A heat recycling system for recycling heat from an electronic device includes a pipe with an inside tube and an outside tube coiled around the inside tube. The inside tube is connected to a first airduct to receive heated air from the electronic device. The outside tube is to receive cooling air from outside. A number of thermoelectric modules are formed in walls of the inside tube. A first end of each thermoelectric module is inserted into the outside tube, and a second end of each thermoelectric module is inserted into the inside tube. Therefore, the number of thermoelectric modules may generate current.

Patent
   8704077
Priority
Jul 15 2009
Filed
Aug 28 2009
Issued
Apr 22 2014
Expiry
Dec 25 2032
Extension
1215 days
Assg.orig
Entity
Large
0
39
EXPIRED
1. A heat recycling system for recycling heat from an electronic device, the heat recycling system comprising:
a first airduct connected to the electronic device to receive heated air from the electronic device; and
a pipe comprising an inside tube, and an outside tube coiled around the inside tube, wherein the inside tube is connected to the first airduct to receive the heated air with an inner space, a space between the outside tube and the inside tube is used to receive cooling air from outside, a plurality of thermoelectric modules are embedded in walls of the inside tube, a first end of each thermoelectric module is inserted into the space between the outside tube and the inside tube, and a second end of each thermoelectric module is inserted into the inner space of the inside tube.
2. The heat recycling system of claim 1, further comprising a storage apparatus to store electric charge, wherein the plurality of thermoelectric modules are connected in series, with the first one and the last one of the thermoelectric modules respectively connected to two opposite ends of the storage apparatus.
3. The heat recycling system of claim 2, wherein the storage apparatus is a capacitor.
4. The heat recycling system of claim 2, further comprising a power circuit connected to the storage apparatus.
5. The heat recycling system of claim 1, wherein the outside tube comprises an air inlet, the cooling air from outside enters into the space between the outside tube and the inside tube through the air inlet.
6. The heat recycling system of claim 1, further comprising an air controller, wherein the air controller comprises a temperature sensor, an air inlet, and a first air outlet, wherein the outside tube of the pipe comprises a second air outlet, the air inlet of the air controller is connected to the second air outlet of the outside tube, the temperature sensor senses temperature of airflow in the air controller to open or close the first air outlet of the air controller correspondingly.
7. The heat recycling system of claim 6, further comprising a second airduct, wherein the air controller further comprises a third air outlet, a first end of the second airduct is connected to the third air outlet of the air controller, a second end of the second airduct is connected to the electronic device; wherein upon the condition that the temperature of the airflow in the air controller is greater than a predetermined value, the air controller opens the first air outlet to allow the airflow to enter the open space, upon the condition that the temperature of the airflow in the air controller is less than the predetermined value, the air controller opens the third air outlet to allow the airflow to enter into the second airduct.
8. The heat recycling system of claim 1, further comprising an air controller, wherein the air controller comprises a temperature sensor, an air inlet, and a first air outlet, wherein the inside tube comprises a second air outlet, the air inlet of the air controller is connected to the second air outlet of the inside tube, the temperature sensor senses temperature of airflow in the air controller to open or close the first air outlet of the air controller correspondingly.
9. The heat recycling system of claim 8, further comprising a second airduct, wherein the air controller further comprises a third air outlet, a first end of the second airduct is connected to the third air outlet of the air controller, a second end of the second airduct is connected to the electronic device; wherein upon the condition that the temperature of the airflow in the air controller is greater than a predetermined value, the air controller opens the first air outlet to allow the airflow to enter the open space, upon the condition that the temperature of the airflow in the air controller is less than the predetermined value, the air controller opens the third air outlet to allow the airflow to enter into the second airduct.

1. Technical Field

The present disclosure relates to a heat recycling system.

2. Description of Related Art

With advances in electronic technology, modern computer components and other electronic components can operate at high speeds and frequencies, and these electronic components typically generate large amount of heat. There are numerous kinds of heat-dissipating devices used to cool the electronic components. However, all the heat-dissipating devices only focus on how to dissipate heat from the electronic components, without adequately considering how to recycle the generated heat to save energy and preserve the environment.

FIG. 1 is a schematic diagram of an exemplary embodiment of a heat recycling system, the heat recycling system includes a pipe.

FIG. 2 is a sectional view of the pipe in FIG. 1.

Referring to FIG. 1, an exemplary embodiment of a heat recycling system 1 to recycle heat generated by an electronic device 10 includes a first airduct 20, a pipe 30, a second airduct 40, a first air controller 50, a second air controller 60, and a storage apparatus, such as a capacitor 70, for storing electric charge.

The electronic device 10 includes a heat channel 11 and a power circuit 13. The heat channel 11 dissipates heat generated by the electronic device 10 to the surrounding air. The heat channel 11 includes a first air inlet 11a, a first air outlet 11b, and a second air inlet 11c. It can be understood that the heat channel 11 is typical of heat channels used in computer systems. The power circuit 13 provides power to the electronic device 10.

A first end of the first airduct 20 is connected to the first air outlet 11b of the heat channel 11.

Referring to FIG. 2, the pipe 30 includes an inside tube 31 and an outside tube 32 coiled around the inside tube 31. A first end of the inside tube 31 is connected to a second end of the first airduct 20. The outside tube 32 defines a third air inlet 33 and a second air outlet 34.

The outside tube 32 directs airflow. A plurality of thermoelectric modules 37 are radially embedded in walls of the inside tube 31. A first end of each thermoelectric module 37 is inserted into a space between the outside tube 32 and the inside tube 31. A second end of each thermoelectric module 37 is inserted into an inner space of the inside tube 31. The plurality of thermoelectric modules 37 are connected in series. One thermoelectric module 37, which is located at the head, and another thermoelectric module 37, which is located at the end, are connected to opposite ends of the capacitor 70, respectively.

Each thermoelectric module 37 converts a temperature difference between opposite ends of the thermoelectric module 37 into a current passing through the thermoelectric module 37.

The first air controller 50 includes a fourth air inlet 51, a first temperature sensor 52, a third air outlets 53, and a fourth air outlet 54. The fourth air inlet 51 is connected to the second air outlet 34 of the outside tube 32 of the pipe 30.

The second air controller 60 includes a fifth air inlet 61, a second temperature sensor 62, a fifth air outlet 63, and a sixth air outlet 64. The fifth air inlet 61 is connected to a second end of the inside tube 31.

Two air inlets 42 and 44 are defined at a first end of the second airduct 40. The air inlet 42 is connected to the fourth air outlet 54 of the first air controller 50. The air inlet 44 is connected to the sixth air outlet 64 of the second air controller 60. A second end of the second airduct 40 is connected to the first air inlet 11a of the heat channel 11 of the electronic device 10.

In use, outside air enters into the heat channel 11 through the second air inlet 11c, to cool the electronic device 10. Air heated by the electronic device 10 from the first air outlet 11b of the heat channel 11 passes through the first airduct 20, and enters into the inside tube 31 of the pipe 30. Cooling air from outside enters into the outside tube 32 of the pipe 30 through the third air inlet 33. Therefore, the first end of each thermoelectric module 37 contacts the cooling air from outside, and the second end of each thermoelectric module 37 contacts the heated air. A temperature difference develops between the first end and the second end of each thermoelectric module 37. As a result, current is generated in each thermoelectric module 37.

The capacitor 70 is also connected to the power circuit 13 of the electronic device 10, to provide power to the electronic device 10.

Because of heat exchange between the inside tube 31 and the outside tube 32 via the plurality of thermoelectric modules 37, the temperature of airflow at the second air outlet 34 of the pipe 30 is greater than the temperature of the cooling air from outside at the third air inlet 33 of the pipe 30, and the temperature of airflow at the second end of the inside tube 31 is less than the heated air in the first airduct 20.

The first temperature sensor 52 of the first air controller 50 senses the airflow from the second air outlet 34 of the outside tube 32 of the pipe 30. Upon the condition that the temperature of the airflow from the second air outlet 34 is less than a first predetermined value, the first air controller 50 opens the fourth air outlet 54 to let the airflow pass through the second airduct 40 and enter into the electronic device 10. Upon the condition that the temperature of the airflow from the second air outlet 34 is greater than the first predetermined value, the first air controller 50 opens the third air outlet 53 to let the airflow conduct to the outside. It can be understood that the temperature of the airflow from the second air outlet 34 being less than the first predetermined value means the temperature of the airflow is low enough to cool the electronic device 10, and when the temperature of the airflow is greater than the first predetermined value, the airflow cannot cool the electronic device 10.

The second temperature sensor 62 of the second air controller 60 senses the airflow from the inside tube 31. Upon the condition that the temperature of the airflow from the inside tube 31 is less than a second predetermined value, the second air controller 60 opens the sixth air outlet 64 to let the airflow pass through the second airduct 40 and enter into the electronic device 10. Upon the condition that the temperature of the airflow from the inside tube 31 is greater than the second predetermined value, the second air controller 60 opens the fifth air outlet 63 to let the airflow conduct to outside. It can be understood that when the temperature of the airflow from the inside tube 31 is less than the second predetermined value, the airflow is cool enough to cool the electronic device 10, and when the temperature of the airflow from the inside tube 31 is greater than the second predetermined value, the airflow cannot cool the electronic device 10.

In other embodiments, the heated air from the first air outlet 11b may pass through the first airduct 20, and enter into the outside tube 32. Cooling air from Outside may enter into the inside tube 31. Therefore, a temperature difference develops between the first end and the second end of each thermoelectric module 37.

The foregoing description of the exemplary embodiments of the disclosure has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above everything. The embodiments were chosen and described in order to explain the principles of the disclosure and their practical application so as to enable others of ordinary skill in the art to utilize the disclosure and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those of ordinary skills in the art to which the present disclosure pertains without departing from its spirit and scope. Accordingly, the scope of the present disclosure is defined by the appended claims rather than the foregoing description and the exemplary embodiments described therein.

Jian, Zh-Wei

Patent Priority Assignee Title
Patent Priority Assignee Title
2919553,
2959925,
2996889,
3054840,
3097027,
3127749,
3269872,
3400452,
3648470,
3833428,
3900603,
3945855, Nov 24 1965 Teledyne, Inc. Thermoelectric device including an alloy of GeTe and AgSbTe as the P-type element
4011104, Oct 05 1973 Hughes Aircraft Company Thermoelectric system
4092140, Sep 08 1976 PPG Industries, Inc. Apparatus and method using heat pipes for manipulating temperature gradients in a glass forming chamber
4095998, Sep 30 1976 The United States of America as represented by the Secretary of the Army Thermoelectric voltage generator
4125122, Aug 11 1975 Direct energy conversion device
4249121, Jul 28 1977 Thermoelectric arrangement
4312402, Sep 19 1979 Hughes Electronics Corporation Osmotically pumped environmental control device
4463214, Mar 16 1982 Atlantic Richfield Company Thermoelectric generator apparatus and operation method
4497973, Feb 28 1983 ENERGY CONVERSION DEVICES, INC Thermoelectric device exhibiting decreased stress
4520305, Aug 17 1983 Thermoelectric generating system
4566961, Mar 02 1983 BRITISH PETROLEUM COMPANY P L C THE, BRITIANNIC HOUSE, MOOR LANE, LONDON, EC2Y 9BU, ENGLAND Electric arc conversion process
4677416, Nov 22 1984 YAMATAKE HONEYWELL, A CORP OF JAPAN Humidity sensing apparatus
4802929, Dec 19 1986 CITICORP NORTH AMERICA, INC Compliant thermoelectric converter
5228923, Dec 13 1991 Medtronic Cryocath LP Cylindrical thermoelectric cells
5286304, Oct 24 1991 Enerdyne Corporation Thermoelectric device and method of manufacturing
5505835, Feb 22 1993 MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD Method for fabricating optical information storage medium
6046398, Nov 04 1998 The United States of America as represented by the Administrator of the Micromachined thermoelectric sensors and arrays and process for producing
6096964, Nov 13 1998 Hi-Z Technology, Inc. Quantum well thermoelectric material on thin flexible substrate
6207887, Jul 07 1999 Hi-2 Technology, Inc. Miniature milliwatt electric power generator
6215580, Nov 26 1997 NEC Corporation Wavelength converter for generating optical harmonics of incident laser light at high efficiency and method for varying wavelength of incident laser light
6637210, Feb 09 2001 Gentherm Incorporated Thermoelectric transient cooling and heating systems
6700052, Nov 05 2001 Gentherm Incorporated Flexible thermoelectric circuit
7777126, Dec 28 2007 Industrial Technology Research Institute Thermoelectric device with thin film elements, apparatus and stacks having the same
20020148236,
20040094192,
20070193617,
CN101325386,
CN1946927,
//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 18 2009JIAN, ZH-WEI HON HAI PRECISION INDUSTRY CO , LTD ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0231590689 pdf
Aug 28 2009Hon Hai Precision Industry Co., Ltd.(assignment on the face of the patent)
Date Maintenance Fee Events
Dec 04 2017REM: Maintenance Fee Reminder Mailed.
May 21 2018EXP: Patent Expired for Failure to Pay Maintenance Fees.


Date Maintenance Schedule
Apr 22 20174 years fee payment window open
Oct 22 20176 months grace period start (w surcharge)
Apr 22 2018patent expiry (for year 4)
Apr 22 20202 years to revive unintentionally abandoned end. (for year 4)
Apr 22 20218 years fee payment window open
Oct 22 20216 months grace period start (w surcharge)
Apr 22 2022patent expiry (for year 8)
Apr 22 20242 years to revive unintentionally abandoned end. (for year 8)
Apr 22 202512 years fee payment window open
Oct 22 20256 months grace period start (w surcharge)
Apr 22 2026patent expiry (for year 12)
Apr 22 20282 years to revive unintentionally abandoned end. (for year 12)