A voltage reducing circuit includes an internal power supply section configured to reduce an external power supply voltage supplied from an external power supply to an internal power supply voltage which is lower than the external power supply voltage based on a reference voltage. A first current control section is configured to control a current flowing through the internal power supply section when the internal power supply voltage is lower than a setting voltage. A second current control section is configured to control the current flowing through the internal power supply section when the internal power supply voltage exceeds the setting voltage.
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1. A voltage reducing circuit comprising:
a reducing circuit, comprising a differential circuit and a voltage supplying circuit, receiving a first voltage and generating a second voltage from the first voltage based on a reference voltage, wherein the second voltage is lower than the first voltage;
a first current control circuit having a control switch which has a control node receiving as a control input the second voltage, and applying a first current to the differential circuit based on the second voltage; and
a second current control circuit receiving the second voltage, and applying a second current to the differential circuit based on the second voltage,
wherein the differential circuit receives the first and second currents and outputs an output voltage based on the reference voltage, and
wherein the voltage supplying circuit generates the second voltage from the first voltage based on the output voltage.
5. A voltage reducing circuit comprising:
a reducing circuit receiving a first voltage, generating a second voltage from the first voltage based on a reference voltage, wherein the second voltage is lower than the first voltage;
a first current control circuit having a control switch which has a control node reflected the second voltage, and applying a first current to the reducing circuit based on the second voltage; and
a second current control circuit receiving the second voltage, and applying a second current to the reducing circuit based on the second voltage,
wherein the first current control circuit further comprises a first current mirror and a second switch,
wherein the first current mirror includes first and second transistors, and
wherein the second switch responds to the second voltage and is coupled between a third voltage and both of control terminals of the first and second transistors, and the third voltage is lower than the second voltage.
2. The voltage reducing circuit according to
3. The voltage reducing circuit according to
4. The voltage reducing circuit according to
wherein the first current mirror includes first and second transistors, and
wherein the second switch responds to the second voltage and is coupled between a third voltage and both of control terminals of the first and second transistors, and the third voltage is lower than the second voltage.
6. The voltage reducing circuit according to
7. The voltage reducing circuit according to
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Japan Priority Application 2009-197541, filed Aug. 28, 2009 including the specification, drawings, claims and abstract, is incorporated herein by reference in its entirety. This application is a Divisional of U.S. application Ser. No. 12/893,033, filed Jul. 19, 2010, incorporated herein by reference in its entirety.
The present invention relates to a semiconductor device and more specifically to a voltage reducing circuit that reduces a voltage supplied from outside and supplies it to an internal circuit of a semiconductor device as an internal power supply voltage.
In a semiconductor device, cost reduction is achieved by increasing integration and reducing a chip size. For this purpose, miniaturization of a memory element and a transistor in the semiconductor device has been preceded.
With the miniaturization of the memory element and the transistor, a power supply voltage applied to the semiconductor device also needs to be lowered from the view of reliability. On the other hand, in order to maintain compatibility with existing products as product specifications of the semiconductor device, the power supply voltage supplied to the semiconductor device may be maintained to the same voltage as that in the existing products. For example, when the power supply voltage of 1.8V is externally supplied and an internal power supply voltage in the semiconductor device is 1.5V, the external power supply voltage of 1.8V needs to be reduced to the internal supply voltage of 1.5V.
The conventional voltage reducing circuit includes an internal power supply section 20 and a current control section 110. The internal power supply section 20 includes a differential circuit section 21 and a voltage supplying section 22. The differential circuit section 21 includes P-type MOSFET (which will be referred to as a “PMOS transistor,” hereinafter) MP12 and MP13 and N-type MOSFET (which will be referred to as “NMOS transistors,” hereinafter) MN12 and MN13.
The PMOS transistor MP12 has a source connected with a first external power supply voltage VDD and a drain connected with a first node N1. The PMOS transistor MP13 has a source connected with the first external power supply voltage VDD, a gate connected with a gate of the PMOS transistor MP12 and a drain. The NMOS transistor MN12 has a drain connected with the first node N1, a source connected with a second node N2, and a gate to which the reference voltage VREF is supplied so as to set an internal power supply voltage VDL. The NMOS transistor MN13 has a drain connected with a drain of the PMOS transistor MP13, a source connected with the second node N2, and a gate connected with a fourth node N4. The first node N1 is used as an output of the differential circuit section 21, and an output voltage VPG is outputted from the first node N1.
The voltage supplying section 22 includes a PMOS transistor MP14 and resistance elements R12 and R13. The PMOS transistor MP14 has a source connected with the first external power supply voltage VDD, a drain connected with a third node N3, and a gate connected with the first node N1, and supplied with the output voltage VPG from the differential circuit section 21. The resistance element R12 is connected between the third node N3 and the fourth node N4. The resistance element R13 is connected between the fourth node N4 and a second external power supply voltage (ground voltage) GND. The third node N3 is used as the output of the voltage supplying section 22, and the internal power supply voltage VDL is outputted from the third node N3.
When the voltage supplying section 22 does not include the resistance elements R12 and R13, the third node N3 is connected to the gate of the NMOS transistor MN13 in place of the fourth node N4.
The current control section 110 includes a PMOS transistor MP11, a resistance element R11, and NMOS transistors MN11 and MN14. The PMOS transistor MP has a source connected with the first external power supply voltage VDD and a gate connected with the second power supply voltage GND. The NMOS transistor MN11 has a source connected with the second power supply voltage GND. The resistance element R11 is connected between a drain of the PMOS transistor MP11 and a drain of the NMOS transistor MN11. The NMOS transistor MN14 is a constant current source and has a drain connected with the second node N2 of the differential circuit section 21, a source connected with the second power supply voltage GND, and a gate connected with a gate and the drain of the NMOS transistor MN11.
Next, an operation of the conventional voltage reducing circuit will be described.
The internal power supply voltage VDL can be set based on the reference voltage VREF and a division voltage VMON. The reference voltage VREF serves as an input of the differential circuit section 21, and is supplied to the gate of the NMOS transistor MN12 of the differential circuit section 21 as described above. The division voltage VMON is a voltage supplied from the fourth node N4 when the internal power supply voltage VDL is divided by use of the resistance elements R12 and R13. That is, the division voltage VMON is supplied to the gate of the NMOS transistor MN13 of the differential circuit section 21. In this case, the division voltage VMON is expressed as follows:
VMON=VDL×R13/(R12+R13)
In the differential circuit section 21, the division voltage VMON is made stable in the same voltage as the reference voltage VREF, and thus relation between the reference voltage VREF and the division voltage VMON is expressed as:
VREF=VMON=VDL×R13/(R12+R13).
Developing this, the internal power supply voltage VDL is expressed as:
VDL=VREF×(R12+R13)/R13.
When the external power supply voltage VDD is 1.8V and the internal power supply voltage VDL is 1.5V, it could be understood from the above equation that it is sufficient that the reference voltage VREF is set to be 0.75V and resistance values of the resistance elements R12 and R13 are equal to each other.
A configuration could be considered that the resistance elements R12 and R13 are not arranged and the internal power supply voltage VDL is directly connected to the gate of the NMOS transistor MN 13. In such a case, VREF=VDL.
When the reference voltage VREF is set to be 0.75V after the external power supply voltage VDD is supplied, a current flows through a path from the power supply voltage VDD to the PMOS transistor MP11, the resistance element R11 and the NMOS transistor MN11 in the current control section 110, and a voltage VNG supplied to a gate of the NMOS transistor MN11 increases. As a result, the NMOS transistor MN14 is turned on so that the differential circuit section 21 is activated, which increases the internal power supply voltage VDL from the power supply voltage GND.
At this time, the division voltage VMON also increases with the increase in the internal power supply voltage VDL. When the internal power supply voltage VDL has increased to 1.5V, the division voltage VMON is set to be 0.75V, in which case the reference voltage VREF is equal to the division voltage VMON, so that the internal power supply voltage VDL is consequently controlled at 1.5V.
The conventional voltage reducing circuit controls the internal power supply voltage VDL by referring to the reference voltage VREF, and has an advantage that even when the external power supply voltage VDD changes, for example, even when the external power supply voltage VDD changes to 1.6V or 2.0V while a standard state of the external power supply voltage VDD is 1.8V, the internal power supply voltage VDL can be kept at 1.5V, thereby achieving a stable operation of the internal circuit 203.
In the conventional voltage reducing circuit, a current flowing through the differential circuit section 21 is controlled by the current control section 110. Thus, the response characteristic varies depending on an amount of the current flowing through the differential circuit section 21, and the influence is exerted on stability of the internal power supply voltage VDL. Moreover, a current consumption amount of the differential circuit section 21 also consequently varies. Therefore, it is preferable that a characteristic of the current control section 110 does not change.
However, since the current control section 110 in the conventional voltage reducing circuit includes the PMOS transistor MP11, the resistance element R11 and the NMOS transistor MN11 which are connected in series between the first external power supply voltage VDD and the second external power supply voltage GND, the change in the external power supply voltage VDD raises a problem that a current value controlled by the current control section 110 varies.
If a resistance value of the resistance element R11 of the current control section 110 is 10 KΩ, a voltage-current characteristic of the resistance element R11 are expressed by IR16V (VDD=1.6V), IR18V (VDD=1.8V), and IR20V (VDD=2.0V), which are respectively indicated by straight lines.
Moreover, if the horizontal axis shows a voltage of the drain and the gate of the NMOS transistor MN11, a current characteristic of the NMOS transistor MN11 is expressed by IMN 11, which is indicated by a curved line.
In this case, an actual value of the current flowing through the current control section 110 is determined by use of intersection points of the characteristics IR16, IR18, and IR20 of the resistance element R11 and the characteristic IMN11 of the NMOS transistor MN11. In this example, a current value of the current control section 110 varies from 75 μA, to 105 μA with the external power supply voltage VDD varied in a range from 1.6V to 2.0V, which adversely influences a stable operation of the voltage reducing circuit.
Considering such a change in the current control section 110 due to the change in the external power supply voltage VDD, countermeasures are taken at a design stage by setting the current flowing through the current control section 110 to a larger current to ensure responsibility of the differential circuit section 21. However, a current consumption amount of the voltage reducing circuit increases.
In an aspect of the present invention, a voltage reducing circuit includes: an internal power supply section configured to reduce an external power supply voltage supplied from an external power supply to an internal power supply voltage which is lower than the external power supply voltage based on a reference voltage. A first current control section is configured to control a current flowing through the internal power supply section when the internal power supply voltage is lower than a setting voltage. A second current control section is configured to control the current flowing through the internal power supply section when the internal power supply voltage exceeds the setting voltage.
In another aspect of the present invention, a semiconductor device includes: an internal circuit; and the voltage reducing circuit described above.
In the voltage reducing circuit of the present invention, by the above configuration, the current flowing through the differential circuit section 21 is controlled to be a constant current value without receiving any influence of the change in the external power supply voltage VDD. That is, the configuration can ensure the stable operation.
In the voltage reducing circuit of the present invention, also the above configuration does not require a design considering the change in the external power supply voltage VDD, unlike the conventional voltage reducing circuit, and thus also does not require setting the current consumption amount of the voltage reducing circuit to be larger, thereby contributing to reducing the current consumption amount.
The above and other objects, advantages and features of the present invention will be more apparent from the following description of certain embodiments taken in conjunction with the accompanying drawings, in which:
Hereinafter, a voltage reducing circuit according to the present invention will be described in detail with reference to the attached drawings.
The voltage reducing circuit according to the first embodiment of the present invention includes a first current control section 10, a second current control section 11, and an internal power supply section 20. The first current control section 10 includes a first P-channel MOSFET (to be referred to as a “PMOS transistor,” hereinafter) MP11, first and second N-channel MOSFETs (to be referred to as “NMOS transistors” hereinafter) MN11 and MN14, and a first resistance element R11. The second control section 11 includes third and fourth NMOS transistors MN16 and MN15 and a second resistance element R14.
The internal power supply section 20 includes a differential circuit section 21 and a voltage supplying section 22. The differential circuit section 21 includes second and third PMOS transistors MP12 and MP13 and fifth and sixth NMOS transistors MN12 and MN13. The voltage supplying section 22 includes a fourth PMOS transistor MP14 and third and fourth resistance elements R12 and R13.
Components and connection of the differential circuit section 21 and the voltage supplying section 22 are the same as those of the differential circuit section 21 and the voltage supplying section 22 in the conventional voltage reducing circuit. That is, the differential circuit section 21 includes PMOS transistors MP12 and MP13 and NMOS transistors MN12 and MN13.
The PMOS transistor MP12 has a source connected with a first external power supply voltage VDD and a drain connected with a first node N1. The PMOS transistor MP13 has a source connected with the first external power supply voltage VDD, a gate connected with a gate of the PMOS transistor MP12 and a drain. The NMOS transistor MN12 has a drain connected with the first node N1, a source connected with a second node N2, and a gate to which the reference voltage VREF is supplied so as to set an internal power supply voltage VDL. The NMOS transistor MN13 has a drain connected with a drain of the PMOS transistor MP13, a source connected with the second node N2, and a gate connected with a fourth node N4. The first node N1 is used as an output of the differential circuit section 21, and an output voltage VPG is outputted from the first node N1.
The voltage supplying section 22 includes a PMOS transistor MP14 and resistance elements R12 and R13. The PMOS transistor MP14 has a source connected with the first external power supply voltage VDD, a drain connected with a third node N3, and a gate connected with the first node N1, and supplied with the output voltage VPG from the differential circuit section 21. The resistance element R12 is connected between the third node N3 and the fourth node N4. The resistance element R13 is connected between the fourth node N4 and a second external power supply voltage (ground voltage) GND. The third node N3 is used as the output of the voltage supplying section 22, and the internal power supply voltage VDL is outputted from the third node N3.
When the voltage supplying section 22 does not include the resistance elements R12 and R13, the third node N3 is connected to the gate of the NMOS transistor MN13 in place of the fourth node N4.
In the first current control section 10, the PMOS transistor MPH has a source connected with a first external power supply voltage VDD and a gate connected with an output of the voltage supplying section 22 (third node N3), and supplied with an internal power supply voltage VDL from the voltage supplying section 22. The NMOS transistor MN 11 has a source connected with a second external power supply voltage GND. The resistance element R11 is connected between a drain of the transistor MP11 and a drain of the NMOS transistor MN11. The NMOS transistor MN14 functions as a first constant current source, and has a drain connected with a second node N2 of the differential circuit section 21, a source connected with the second external power supply voltage GND, and a gate connected with a gate and the drain of the NMOS transistor MN11. That is, in the first current control section 10, the internal power supply voltage VDL is supplied to the gate of the PMOS transistor MP11, unlike the conventional current control section 110.
The second current control section 11 is newly added to the conventional voltage reducing circuit and has the internal power supply voltage VDL as its power supply voltage.
In the second current control section 11, the NMOS transistor MN16 has a source connected with the second external power supply voltage GND. The resistance element R14 is connected between the output (third node N3) of the voltage supplying section 22 and a drain of the NMOS transistor MN16, and is supplied with the internal power supply voltage VDL from the voltage supplying section 22. The NMOS transistor MN15 is a second constant current source, and has a drain connected with the second node N2 of the differential circuit section 21, a source connected with the second external power supply voltage GND, and a gate connected with a gate and the drain of the NMOS transistor MN16.
Next, an operation of the voltage reducing circuit according to the first embodiment of the present invention will be described.
When the reference voltage VREF is set to be 0.75V after an external power supply voltage VDD is supplied, a current flows through a path from the external power supply voltage VDD to the PMOS transistor MP11, the resistance elements R11, and the NMOS transistor MN11, and the voltage VNG supplied to the gate of the NMOS transistor MN11 increases in the first control section 10. As a result, the NMOS transistor MN14 is turned on, to activate the differential circuit section 21, which increases the internal power supply voltage VDL through the PMOS transistor MP14 from the external power supply voltage VDD.
Then, when the internal power supply voltage VDL has increased so as to be higher than a threshold value (for example, 0.4V) of the NMOS transistor MN16 of the second current control section 11, the NMOS transistor MN16 transits to a conductive state so that the current starts to flow through the second current control section 11. At this time, a voltage VNG2 supplied to the gate of the NMOS transistor MN15 increases (time T1).
When the internal power supply voltage VDL further has increased, the voltage at the gate of the PMOS transistor MP11 of the first current control section 10 increases, and impedance of the PMOS transistor MP11 increases, so that the current flowing through the first current control section 10 starts to decrease (time T2).
Then, when the internal power supply voltage VDL increases and has exceeded the set voltage (1.4V) while the external power supply voltage VDD is 1.8V (the threshold voltage of the PMOS transistor MP11 is −0.4V and a setting voltage is 1.4V), a voltage difference between the gate and the source in the PMOS transistor MP11 becomes less than the threshold voltage, so that the PMOS transistor MP11 is turned off and the NMOS transistor MN14 of the first current control section 10 is also turned off. Thus, no current flows through the first current control section 10(time T3).
On the other hand, in the second current control section 11, when the current increases with the increase in the internal power supply voltage VDL, and the internal power supply voltage VDL increases to the control level of 1.5V, a desired constant current consequently flows (time T4).
As described above, in the voltage reducing circuit according to the first embodiment of the present invention, the differential circuit section 21 of the internal power supply section 20 outputs an output voltage VPG based on the reference voltage VREF, and the voltage supplying section 22 reduces the voltage from the external power supply voltage VDD to the internal power supply voltage VDL in accordance with the output voltage VPG. The first current control section 10 controls a current flowing through the differential circuit section 21 when the internal power supply voltage VDL is equal to or lower than the setting voltage, and stops the control of the current flowing through the differential circuit section 21 when the internal power supply voltage VDL exceeds the setting voltage. On the other hand, the second current control section 11 has the internal power supply voltage VDL as its power supply, and controls the current flowing through the differential circuit section 21 when the internal power supply voltage VDL exceeds the setting voltage.
Therefore, in the voltage reducing circuit according to the first embodiment of the present invention, the current flowing through the differential circuit section 21 is controlled to be a constant current value without any influence from a change in the external power supply voltage VDD. That is, the configuration can ensure stable operation.
Moreover, in the voltage reducing circuit according to the first embodiment of the present invention, the design in consideration of the change in the external power supply voltage VDD is not required, and thus also a current consumption amount of the voltage reducing circuit needs not to be set larger, thereby contributing to reducing the current consumption amount.
The first current control section 10 further includes an NMOS transistor MN17. The NMOS transistor MN17 has a drain connected with a drain of the NMOS transistor MN11, a source connected with a second external power supply voltage GND, and a gate connected with a drain of the NMOS transistor MN16 of the second current control section 11.
Here, the NMOS transistor MN17 is provided in the first current control section 10, but may be provided in the second current control section 11 if the same connection relation applies.
Next, an operation of the voltage reducing circuit according to the second embodiment of the present invention will be described.
The operation up to time T1 is the same as that of the first embodiment.
After the time T1, a current starts to flow through the second current control section 11, and the NMOS transistor MN17 of the first current control section 10 is turned on, which decreases the voltage VNG supplied to a gate of the NMOS transistor MN11, so that a current flowing through the first current control section 10 starts to decrease at the time T1.
Then, when the voltage VNG has decreased to a threshold value (for example, 0.4V) of the NMOS transistor MN14 by the NMOS transistor MN17, the NMOS transistor MN14 is turned off, which no longer contributes to control of the current flowing through the differential circuit section 21 (time T3).
On the other hand, in the second current control section 11, when the current increases with an increase in the internal power supply voltage VDL, and the internal power supply voltage VDL has increased to the control level of 1.5V, a desired constant current flows (time T4).
As described above, in the voltage reducing circuit according to the second embodiment of the present invention, by providing the NMOS transistor MN17 in the first current control section 10 or the second current control section 11, a current value of the first current control section 10 is decreased in response to the current flowing through the second current control section 11.
Therefore, with the voltage reducing circuit according to the second embodiment of the present invention, an overall current value in a period during which the first current control section 10 and the second current control section 11 are simultaneously activated, that is, a current value as an intersection point of the current characteristic IMN14 and the current characteristic IMN15 is not more than that of the first embodiment, so that the current control on the differential circuit section 21 can be smoothly transferred from the first current control section 10 to the second current control section 11.
Although the present invention has been described above in connection with several embodiments thereof, it would be apparent to those skilled in the art that those embodiments are provided solely for illustrating the present invention, and should not be relied upon to construe the appended claims in a limiting sense.
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