led backlight module structure for increasing process yield comprises a housing, a copper circuit layer, a plurality of led chips, a plurality of solder paste overflow prevention members, a light guide plate, and a bottom reflector. In the present invention, it mainly disposed the solder paste overflow prevention members between the led chips and the copper circuit layer, therefore, the solder paste overflow phenomenon is prevented when using a pressing fixture to assist in executing the welding process of led chips, and it ensures that the soldering pins of the led chips would not electrically connect to each other due to the solder paste overflow phenomenon. Moreover, a position limiting band can be further disposed on the copper circuit layer for receiving and fixing the led chips, in addition, the position limiting band is helpful to the led chips in heat dissipation when the led chips emit light.
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1. An light-emitting diode (led) backlight module structure for increasing process yield, comprising:
a housing;
a copper circuit layer, being disposed on the surface of a circuit-disposing portion of the housing through a thermally conductive insulating layer, wherein the copper circuit layer has at least one main circuit and a plurality of soldering point;
a plurality of led chips, having a plurality of soldering pins and a light-emitting surface on the bottoms and the tops thereof, wherein the plurality of led chips are disposed on the copper circuit layer, and the soldering pins being welded to the soldering points;
a plurality of solder paste overflow prevention members, being disposed between the led chips and the copper circuit layer;
a light guide plate, being disposed in the housing, and a light-receiving surface of the light guide plate being opposite to the light-emitting surfaces of the led chips; and
a bottom reflector, being disposed on the bottom of the light guide plate for preventing light leakage.
20. An light-emitting diode (led) backlight module structure for increasing process yield, comprising:
a housing;
a copper circuit layer, being disposed on the surface of a circuit-disposing portion of the housing through a thermally conductive insulating layer, wherein the copper circuit layer has at least one main circuit and a plurality of soldering point;
a plurality of led chips, having a plurality of soldering pins and a light-emitting surface on the bottoms and the tops thereof, wherein the plurality of led chips are disposed on the copper circuit layer, and the soldering pins being welded to the soldering points;
a position limiting band, being disposed on the copper circuit layer via another thermally conductive insulating layer, wherein the another thermally conductive insulating layer has a plurality of openings for exposing the soldering points of the copper circuit layer, and the position limiting band comprising:
a plurality of position limiting holes, for receiving and fixing the led chips; and
a plurality of avoiding recesses, being formed on the bottom of the inner wall of each position limiting hole pairwise;
a light guide plate, being disposed in the housing, and a light-receiving surface of the light guide plate being opposite to the light-emitting surfaces of the led chips; and
a bottom reflector, being disposed on the bottom of the light guide plate for preventing light leakage.
11. An light-emitting diode (led) backlight module structure for increasing process yield, comprising:
a housing, having at least one circuit-disposing portion, and the circuit-disposing portion having a plurality of disposing holes;
a circuit substrate;
a copper circuit layer, being disposed on the surface of the circuit substrate through a thermally conductive insulating layer, wherein the copper circuit layer has at least one main circuit and a plurality of soldering point;
a plurality of led chips, having a plurality of soldering pins and a light-emitting surface on the bottoms and the tops thereof, wherein the plurality of led chips are disposed on the copper circuit layer, and the soldering pins being welded to the soldering points;
moreover, the circuit substrate being attached to the outer surface of the circuit-disposing portion via another thermally conductive insulating layer, such that the led chips respectively pass through the disposing holes and enter the interior of the housing from the outer surface of the circuit-disposing portion;
a plurality of solder paste overflow prevention members, being disposed between the led chips and the copper circuit layer;
a light guide plate, being disposed in the housing, and a light-receiving surface of the light guide plate being opposite to the light-emitting surfaces of the led chips; and
a bottom reflector, being disposed on the bottom of the light guide plate for preventing light leakage.
30. An light-emitting diode (led) backlight module structure for increasing process yield, comprising:
a housing, having at least one circuit-disposing portion, and the circuit-disposing portion having a plurality of disposing holes;
a circuit substrate;
a copper circuit layer, being disposed on the surface of the circuit substrate through a thermally conductive insulating layer, wherein the copper circuit layer has at least one main circuit and a plurality of soldering point;
a plurality of led chips, having a plurality of soldering pins and a light-emitting surface on the bottoms and the tops thereof, wherein the plurality of led chips are disposed on the copper circuit layer, and the soldering pins being welded to the soldering points; moreover, the circuit substrate being attached to the outer surface of the circuit-disposing portion via another thermally conductive insulating layer, such that the led chips respectively pass through the disposing holes and enter the interior of the housing from the outer surface of the circuit-disposing portion;
a position limiting band, being disposed on the copper circuit layer via another thermally conductive insulating layer, wherein the another thermally conductive insulating layer has a plurality of openings for exposing the soldering points of the copper circuit layer, and the position limiting band comprising:
a plurality of position limiting holes, for receiving and fixing the led chips; and
a plurality of avoiding recesses, being formed on the bottom of the inner wall of each position limiting hole pairwise;
a light guide plate, being disposed in the housing, and a light-receiving surface of the light guide plate being opposite to the light-emitting surfaces of the led chips; and
a bottom reflector, being disposed on the bottom of the light guide plate for preventing light leakage.
2. The led backlight module structure for increasing process yield of
3. The led backlight module structure for increasing process yield of
4. The led backlight module structure for increasing process yield of
a plurality of position limiting holes, for receiving and fixing the led chips; and
a plurality of avoiding recesses, being formed on the bottom of the inner wall of each position limiting hole pairwise.
5. The led backlight module structure for increasing process yield of
6. The led backlight module structure for increasing process yield of
7. The led backlight module structure for increasing process yield of
8. The led backlight module structure for increasing process yield of
9. The led backlight module structure for increasing process yield of
10. The led backlight module structure for increasing process yield of
12. The led backlight module structure for increasing process yield of
13. The led backlight module structure for increasing process yield of
14. The led backlight module structure for increasing process yield of
a plurality of position limiting holes, for receiving and fixing the led chips; and
a plurality of avoiding recesses, being formed on the bottom of the inner wall of each position limiting hole pairwise.
15. The led backlight module structure for increasing process yield of
16. The led backlight module structure for increasing process yield of
17. The led backlight module structure for increasing process yield of
18. The led backlight module structure for increasing process yield of
19. The led backlight module structure for increasing process yield of
21. The led backlight module structure for increasing process yield of
22. The led backlight module structure for increasing process yield of
23. The led backlight module structure for increasing process yield of
24. The led backlight module structure for increasing process yield of
25. The led backlight module structure for increasing process yield of
26. The led backlight module structure for increasing process yield of
27. The led backlight module structure for increasing process yield of
28. The led backlight module structure for increasing process yield of
29. The led backlight module structure for increasing process yield of
31. The led backlight module structure for increasing process yield of
32. The led backlight module structure for increasing process yield of
33. The led backlight module structure for increasing process yield of
34. The led backlight module structure for increasing process yield of
35. The led backlight module structure for increasing process yield of
36. The led backlight module structure for increasing process yield of
37. The led backlight module structure for increasing process yield of
38. The led backlight module structure for increasing process yield of
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1. Technical Field
The present invention relates to a backlight module structure, and more particularly, to an LED backlight module structure for increasing process yield.
2. Description of Related Art
Light-emitting diodes (LEDs) are the widely used light-emitting devices. The LED has the advantages of small volume and lone lifetime, so that it is widely used in human life.
Recently, LEDs are also applied in backlight module. Please refer to
Referring to
The aforesaid LED backlight module 1′ is widely used in liquid crystal display, in addition, the pressing fixture 2′ levels all the LED chips 13′ on the copper circuit layer 12′ when the welding process is executed, such that the backlight quality of the LED backlight module 1′ is good. Even so, the LED backlight module 1′ still includes the drawbacks and the shortcomings as follows:
Accordingly, in view of the conventional LED backlight module still has shortcomings and drawbacks, the inventor of the present application has made great efforts to make inventive research thereon and eventually provided an LED backlight module structure for increasing process yield.
The first objective of the present invention is to provide an LED backlight module structure for increasing process yield, in which a plurality of solder paste overflow prevention members is disposed between the LED chips and the copper circuit layer, therefore, the solder paste overflow phenomenon can be prevented when using a pressing fixture to assist in executing the welding process of LED chips, and then it can make sure that the soldering pins of the LED chips would not electrically connect to each other due to the solder paste overflow phenomenon.
Accordingly, to achieve the first objective of the present invention, the inventor proposes an LED backlight module structure for increasing process yield, comprising:
a housing;
a copper circuit layer, disposed on the surface of a circuit-disposing portion of the housing through a thermally conductive insulating layer, wherein the copper circuit layer has at least one main circuit and a plurality of soldering point;
a plurality of LED chips, having a plurality of soldering pins and a light-emitting surface on the bottoms and the tops thereof, wherein the plurality of LED chips are disposed on the copper circuit layer, and the soldering pins being welded to the soldering points;
a plurality of solder paste overflow prevention members, disposed between the LED chips and the copper circuit layer;
a light guide plate, disposed in the housing, and a light-receiving surface of the light guide plate is opposite to the light-emitting surfaces of the LED chips; and
a bottom reflector, disposed on the bottom of the light guide plate for preventing light leakage.
The second objective of the present invention is to provide an LED backlight module structure for increasing process yield, in which a plurality of solder paste overflow prevention members is disposed between the LED chips and the copper circuit layer, moreover, the copper circuit layer and the solder paste overflow prevention members are disposed on the outer surface of the housing for meeting the demands from different structure design of LED backlight module.
So that, to achieve the second objective of the present invention, the inventor proposes an LED backlight module structure for increasing process yield, comprising:
a housing, having at least one circuit-disposing portion, and the circuit-disposing portion has a plurality of disposing holes;
a circuit substrate;
a copper circuit layer, disposed on the surface of the circuit substrate through a thermally conductive insulating layer, wherein the copper circuit layer has at least one main circuit and a plurality of soldering point;
a plurality of LED chips, having a plurality of soldering pins and a light-emitting surface on the bottoms and the tops thereof, wherein the plurality of LED chips are disposed on the copper circuit layer, and the soldering pins are welded to the soldering points; moreover, the circuit substrate is attached to the outer surface of the circuit-disposing portion via another thermally conductive insulating layer, such that the LED chips can respectively pass through the disposing holes and enter the interior of the housing from the outer surface of the circuit-disposing portion;
a plurality of solder paste overflow prevention members, disposed between the LED chips and the copper circuit layer;
a light guide plate, disposed in the housing, and a light-receiving surface of the light guide plate being opposite to the light-emitting surfaces of the LED chips; and
a bottom reflector, disposed on the bottom of the light guide plate for preventing light leakage.
The third objective of the present invention is to provide an LED backlight module structure for increasing process yield, in which a position limiting band is disposed on the copper circuit layer for receiving and fixing the LED chips, such that the position limiting band can assist the LED chips in heat dissipation when the LED chips emit light.
Thus, to achieve the third objective of the present invention, the inventor proposes an LED backlight module structure for increasing process yield, comprising:
a housing;
a copper circuit layer, disposed on the surface of a circuit-disposing portion of the housing through a thermally conductive insulating layer, wherein the copper circuit layer has at least one main circuit and a plurality of soldering point;
a plurality of LED chips, having a plurality of soldering pins and a light-emitting surface on the bottoms and the tops thereof, wherein the plurality of LED chips are disposed on the copper circuit layer, and the soldering pins are welded to the soldering points;
a position limiting band, disposed on the copper circuit layer via another thermally conductive insulating layer, wherein the another thermally conductive insulating layer has a plurality of openings for exposing the soldering points of the copper circuit layer, and the position limiting band comprises: a plurality of position limiting holes, for receiving and fixing the LED chips; and a plurality of avoiding recesses, formed on the bottom of the inner wall of each position limiting hole pairwise;
a light guide plate, disposed in the housing, and a light-receiving surface of the light guide plate is opposite to the light-emitting surfaces of the LED chips; and
a bottom reflector, disposed on the bottom of the light guide plate for preventing light leakage.
The fourth objective of the present invention is to provide an LED backlight module structure for increasing process yield, in which a position limiting band is disposed on the copper circuit layer for receiving and fixing the LED chips, moreover, the copper circuit layer and the position limiting band are disposed on the outer surface of the housing for meeting the demands from different structure design of LED backlight module
Therefore, to achieve the fourth objective of the present invention, the inventor proposes an LED backlight module structure for increasing process yield, comprising:
a housing, having at least one circuit-disposing portion, and the circuit-disposing portion has a plurality of disposing holes;
a circuit substrate;
a copper circuit layer, disposed on the surface of the circuit substrate through a thermally conductive insulating layer, wherein the copper circuit layer has at least one main circuit and a plurality of soldering point;
a plurality of LED chips, having a plurality of soldering pins and a light-emitting surface on the bottoms and the tops thereof, wherein the plurality of LED chips are disposed on the copper circuit layer, and the soldering pins are welded to the soldering points; moreover, the circuit substrate is attached to the outer surface of the circuit-disposing portion via another thermally conductive insulating layer, such that the LED chips can respectively pass through the disposing holes and enter the interior of the housing from the outer surface of the circuit-disposing portion;
a position limiting band, disposed on the copper circuit layer via another thermally conductive insulating layer, wherein the another thermally conductive insulating layer has a plurality of openings for exposing the soldering points of the copper circuit layer, and the position limiting band comprising:
a plurality of position limiting holes, for receiving and fixing the LED chips; and
a plurality of avoiding recesses, being formed on the bottom of the inner wall of each position limiting hole pairwise;
a light guide plate, disposed in the housing, and a light-receiving surface of the light guide plate is opposite to the light-emitting surfaces of the LED chips; and
a bottom reflector, disposed on the bottom of the light guide plate for preventing light leakage.
The invention as well as a preferred mode of use and advantages thereof will be best understood by referring to the following detailed description of an illustrative embodiment in conjunction with the accompanying drawings, wherein:
-shaped housing;
To more clearly describe an LED backlight module structure for increasing process yield according to the present invention, embodiments of the present invention will be described in detail with reference to the attached drawings hereinafter.
The LED backlight module structure for increasing process yield provided in the present invention includes many embodiments, please refer to
Continuously referring to
Referring to
Continuously referring to
The structure of aforesaid first embodiment is the simplest structure of the LED backlight module structure 1 for increasing process yield; However, for meeting the demands from different structure design of LED backlight module, it can also add some constituting elements or members into the simplest structure of the LED backlight module structure, such that the LED backlight module structure may performs more functionality.
Please refer to
Continuously refer to
Referring to
Furthermore, for the aforesaid first embodiment of the LED backlight module structure 1, it is able to increase the backlight efficiency thereof by being added a reflector. Please refer to
Please refer to -shaped housing. For the aforesaid first embodiment and second embodiment of the LED backlight module structure 1, the housing 11 can be a sheet metal housing; as shown in
-shaped housing. Besides, please refer to
The present invention further provides a third embodiment of the LED backlight module structure 1. Please refer to
In the third embodiment, the housing 11 includes a circuit-disposing portion 111, and the circuit-disposing portion 111 having a plurality of disposing holes 111. The copper circuit layer 12 is disposed on the surface of the circuit substrate 12S through a thermally conductive insulating layer 18, wherein the copper circuit layer 12 has at least one main circuit 121 and a plurality of soldering point 122 (the main circuit 121 and the soldering points 122 are not shown in
For aforesaid third embodiment, it is not limited to use the disposed the copper circuit layer 12 on the surface of the circuit substrate 12S. In the third embodiment, it can also directly attached the copper circuit layer 12 to the outer surface of the circuit-disposing portion 111 through the thermally conductive insulating layer 18, such that the LED chips 13 also respectively pass through the disposing holes 1111 and enter the interior of the housing 11 from the outer surface of the circuit-disposing portion 111. Thus, by this way, it can also finish the third embodiment of the LED backlight module structure without using the circuit substrate 12S and the another thermally conductive insulating layer 18a.
In addition, in the third embodiment, the plurality of solder paste overflow prevention members 17 are disposed between the LED chips 13 and the copper circuit layer 12, wherein each solder paste overflow prevention member 17 consists of a bar-shaped solder paste overflow prevention member and a block-shaped solder paste overflow prevention member, and the material of the solder paste overflow prevention member 17 can be heat-resistant adhesive tape, acrylic, silicone, and epoxy resin.
Similarly, for meeting the demands from different structure design of LED backlight module, it can also add some constituting elements or members into the third embodiment of the LED backlight module structure 1, such that the LED backlight module structure may performs more functionality. Please refer to
Referring to
Furthermore, similarly, for the aforesaid third embodiment and fourth embodiment of the LED backlight module structure 1, it is able to increase the backlight efficiency thereof by being added a reflector 14, wherein the diagram and structure are according to -shaped housing, but also be an extrusion housing.
The present invention further provides a fifth embodiment of the LED backlight module structure 1. Please refer to
The plurality of LED chips 13 are disposed on the copper circuit layer 12, and each LED chips 13 has a plurality of soldering pins and a light-emitting surface on the bottom and the top thereof, wherein the plurality of LED chips 13 are welded to the soldering points 122 by a solder 4. The position limiting band 19 is disposed on the copper circuit layer 12 via another thermally conductive insulating layer 18a, wherein the another thermally conductive insulating layer 18a has a plurality of openings 181a for exposing the soldering points 122 of the copper circuit layer 12. The position limiting band 19 includes: a plurality of position limiting holes 191, for receiving and fixing the LED chips 13, and a plurality of avoiding recesses 192, formed on the bottom of the inner wall of each position limiting hole 191 pairwise. In addition, for meeting the demands from different structure design of LED backlight module, it can also add some constituting elements or members into the fifth embodiment of the LED backlight module structure, such that the LED backlight module structure may performs more functionality. As shown in
Finally, the present invention further provides a sixth embodiment of the LED backlight module structure 1. Please refer to
In the sixth embodiment, the housing 11 includes a circuit-disposing portion 111, and the circuit-disposing portion 111 having a plurality of disposing holes 111. The copper circuit layer 12 is disposed on the surface of the circuit substrate 12S through a thermally conductive insulating layer 18, wherein the copper circuit layer 12 has at least one main circuit 121 and a plurality of soldering point 122 (the main circuit 121 and the soldering points 122 are not shown in
Differing from the fifth embodiment, in the sixth embodiment, the circuit substrate 12S is attached to the outer surface of the circuit-disposing portion 111 via another thermally conductive insulating layer 18a, such that the LED chips 13 can respectively pass through the disposing holes 1111 and enter the interior of the housing llfrom the outer surface of the circuit-disposing portion 111. Besides, the position limiting band 19 includes: a plurality of position limiting holes 191, for receiving and fixing the LED chips 13, and a plurality of avoiding recesses 192, formed on the bottom of the inner wall of each position limiting hole 191 pairwise. Moreover, For aforesaid sixth embodiment, it is not limited to use the disposed the copper circuit layer 12 on the surface of the circuit substrate 12S. In the sixth embodiment, it can also directly attached the copper circuit layer 12 to the outer surface of the circuit-disposing portion 111 through the thermally conductive insulating layer 18, such that the LED chips 13 also respectively pass through the disposing holes 1111 and enter the interior of the housing 11 from the outer surface of the circuit-disposing portion 111. Thus, by this way, it can also finish the third embodiment of the LED backlight module structure without using the circuit substrate 12S and the another thermally conductive insulating layer 18a.
Similarly, for meeting the demands from different structure design of LED backlight module, it can also add some constituting elements or members into the fifth embodiment of the LED backlight module structure, such that the LED backlight module structure may performs more functionality. As shown in
Therefore, the above descriptions have been clearly and completely introduced all of the embodiments of the LED backlight module structure for increasing process yield; in summary, the present invention has the following advantages:
The above description is made on embodiments of the present invention. However, the embodiments are not intended to limit scope of the present invention, and all equivalent implementations or alterations within the spirit of the present invention still fall within the scope of the present invention.
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