving unit 3 and the first wiring layer 4 are formed at the corresponding device formation regions of the semiconductor substrate (semiconductor wafer). The device formation regions constitute an image sensor such as CCD image sensor or a CMOS image sensor.
The supporting substrate 2 is made of a light transmission member such as glass substrate. In this embodiment, the supporting member 2 is employed as a light transmission protective member for the light receiving unit 3 formed on the first main surface 1a of the semiconductor substrate 1. Concretely, the light receiving member is made of borosilicate glass, quartz glass or soda-lime glass, for example. The size of the supporting substrate 2 is set almost equal to or slightly larger than the size of the semiconductor substrate 1. The supporting substrate 2 is disposed above the first main surface 1a of the semiconductor substrate 1 on which the light receiving unit 3 and the like are formed.
Then, an adhesive layer 5 is coated at the periphery of the semiconductor substrate 1 except the light receiving unit 3 of the first main surface 1a of the semiconductor substrate 1 so that the semiconductor substrate 1 is laminated with the supporting substrate 2 via the adhesive layer 5, as shown in
In the lamination between the semiconductor substrate 1 (semiconductor wafer) and the supporting substrate 2 made of the wafer-shape glass substrate, notches 7 and 8 are formed at the semiconductor substrate 1 and the supporting substrate 2 in advance, respectively, as shown in
Since the size of the second notch 8 is larger than the size of the first notch 7, the edges of the second notch 8 are located outside from the edges of the first notch 7 when the first notch 7 is matched with the second notch 8. Therefore, since the first notch 7, formed at the periphery of the semiconductor substrate 1, is not shielded by the supporting substrate 2, the first notch 7 can function as the inherent notch. In other words, when the semiconductor substrate 1 is laminated with the supporting substrate 2, the first notch 7 of the semiconductor substrate 1 can be directly detected by a light so that the accuracy of the position detection of the semiconductor substrate 1 can be enhanced and the position detection of the semiconductor substrate 1 can be conducted after one or some film forming processes.
The size of the second notch 8 may be set equal to the size of the first notch 7. In this case, the edges of the first notch 7 may be partially shielded by the second notch 8 due to the poor accuracy of the matching between the first notch 7 and the second notch 8 when the first notch 7 is matched with the second notch 8. In this point of view, it is desired that the size of the second notch 8 is set larger than the size of the first notch 7. Preferably, the second notch 8 is formed such that the edges of the second notch 8 are receded from the edges of the first notch 7 by a distance of 0.3 mm or more. According to the first notch 7 and the second notch 8 satisfying the above-described requirement, the position of the semiconductor substrate 1 can be detected even through the supporting substrate 2 is not made of the light transmission member.
Then, the semiconductor substrate 1 is thinned as shown in
Then, as shown in
Then, as shown in
The second wiring layers 10 are formed by depositing conductive films into the through holes 9 and on the second main surface 2b by means of sputtering, CVD, vacuum deposition, plating, coating or the like. Alternatively, the conductive films are formed over the second main surface 1b of the semiconductor substrate 1 so as to embed the through holes 9. The conductive films are etched by using a predetermined patterned mask to form the second wiring layers 10. The insulating films, which are located between the second main surface 1b of the semiconductor substrate 1 and the conductive films, are patterned in the same manner as the second wiring layers. Herein, the film-forming step in this embodiment includes the formation step of at least one of the insulating films and the conductive films on the second main surface 1b of the semiconductor substrate 1.
During or after the film-forming step, since the first notch 7 formed at the periphery of the semiconductor substrate 1 is not shielded by the debris deposited on the supporting substrate 2 and originated from the formation of the insulating films and the conductive films, the position of the first notch 7 can be directly detected by a light. The position detection of the semiconductor substrate 1 can be conducted using the first notch 7 as follows. First of all, a light is irradiated onto the periphery of the semiconductor substrate 1 from a light source so that a portion of the light passing through the first notch 7 is detected at a light receiving sensor. After the position detection of the semiconductor substrate 1 is conducted on the detection at the sensor, the semiconductor substrate 1 is aligned using the first notch as a position-determining mark. In this way, the first notch 7 can be utilized effectively for the alignment of the semiconductor substrate 1.
Then, as shown in
In the manufacturing process of the semiconductor device 13 according to the first embodiment, since the position of the first notch 7 of the semiconductor substrate 1 can be directly detected even though the semiconductor substrate 1 is laminated with the supporting substrate 2, the accuracy of the position detection of the semiconductor substrate 1 can be enhanced. Moreover, since the position of the notch 7 of the semiconductor substrate 1 can be detected after the film-forming process is conducted, the wafer process including the film-forming process and the etching process can be conducted effectively and efficiently.
In this embodiment, since the size of the second notch 15 is smaller than the size of the first notch 14, the edges of the second notch are located inside from the edges of the first notch when the first notch is matched with the second notch. In this case, the positions of the notches 14 and 15 (concretely, the position of the second notch 15) can be detected using a mechanical position detecting means such as a pin. The positions of the notches 14 and 15 can be detected after the film-forming process is finished as described previously. Therefore, the position detection of the semiconductor substrate 1 can be conducted effectively and efficiently.
In the embodiments, the semiconductor substrate 1 with the light receiving unit 3 within the active element region is laminated with the supporting substrate (light transmission protective member) 2, but the present invention is not limited to the embodiments. For example, when an FBAR filter or an MEMS which are made of piezoelectric body is formed on the first main surface of the semiconductor substrate, the FBAR filter or the MEMS is required to be covered with a protective member so that the FBAR filter or the MEMS can be disposed in the cavity formed between the semiconductor substrate and the protective member, according to the embodiments as described above. In this case, the semiconductor substrate 1 is cut out into the pieces with the supporting substrate 2. Each piece constitutes the semiconductor device 13 with the FBAR filter or the MEMS.
Then, the manufacturing process of a semiconductor device according to a second embodiment will be described with reference to
The supporting substrate 22 is made of a light transmission member such as glass substrate or a light non-transmission member such as semiconductor substrate. In this embodiment, the supporting member 22 is made of borosilicate glass, quartz glass or soda-lime glass, for example. The size of the supporting substrate 22 is set almost equal to or slightly larger than the size of the semiconductor substrate 21. The supporting substrate 22 is disposed above the first main surface 21a of the semiconductor substrate 21 on which the element unit 23 is formed.
Then, an adhesive layer 24 is coated at the periphery of the first main surface 21a of the semiconductor substrate 21 so that the semiconductor substrate 21 is laminated with the supporting substrate 22 via the adhesive layer 24, as shown in
The semiconductor substrate 21 is laminated with the supporting substrate 22 so that the first notch 14 is matched with the second notch 15 in the same manner as the first embodiment. The concrete shapes and functions of the first notch 14 and the second notch 15 may be set in the same manner as the concrete shapes and functions of the first notch 7 and the second notch 8, respectively.
Then, the semiconductor substrate 21 is thinned as shown in
Then, after the subsequent steps (wafer process) are finished, the supporting substrate 22 is peeled off from the semiconductor substrate 21 as shown in
In the manufacturing process of the semiconductor device 25 according to the second embodiment, since the position of the first notch 14 of the semiconductor substrate 21 can be directly detected even though the semiconductor substrate 21 is laminated with the supporting substrate 22, the accuracy of the position detection of the semiconductor substrate 21 can be enhanced. Therefore, the manufacturing efficiency of the semiconductor device 25 can be enhanced and manufacturing cost of the semiconductor device 25 can be reduced.
Although the present invention was described in detail with reference to the above examples, this invention is not limited to the above disclosure and every kind of variation and modification may be made without departing from the scope of the present invention. For example, the present invention can be applied for various manufacturing method of a semiconductor device requiring thinning process and/or film forming process under the condition that the semiconductor substrate is laminated with the supporting substrate.
Sekiguchi, Masahiro, Harada, Susumu, Dohi, Masayuki, Takano, Eiji, Shirakawa, Tatsuhiko, Hagiwara, Kenichiro
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