A micro-lens and a method for forming the micro-lens is provided. A micro-lens includes a substrate and lens material located within the substrate, the substrate having a recessed area serving as a mold for the lens material. The recessed can be shaped such that the lens material corrects for optical aberrations. The micro-lens can be part of a micro-lens array. The recessed area can serve as a mold for lens material for the micro-lens array and can be shaped such that the micro-lens array includes arcuate, non-spherical, or non-symmetrical micro-lenses.

Patent
   8390931
Priority
Nov 26 2003
Filed
Jun 23 2009
Issued
Mar 05 2013
Expiry
Jun 15 2025
Extension
567 days
Assg.orig
Entity
Large
2
14
EXPIRING-grace
12. A system comprising:
a processor; and
an imaging device, the imaging device comprising:
a plurality of pixel cells each having a photosensor, wherein each pixel cell has a center; and
a micro-lens array including a plurality of micro-lenses each associated with one of said pixel cells, each micro-lens having a focal point, wherein the focal point of at least a first microlens is shifted, by a first distance, away from the center of the pixel cell associated with the first micro-lens.
11. An imaging system comprising:
an imager comprising:
an array of pixel cells; and
a micro-lens array positioned over the array of pixel cells, the micro-lens array comprising a plurality of micro-lenses, each of the micro-lenses having a respective focal point, wherein the focal point of at least one of the plurality of micro-lenses differs from the focal point of at least one other of the plurality of micro-lenses, and wherein the differing focal points of the plurality of micro-lenses focus light to different depths in the pixel cells.
1. An imaging system comprising:
an imager comprising:
an array of pixel cells;
a micro-lens array positioned over the array of pixel cells, the micro-lens array comprising a plurality of micro-lenses, each of the micro-lenses having a respective focal point, wherein the focal point of at least one of the plurality of micro-lenses differs from the focal point of at least one other of the plurality of micro-lenses, wherein the micro-lens array is formed in a substrate positioned over the array of pixel cells, wherein the micro-lens array comprises lens material; and
a plurality of openings in the substrate, wherein each opening contains lens material that forms a respective plurality of given micro-lenses out of the plurality of micro-lens in the micro-lens array, each of the given micro-lenses having a respective focal point.
2. The system of claim 1, wherein the micro-lenses are shaped such that the micro-lenses correct for optical aberrations.
3. The system of claim 1, wherein the lens material exhibits a refractive index greater than that of the substrate.
4. The system of claim 1, wherein the lens material exhibits a refractive index less than the substrate.
5. The system of claim 1, wherein the focal point of at least one of the plurality of given micro-lenses differs from the focal point of at least one other of the plurality of given micro-lenses in the same opening.
6. The system of claim 1, wherein the focal points of the plurality of micro-lenses change gradually across the micro-lens array.
7. The system of claim 1, wherein each pixel cell comprises a photosensor and wherein each micro-lens is respectively associated with the photosensor of one of the array of pixel cells.
8. The system of claim 1, wherein at least one of the plurality of micro-lenses has a different shape than another one of the plurality of micro-lenses.
9. The system of claim 1, wherein at least one of the plurality of micro-lenses has a different size than another one of the plurality of micro-lenses.
10. The system of claim 1, wherein at least one of the plurality of micro-lenses has a different profile than another one of the plurality of micro-lenses.
13. The system of claim 12, further comprising a light shield for directing electromagnetic radiation to each photosensor.
14. The system of claim 12, wherein the micro-lens array includes at least one non-symmetrical micro-lens.
15. The system of claim 12, wherein the micro-lens array includes at least one non-spherical micro-lens.
16. The system of claim 12, wherein the plurality of pixel cells are CMOS pixel cells.
17. The system of claim 12, wherein each of the micro-lenses is formed in a substrate and comprises a lens material exhibiting a refractive index greater than that of the substrate.
18. The system of claim 12, wherein each of the micro-lenses is formed in a substrate and comprises a lens material exhibiting a refractive index less than the substrate.
19. The system of claim 12, wherein the imaging device further comprises a plurality of color filters respectively associated with said pixel cells and wherein the plurality of color filters includes at least a first filter for a first color and a second filter for a second color.
20. The system of claim 19, wherein said plurality of micro-lenses includes at least a first micro-lens associated with the first filter and a second micro-lens associated with the second filter, said first and second micro-lenses each being configured to account for optical aberrations in the light directed through the first and second filters.
21. The system of claim 12, wherein each of the micro-lenses is formed in a substrate and comprises lens material located within a recessed area of a substrate which serves as a mold for the lens material.
22. The system of claim 21, wherein the recessed area has at least one arcuate portion.
23. The system of claim 21, wherein the recessed area is shaped such that said lens material corrects for optical aberrations.
24. The system of claim 12 wherein the focal point of at least a second microlens is not shifted away from the center of the pixel cell associated with the second micro-lens.
25. The system of claim 12 wherein the focal point of at least a second microlens is shifted away, by a second distance, from the center of the pixel cell associated with the second micro-lens.

The present application is a continuation of U.S. patent application Ser. No. 11/385,679, filed on Mar. 22, 2006, now U.S. Pat. No. 7,566,405 which is a divisional of U.S. patent application Ser. No. 10/721,165, filed on Nov. 26, 2003, (now U.S. Pat. No. 7,333,267), the disclosures of which are incorporated by reference in their entirety.

The present invention relates generally to the field of semiconductor devices and more particularly, to micro-lenses utilized in imager devices or displays.

The semiconductor industry currently uses different types of semiconductor-based imagers, such as charge coupled devices (CCDs), CMOS active pixel sensors (APS), photodiode arrays, charge injection devices and hybrid focal plane arrays, among others, that use micro-lenses. Semiconductor-based displays using micro-lenses are also known.

It is desirable to maximize the amount of light received by the photo-conversion devices of an imager. One way to increase the light received by the photo-conversion devices is to increase the amount of light received by micro-lenses, which collect external light and focus it on the photo-conversion device. Another way is to enhance the positioning of the focal point of each micro-lens to ensure that much of the light received by the micro-lenses is focused on the photo-conversion devices.

Micro-lenses may be formed through an additive process in which a lens material is formed on a substrate and subsequently is formed into a micro-lens shape. Micro-lenses also may be formed by a subtractive process in a substrate. Known subtractive processes are complex and manufacturing micro-lenses from such known processes is difficult.

The present invention provides an easily manufactured micro-lens which can be used in an imager or display device. In one exemplary embodiment, the micro-lens includes a substrate and lens material located within the substrate, the substrate having an opening serving as a mold for the lens material. The opening can be shaped such that the lens material corrects for optical aberrations.

In an exemplary embodiment of an imager, the imager includes a plurality of pixel cells each having a photo-conversion device, a mask for directing electromagnetic radiation to each photo-conversion device, a color filter assembly, and a micro-lens array including a plurality of micro-lenses each associated with one of the pixel cells. The micro-lens array includes a recessed area in a substrate serving as a mold for lens material. The micro-lens array can be configured to effect a change in focal point between the micro-lenses to correct for optical aberrations and/or for the wavelength dependency of the photo-conversion devices for each of the colors detected.

In an exemplary micro-lens system embodiment, a micro-lens system is provided that includes a first micro-lens array including a first plurality of micro-lenses and a second micro-lens array including a second plurality of micro-lenses. The first micro-lens array is positioned over the second micro-lens array.

In an exemplary fabrication embodiment, a method is provided for manufacturing a micro-lens array. The method includes the acts of forming a recessed area in a substrate, wherein the recessed area includes a plurality of micro-lens sections having different profiles, and filling the recessed area with a lens material to form a plurality of micro-lenses.

These and other features of the invention will be more readily understood from the following detailed description of the invention, which is provided in connection with the accompanying drawings.

FIG. 1 is a plan view of a portion of a lithographic mask constructed in accordance with an exemplary embodiment of the invention.

FIGS. 2A-2F are cross-sectional views illustrating formation of a micro-lens using the lithographic mask of FIG. 1.

FIG. 2G is a top view illustrating the lens mold shown in FIG. 2D.

FIG. 3 illustrates a process for forming a micro-lens using the lithographic mask of FIG. 1.

FIG. 4 is an exploded view of an imager with a micro-lens formed from the lithographic mask of FIG. 1.

FIG. 5 is a view of an imager formed in accordance with another exemplary embodiment of the invention.

FIG. 6 is a cross-sectional view of a micro-lens system formed in accordance with another exemplary embodiment of the invention.

FIG. 7 is a cross-sectional view of an alternative micro-lens system.

FIGS. 1 and 2A illustrate a portion of a lithographic mask 30 used in forming a first exemplary embodiment of a micro-lens array. The lithographic mask 30 as shown includes a variety of openings 32A-D. The openings 32A-D are shown to be circular in shape, although it should be understood that the openings 32A-D may take any symmetrical or non-symmetrical shape. The openings 32A-D are further illustrated as being in a pattern whereby the largest opening 32A is immediately surrounded by the next largest openings 32B. with the smaller openings 32C and 32D being positioned peripheral to the openings 32B. The illustrated lithographic mask 30 is suitable for manufacturing a plurality of micro-lenses at a time. The lithographic mask 30 may further include many similar patterns for the formation of a greater number of micro-lenses.

With specific reference to FIGS. 2A-2G and 3, next will be described a process for forming a first micro-lens array embodiment. An objective is to form, through controllable design and processing, a plurality of micro-lenses whose focal points change gradually across the micro-lens array. The process generally includes a subtractive step followed by an additive step, another subtractive step, and an optional out gassing step.

At Step 100 (FIG. 3), a photo resist layer 36 is formed on a substrate 40. The substrate 40 is an insulating layer of an imager pixel array which is above a semiconductor substrate on which the pixel array is formed. Preferably, the substrate 40 may be formed of any well known transparent insulator material, for example, SiO2, among many others.

As illustrated (FIGS. 2A, 2B), the photo resist material forming the photo resist layer 36 is a positive resist. Nonetheless, the photo resist material forming the photo resist layer 36 may be a negative resist. If the photo resist layer 36 is formed of a negative resist material, the lithographic mask would have to be inverted from the lithographic mask 30 illustrated in FIGS. 1 and 2A.

Next, at Step 105, electromagnetic radiation, such as light 34, is directed through the lithographic mask 30 to image the photo resist layer 36 and expose first portions 38, leaving second portions 39 unexposed. Following Step 105, at Step 110 portions of the photo resist layer 36 are removed using a suitable resist developer, such as, for example, dilute TMAH. The photo resist layer 36 illustrated in FIGS. 2A and 2B is a positive resist, and so the first portions 38 are those portions imaged by the electromagnetic radiation 34 at Step 105 and subsequently removed at Step 110 to form openings 42A-C. It should be appreciated, however, that for a photo resist layer 36 that is a negative resist, a lithographic mask inverse to the lithographic mask 30 would be required and the electromagnetic radiation 34 would image the second portions 39 at Step 105, and the unexposed first portions 38 of the photo resist layer 36 would be removed at Step 110.

The remainder of the photo resist layer 36 is then used as an etch mask. Specifically, at Step 115, the substrate 40 is etched through the etch mask (remainder of photo resist layer 36) to form a recessed area 46 (FIG. 2D). Etching material 44, which is at least partially if not fully isotropic, is placed within the openings 42A-C and allowed to etch through both the photo resist layer 36 and the substrate 40 (FIG. 2C). The etching material 44 may be a dry etching material, a wet etching material, or a combination of wet and dry etching materials. As illustrated in FIGS. 2C and 2D, during the etching process, holes 46A-C are formed in the substrate 40, and due to the isotropic nature of the etching material and the crystalline orientation of the substrate 40, the holes 46A-C grow in size and depth and eventually combine to form the recessed area 46, which is then used as a mold for the micro-lens array. The targeted shape of the recessed area 46 includes a smooth surface which is obtained by a controlled merging of the neighboring holes 46A-C. The holes 46A-C are sized and positioned in such a way to, along with the underetch properties of the etching material 44, determine the shape of the mold for the micro-lens array.

As illustrated in FIGS. 2C-2F, the etching material 44 in the openings 42A-C etches the substrate 40 to assist in the formation of the holes 46A-C, which grow to form micro-lens molds 46A-C. Specifically, the hole 46A grows to become the micro-lens mold 46A of the recessed area 46. In likewise fashion, the etching material 44 in the openings 42B etches the substrate 40 to combine all the holes 46B together and to create the micro-lens molds 46B, and the etching material 44 deposited in the openings 42C etches the substrate 40 to enlarge all the holes 46C to create the micro-lens molds 46C. Although the micro-lens molds 46A-C are shown to have arcuate portions, it should be appreciated that one or more of the micro-lens molds 46A-C may instead have non-spherical and even non-symmetrical aspects. Further, it should be appreciated that more or less than three micro-lens molds may be formed, depending upon the number of openings in the photo resist layer 36.

Next, at step 120, the remainder of the photo resist layer 36 is removed and the micro-lens array mold 46 for the micro-lens array is filled to form an array of micro-lenses 48 having micro-lenses 48A-C. Preferably, the micro-lens array mold 46 is filled with a lens material 47 (FIG. 2E) having a different refractive index than the refractive index of the substrate 40, which, as noted, may be formed of silicon dioxide. If forming a positive micro-lens, the refractive index of the lens material 47 is greater than the refractive index of the substrate 40, and hence the micro-lenses thus formed are focusing lenses causing light rays to converge. One preferred positive micro-lens includes a silicon nitride lens material 47 in a silicon dioxide substrate 40. If forming a negative micro-lens, the refractive index of the lens material 47 is less than the refractive index of the substrate 40, and hence, the micro-lenses thus formed cause light rays to diverge. One preferred negative micro-lens includes a low refractive index polymer, most preferably a transparent photosensitive polymer, lens material 47 in a silicon dioxide substrate 40.

With specific reference to FIGS. 2D-2G, the micro-lens molds 46A-C are filled with the lens material 47, to form a first micro-lens 48A surrounded by second micro-lenses 48B and third micro-lenses 48C. The illustrated first micro-lens 48A has a generally circular profile. The surrounding second micro-lenses 48B each includes an arcuate portion and they completely surround the first micro-lens 48A. The illustrated third micro-lenses 48C each includes an arcuate lens portion separated from one another. Each of the third micro-lenses 48C combines with a second micro-lens 48B. It should be appreciated that the mask 30 can be so configured to produce the third micro-lenses 48C in such a way that they instead combine together like the second micro-lenses 48B. Once the micro-lens array mold 46 has been filled with the lens material 47, at Step 125 the lens material 47 is planarized by, for example, chemical-mechanical planarization, to render it flush with the surface of the substrate 40.

As illustrated in FIG. 2F, a color filter array 50 including color filters 50A-C is then formed over the micro-lenses 48 thus made at Step 130 so that each pixel cell has one associated color filter of, for example, red, green or blue filters. If the lens material 47 used to form the micro-lenses 48 is a special heat-decomposable polymer, at Step 135 heat 52 can be applied to the micro-lenses 48 to cause thermal decomposition, or outgassing, 54 to leave only residual gas in the micro-lenses 48. To facilitate outgassing, suitable small openings can be provided in the color filter array.

Referring to FIG. 4, there is shown a portion of an imager 60, for example, a CMOS imager, that may incorporate the micro-lens array 48, including the micro-lenses 48A-C formed through the process described with reference to FIGS. 1-3. It should be appreciated that other semiconductor-based imagers, as well as semiconductor-based displays, may also incorporate the micro-lens array 48. The illustrated CMOS imager 60 includes a light shield 64 and a plurality of pixel cells, each with a respective photosensor 68A-C, which may be a photo-conversion device such as a photodiode or photogate. The CMOS imager 60, which includes the micro-lens array 48 formed in the substrate 40, also includes a color filter array 50 including a variety of color filters, one for each micro-lens 48A-C and corresponding pixel cell and photosensor 68A-C. Electromagnetic radiation, such as light 62, is directed through the micro-lens array 48, and each micro-lens 48A-C focuses the light 62 on respective one of the photosensors 68A-C. The light shield 64 is configured to inhibit cross talk between the illustrated pixel cells. The micro-lens array 48 effects a change in the focal point between the individual micro-lenses to correct for optical aberrations in the imager module or pixel asymmetries, for example, those due to specific space saving imager designs.

FIG. 5 illustrates a portion of an imager 160, e.g., a CMOS imager, that includes a plurality of pixel cells. Each pixel cell includes a respective photosensor, such as the illustrated photosensors 168A, 169, 169′, 171, 171′, 173, and 175′. Again, as with the light shield 64 (FIG. 4), a light shield 164 is positioned and configured to suppress cross talk between the illustrated pixel cells. The illustrated imager 160 includes a color filter array 150. A micro-lens array 148 is included with a non-symmetrical micro-lens 149 and more symmetrical micro-lenses 48A, 48B, and 48C, whereas a micro-lens array 148′ is included with a non-spherical micro-lens 149′ and more symmetrical micro-lenses 48A and 48B. It should be appreciated that a matrix of micro-lens arrays, such as the arrays 48, 148, and 148′ can be formed adjacent to one another. Although the light shields 64, 164 are illustrated as part of the imager 60, 160, it should be appreciated that the light shields 64, 164 are optional and may not be required in certain circumstances.

By forming micro-lenses through the above-described subtractive method, individual micro-lens structures can be formed for each type of color pixel cells to take advantage of the different absorption depths of light in the substrate 40 due to the different wavelengths of light which pass through the various filters. The focal point of each micro-lens is wavelength dependent. For example, light through a blue filter absorbs at the surface of a silicon substrate and thus requires a short focal length, while light through a red filter absorbs several microns into the silicon substrate and thus requires a longer focal length. Thus, forming micro-lenses with structural differences depending on the wavelength of light to be detected by a pixel cell enhances the light received at each photosensor by controlling the position of the focal point for each micro-lens.

Further, if a photosensor is not centered within its respective pixel cell, then the focal point of the micro-lens would be shifted along the X-Y plane. The use of non-symmetrical lens sections, such as the non-symmetrical lens section 149 adjusts the focal point. Additionally, if the imager 160 is positioned so close to a primary imaging lens, for example, a camera lens, that the size of the imager is comparable to the distance between the camera lens and the imager, the incident angle of light on each pixel cell changes significantly across the imager. This results in signal intensity and color changes across the image, as well as added pixel cell cross talk. By providing micro-lenses with changing shapes for respective lens sections, the effects caused by the close proximity of the imager to the camera lens can be compensated for.

Micro-lenses according to embodiments of the invention described above in connection with FIGS. 1-5 can be implemented in a lens system. A lens system can include a series of lenses that function together. FIGS. 6 and 7 illustrate exemplary embodiments of lens systems according to the invention. As shown in FIG. 6, a lens system 250 includes a micro-lens array 48, which in turn includes the micro-lenses 48A-C. Positioned over the micro-lens array 48 is a micro-lens array 248 formed in an additive process. The micro-lens array 248 includes spherical micro-lenses and can be formed by techniques known in the art.

FIG. 7 depicts another embodiment of a lens system according to the invention. In the lens system 350, includes micro-lens arrays 48 and 48′, both of which are formed through the subtractive process described above in connection with FIGS. 1-5. Specifically, each of the micro-lens arrays 48′, 48 are formed in a substrate 40 and layer 41, respectively. After a first micro-lens array 48′ is formed in substrate 40, a second layer 41 of a suitable material, for example, a same material as substrate 40, e.g. SiO2, is deposited over substrate 40 and first micro-lens array 48′. Then, a second micro-lens array 48 is formed in layer 41 by the same methods used to form micro-lens array 48′.

The lens systems 250, 350 are advantageous in that they allow for additional control to be exerted over chromatic properties. Chromatic aberrations can be alleviated at least to some extent with the lens systems 250, 350. The micro-lens arrays in the lens systems 250, 350 may have differing refractive indexes and/or different lens shapes to assist in correcting chromatic aberrations.

While the invention has been described in detail in connection with exemplary embodiments known at the time, it should be readily understood that the invention is not limited to such disclosed embodiments. Rather, the invention can be modified to incorporate any number of variations, alterations, substitutions or equivalent arrangements not heretofore described, but which are commensurate with the spirit and scope of the invention. Accordingly, the invention is not to be seen as limited by the foregoing description, but is only limited by the scope of the appended claims.

Li, Jin, Boettiger, Ulrich C.

Patent Priority Assignee Title
11187831, Apr 19 2016 Lumentum Operations LLC Semiconductor lens optimization of fabrication
8675118, Sep 30 2010 Samsung Electronics Co., Ltd. Image sensor
Patent Priority Assignee Title
5479049, Feb 01 1993 Sharp Kabushiki Kaisha Solid state image sensor provided with a transparent resin layer having water repellency and oil repellency and flattening a surface thereof
5764319, Aug 08 1995 Sony Corporation Transmissive display device with microlenses and microprisms adjacent counter electrode
5790730, Nov 10 1994 Package for integrated optic circuit and method
5815229, Nov 21 1994 Seiko Epson Corporation Microlens imbedded liquid crystal projection panel including thermal insulation layer
6469832, Dec 28 1999 Seiko Epson Corporation Method for manufacturing microlens substrate, microlens substrate, opposing substrate for liquid crystal panel, liquid crystal panel, and projection display apparatus
6781762, Jun 12 2002 138 EAST LCD ADVANCEMENTS LIMITED Method of manufacturing microlens, microlens, microlens array plate, electrooptic device and electronic equipment
6821810, Aug 07 2000 Taiwan Semiconductor Manufacturing Company High transmittance overcoat for optimization of long focal length microlens arrays in semiconductor color imagers
6909554, Dec 27 2000 II-VI Incorporated; MARLOW INDUSTRIES, INC ; EPIWORKS, INC ; LIGHTSMYTH TECHNOLOGIES, INC ; KAILIGHT PHOTONICS, INC ; COADNA PHOTONICS, INC ; Optium Corporation; Finisar Corporation; II-VI OPTICAL SYSTEMS, INC ; M CUBED TECHNOLOGIES, INC ; II-VI PHOTONICS US , INC ; II-VI DELAWARE, INC; II-VI OPTOELECTRONIC DEVICES, INC ; PHOTOP TECHNOLOGIES, INC Wafer integration of micro-optics
7042527, Aug 31 2000 VISTA PEAK VENTURES, LLC Field sequential display of color video picture with color breakup prevention
7115853, Sep 23 2003 Aptina Imaging Corporation Micro-lens configuration for small lens focusing in digital imaging devices
20050103745,
JP2001239532,
JP5150103,
JP9116127,
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Nov 13 2003BOETTIGER, ULRICH C Micron Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0403450883 pdf
Nov 24 2003LI, JINMicron Technology, IncASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0403450883 pdf
Sep 26 2008Micron Technology, IncAptina Imaging CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0408230001 pdf
Jun 23 2009Aptina Imaging Corporation(assignment on the face of the patent)
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