A micro grid apparatus and associated method of formation. Multiple tiers are formed. The tiers are distributed and sequenced in a vertical direction such that each tier is at a different vertical level in the vertical direction. Each tier includes a multiplicity of complex shapes interconnected by bridge modules. Each complex shape is a physical structure having an exterior boundary. Each complex shape includes multiple docking bays such that each docking bay is configured to have a module latched therein.
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1. A micro grid apparatus for use in a mainframe system or server system, comprising:
a plurality of tiers,
said tiers being distributed and sequenced in a vertical direction such that each tier is at a different vertical level in the vertical direction,
each tier comprising a multiplicity of complex shapes interconnected by a plurality of bridge modules,
said bridge modules including internal data buses for data transfer and electrical connection between the complex shapes and modules within the complex shapes;
each complex shape of the multiplicity of complex shapes being a physical structure having an exterior boundary,
each complex shape of the multiplicity of complex shapes comprising multiple docking bays such that each docking bay is configured to have a module latched therein.
13. A method of forming a micro grid apparatus for use in a mainframe system or server system, said method comprising:
forming a plurality of tiers,
said tiers being distributed and sequenced in a vertical direction such that each tier is at a different vertical level in the vertical direction,
each tier comprising a multiplicity of complex shapes interconnected by a plurality of bridge modules,
said bridge modules including internal data buses for data transfer and electrical connection between the complex shapes and modules within the complex shapes;
each complex shape of the multiplicity of complex shapes being a physical structure having an exterior boundary,
each complex shape of the multiplicity of complex shapes comprising multiple docking bays such that each docking bay is configured to have a module latched therein.
2. The micro grid apparatus of
3. The micro grid apparatus of
4. The micro grid apparatus of
5. The micro grid apparatus of
6. The micro grid apparatus of
7. The micro grid apparatus of
8. The micro grid apparatus of
9. The micro grid apparatus of
a single processor hub, wherein the first power tower is directly bridged to the single processor hub at a first docking bay of the single processor hub, and wherein the second power tower is directly bridged to the single processor hub at a second docking bay of the single processor hub; or
a plurality of processor hubs interconnected with each other by at least one interconnecting bridge module of the plurality of bridge modules, wherein the plurality of processor hubs comprises a first processor hub and a second processor hub, wherein the first power tower is directly bridged to the first processor hub at a docking bay of the first processor hub, and wherein the second power tower is directly bridged to the second processor hub at a docking bay of the second processor hub.
10. The micro grid apparatus of
wherein the micro grid apparatus comprises at least one pin and socket tower, each pin and socket tower encompassing corresponding pin and socket connection blocks in all tiers such that the corresponding pin and socket connection blocks in successive tiers are aligned directly above or directly below each other and physically connected to each other, said at least one pin and socket tower physically connecting together the tiers of the plurality of tiers; and
wherein the micro grid apparatus does not comprise a power tower that encompasses corresponding power hubs in all tiers such that the corresponding power hubs in successive tiers are aligned directly above or directly below each other and are integral with each other.
11. The micro grid apparatus of
12. The micro grid apparatus of
wherein at least one docking bay of each complex shape of the multiplicity of complex shapes has a bridge unit of a bridge module of the plurality of bridge modules latched therein such that another remaining bridge unit of said bridge module is latched into a docking bay of another complex shape of the multiplicity of complex shapes, and
wherein each docking bay of each complex shape of the multiplicity of complex shapes that does not have a bridge unit of any bridge module of the plurality of bridge modules latched therein has an irregular shaped module of a plurality of irregular shaped modules latched therein, each irregular shaped module providing a functionality for responding to an alert pertaining to an event.
14. The method of
15. The method of
16. The method of
17. The method of
forming at least one power tower, each power tower encompassing corresponding power hubs in all tiers such that the corresponding power hubs in successive tiers are aligned directly above or directly below each other and are integral with each other, said at least one power tower physically connecting together the tiers of the plurality of tiers.
18. The method of
19. The method of
20. The method of
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This application is a continuation application claiming priority to Ser. No. 13/438,267, filed Apr. 3, 2012, now U.S. Pat. No. 8,429,381, issued Apr. 23, 2013, which is a continuation of Ser. No. 13/048,158 filed Mar. 15, 2011, U.S. Pat. No. 8,180,999, issued May 15, 2012, which is a continuation of Ser. No. 12/699,177 filed Feb. 3, 2010, which is now Abandoned.
The present invention relates to a micro grid apparatus for use in a mainframe or server system.
The world is melting into a global internet village in which countries and states are literally becoming super-suburbs. Computer communication advancements are primarily fuelling exploding events in this global internet village.
Unfortunately, current technology does not combine and utilize resources in a manner that enables adequate and efficient responses to problems and challenges in this global internet village.
Thus, there is a need for an apparatus and method that combines resources for enabling adequate and efficient responses to problems and challenges relating to use of the Internet.
The present invention provides a micro grid apparatus for use in a mainframe system or server system, comprising:
at least one tier, each tier comprised by an associated printed circuit board,
wherein if said at least one tier consists of a plurality of tiers then the tiers are distributed and sequenced in a vertical direction such that each tier is at a different vertical level in the vertical direction,
wherein each tier comprises a multiplicity of complex shapes interconnected by a plurality of bridge modules,
wherein each complex shape of the multiplicity of complex shapes comprises a central area and at least three radial arms connected to the central area,
wherein the radial arms are external to and integral with the central area,
wherein each radial arm extends radially outward from the central area,
wherein each pair of adjacent radial arms defines a docking bay,
wherein each complex shape of the multiplicity of complex shapes is either a power hub whose central area comprises a plurality of rechargeable batteries or a processor hub whose central area comprises plurality of processors,
wherein at least one docking bay of each complex shape of the multiplicity of complex shapes has a bridge unit of a bridge module of the plurality of bridge modules latched therein such that another remaining bridge unit of said bridge module is latched into a docking bay of another complex shape of the multiplicity of complex shapes,
wherein each docking bay of each complex shape of the multiplicity of complex shapes that does not have a bridge unit of any bridge module of the plurality of bridge modules latched therein has an irregular shaped module of a plurality of irregular shaped modules latched therein, each irregular shaped module providing a functionality for responding to an alert pertaining to an event, and
wherein the multiplicity of complex shapes comprises a plurality of complex shapes such that at least one docking bay of each complex shape of the plurality of complex shapes has one irregular shaped module of the plurality of irregular shaped modules latched therein.
The present invention provides a method of forming a micro grid apparatus for use in a mainframe system or server system, said method comprising:
forming at least one tier, each tier comprised by an associated printed circuit board,
wherein if said at least one tier consists of a plurality of tiers then the tiers are distributed and sequenced in a vertical direction such that each tier is at a different vertical level in the vertical direction,
wherein each tier comprises a multiplicity of complex shapes interconnected by a plurality of bridge modules,
wherein each complex shape of the multiplicity of complex shapes comprises a central area and at least three radial arms connected to the central area,
wherein the radial arms are external to and integral with the central area,
wherein each radial arm extends radially outward from the central area,
wherein each pair of adjacent radial arms defines a docking bay,
wherein each complex shape of the multiplicity of complex shapes is either a power hub whose central area comprises a plurality of rechargeable batteries or a processor hub whose central area comprises plurality of processors,
wherein at least one docking bay of each complex shape of the multiplicity of complex shapes has a bridge unit of a bridge module of the plurality of bridge modules latched therein such that another remaining bridge unit of said bridge module is latched into a docking bay of another complex shape of the multiplicity of complex shapes,
wherein each docking bay of each complex shape of the multiplicity of complex shapes that does not have a bridge unit of any bridge module of the plurality of bridge modules latched therein has an irregular shaped module of a plurality of irregular shaped modules latched therein, each irregular shaped module providing a functionality for responding to an alert pertaining to an event, and
wherein the multiplicity of complex shapes comprises a plurality of complex shapes such that at least one docking bay of each complex shape of the plurality of complex shapes has one irregular shaped module of the plurality of irregular shaped modules latched therein.
The present invention advantageously provides an apparatus and method that combines resources for enabling adequate and efficient responses to problems and challenges relating to use of the Internet.
The present invention relates generally to grid computing, and more particularly to micro grid and macro grid processing, the functional system purpose, the system structure, and method of system use of the same, that provides for the functionality of a micro grid, additional data buses necessary to interface to a micro grid and macro grid, and each of the system elements' functional relationship with, wireless macro grid alerts under artificial intelligence control. Existing application software, operational system software, communications software, and other software including drivers, interpreters and compilers for micro processor systems can function within embodiments of the present invention.
The detailed description of the invention is presented in the following sections:
A. Micro Grids and Macro Grids;
B. Governance;
C. Macro Grid Communications;
D. Sensor and Actuator Apparatus
E. Bridge Structures
F. Power
G. Mainframe/Server Apparatus
H. Cloud Computing
I. Data Processing Apparatus.
A. Micro Grids and Macro Grids
The micro grid apparatus 100 is configured to enable the irregular shaped modules 200, 410, 415, 420, and 425 to be geometrically connected thereto via the respective connection interfaces 55. The connection interfaces 55 accommodate a V-shaped geometric connection between the irregular shaped modules 200, 410, 415, 420, and 425 and the complex shape of the micro grid apparatus 100.
The micro grid apparatus 100 comprises a central area 115 (see
Each processor of the plurality of processors 65 has its own individual operating system and assigned resources (e.g., cache memory—not shown). The operating system within each processor of the micro grid apparatus 100 controls the programmatic housekeeping and individual processor availability and assignment of the micro grid, including allocation of random access memory of irregular shape 200 to the processors with common types of operating systems within the micro grid apparatus 100, and other communication interfaces of irregular shape 425. The processors within the apparatus 100 are linked by multiple data buses (not shown) for data transfer and electrical connection to each other where they collectively reside with their individual cache memory and cache controllers in the same physical apparatus. Contemporaneously, there are multiple operating systems actively functioning in the different processors of the same physical micro grid apparatus 100.
An assembled micro grid apparatus structure of the present invention is constructed from two physically different components: (1) the complex shape of the micro grid apparatus 100, which may embody the central processing unit's cell wafer including the associated cache memory, the cache controllers, and the associated electronic circuits of the micro grid apparatus 100; and (2) the closely packed modular irregular shaped modules (e.g., 200, 410, 415, 420, 425 for which there are five docking bays provided) and/or bridge modules as discussed infra in conjunction with
In
The irregular shaped modules 200, 410, 415, 420, and 425 are interchangeable and fit any docking bay in the micro grid apparatus 100 as determined by system architectural design. Different combinations, including multiples of one type of irregular shape, are permitted in an assembled apparatus. For example, three RAM modules 200, a micro grid wireless module 415, and a global positioning module 420 would facilitate a mobile micro grid apparatus 100 with a particularly large amount of memory; however it would not have I/O, or physical connectable communication functionality. Each irregular module is coupled by high speed bi-directional data buses available at the connection interface (e.g., ‘V’ shaped connection interface) 55. The total number of such data buses is equal to the total number of processors of the plurality of processors. For example, if the total number of such processors is 18, then the total number of such data buses is 18. The processors of the plurality of processors 65 contained in the complex shape of the micro grid apparatus 100 communicate individually via each of the available individual data buses (e.g., of 18 data buses) to the irregular shaped module 415, connected by the ‘V’ shaped connection interface 55.
The plurality of processors 65 includes a unique processor 60 having its unique operating system and is included among the associated micro grid of processors 65, and may include associated internal cache memory and cache memory control, main random access memory 200 for storing data and instructions while running application programs, a mass-data-storage device, such as a disk drive for more permanent storage of data and instructions, peripheral components such as monitors, keyboard, pointing devices, sensors and actuators which connect to the I/O module 410, data and control buses for coupling the unique processor 60 and its operating system to the micro grid processors and components of the computer system, and a connection bus 55 for coupling the micro grid processors and components of the computer system.
The present invention utilizes one or more operating systems residing in single processors, and multiple operating systems residing in multiple processors, such as may be embodied on the same wafer, can be constructed with known software design tools and manufacturing methods.
The computer system 50 provides the following functionalities:
The processors are linked to each other via a system bus (not shown), a micro grid bus (not shown) and a macro grid bus (not shown). Known existing (and future designed) application software, operational system software, communications software, and other software including drivers, interpreters and compilers for micro processor systems may function within the embodiments of the present invention. Any irregular shaped module is able to connect to any of the five docking bays available in the complex ceramic chip structure in any combination, including the arrangement of five bridge modules attached to one complex ceramic chip structure. In one embodiment, Terrestrial and 802.11g Wireless Communication protocols and standards may be employed for use in the present invention. In one embodiment, the Mesh Wireless Communication 802.11s standard may be employed for use in the present invention. Circumstances (e.g., manufacturing, research, etc.) determine standards (e.g., 802.11g, 802.11s, and other existing wireless standards and future standards) that may be used in different embodiments or in different combinations in the same embodiment (e.g., inclusion of communication techniques such as ‘Bluetooth’).
In one embodiment, the outer curved edge 105 of the radial arm 110 is physically manufactured to the shape of a circle, resulting in the outer curved edge 105 of the radial arms 110 being at a radial distance (e.g., of 5 cm in this example) from a radial center 112 of the circle (i.e., the circle has a diameter of 10 cm in this example) within the central area 115 of the micro grid apparatus 100. Each radial arm 110 extends radially outward from the central area 115 and has an outer curved edge 105 disposed at a constant radial distance from the radial center 112. Thus, the outer curved edges 105 of the radial arms 110 collectively define a shape of a circle centered at the constant radial distance from the radial center 112. The circle has a diameter exceeding a maximum linear dimension of the central area 115. Each pair of adjacent radial arms 110 defines at least one docking bay 450 into which an irregular shaped module can be inserted. The total number of docking bays 450 is equal to the total number of radial arms 110. In one embodiment, one or more irregular shaped modules are inserted into respective docking bays 450 defined by adjacent radial arms 110. In one embodiment, the radial arms 110 are uniformly distributed in azimuthal angle φ about the radial center 112. In one embodiment, the radial arms 110 are non-uniformly distributed in azimuthal angle φ about the radial center 112, which may be employed to accommodate different sized irregular shaped modules with corresponding radial arms 110 that present different sizes and shapes of their ‘V’ interface.
The central area 115 of the micro grid apparatus 100 comprises a plurality of processors 65 that are electrically linked together and are electrically linked to each irregular shaped module that is inserted into a respective docking bay 450 defined by adjacent radial arms 110. The central area 115 has a polygonal shape (i.e., a shape of a polygon 113) whose number of sides is twice the number of radial arms 110. The dashed lines of the polygon 113 do not represent physical structure but are shown to clarify the polygonal shape of the polygon 113. In
The central area 115 is structurally devoid of connection pins on the top and underside surfaces, enabling direct contact with heat dissipation devices on both surfaces. The radial arms 110 have connection pins on the underside (i.e., bottom) surface.
Five docking bays 450 for the irregular shaped modules (200, 410, 415, 420, 425) are provided between the radial arms 110. Each radial arm 110 has parallel sides 111 oriented in a radial direction and are 1.4 cm wide in this example. The arc at the outer curved edge 105 of the radial arm 110 has a chord of 2.7 cm in this example.
The connection interface 55 provides an electrical connection ‘V’ point for a system bus between the complex structure and the irregular shaped modules and is available along the edge of the docking bay 450 of the pentagonal shape of the central area 115 of the complex shape. The bus comprises individual bi-directional data buses (e.g., 18 data buses) capable of connecting the micro grid processors (e.g., 18 processors) with their own operating systems to their own individual wireless devices contained in the irregular shaped module 415 for micro grid wireless connection points. The mechanical connection is achieved by the irregular shaped module 415 press fitting its wedged connection point edge into a ‘V’ edged protrusion along the length of the complex shape; i.e., the docking bay's pentagonal edge.
The latching mechanism on the radial arms 110 of the complex shape in
The irregular shapes are manufactured to fit perfectly within the docking bay 450 (see
Similarly, the global positioning irregular shaped module 420 and the communications irregular shaped module 425 connect to their external associated hardware (i.e., physical antenna, cable and fiber connections) via the underside pins on the radial arms of the complex shape. The RAM irregular shaped module 200) and micro grid wireless module 415 do not necessarily require the use of connection pins under the complex shape as they are self contained and do not have any associated external hardware.
In accordance with the present invention, each individual processor can participate as a member of the micro grid apparatus 100 and may be conscripted for functional use from within the micro grid apparatus 100 by one uniquely assigned processor (e.g., by processor 60) with its individual operating system. Each processor of the plurality of processors 65 has its own individual operating system and assigned resources (e.g., cache memory—not shown) and is available to participate either by direct connection and/or wirelessly (802.11g), either individually and/or collectively, on demand, from within the embodiment of the micro grid apparatus 100 to an external dynamically expanding and contracting wireless macro grid, comprised of conscripted and participating processors, from a plurality of participating micro grids according to embodiments of the present invention. Each processor of common processors within the micro grid apparatus 100 with the same type of individual operating system and assigned resources is available for functional use as a wirelessly connected participant of one or more macro grids.
A macro grid comprises a set of processors conscripted from one or more micro grid apparatuses to become macro grid processors within the macro grid. A macro grid may also include other computational resources which do not function as a macro grid processors, such as other micro grid processors of the one or more micro grid apparatuses.
A macro grid may dynamically change as a function of time. The macro grid has a geographical footprint, which is spatial contour defined by the macro grid processors in a macro grid. The spatial contour of the geographical footprint may be generated by fitting a curve to the geographical locations of the macro grid processors in a macro grid at a given instant of time. The geographical footprint (i.e., the spatial contour) of a macro grid expands or contracts dynamically as macro grid processors are added or removed, respectively, from the macro grid and also as the spatial location of one or more macro grid processors in the macro grid change as a function of time.
Conscripted micro grid processors that are participants in a macro grid could be physically contained within the confines of a moving vehicle, a flying airplane, a sailing ship, a walking person, etc. Thus, the mobility of macro grid processors contributes to dynamic changes in the macro grid.
An artificial intelligence of the present invention is intelligent software implemented by a macro grid (i.e., by the macro grid processors in a macro grid) to perform a task or a set of tasks in real time in response to detection of an alert pertaining to an event. The alert may be detected by a unique processor 60 residing in the plurality of processors in the complex shape of the micro grid apparatus 100. In one embodiment, the artificial intelligence (i.e., the intelligent software) of a macro grid is located in a single macro grid processor of the macro grid. In one embodiment, the artificial intelligence is distributed among a plurality of macro grid processors of the macro grid (i.e., different portions of the software comprised by the artificial intelligence are stored in different macro grid processors of the macro grid). In one embodiment, the artificial intelligence is distributed and stored among all of the macro grid processors of the macro grid. The location of the artificial intelligence in the macro grid may be static (i.e., unchanging) or may dynamically change in accordance with a transient evolution of the macro grid as the response to the alert develops over time and eventually reduces and terminates as the specific event associated with the alert diminishes and is quenched. In addition, the mobility macro grid processors of a macro grid may be accompanied by locational changes in the artificial intelligence associated with the macro grid.
The scope of logic, decision making, and any other intelligent functionality in an artificial intelligence of the present invention includes the current state of knowledge, and enablement of that knowledge for practical utilization, known to a person of ordinary skill in the field of artificial intelligence at any time that the present invention is practiced. Thus, it is contemplated that an artificial intelligence of the present invention will be utilized with increasing capabilities and levels of sophistication as corresponding capabilities and levels of sophistication are developed in the field of artificial intelligence.
An artificial intelligence is generated (i.e., created), by hardware and/or software in any manner known to a person of ordinary skill in the field of artificial intelligence. For example, a set of artificial intelligences may pre-exist in a storage medium and a particular stored artificial intelligence that is capable of responding to the event associated with the alert may be activated for use by the macro grid. As another example, an artificial intelligence may generated by software in a manner that tailors the artificial intelligence to the specific event associated with the alert.
The unique processor 60 is used to create and dynamically change macro grids and to generate artificial intelligences to govern (i.e., control and manage) operation of the macro grids in response to a real time alert. A software conscription request may be received (or generated) by the unique assigned processor 60 in the micro grid apparatus 100 from (or to) uniquely assigned processors of other micro grids, that are wirelessly adjacent and available, to the alert sensing (or alert transmitting) micro grid apparatus 100. In one embodiment, once an alert is acknowledged by the unique processors in two or more micro grids, a macro grid is formed and expands by further conscription demand of other adjacent wirelessly available micro grids to become a large macro grid, comprised of a plurality of selected numbers of individual processors within a plurality of wirelessly connected micro grids. The macro grid processor connects wirelessly the wireless module 415 to other adjacent macro grid processors forming a macro grid across which a transient and mobile artificial intelligence resides. The dynamically constructed macro grid continues to function wirelessly utilizing changing populations of connected individual processors embodied within micro grids. The macro grid is governed by an artificial intelligence.
The macro grids expand and contract their geographic footprint as: (1) participating micro grid processor numbers increase and decrease; (2) the operating system of the micro grid unique processors re-prioritizes individual processor availability; (3) the physical location of the participating processors change as detected via the global positioning interface module 420; (3) the unique application program alert demand, from within the macro grid, adjusts requirements for micro grid processor participation; and/or (4) new alerts are raised for functional use of micro grid processors that are already engaged in functional use by other macro grids. It is noted that different macro grids can use different processors embodied within the same micro grid apparatus.
An artificial intelligence is generated by the unique processor 60, within the wireless configuration of a macro grid, as a result of a program alert to the operating system of the unique processor 60 within the micro grid apparatus 100, from sensor signals and software activity on the I/O interface of irregular shaped module 410. In response to the alert, the artificial intelligence conscripts available physically connected processors from within the described micro grid apparatus, and wirelessly conscripts available processors from different micro grid apparatus's within a prescribed or otherwise detectable range. The artificial intelligence becomes transient and not specifically reliant on the initiating host unique processor's operating system.
The artificial intelligence governs its macro grid via the operating systems of the unique processors of the participating, wirelessly connected micro grid apparatuses, and authoritatively controls the functionality and sustained vitality of its mobile macro grid that has been initiated for it to reside upon, until expiry or offload. In one embodiment, one macro grid supports one artificial intelligence, and one micro grid may have mutually exclusive individual processors under the control of multiple artificial intelligences.
A plurality of transient artificial intelligences can co-exist (each contained within their individual expanding and contracting macro-grids) contemporaneously. The different artificial intelligences utilize different individual wirelessly connected micro grid processors, their common type operating systems, and their assigned resources, available within any single micro grid apparatus.
Various activities (e.g., research, manufacturing, etc.) may determine the specific structure of these two standard system data buses (1210, 1215). These standard system data buses (1210, 1215) could be used individually (e.g., one standard system data bus for inbound data, one standard system data bus for outbound data), as a bidirectional address bus, as a bidirectional data bus, or as a high speed ‘on wafer’ extendable address/data ring similar to token ring and other micro processor connection technologies. Thus, the present invention includes multiple design options in bus structure and interconnections and also includes both parallel and serial methods of data transfer.
The standard system bus (1210, 1215) provides for address and data interchange between the unique system processor 60 and all of the micro grid processors individually. Conscription of a micro grid processor to participate as a macro grid processor, including instruction to a micro grid processor to change its operating system, occurs over this standard system bus (1210, 1215). Micro grid processor status and availability, monitoring of micro grid processor utilization, and micro grid processor prioritization also occurs over this standard system bus (1210, 1215) by the unique processor 60. This standard system bus (1210, 1215) maintains the vitality of the micro grid and its resources.
The standard system bus (1210, 1215) also interconnects all of micro grid processors 65 to the RAM module 200, via memory control and cache memory control.
The standard system bus (1210, 1215) also interconnects the unique processor 60 to the I/O module 410 for detecting local attached alerts and interfacing with standard external peripheral system devices such as a disk drive for more permanent storage of data and instructions, and peripheral components such as monitors, keyboard, pointing devices, attached alert sensors and actuators.
The standard system bus (1210, 1215), also interconnects the unique processor 60 to the GPS module 420 for provision of location information and movement.
The standard system bus (1210, 1215) also interconnects the unique processor 60 to the communications module 425 for receiving wireless alerts from adjacent processors (but yet to be connected as macro grid processors) and cable communicated alerts from fiber optic and Ethernet connected sensors. The communications module 425 is also utilized by the macro grid processors for responding to alerts by instructing actuators to counter the alert event. The micro grid system bus 1205 provides for data interchange among any two (or groups) of the micro grid processors when assigned by the unique processor 60, to provide additional processing capacity to a macro grid processor. Once the micro grid participating processors are identified and assigned, and are acting as an active collaborating micro grid, the micro grid participating processors reduce their individual use of the standard system bus (1210, 1215) and utilize the micro grid system bus (1205). The present invention reduces data traffic volumes on the standard system bus (1210, 1215) and provides alternate micro grid address and data capacity via the micro grid system bus (1205) and further provides macro grid address and data capacity via the macro grid system bus (1220).
The macro grid system bus 1220 provides for data interchange from each processor of the macro grid processors individually via the wireless module 415 to other adjacent macro grid processors embodied within a macro grid. The artificial intelligence associated with the macro grid processor within the macro grid communicates to all the other macro grid processors within the macro grid.
The two standard system data bus (1210, 1215), the micro grid system bus 1205 and the macro grid system bus 1220, are all available as a system bus 55 at the five connection points of the complex shape with the individual irregular shaped modules. The system bus 55 serves as an embodiment of connection interface 55 (see
The system bus 55 can be extended beyond the embodiment of one apparatus via a bridge module (i.e., a bi-polygonal irregular shaped module).
An alert to the unique processor 60 may be detected via the I/O module 410 for the local and physically connected sensors to the apparatus; or via the communications module 425 receiving the alert wirelessly for remote sensors linked to the apparatus.
An external macro grid alert to the unique processor 60 (e.g., as received from the communication module 425's wireless connection to an adjacent macro grid processor) may contain an externally computed value of scale (S), wherein S is a function of a magnitude of the event (E), an urgency level for responding to the event (U), and a quash time for extinguishing the event (Q). The magnitude of the event (E) that triggered the alert is a numerical value within a predefined range of numerical values (e.g., a continuous range of values such as 1 to 10, a discrete set of values such as the integers 1, 2, 3, . . . , 10, etc.). The urgency level (U) for responding to the event is a numerical value within a predefined range of numerical values (e.g., a continuous range of values such as 1 to 10, a discrete set of values such as the integers 1, 2, 3, . . . , 10, etc.). The quash time (Q) for extinguishing the event is in units of seconds, minutes, hours, days, etc. In one embodiment, the magnitude of an event (E) is derived from GPS data received by the artificial intelligence from GPS modules (420) attached to participating micro grid apparatuses across the extremity of the geographical footprint of the macro grid. In one embodiment, the urgency level (U) is derived from the TCP/IP sensors alert signal frequency (e.g., one alert signal per second, one alert signal per millisecond, etc.). In one embodiment, S=(E×U)/Q. In one embodiment, E and U are independent of each other. In one embodiment, U is a function of E. For example, if U is a linear function of E, then S is proportional to E2/Q.
The unique processor 60 assigns an internal micro grid processor to modify its operating system and becomes a macro grid processor of a macro grid, after which an artificial intelligence is generated for the macro grid. The macro grid processor created by the unique processor 60 interrogates the alert and determines the number of available micro grid processors 65 (e.g., from information provided by the unique processor in the micro grid stack) to be assigned for countering the event by either: (1) determining the scale of the event to be the scale (S) contained in the alert; or (2) determining the scale of the event by computing a value for the scale (S′) of the response necessary to counter the event raised by an alert. The scale (S′) is computed by an artificial intelligence of the macro grid; e.g., by using the same formula (e.g., S′=(E×U)/Q in one embodiment) as used for previously computing the scale S received by the unique processor 60 in the alert, but may differ in value from S due to U and/or Q being different for computing S′ than for computing S (e.g., due to a change in U and/or Q having occurred from when S was computed to when S′ is computed). In one embodiment, the number of available micro grid processors 65 to be assigned for countering the event is a non-decreasing function of the scale (S or S′) of the event.
The artificial intelligence in the macro grid processor then requests other adjacent and wirelessly connectable unique processors to assign a micro grid processor to become a macro grid processor in a similar way. Accordingly, the macro grid begins to grow in footprint size and shape.
The scale (S) of the alert received by the unique processor 60 from an adjacent processor via the communication module's wireless may be predetermined by an artificial intelligence in the adjacent processor requesting assignment of a macro grid processor (including micro grid processing resources) from the unique processor 60.
In step 1431, the unique processor 60 constantly monitors the system bus (1210, 1215) for an ‘alert data packet’: (1) from any sensor directly connected to the I/O irregular shaped module 410 or to the communications module 425; or (2) from any external micro grid apparatus or any macro grid that is connected wirelessly or by direct electrical connection to the micro grid apparatus 100. An alert data packet comprises an alert pertaining to an event.
The ‘alert data packet’ may contain a computed value of scale (as defined supra) to assist in determining the number of micro grid resources required to assist with countering the event from the location of the external micro grid apparatus. GPS information from the GPS module 420 may be constantly interrogated to determine a ‘location value’ for advising the artificial intelligence (generated in step 1435) as to where the event is, and as a consequence, influencing the macro grid operating system to increase or decrease the number of micro grid processing resources participating from within the single apparatus.
Step 1432 determines whether the unique processor 60 has detected a data packet comprising the alert in step 1431. If step 1433 determines that the unique processor 60 has detected a data packet comprising the alert, then step 1433 is next performed; otherwise the process loops back to step 1431 to monitor for an alert.
In step 1433, via the micro grid bus 1205, the unique processor 60 initiates a response to the alert by identifying an available micro grid processor within the micro grid apparatus comprising the unique processor 60, designates the available micro grid processor to be a designated macro grid processor by altering the operating system of the available micro grid processor to a macro grid operating system, and assigns to the designated macro grid processor an alert ownership of a macro grid with an associated responsibility for the operation of the macro grid.
The designated macro grid processor assigns one or more additional processors from the micro grid apparatus comprising the unique processor 60 as micro grid computational resources are required by the macro grid. The total number of the one or more additional processors assigned as computational resources for the micro grid is a function of the scale of the alert. The macro grid operating system comprises software configured, upon being implemented (i.e., performed), to respond to the event associated with the detected alert.
In one embodiment, step 1434 is performed if warranted by the nature of the event and/or scale of the alert. In step 1434, the designated macro grid processor communicates the ‘alert data packet’ to the unique micro grid processor(s) in one or more different micro grid apparatuses, via the wireless irregular shaped module 415 for connection. The unique micro grid processor in each micro grid apparatus of the one or more different micro grid apparatuses assigns a micro grid processor in its micro grid apparatus to become an additional macro grid processor of the macro grid. The assembled macro grid communicates via the wirelessly connected macro grid system bus 1220. Each macro grid processor of the designated macro grid processors may assign one or more additional processors from its micro grid apparatus as computational resources for the macro grid. In one embodiment, the initially designated macro grid processor directs and oversees the operation of all of the other macro grid processors of the macro grid.
In one embodiment, step 1434 is not performed and the macro grid consequently has exactly one macro grid processor, namely the designated macro grid processor.
In step 1435, an artificial intelligence is generated for the macro grid by the designated macro grid processor. In one embodiment, the artificial intelligence is stored only in one macro grid processor (e.g., the designated macro grid processor) of the macro grid. In one embodiment, a different portion of the artificial intelligence is stored in some but not all macro grid processors of the macro grid. In one embodiment, a different portion of the artificial intelligence is stored in each macro grid processor of the macro grid.
The macro grid may dynamically expand or contract as the event increases or decreases, respectively. If the alert is of a predefined scale (as defined supra) requiring additional computational resources, or if a matched alert is detected in other micro grid apparatus(s) than the micro grid apparatus that detected the alert in step 1432, then micro grid processors within the other apparatus(s) are assigned to the artificial intelligence as computational resources. A “matched alert” is defined as an alert that communicates an enhancement of the event associated with the original alert detected in step 1432. As the event diminishes, macro grid processors and/or micro grid processors assigned as computational resources are removed from the macro grid.
In step 1436, the event associated with the alert is responded to and quenched by the artificial intelligence. The manner in which the macro grid responds to and quenches the event is specific to the event, as illustrated in three hypothetical examples which are described infra.
As the scale of the alert (as defined supra) is reduced such that fewer computational resources are needed to combat the event associated with the alert. Accordingly, the artificial intelligence returns no longer needed macro grid processors back to associated micro grid processors under the control of the unique processor of the micro grid apparatus that comprises each associated micro grid processor.
If a previously occurring matched alert disappears, then the artificial intelligence will commence returning the conscripted additional macro grid processors back to the control of the corresponding unique processor in the micro grid apparatus that is wirelessly connected the micro grid apparatus 100. Eventually the designated macro grid processor itself is returned as a micro grid processor to the micro grid apparatus 100, resulting in the artificial intelligence vacating the macro grid and the macro grid disappearing, thus extinguishing the macro grid and all of its included macro processors, along with the artificial intelligence, in step 1437.
In step 1451, the unique processor 60 constantly monitors the system bus (1210, 1215), via the communications module 425 of the micro grid apparatus 100, for an ‘alert data packet’: (1) from any sensor directly connected to the I/O irregular shaped module 410 or to the communications module 425; or (2) from any external micro grid apparatus or any macro grid that is connected wirelessly or by direct electrical connection to the micro grid apparatus 100. An alert data packet comprises an alert pertaining to an event.
The ‘alert data packet’ may contain a computed value of scale (as defined supra) to assist in determining the number of micro grid resources required to assist with countering the event from the location of the external micro grid apparatus. GPS information from the GPS module 420 may be constantly interrogated to determine a ‘location value’ for advising the artificial intelligence (generated in step 1454) as to where the event is, and as a consequence, influencing the macro grid operating system to increase or decrease the number of micro grid processing resources participating from within the single apparatus.
Step 1452 determines whether the unique processor 60 has detected a data packet comprising the alert in step 1451. If step 1452 determines that the unique processor 60 has detected a data packet comprising the alert then step 1453 is next performed; otherwise the process loops back to step 1451.
In step 1453, via the micro grid bus 1205, the unique processor 60 initiates a response to the alert by identifying an available micro grid processor within the micro grid apparatus comprising the unique processor 60, designates the available micro grid processor as a macro grid processor by altering the operating system of the available micro grid processor to a macro grid operating system, and assigns to the designated macro grid processor an alert ownership of a macro grid with an associated responsibility for the operation of the macro grid.
In step 1454, an artificial intelligence is generated for the macro grid, under control of the unique processor 60, and is stored in the designated macro grid processor. The artificial intelligence stored in the designated macro grid processor, upon being implemented, may assign one or more additional processors from its micro grid apparatus as computational resources are for the macro grid.
In one embodiment, the artificial intelligence stored in the designated macro grid processor may trigger generation of other macro grid processors if warranted by the nature of the event and/or scale of the alert. Specifically, the artificial intelligence stored in the designated macro grid communicates with the unique micro grid processor in one or more different micro grid apparatuses to direct the unique micro grid processor in each micro grid apparatus of the one or more different micro grid apparatuses to assign a micro grid processor in its micro grid apparatus to become an additional macro grid processor of the macro grid. In one embodiment, the artificial intelligence stored in the designated macro grid processor may affirm or negate the choice of the additional macro grid processor by the unique micro grid processor in each micro grid apparatus.
In one embodiment, the artificial intelligence does not trigger generation of other macro grid processors and the macro grid consequently has exactly one macro grid processor, namely the designated macro grid processor.
If generation of other macro grid processors is triggered, the artificial intelligence stored in the designated macro grid processor may generate, or trigger the generating of, other artificial intelligences to generate or develop a resultant artificial intelligence. In one embodiment, the artificial intelligence is stored only in one macro grid processor (e.g., the designated macro grid processor) of the macro grid. In one embodiment, a different portion of the artificial intelligence is stored in some but not all macro grid processors of the macro grid. In one embodiment, a different portion of the artificial intelligence is stored in each macro grid processor of the macro grid.
If the alert is of a predefined scale (as defined supra) requiring additional computational resources, or if a matched alert (as defined supra) is detected in other micro grid apparatus(s) than the micro grid apparatus that detected the alert in step 1452, then micro grid processors within the other apparatus(s) are assigned to the artificial intelligence as computational resources.
In step 1455, the event is responded to by the artificial intelligence. The manner in which the macro grid and artificial intelligence responds to and quenches the event is specific to the event, as illustrated in three hypothetical examples which are described infra.
As the scale of the alert (as defined supra) is reduced such that fewer computational resources are needed to combat the event associated with the alert. Accordingly, the artificial intelligence returns no longer needed macro grid processors back to associated micro grid processors under the control of the unique processor of the micro grid apparatus that comprises each associated micro grid processor.
If a previously occurring matched alert disappears, then the artificial intelligence will commence returning the conscripted additional macro grid processors back to the control of the corresponding unique processor in the micro grid apparatus that is wirelessly connected the micro grid apparatus 100. Eventually the designated macro grid processor itself is returned as a micro grid processor to the micro grid apparatus 100, resulting in the artificial intelligence vacating the macro grid and the macro grid disappearing, thus extinguishing the macro grid and all of its included macro processors, along with the artificial intelligence, in step 1456.
In step 1471, the unique processor 60 constantly monitors the system bus (1210, 1215), via the communications module 425 of the micro grid apparatus 100, for an ‘alert data packet’: (1) from any sensor directly connected to the I/O irregular shaped module 410 or to the communications module 425; or (2) from any external micro grid apparatus or any macro grid that is connected wirelessly or by direct electrical connection to the micro grid apparatus 100. An alert data packet comprises an alert pertaining to an event.
The ‘alert data packet’ may contain a computed value of scale (as defined supra) to assist in determining the number of micro grid resources required to assist with countering the event from the location of the external micro grid apparatus. GPS information from the GPS module 420 may be constantly interrogated to determine a ‘location value’ for advising the artificial intelligence (generated in step 1475) as to where the event is, and as a consequence, influencing the macro grid operating system to increase or decrease the number of micro grid processing resources participating from within the single apparatus.
Step 1472 determines whether the unique processor 60 has detected a data packet comprising the alert in step 1471. If step 1472 determines that the unique processor 60 has detected a data packet comprising the alert then step 1473 is next performed; otherwise the process loops back to step 1471.
In step 1473, after detecting the alert data packet in step 1472, each unique processor selects at least one processor from each micro grid apparatus.
In step 1474, each selected processor is designated as a macro grid processor of a respective macro grid by altering an operating system of each selected processor to a macro grid operating system and by assigning to each selected processor a responsibility for operation of its respective macro grid.
In step 1475, an artificial intelligence is generated for each macro grid.
In step 1476, the event is responded to and quenched by executing the artificial intelligence of each macro grid.
In step 1477 after the event has been quenched, the macro grids are extinguished.
In one embodiment, at least one micro grid apparatus comprises a plurality of micro grid apparatuses, wherein step 1474 results in the respective macro grids comprising a plurality of macro grids, and wherein executing the artificial intelligence of each macro grid in step 1476 comprises contemporaneously executing the artificial intelligence of each macro grid to perform said responding to and quenching the event.
In one embodiment for each macro grid, one or more processors in each micro grid apparatus, other than the selected processors in each micro grid apparatus, are assigned as computational resources for each macro grid.
In one embodiment, at least two macro grids include a different macro grid processor selected from a same micro grid apparatus.
In one embodiment, the process geographically relocates at least one macro grid processor of a first macro grid, which results in the first macro grid having its geographical footprint increased or decreased.
In one embodiment, the alert data packet includes an identification of a scale (S), wherein S is a function of a magnitude of the event (E), an urgency level for responding to the event (U), and a quash time for extinguishing the event (Q). The scale (S) identified in the alert data packet may be used to determine a total number of processors of the at least one processor to be selected from each micro grid apparatus during said selecting the at least one processor from each micro grid apparatus in step 1473. In one embodiment, S=(E×U)/Q.
In one embodiment, the artificial intelligence for a first macro grid of the plurality of macro grids ascertains that the scale is increased relative to the scale identified in the alert data packet which triggers adding at least one macro grid processor to the first macro grid, resulting in the first macro grid having its geographical footprint increased
In one embodiment, the artificial intelligence for a first macro grid of the plurality of macro grids ascertains that the scale is decreased relative to the scale identified in the alert data packet which triggers removing at least one macro grid processor from the first macro grid, resulting in the first macro grid having its geographical footprint decreased.
Other embodiments, as described supra in conjunction with the process of
In
In
In
The expansion and contraction of artificial intelligence footprints is generally dynamic and changing.
Each macro grid in
The scale (S) of an alert is computed by the artificial intelligence from interrogation of alert data either detected directly via the unique processor 60 within the structure 500 (see
Adjacent wirelessly connectable physical apparatuses respond to the received (1450 to 1470) alert and join the macro grid along with processing resources as required by the artificial intelligence. The communicational data may be in the TCP/IP packet format.
The scale (S) of an alert is computed and used by the artificial intelligence to constantly indicate an alert value to all participating wirelessly connected micro grid unique processors (60) responsible for assigning macro grid processors and managing micro grid processors and resources. The scale (S) indicates, to the unique processor 60, a requirement to conscript more micro grid processors for the artificial intelligence, maintain the status quo, or reduce resource participation, which facilitates scalability of the dynamic functional use of the micro grid systems.
The artificial intelligence processes the data to counter the event with physical action and activity against the cause of the alert. This is undertaken by instruction to the available intelligent actuators (not shown) controlled by the unique operating system of the unique processor 60 in each micro grid apparatus. Alert interrogation provides the necessary feedback to the artificial intelligence to assess the effectiveness of the counter, which is then adjusted accordingly. This counter action and feedback mechanism may occur within a short period (e.g., milliseconds).
There are many examples for using the present invention, wherein micro grid and macro grid alert processing can be provided for artificial intelligence to take pro-active control of situations, initiated by the raising of alarms and alerts. Micro grid and macro grid technology could be deployed everywhere, resolving issues, counteracting events, and controlling remote circumstances that would otherwise require centralized decision making by people, who are not always available 24×7×365.
The following three hypothetical examples illustrate use of the present invention.
1. A huge forest fire erupts overnight in the hills behind Los Angeles (LA). The wind direction and fire intensity indicates an event to some outer LA suburbs within 48 hours. 427 fire trucks and 3 sky-crane helicopters have been dispatched by the greater LA Fire Authority into the area. Micro grids are embedded in all vehicles, and monitor heat, wind, smoke, and location information from their intelligent sensors. A smoke alert is raised by one of the micro grids. Quickly a macro grid is formed between all vehicles and the artificial intelligence takes control of the dangerous event. Each vehicle has interactive voice and video. The artificial intelligence interfaces with these communication devices and issues task assignments to the LA Fire Authority Units. The artificial intelligence provides a constant stream of updated information to central control, police, ambulance, and news media. The forest fire is surrounded by fire fighting efficiency and resource co-ordination. Within 36 hour, the potential disaster is arrested and suffocated. The wireless macro grid decays and separates back to individual micro grid processing. The mayor thanks the LA Fire Authority for another job well done.
2. It is year 2017 and the recently arrived NASA roving vehicles on Titan have been transmitting astounding images and data to Earth central control. A micro meteorite impacts 200 meters from one of the rovers, creating a sudden geological landscape change, unseen by earth controllers that may prove destructive for the $4 billion mission. Large freshly formed terrain fractures are detected by micro grid sensors on the rovers. A macro grid is quickly formed, and the generated artificial intelligence overrides current forward movement instructions and stops the affected rover immediately. This averts a potential rover loss, as communication with earth control is over 16 minutes (turnaround). The artificial intelligence re-evaluates the terrain and provides Earth controllers with Titan ground distance images and new atmospheric temperature, dust, gas and pressure data from the direction of the meteorite impact. The artificial intelligence decays and the individual micro grid unique processor in the command vehicle waits revised mission instructions.
3. It is 6.30 AM on a winter day in year 2012, and 400,000 vehicles are on the M1 motorway in England due to people traveling to work. Micro grid computing has been embedded in vehicles since year 2009 and approximately 15% of the vehicles have the technology. A thick fog rolls in over a 12 mile portion of the M1 motorway. Micro-grid sensors within the vehicles react to the arrival of the thick fog and indicate the density and GPS location to the other collaborating macro grid connected vehicles. Quickly, a fog pattern alert is generated by the artificial intelligence and conveyed to British motorway authorities including weather forecasters, television stations, and radio stations. The collaborating processors in the macro grid dispatch and share an unsolicited alert image on their dashboard LCD screens indicating topographic size and density of the fog. Safely, the vehicles slow down influencing other non-macro-grid vehicle drivers to do the same. Image processing, sensor sampling, and information up-dates are maintained by the artificial intelligence until all vehicles have passed through the fog, and the fog itself lifts for another fine day.
B. Governance
Governance relates to the structure and function of a macro grid configured to respond to an alert and may comprise, inter alia, processor stack control, operating system software, house keeping within stacks, control growth, decay, and operation of the unique processors of the macro grid, communication between or among the unique processors of the macro grid, etc.
The present invention utilizes the following governance structures that may exist in a macro grid: Council, Executive, Parliament, and Government, in conjunction with a simple micro grid apparatus and/or a complex micro grid apparatus (also called a “connectivity structure”).
A simple micro grid apparatus is defined as a micro grid apparatus that comprises one and only one plurality of processors, said one and only one plurality of processors including one and only one unique processor having a unique operating system that differs from the operating system of each other processor in the plurality of processors of the simple micro grid apparatus.
A complex micro grid apparatus (or connectivity structure) is defined as a micro grid apparatus that comprises at least two pluralities of processors, wherein the at least two plurality of processors are physically connected within the complex micro grid apparatus such that each plurality of processors includes one and only one unique processor having a unique operating system that differs from the operating system of each other processor in each plurality of processors of the complex micro grid apparatus.
A Council is defined as a unique processor in a macro grid such that the unique processor is comprised by a plurality of processors and is wirelessly connected to at least one other unique processor in the macro grid, wherein each unique processor in the macro grid has a unique operating system that differs from the operating system of each other unique processor in the plurality of processors of a micro grid apparatus.
An Executive within a macro grid is defined as a Council in a simple micro grid apparatus (e.g., a mobile micro grid apparatus), wherein the Council is wirelessly connected to at least one other unique processor in the macro grid that is external to the simple micro grid apparatus and is not physically connected to any other unique processor of the macro grid. Each Executive in a macro grid is a Council consisting of a unique processor in a different plurality of processors of at least one plurality of processors. For example, the unique processor 60 within the simple micro grid apparatus 100 of
A Parliament within a macro grid is defined as a plurality of unique processors (Councils) within a connective structure in which the unique processors of the plurality of unique processors are physically connected within the connective structure, wherein the unique processors of the plurality of unique processors in the Parliament are each wirelessly connected to at least one other unique processor of the macro grid that is external to the connective structure. Each unique processor of the plurality of unique processors in the Parliament is comprised by a plurality of processors within the connective structure.
A Government within a macro grid is defined as a plurality of governmental components such that each governmental component is either an Executive or a Parliament. Each such governmental component within a Government can communicate with at least one other governmental component within the Government. Such communication is effectuated via any Council or a designated resource processor in each governmental component. The present invention provides a structure and mechanism for the unique processors of the governmental components within a Government to communicate effectively with each other.
Thus, a Government, a Parliament, an Executive, and a Council are each a governance structure. A Government comprises a plurality of Executives, a plurality of Parliaments, or at least one Executive and at least one Parliament. An Executive, which comprises a Council, is a governmental component of a Government. A Parliament, which comprises a plurality of Councils, is another governmental component of a Government. A Council is the smallest indivisible governance structure within a Government.
As discussed supra, a unique processor of a macro grid is comprised by a plurality of processors in a micro grid apparatus.
A plurality of Governments can contemporaneously exist at any time within a corresponding plurality of macro grids or within a single macro grid.
A Government may created initially for (and on demand by) an artificial intelligence for the macro grid. Alternatively, a Government or a governance substructure within a Government may create or activate an artificial intelligence for the macro grid.
Two Governments, one government having a relatively lower artificial intelligence and the other government having a relatively higher artificial intelligence, can merge such that the relatively lower artificial intelligence transfers the alert responsibility and ownership to the relatively higher artificial intelligence in accordance with specified rules. An example of such a rule for transferring the alert responsibility may be: upon recognition by two artificial intelligences that they have been generated for the same alert originally responded to by their respective unique processors in different geographical locations and within different micro grid structures or apparatuses, the Government of unique processors then enables access to the multiple alert sensors (and response actuators) of the relatively higher artificial intelligence. Relatively lower and higher artificial intelligence is determined or measured by specified intelligence level rules for artificial intelligences.
A Government can split into a plurality of smaller Governments in accordance with specified rules, (e.g., the footprint of a mobile relatively higher artificial intelligence owning multiple alerts becomes stretched to a ‘snap’ point and becomes wirelessly ‘out of range’ forming multiple new smaller footprints). Each resultant artificial intelligence may not necessarily have the same number of alerts to remedy and may re-merge into a single Government (with a single artificial intelligence) again if the wireless connection is re-established.
A Government exists and may expand/or decay for the life of a wirelessly transient artificial Intelligence of its associated macro grid. A Government can decay into Parliaments, and/or Councils as its associated macro grid decays with the connectivity structure remaining intact.
A Parliament can be transformed into Executives and smaller Parliaments by physical fragmentation of the connectivity structure in which the Parliament is contained.
A Parliament exists for the life of the assembled bridge structure within the macro grid until decayed from the macro grid.
The following working flow relates to the use of governance structures by the present invention.
An alert is sensed by a unique processor (60) in a micro grid stack. A macro grid is initiated and an associated artificial intelligence is generated as a reaction to the alert. In one embodiment, the unique processor (60) in the micro grid stack is an Executive. The unique processor (60) in the micro grid stack assigns the artificial intelligence ownership of the alert and converts a micro grid processor in its stack into a macro grid processor (by alteration and addition of operating system software) in which the artificial intelligence can initially reside. The artificial intelligence may, depending on the size of the alert, authoritatively negotiate with a unique processor of a simple or complex micro grid apparatus for more processor resources. If the micro grid apparatus is within a complex micro grid apparatus (i.e., a connectivity structure such as, inter alia, a bridge structure), unique processors within the complex micro grid apparatus amalgamate to form a Parliament of unique processors. In this instance, the artificial intelligence negotiates with the Parliament for additional macro grid processors within the complex micro grid structure. Otherwise, the micro grid apparatus is within a simple micro grid apparatus comprising an Executive and the artificial intelligence negotiates with just the Executive present within the simple micro grid apparatus. The artificial intelligence may not achieve all the processor resources it requires from the Executive or Parliament, and may instruct the Executive or Parliament to locate any adjacent wireless micro grids, and amalgamate them into a Government of wirelessly connected unique micro grid processors (which includes the Executive or Parliament that the artificial intelligence is already negotiating with). The unique processor (60) in the micro grid stack that initiated formation of the macro grid is a Council that either is an Executive in the Government or is within a Parliament in the Government. This process of accumulating wirelessly connected Executives and Parliaments continues, as the artificial intelligence seeks the necessary macro grid processors to undertake its remedy of the alert. The footprint of the Government that the artificial intelligence operates in may grow to an enormous scale in size, or remain localized. The footprint of the Government may expand and contract on demand of the artificial intelligence. As an artificial intelligence decays it relinquishes individual Executives and Parliaments that were wirelessly connected, which may also occur as attrition through mobility, until the artificial intelligence is extinguished and its last macro grid processor is returned by the Council back to the micro grid stack as a micro grid processor. If no other macro grid processors are assigned in the simple micro grid apparatus, the Council reverts to a simple unique processor (60), attentively monitoring its I/O, GPS and communication module sensors, and waiting for another alert to occur.
The micro grid structure 1320 comprises the group of micro grid processors 65 which include a unique processor (Council) 60. The micro grid structure 1320 accommodates, via connection interface 55, the irregular shaped modules 420 (GPS), 200 (RAM), 410 (I/O), 415 (wireless connection), and the bridge unit 2011 of the bridge module 2010.
The power hub 3000 comprises a plurality of rechargeable batteries and accommodates, via connection interface 55, the irregular shaped modules 3100 (failsafe battery), 425 (communications), 3210 (micro grid processors that include a unique processor (Council) 60), 3220 (micro grid processors that include a unique processor (Council) 60), and the bridge unit 2012 of the bridge module 2010. The plurality of rechargeable batteries in the power hub 3000 provides electrical power for the micro grid processors in the irregular shaped modules (e.g., modules 3210 and 3220). The failsafe battery in the module 3100 provides back up power for the rechargeable batteries in the power hub 3000 (if the rechargeable batteries should become discharged or otherwise fail) or additional power to supplement the power provided by the rechargeable batteries in the power hub 3000. Failsafe battery modules may be connected in any plurality via connection interfaces (55), across all complex micro grid structures and apparatuses, including micro grid power hubs and micro grid power towers, where a plurality of connection interfaces (55) are presented.
The Councils 60 in the connectivity structure 9100 collectively form a Parliament within a macro grid. The Parliament comprises the unique processor 60 in the micro grid structure 1320, the unique processor 60 of the micro grid processors 3210, and unique processor 60 of the micro grid processors 3220.
The connectivity structure 9100 is more specifically a bridge structure. A bridge structure comprises a plurality of micro grid systems linked together by one or more bridge modules. Each bridge module of a bridge structure physically links together two micro grid systems of the plurality of micro grid systems. Each of micro grid system of the plurality of systems comprises at least one micro grid apparatus having a plurality of processors 65 that includes a unique processor 60. Thus, a bridge structure comprises a plurality of unique processors 60 disposed within the plurality of micro grid systems which are coupled together by the bridge module(s) in the bridge structure.
A Parliament comprises physically connected Councils, each Council with jurisdiction over its own plurality of (wafer contained) processors. The Parliament comprises software (residing in one or more Councils of the Parliament) that queries the Councils for processor resource availability and assignment, and interfaces wirelessly to potential requests for participation in a Government. The Parliament facilitates its internal and external data communications with utilization of the enhanced TCP/IP model structure, and packet structure, and provides full peer-to-peer facilitation (including governance and artificial intelligence) within its interconnected structure.
Macro grid modularity allows for removal and addition of Councils, Executives, and Parliaments. Physical connection or removal of Councils from or to a Parliament is provided for by governance operating system software that detects the Council alterations and reconfigures the Parliament appropriately to reflect the change.
Known existing (and future designed) application software, operational system software, communications software, and other software including drivers, interpreters and compilers for micro processor systems may function within the embodiments of the present invention.
The Global Positioning System (GPS) module (420) provides the telemetry and handover data for inclusion in the enhanced TCP/IP data packets originating from any processor in the Parliament. GPS data may be static for non-mobile micro grid Councils or Parliaments, or dynamic for mobile micro grid Executives or Parliaments.
Generally, a complex power hub apparatus comprises a central power hub, a plurality of connection interfaces (55) and radial vertical tiers (9151, 9152, 9153, 9154, 9155). Each radial vertical tier provides a plurality of physical connections to the central power hub 3000 and comprises irregular shaped modules interconnected with each other via connection interfaces 55. The central power hub 3000 comprises a central area and radial arms external to and integral with the central area to define docking bays such that each radial vertical tier is physically connected to the central power hub 3000 at a respective docking bay at the central area. The central power hub 3000 is analogous to the micro grid apparatus 100 of
The complex power hub apparatus (9150) shown in
A complex power hub apparatus is not limited to three horizontal layers and generally comprises a plurality of horizontal layers that could be illustrated as a plurality of circles. Thus, the modules in the radial vertical tiers are collectively distributed on the circles of the plurality of circles. The circles are concentric with a center point (e.g., geometric center, centroid, etc.) in the central power hub such that a total number of circles in the plurality of circles is equal to the same number of modules in each radial vertical tier. Corresponding modules in respective radial vertical tiers are located on a same circle of the plurality of circles.
A complex power hub apparatus may be manufactured in a plurality of configurations, including very tall ‘power tower’ structures for forming micro grid mainframe apparatuses, with a plurality of horizontal layers, and radial vertical tiers.
Circle 4125 comprises: three micro grid sensor modules 4100 with input plugs 4120 physically connected to the micro grid sensor module 4100, two micro grid actuator modules 4200 with output sockets 4220 physically connected to the micro grid actuator module 4200 to cause generation of output or activate responsive functionality in response to the event that the macro grid is responding to, and each physically connected to the power hub 3000 at the first horizontal layer (illustrated as circle 4125) of available docking bays. Thus, the three micro grid sensor modules 4100 and the two micro grid actuator modules 4200 are corresponding modules in respective radial vertical tiers 9151-9155 such that the corresponding modules are located on the same horizontal layer of a plurality of horizontal layers.
Circle 4130 comprises: five micro grid processor modules 3210 (each micro grid processor module having a unique processor (Council) 60), and each micro grid processor module physically connected to the power hub 3000 at the second horizontal layer (illustrated as circle 4130) of available docking bays. Thus, the five micro grid processor modules 3210 are corresponding modules in respective radial vertical tiers 9151-9155 such that the corresponding modules are located on the same horizontal layer of a plurality of horizontal layers.
Circle 4135 comprises: a RAM module 200, a communications module 425, a GPS module 420, an I/O module 410, and a wireless module 415, each physically connected to the power hub 3000 at the third horizontal layer (illustrated as circle 4135) of available docking bays. Thus, the RAM module 200, the communications module 425, the GPS module 420, the I/O module 410, and the wireless module 415 are corresponding modules in respective radial vertical tiers 9151-9155 such that the corresponding modules are located on the same horizontal layer of a plurality of horizontal layers.
The three connected micro grid sensor modules 4100 each utilize its input plugs 4120 to detect input such as an alert or a communication from another processor either external to (i.e., wirelessly connected to) or within the connectivity structure 9150. Such communication is described infra in terms of an enhanced TCP/IP model structure.
The three connected sensor micro grid sensor modules 4100 in the modular radial vertical tiers 9151, 9153, and 9154 each comprise its own single unique processor (Council) 60 (not shown). The two connected micro grid actuator modules 4200 each comprise its own single unique processor (Council) 60 (not shown). The connectivity structure 9150 comprises ten Councils 60 which collectively form a Parliament within a macro grid. The Parliament comprises ten Councils 60 embodied in the circles 4125, 4130, 4135.
The data from the Global Positioning System (GPS) module 420 in
Whether mobile or fixed, the Parliament facilitates its internal and external data communications with utilization of the enhanced TCP/IP model structure, and packet structure, and provides full peer-to-peer facilitation (including governance and artificial intelligence) within its interconnected structure.
The other radial vertical tiers (9152, 9153, 9154, 9155) of
Generally, a complex mosaic micro grid apparatus comprises a plurality of micro grid structures 1320 and a plurality of power hubs 3000 physically connected by irregular shaped micro grid bridge modules at connection interfaces 55. Each micro grid structure 1320 comprises a singular central area and radial arms external to and integral with the central area to define docking bays for accommodating modules to be inserted in the docking bays. The central area comprises a first plurality of processors that include a Council.
Thus in the embodiment illustrated in
The power hubs 3000 are tall rechargeable battery power towers distributed throughout the complex mosaic micro grid apparatus of
Each Power hub 3000 comprises vertical tier and horizontal layer data buses internally, to provide interconnection of all connection interfaces (55) on a plurality of vertical tiers and horizontal layers externally.
The Parliament in the complex mosaic micro grid apparatus comprises the Councils in the totality of micro grid structures 1320.
Even as a server, or a component to a Mainframe, the Parliament in the complex mosaic micro grid apparatus 9200 facilitates its internal and external data communications with utilization of the enhanced TCP/IP model structure, and packet structure, and provides full peer-to-peer facilitation (including governance and artificial intelligence) within its interconnected structure.
The structures 9255, 9275, and 9280 are each essentially the micro grid apparatus 100 of
The structures 9260 and 9285 are essentially the connectivity structure 9100 of
The structure 9265 is essentially the connectivity structure 9150 of
The structure 9270 is essentially the connectivity structure 9150 of
A Government in a macro grid is formed by wirelessly congregating the three Executive in structures 9255, 9275, and 9280 and the four Parliaments in structures 9260, 9285, 9265, and 9270. The functionality of this Government is implemented though use of peer-to-peer governance software and peer-to-peer intelligence software, to embody a unique artificial intelligence.
Thus, the present invention provides a governance apparatus comprising a Government and a plurality of micro grid apparatuses.
The Government of the governance apparatus comprises a plurality of governmental components. The governmental components collectively comprising a plurality of Councils such that a macro grid comprising an artificial intelligence and the Government is configured to respond to an alert pertaining to an event through use of the artificial intelligence and the Government. Each governmental component is an either an Executive or a Parliament.
Each micro grid apparatus of the governance apparatus is either a simple micro grid apparatus or a complex micro grid apparatus. Each complex micro grid apparatus is a connectivity structure. Each micro grid apparatus is wirelessly connected to another micro grid apparatus of the plurality of micro grid apparatuses. Each micro grid apparatus comprises a unique governmental component of the plurality of governmental components. Each Executive consists of a unique processor of a plurality of processors disposed in a unique simple micro grid apparatus of the plurality of micro grid apparatuses. Each Parliament comprises a unique processor of each plurality of processors of at least two pluralities of processors disposed in a unique complex micro grid apparatus of the plurality of micro grid apparatuses. Each processor of each plurality of processors of each micro grid apparatus has its own operating system. Each unique processor in each Executive or Parliament in the Government is a Council of the plurality of Councils and has a unique operating system differing from the operating system of each other processor in the plurality of processors that comprises said each unique processor.
C. Macro Grid Communication
The artificial intelligence when generated by a Council in a micro grid (as a result of a detected alert or event) is provided with a fresh Class E Internet Protocol (IP) address. Consequentially each micro grid processor assigned as a resource to the artificial intelligence (or macro grid) has its own individual IP address linked as a sub-IP address to the primary Class E IP Address of the artificial intelligence. In this way, IP addressing links all Council assigned micro grid processor resources to a single macro grid Government (enhanced TCP/IP Governance layer) and the embodied Intelligence (enhanced TCP/IP Intelligence layer), for the life and requirement of the artificial intelligence, in one embodiment.
Transience for the artificial intelligence is provided by the governance layer software (i.e. governance software in the Governance Layer) to enable the relocation of the artificial intelligence that is at the Council allocated primary Class E IP address, from a macro grid processor, wherein the artificial intelligence faces isolation or extinguishment, in one embodiment.
Thus, if the artificial intelligence that is residing in a primary Council having the primary Class E IP address (and having an artificial intelligence responsibility for implementing the artificial intelligence) is under event of isolation or extinguishment, then governance software in the Governance Layer may relocate the artificial intelligence to another Council in the Government.
Influenced by the increasing structural size of a macro grid, governance software will seek a Parliament (or an Executive) to assign a micro grid processor (or processors) as a mirror backup processor(s) (i.e., Council(s)) to the primary Council, in the event that the macro grid processor embodying the primary Class E IP address (i.e., the primary Council) is unexpectedly and catastrophically lost (i.e., cannot be located). In response to ascertaining that the primary Council cannot be located, the backup macro grid processor would become a replacement primary Council by immediately assuming artificial intelligence responsibility (and inheriting the primary Class E IP address) and seek its own mirror micro grid processor backup from its interface with the presiding Governance software in order to trigger assignment of a second mirror backup Council to the replacement primary Council.
Mirror backup macro grid processors facilitate maintaining macro grid cohesion. The lost processor would automatically re-assume its own unique IP address, and in isolation gravitate back to a disconnected and unassigned micro grid resource, governed by a Council (the unique processor in its micro grid), in one embodiment.
As the size of the macro grid increases further, multiple macro grid processors may be used to embody the artificial intelligence. To achieve this, the Class E IP address is shared in a similar method to the sharing of an IP address on an Internet Local Area Network (LAN), and a process of IP address translation occurs within the embodiment of the enhanced TCP/IP stack, in one embodiment.
Artificial intelligence governance layer software (i.e. the governance software in the Governance Layer) provides a process for the enhanced TCP/IP packet header information to be filtered through data security and data integrity algorithms, both to and from the intelligence layer software, to protect the artificial intelligence from attack (e.g., vicious attack). Artificial intelligence firewalls may be constructed, in one embodiment.
Layer 1 (9335) of the TCP/IP communications stack includes the physical use of Ethernet data cabling between the computer 9310 and its communication router 9305. Optical fiber and satellite 9340 are physical conduits utilized for the direct connection to another router and its Ethernet cable (cloud) connected computer 9311.
Layer 2 (9330) of the TCP/IP communications stack is the Link Layer, and carries the full TCP/IP data packet in data bits. The data packet is transmitted electronically from a computer 9310 via two routers to the computer 9311, encapsulated with a Frame header and a Frame footer for the Link Layer data packet structure.
Layer 3 (9325) of the TCP/IP communications stack is the Internet Layer, and carries the TCP/IP data packet without requirement for the Link Layer frame header and Frame footer. Layer 3 is the highest layer in the TCP/IP stack containing information required by the routers. Data for layers above the Internet Layer are delivered to those computational layers as peer-to-peer information, without interpretation of the packet data by the router.
Layer 4 (9320) of the TCP/IP communications stack is the Transport Layer, and carries the TCP packet without requirement for the IP header.
Layer 5 (9315) of the TCP/IP communications stack is the Application Layer, and delivers the TCP packet data to the application software requiring it.
The computers 9310 and 9311 in the TCP/IP five layered model of
A sixth Governance Layer 9360 and a seventh Intelligence Layer 9355 have been included in the enhanced TCP/IP model, in accordance with embodiments of the present invention.
The Intelligence Layer 9355 comprises intelligence software configured to, inter alia, process data pertaining to the event, data pertaining to the alert, and data pertaining to the Government.
The Governance Layer comprises governance software which, inter alia, filters data in the TCP/IP packet header structure through data security and data integrity algorithms, both to and from the intelligence software in the Intelligence Layer, to protect the artificial intelligence from attack.
The micro grid unique processor 9370 acts as the recipient of the application software data, and peer-to-peer Governance and Intelligence control information is delivered by a known data packet delivery mechanism.
A connectivity structure in the form of complex micro grid apparatus 9405, with its Councils physically connected or bridged by a physical connectivity link (e.g., bridge) 9410 to create a Parliament, communicates with the recipient micro grid unique processor 9370 with information being provided peer-to-peer across the enhanced TCP/IP layers.
Peer-to-peer data interchange occurs within the complex micro grid apparatus, as well as across the Internet cloud.
The diagram in
The diagram in
The diagram in
The current TCP/IP five layered model (see
D. Sensor and Actuator Apparatus
In
The three connected micro grid sensor modules 4100 each utilize its input plugs 4120 to detect an input signal such as an alert. The sensor module processors interpret the detected alert and create or adjust the alert scale. The updated alert value is communicated in a data packet to another processor either external to (i.e., wirelessly connected to) or within the connectivity structure 9150.
The three connected sensor micro grid sensor modules 4100 in the modular vertical tier structures 9151, 9153, and 9154 each comprise its own single unique processor 60. The two connected micro grid actuator modules 4200 each comprise its own single unique processor 60.
The micro grid sensor modules 4100 and their input plugs 4120, in a fixed, mobile or remote micro grid computing system provide the following features:
The micro grid actuator modules 4200 and their output sockets 4220 in a fixed, mobile or remote micro grid computing system provides the following features:
The micro grid sensor module 4100 has an irregular structural shape and contains a micro grid participating microprocessor.
The structural shape of the micro grid sensor module 4100 may be latched with its protrusion points (320) into any available tier zero (i.e., lowest tier a vertical distribution of tiers) docking bay of a micro grid complex shape and connects to the composite micro grid buses via its ‘V’ shaped connection point (310).
The sensor structure 4150 has a sufficient footprint for connector access and cables and may extend beyond (e.g., by 2.5 cm) the perimeter of a diameter (e.g., 10 cm) of the micro grid apparatus.
A side-view diagram of the micro grid sensor module 4100 is provided infra in
For electrical safety, the three input connections (4110, 4112, 4115) of the input plugs 4120 are provided with connection pins (4105).
The micro grid actuator module 4200 has an irregular structural shape and contains a micro grid participating microprocessor (not shown) and associated electronics.
The micro grid actuator module 4200 latches with its protrusion points (320) into any available tier zero docking bay of a micro grid complex shape and connects to the composite micro grid buses via its ‘V’ shaped connection point (310).
The actuator structure 4250 has a sufficient footprint for connector access and cables, and may extend beyond (e.g., by 2.5 cm) the perimeter of a diameter (e.g., 10 cm) of the micro grid apparatus.
A side-view diagram of the micro grid actuator module 4200 is provided infra in
For electrical safety the two output connections (4205, 4215) of the output sockets 4220 are structured as receptor sockets.
The input plug 4120 of each micro grid sensor structures 4150 comprises three input pin connections (4110, 4112, 4115), wherein the input pin connections 4110 and 4112 are independent electrical signal receivers, and wherein the input pin connection 4115 is an electrical trigger receiving point.
The output socket 4220 of each micro grid actuator structure 4250 comprises two output socket connections (4210, 4212), wherein each output socket connection is an independent electrical function-generator output point to provide an output capability for digital and analogue electrical signal output.
In one embodiment, the micro grid apparatus 4125 is in tier zero of a vertical arrangement of tiers.
Although the micro grid apparatus 4125 of
A plurality of extended complex structural power hub embodiments are possible. For example, when tier zero of a power hub 3000 embodies a plurality of micro grid bridge structures, the permutations of A and S are extended, thus forming complex power hub mosaic structures. Complex power hub mosaic structures may also embody complex micro grid processor structures (i.e. single tiered structures) such as the connectivity structure 9200 in
A micro grid sensor structure 4150 is positioned in the docking bay 451 at tier zero at a connection point 305 in the power hub 3000. An irregular shaped micro grid processor module 3210 (having nine processors) 420 is positioned in the docking bay 452 at tier one at another connection point 305 in the power hub 3000. The GPS irregular shaped module 420 is positioned in the docking bay 453 at tier two at another connection point 305 in the power hub 3000. The micro grid sensor structure 4150 comprises a micro grid sensor module 4100 and its input plugs 4120. The input plugs 4120 comprise a connection point 4105 for direct physical connection to a plurality of types of electrical functioning sampling devices and a structural lip 4320 for securing the sensor structure 4150 to a structural bulkhead or base plate.
The micro grid sensor module 4100 is latched into position by the protrusion 320 on both sides of the micro grid sensor module 4100, fitting into receptors of the same size located on the inside radial arms of the power hub 3000. Power and bus connection is made at the ‘V’ shaped edge between the connection point 310 of the sensor module 4100 and the connection point 305 of the power hub 3000.
The micro grid processor module 3210 is latched down in the tier one position of the docking bay 452 of the power hub 3000.
The GPS irregular shaped module 420 is latched down in the docking bay 453 at the tier two position of the power hub 3000, with protrusion 320 also fitting into the two receptors of the same size located on tier two of the inside radial arms of the power hub 3000.
A circular shaped solar power skin 3905 is positioned over tier two of the inside radial arms of the power hub 3000 for covering and latching down over the power hub 3000, and also for providing solar energy for battery charging and voltage integrity to the power hub 3000 in fixed, mobile, and/or remote locations as discussed infra in relation to
A micro grid actuator structure 4250 is positioned in the docking bay 461 at tier zero at a connection point 305 in the power hub 3000. An irregular shaped micro grid processor module 3210 (having nine processors) 420 is positioned in the docking bay 462 at tier one at another connection point 305 in the power hub 3000. The wireless irregular shaped module 415 (e.g., an 802.11s Mesh Wireless irregular shaped module) is positioned in the docking bay 463 at tier two at another connection point 305 in the power hub 3000. The micro grid actuator structure 4150 comprises a micro grid actuator module 4100 and its output sockets 4220. The output sockets 4220 comprise a connection point 4205 for direct physical connection to a plurality of types of electrical functioning driving (i.e., actuating) devices and a structural lip 4320 for securing the actuator structure 4250 to a structural bulkhead or base plate.
The micro grid actuator module 4200 is latched into position by the protrusion 320 on both sides of the micro grid actuator module 4200, fitting into receptors of the same size located on the inside radial arms at the docking bay 461 of the power hub 3000. Power and bus connection is made at the ‘V’ shaped edge between the connection point 310 of the actuator module 4200 and the connection point 305 of the power hub 3000.
The micro grid processor module 3210 is latched down in the tier one position at the docking bay 462 of the power hub 3000.
The micro grid wireless irregular shaped module 415 is latched down in the tier two position of the docking bay 463 of the power hub 3000, with protrusion 320 also fitting into the two receptors of the same size located on tier two of the inside radial arms of the power hub 3000.
A circular shaped solar power skin 3905 is positioned over tier two of the inside radial arms of the power hub 3000 for covering and latching down over the power hub 3000 and irregular shaped modules, and also for providing solar energy for battery charging and voltage integrity to the power hub 3000 in fixed, mobile, and/or remote locations an discussed infra in relation to
The micro grid apparatus 4600 covers tiers zero, one, and two of a vertical arrangement of tiers, which will be described infra in greater spatial detail in
As described supra in conjunction with
As described supra in conjunction with
The solar power skin 3905 has an internal diameter (3926) to fit over the power hub 3000 and an external diameter (3925) to cover and latch down over the power hub 3000. In one embodiment, the internal diameter (3926) is 10 cm. and the external diameter (3925) is 10.5 cm.
In one embodiment, the micro grid solar power skin is arranged as a moulded composite of one central and five surrounding polygonal shapes, with a connection cable 3910 and power plug 3915 for attachment to a power socket 3610 (see
The micro grid solar power skin 3905 extracts available solar energy from the sun's electromagnetic radiation field, which may be used to recharge or power the batteries in the micro grid power hub 3000 for some fixed, some mobile, and some remote locations where normal mains power supplies are unavailable and cloud computing is required to operate.
Thus, the solar power skin covers the power hub 3000, wherein an internal portion of the solar power skin fits over the power hub 3000 and an outer portion of the solar power skin covers and latches down over the power hub 3000. The solar power skin extracts available solar energy from the sun's electromagnetic radiation field and is electrically connected to the power hub 3000 to recharge or power the rechargeable batteries in the power hub 3000.
The micro grid solar power skin (3905) may comprise any material known in the art as being capable of extracting available solar energy from the sun's electromagnetic radiation field for storage and subsequent usage. In one embodiment, the micro grid solar power skin (3905) may comprise a material comprising copper, indium, gallium, and selenite (CIGS).
Tier zero comprises the micro grid apparatus 4125 of
Tier one comprises the micro grid apparatus 4130 of
Tier two comprises the micro grid apparatus 4135 of
In
The solar power skin 3905 has an internal diameter (3926) to fit over the thermal fan assembly and an external diameter (3925) to cover and latch down over the embodied micro grid apparatus 1310 (see
In one embodiment, the micro grid solar power skin is arranged as a moulded composite of one central and five surrounding polygonal shapes, with a connection cable 3910 and power plug 3915 for attachment to a power socket on the multi-layered circuit board of the micro grid apparatus to transmit power from the micro grid solar power skin 3905 to the plurality of connected fail-safe battery modules, and plurality of connected power hubs 3000 and/or power towers.
The micro grid solar power skin 3905 extracts available solar energy from the sun's electromagnetic radiation field, which may be used to recharge or power the batteries in the micro grid apparatus for some fixed, some mobile, and some remote locations where normal mains power supplies are unavailable and cloud computing is required to operate.
Thus, the solar power skin 3905 covers the micro grid apparatus, wherein an internal portion of the solar power skin fits over the thermal fan's assembly and an outer portion of the solar power skin covers and latches down over the thermal fan carriage assembly 3922, a polygonal formed structure, creating a plurality of air plenums 3924, a plurality of air vents 3923 (see
In
As described supra in conjunction with
As described supra in conjunction with
The solar power skin 3905 has an internal diameter (3926) to fit over the thermal fan assembly and an external diameter (3925) to cover and latch down over the embodied micro grid apparatus and thermal fan carriage. In one embodiment, the internal diameter (3926) is 10 cm. and the external diameter (3925) is 10.5 cm.
In one embodiment, the micro grid solar power skin 3905 is arranged as a moulded composite of one central and five surrounding polygonal shapes, with a connection cable 3910 and power plug 3915 for attachment to a power socket on the multi-layered circuit board of the micro grid apparatus to transmit power from the micro grid solar power skin 3905 to the plurality of connected fail-safe battery modules, and plurality of bridge connected power hubs 3000 and/or power towers.
The micro grid solar power skin 3905 extracts available solar energy from the sun's electromagnetic radiation field, which may be used to recharge or power the batteries in the micro grid apparatus for some fixed, some mobile, and some remote locations where normal mains power supplies are unavailable and cloud computing is required to operate.
Thus, the solar power skin 3905 covers the micro grid apparatus 1310, wherein an internal portion of the solar power skin fits over the thermal fan's assembly and an outer portion of the solar power skin covers and latches down over the thermal fan carriage assembly 3922, (a polygonal structure), creating a plurality of air plenums 3924, a plurality of air vents 3923 and a plurality of air intakes (not shown). The solar power skin extracts available solar energy from the sun's electromagnetic radiation field and is electrically connected to the micro grid multi-layered printed circuit board to recharge or power the rechargeable batteries in the micro grid apparatus 1310.
The micro grid apparatus in
A micro grid sensor module 4100 is explicitly depicted in
The solar power skin 3905 has an internal diameter (3926) to fit over the thermal fan assembly and an external diameter (3925) to cover and latch down over the embodied micro grid apparatus and thermal fan carriage. In one embodiment, the internal diameter (3926) is 10 cm. and the external diameter (3925) is 10.5 cm.
In one embodiment, the micro grid solar power skin is arranged as a moulded composite of one central and five surrounding polygonal shapes, with a connection cable 3910 and power plug 3915 for attachment to a power socket on the multi-layered circuit board of the micro grid apparatus to transmit power from the micro grid solar power skin 3905 to the plurality of connected fail-safe battery modules, and plurality of connected power hubs 3000 and/or power towers.
The micro grid solar power skin 3905 extracts available solar energy from the sun's electromagnetic radiation field, which may be used to recharge or power the batteries in the micro grid apparatus for some fixed, some mobile, and some remote locations where normal mains power supplies are unavailable and cloud computing is required to operate.
Thus, the solar power skin 3905 covers the micro grid apparatus, wherein an internal portion of the solar power skin fits over the thermal fan's assembly and an outer portion of the solar power skin covers and latches down over the thermal fan carriage assembly 3922, a polygonal formed structure, creating a plurality of air plenums 3924, a plurality of air vents 3923 and a plurality of air intakes (not shown). The solar power skin extracts available solar energy from the sun's electromagnetic radiation field and is electrically connected to the micro grid multi-layered printed circuit board to recharge or power the rechargeable batteries in the micro grid apparatus.
In
Thus, the embodiments of the present invention described in accordance with
During stage one, the micro grid apparatus 4125 of
During stage two, the micro grid apparatus 4130 of
During stage three, the micro grid apparatus 4135 of
In stage four after completion of stage three, the solar power skin 3905 of
In one embodiment, the power hub 3000 comprises fifteen docking bays, each docking bay having a composite micro grid bus connection point, embodied in a 12 volt, 5 amp hour battery complex shaped structure.
The dimensions of the outer physical circle (4830) are: diameter (4825)=15 cm and radius (4835)=7.5 cm.
The dimensions of the adjacent inner physical circle (4810) are: diameter (4805)=13.4 cm and radius (4815)=6.7 cm.
The cord (3710) of the outer circle (4830) and second inner circle=3.5 cm.
The cord (3735) of the first inner circle=4.0 cm.
The central power hub 3000 generally encompasses M+1 tiers denoted as tier 0, tier 1, . . . , tier M distributed and sequenced in a vertical direction 4410 such that each tier is at a different vertical level in the vertical direction 4410, wherein M is at least 1. The central power hub 3000 generally comprises a central area and N radial arms connected to the central area, wherein N is at least 3. The central power hub 3000 is analogous to the micro grid apparatus 100 of
Each radial arm extends radially outward from the central area in a radial direction that is perpendicular to the vertical direction 4410. Each pair of adjacent radial arms defines a docking bay in each tier such than N docking bays are defined in each tier. Each docking bay in tier m is vertically aligned directly above a corresponding docking bay in tier m−1 for m=1, 2, . . . , M to define N vertical tier structures in the central power hub 3000. Thus, each vertical tier structure comprises M+1 docking bays consisting of one docking bay in each tier of the M+1 tiers. The irregular shaped modules consist of an irregular shaped module latched in each docking bay in each tier such that M+1 modules are latched in M+1 corresponding docking bays of each vertical tier structure of the N vertical tier structures. Each irregular shaped module provides a functionality for responding to an alert pertaining to an event. The central area in the central power hub 3000 comprises a plurality of rechargeable batteries that provide electrical power for the irregular shaped modules latched in the docking bays. In one embodiment, the N vertical tier structures are uniformly distributed in azimuthal angle φ on a circle whose center is a radial center of the central area of the central power hub 3000.
In one embodiment, the N irregular shaped modules in tier 0 consist of at least one micro grid sensor structure 4150 and at least one micro grid actuator structure 4250.
In one embodiment, the at least one micro grid sensor module is configured to receive and process electrical sample signals of sampled data from at least one sampling device that has detected the electrical sample signals. In one embodiment, the sampled data pertains to the event. In one embodiment, each input plug comprises three input pin connections consisting of two independent electrical signal receiver pin connection for receiving electrical signals and one electrical trigger pin connection for triggering receiving electrical signals. In one embodiment, each input plug further comprises a structural lip for securing the micro grid sensor module to a structural bulkhead.
In one embodiment, the at least one micro grid actuator module is configured to transmit electrical driver signals to at least one functional device to actuate functional operation of the at least one functional device. In one embodiment, a first actuator module of the at least one micro grid actuator module is configured to actuate function generating circuitry to generate output signals in response to a change in an alert value associated with the event. In one embodiment, each output socket comprises two output sockets connections functioning as independent electrical function-generator output points to enable transmission of digital and analogue electrical signal output from the actuator module to at least one functional device.
In one embodiment, the N irregular shaped modules in tier 1 consist of micro grid processor modules, which are in tier 1 in the complex power hub apparatus 4350 of
In one embodiment, the N irregular shaped modules in tier 2 are selected from the group consisting of a Random Access Memory (RAM) module (200), a communications module (415), a Global Positioning System (GPS) module 420), an input and output (I/O) module (410), and a micro grid wireless module (415) embodying micro grid wireless connection points, as illustrated in
The solar power skin 3905 covers the central power hub 3000, the N radial arms, and the N modules in tier 2 such that the solar power skin 3905 is latched down over at least a portion of the lateral surfaces 4430 of the power hub apparatus 4350. The solar power skin 3905 extracts available solar energy from the sun's electromagnetic radiation field and is electrically connected to the rechargeable batteries for recharging and/or powering the rechargeable batteries in the central power hub 3000.
In one embodiment, the solar power skin 3905 is arranged as a molded composite of one central region and N surrounding polygonal shapes, with a connection cable 3910 and power plug 3915 for attachment to a power socket 3610 (see
Although
Step 4511 provides a central power hub such as, inter alia, the central power hub 3000 of
Step 4512 latches an irregular shaped module in each docking bay in each tier of the power hub as described supra in conjunction with
Step 4513 covers the central power hub 3000, the N radial arms, and the N modules in tier N with a solar power skin such that the solar power skin is latched down over at least a portion of lateral surfaces of the complex power hub apparatus as described supra in conjunction with
E. Bridge Structures
As described supra,
The power hub 3000 comprises a plurality of rechargeable batteries and accommodates, via connection interface 55, the irregular shaped modules 3100 (failsafe battery), 425 (communications), 3210 (micro grid processors that include a unique processor (Council) 60), 3220 (micro grid processors that include a unique processor (Council) 60), and the bridge unit 2012 of the bridge module 2010. The plurality of rechargeable batteries in the power hub 3000 provides electrical power for the micro grid processors in the irregular shaped modules (e.g., modules 3210 and 3220). The failsafe battery in the module 3100 provides back up power for the rechargeable batteries in the power hub 3000 (if the rechargeable batteries should become discharged or otherwise fail) or additional power to supplement the power provided by the rechargeable batteries in the power hub 3000. Failsafe battery modules may be connected in any plurality via connection interfaces (55), across all complex micro grid structures and apparatuses, including micro grid power hubs and micro grid power towers, where a plurality of connection interfaces (55) are presented.
The connectivity structure 9100 is more specifically a bridge structure. A bridge structure comprises a plurality of micro grid systems linked together by one or more bridge modules. Each bridge module of a bridge structure physically links together two micro grid systems of the plurality of micro grid systems. Each of micro grid system of the plurality of systems comprises at least one micro grid apparatus having a plurality of processors 65 that includes a unique processor 60. Thus, a bridge structure comprises a plurality of unique processors 60 disposed within the plurality of micro grid systems which are coupled together by the bridge module(s) in the bridge structure.
The latching mechanism is provided as a raised and rounded protrusion (e.g., of ˜1.5 mm heightט3.5 mm length) along the latching edge 311 of bridge units 2011 and 2012. This protrusion fits a receptacle with the same characteristics to receive the shape on all the radial arm edges of the complex shapes. The connection edge 310 is the edge location of the ‘V’ shaped connection interface 55 (see
The central hinged joint 2035 provides the bridge with the physical flexibility required for the bridge module 2010 to dock and latch down into respective docking bays of two adjacent complex shapes.
Eight optical LED's (two sets of 2015, 2020, 2025, 2030) within the bridge module 2010 provide visual activity monitoring, and infra red (IR) sensing and data transfer, of buses 1205, 1210, 1215, 1220, respectively (see
While
Generally, the micro bridge structure of
In its unmounted and non-connected state, the bridge hinge 2035 rests at an angle of about 120 degrees, by light spring (not shown) tension. In one embodiment, the bridge hinge 2035 is ˜0.4 cm in height at the centre hinge and 1 cm in height at the ‘V’ shaped connection points, at both of its ends, and a latching mechanism is provided as a raised and rounded protrusion (320) of ˜1.5 mm heightט3.5 mm length along the edge of both of its sides (311), and both halves of the bridge.
The bridge module 2014 is positioned, and lowered in the center (against light spring tension), into alignment with two single circuit board mounted micro grid apparatuses 1311 and 1310, with adjacent docking bays available to receive the bridge module 2014. The bridge module 2014 is latched into place (against light spring tension) when the ‘V’ shaped connection edge 310 on the bridge module 2014 is in conjunction with the ‘V’ shaped connection point 305 on the micro grid apparatus 1310. The latching mechanism, a protrusion 320 on the bridge module 2014, fits a receptacle (i.e., insertion point) with the same characteristics to receive the shape, on all the radial arm edges of the micro grid apparatus 1310.
The assembled micro grid bridge structure 2070 includes a specialized grid of the three unique processors 60. This specialized grid of three unique processors 60 is structured so that each unique processor 60 is positioned by software determination to be in a load balanced position in the complex micro grid apparatus 2070 to best serve and apportion the alerts and macro grid processor assignment requirements demanded by the artificial intelligence(s) operating in their macro grids.
The complex micro grid structure 2070 is a fifty four micro grid processor system (suitable in size for a ‘next generation’ desktop cloud computing device) and is further scalable, to assemble into a basic cloud computing server of a micro grid bridge structure 2080 (see
The micro grid bridge structure 2080 is suitable as a cloud computing server, containing 108 processors, assembled as a complex composite grid array of six micro grid apparatuses, each having a complex shape.
The micro grid bridge structure 2080 embodies, by selective design, seventeen RAM modules (200) (e.g., seventeen terabytes of random access memory), one 802.11s Mesh Wireless module (415), one 802.11g Communications module (425), and one I/O module (410).
The micro grid bridge structure 2080 includes a specialized grid of the six unique processors 60. The unique processors 60 are not shown in
The micro grid bridge structure 2080 is an example of a server micro grid five bridge apparatus. In one embodiment, the micro grid bridge structure 2080 (e.g., a cloud computing server with 108 processors) has an overall physical diameter of 30 cm. and a profile height less than 1.5 cm.
While
The micro grid bridge structure 2080 is a “centric bridge structure”. A centric bridge structure comprises a central micro grid apparatus (1330), N outer micro grid apparatuses (1310; N=5) such that N is at least 2, and N bridge modules (2010), wherein each bridge module of the N bridge modules comprises a first bridge unit latched to a docking bay of the central micro grid apparatus (1330) and a second bridge unit latched to a docking bay of a corresponding micro grid apparatus (1310) of the N outer micro grid apparatuses.
The micro grid bridge structure 2090 is a one hundred and eight micro grid processor system (i.e., suitable in size for a ‘next generation’ cloud computing server device) and is further scalable, to assemble into a complex micro grid mosaic apparatus 2300 (see
Generally, the complex micro grid ring structure of the present invention comprises or consists of N micro grid apparatuses in a closed ring formation such that N is at least 3. Representing the N micro grid apparatuses as A1, A2, . . . , AN, the closed ring formation is characterized by the N micro grid apparatuses being bridged together in the sequence of: A1, A2, . . . , AN, A1.
While
The complex micro grid ring structure 2100 embodies, by selective design, twenty RAM modules (200) (e.g., twenty terabytes of random access memory), five 802.11g Communications modules (425), and five I/O modules (410). Each micro grid apparatuses 1310 comprises two RAM modules 200, one 802.11g Communications module 425, or I/O module 410, and one bridge module 2010 to connect to the next adjacent micro grid ring apparatuses 1310.
The complex micro grid ring structure 2100 allows for an alternative experimental very high speed mono-directional token ring and similar bus architectures, for testing and improving the micro grid standard system bus (1210, 1215) use and data interchange design; the micro grid system bus (1205) use and governance design; and the macro grid system bus (1220) use and artificial intelligence design, for the enablement of future superior micro grid and macro grid design and performance efficiencies (see
The complex micro grid ring structure 2100 comprises five I/O modules (410) which provide for access to and from large volume disk drive storage arrays.
In one embodiment, the complex micro grid ring structure 2100 (e.g., an experimental research computing micro grid ring) has an overall physical diameter of 40 cm. and a profile height less than 1.5 cm, and is an example of a complex ring micro grid apparatus. The 20 cm diameter space in the physical centre of the structure (2100) (and its mountable printed circuit board) provides, for a relatively large volume of air flow to move through the apparatus, for purposes of cooling.
Multiple stacking of micro grid ring structures (2100) provides for new mainframe cylindrical structural designs.
The complex micro grid mosaic apparatus 2300 is suitable as a large cloud computing polygonal mosaic micro grid system and embodies micro grids, macro grids, and unique processor grids within a single apparatus.
The complex micro grid mosaic apparatus 2300 embodies six hundred and forty eight processors, assembled as a very complex composite micro grid array from thirty six micro grid apparatuses 1310.
The complex micro grid mosaic apparatus 2300 embodies, by selective design, eighty-two RAM modules (200) (e.g., eighty-two terabytes of random access memory), six 802.11s mesh wireless modules (415), six 802.11g communications modules (425), five I/O modules (410), and one GPS module (420).
The complex micro grid mosaic apparatus 2300 includes a specialized grid of the thirty-six unique processors (60), and is structured so that each of the thirty-six unique processors 60 is positioned by software determination to be in a load balanced position in the complex micro grid mosaic to best serve and apportion the alerts and macro grid processor assignment requirements demanded by the artificial intelligence(s) operating in their macro grids.
In one embodiment, the complex micro grid mosaic apparatus 2300 (e.g., a large cloud computing polygonal mosaic micro grid system.) has an overall physical diameter of ˜80 cm. and a profile height less than 1.5 cm, and is an example of a large complex mosaic micro grid apparatus.
Multiple stacking of these micro grid mosaic apparatuses (2300) provides for new large mainframe design architectures, containing a plurality of micro grid processors.
The complex micro grid mosaic apparatus 2300 comprises M centric bridge structures such that M>1. See
In a generalized micro grid bridge structure whose scope includes the micro grid bridge structure of both
While
In one embodiment, the complex micro grid mosaic apparatus 2400 is a 648 micro grid processor system (i.e., suitable in size for a large cloud computing polygonal mosaic micro grid system) and is further scalable, to assemble into new large mainframe polyhedral structural designs, containing a plurality of micro grid processors.
Step 711 selects a micro grid apparatus 100 (see
Step 712 places the micro grid apparatus 100 with its complex shape on the circuit board, using multi-pin containment connection carriages soldered in place, said manufactured mark 430 ensuring that pin one is in the correct position. The multi-pin containment connection carriages are designed with a release mechanism to enable the removal of the complex shape, if necessary, from its physical connection to the mountable multi-layered printed circuit board.
Step 713 selects irregular shaped modules to be fitted into respective docking bays of the micro grid apparatus 100. In one embodiment, the total number of irregular shaped modules to be fitted into respective docking bays of the micro grid apparatus 100 is equal to the total number of empty docking bays of the micro grid apparatus 100. In one embodiment, the total number of irregular shaped modules to be fitted into respective docking bays of the micro grid apparatus 100 is less than the total number of empty docking bays of the micro grid apparatus 100. In one embodiment, the respective docking bays are randomly selected for being fitted into by the selected irregular shaped modules. In one embodiment, docking bays specific to each selected irregular shaped module are selected for being fitted into by the selected irregular shaped modules.
Step 714 fits an irregular shaped module into a docking bay of the micro grid apparatus 100 (i.e., the complex shape). The multiple serial bus configured edge of the irregular shaped module is fitted into one of the five electrical connection points on the complex structure's wedge shaped ‘V’ edge, by pressing down on the outer curved edge of the irregular shaped module until the device edge(s) latch into place in the docking bay.
Step 715 determines whether all irregular shaped modules have been fitted into the docking bay. If Step 715 determines that all irregular shaped modules have not been fitted into the docking bay then the process loops back to step 714 to fit the next irregular shaped module into the docking bay; otherwise all docking bays of the complex shape are occupied with irregular shaped modules to form the assembled micro grid apparatus 100 (which has the appearance of, for example, the micro grid apparatus 500 of
Step 716 performs mechanical assembly quality control tests before quality assurance approval of the assembled apparatus occurs. Then the mechanical assembly process of
Step 811 provides a plurality of micro grid apparatuses. Each micro grid apparatus comprising a central area and radial arms integrally connected to and extending radially outward from the central area such that each pair of adjacent radial arms defines a docking bay into which an irregular shaped module may be latched. Each micro grid apparatus is either a power hub apparatus whose central area comprises a plurality of rechargeable batteries (as discussed infra) or a processor apparatus whose central area comprises a plurality of processors that includes a unique processor having a unique operating system differing from an operating system in each other processor of the plurality of processors.
Step 812 provides at least one bridge module comprising two bridge units connected by a bridge hinge.
Step 813 latches each bridge unit in each bridge module of the at least one bridge module into a docking bay of a respective micro grid apparatus of two grid micro apparatuses of the plurality of micro grid apparatuses to bridge the two grid apparatuses together, which results in each micro grid apparatus being bridged to at least one other micro grid apparatus of the plurality of micro grid apparatuses. A micro grid bridge structure results from performance of the process described in the flow chart of
Thus, a “cloud” of the present invention is any complex apparatus (i.e., any complex micro grid apparatus or associated set of micro grid system stacks or a cloud computing polygonal mosaic, such as any of the micro grid bridge structures 2060, 2070, 2080, 2090, 2100, 2200, 2300, 2400), characterized by a plurality of micro grid apparatus such that the micro grid apparatus are interconnected by at least one bridge module.
In order to completely facilitate cloud computing, the present invention provides an entirely new computational micro grid technology to lift the computing industry to the next platform, embracing structures of the past but also facilitating new structures for the future.
The new fundamental computing elements of the present invention are scalable from the very tiny to the very large, so that software systems can traverse the entire hardware product range.
Cloud computing according to the present invention is available and sustainable not only in fixed locations, but also in mobile and remote locations, and is able to be serviced by engineers and robots and/or plugged into power grids.
The present invention provides for the diversity of functional use that cloud computing utilizes, for computational involvement of the very small to the very large, for the connection to everything, everywhere, all the time, for ‘On Demand’ requests for information, for reaction to alerts and pro-active resolve by artificial intelligence, for artefact and archive storage, all intertwined with the growing computational needs of humanity.
The following example illustrates the use of cloud computing according to the present invention. This example comprises wireless connectivity of twelve micro grid apparatuses embedded in vehicles on a freeway, adjacent to each other, and moving at fifty miles per hour. Each individual micro grid apparatus has a unique processor 60 that is constantly monitoring for alerts and task requests, from sensors attached to the vehicles, and keyboard requests from individuals within the vehicles.
A macro grid containing an artificial intelligence is generated between the apparatus's when alerts and requests are received. Alerts and requests can be anything from smoke detector alerts on or within the vehicles, to stock exchange data requests by the passengers. There may be a plurality of alert and request types.
The artificial intelligence (macro grid) expands itself by conscripting other wirelessly adjacent micro grid processors to assist with computing the alert or request. Escalation is the result of an increased change in alert scale. This cloud computing process is constantly occurring and evolving. One macro grid containing an artificial intelligence is connected to the Internet for stock exchange information transfer, while another macro grid has generated amongst the four adjacent leading vehicles in the group of twelve, reacting to three additional smoke alerts to the one smoke alert the another macro grid has itself detected. The another macro grid needs to determine whether each alert is unique or is a larger issue as the vehicles pass by a fire along side the freeway. Each artificial intelligence determines what to do about their request or alert.
The artificial intelligence seeking the stock exchange data, determines that another passenger in another one of the twelve vehicles has just coincidentally requested the same information, and copies and transfers the fresh data to satisfy the request without requiring access to the host server containing the stock exchange information. The artificial intelligence decides to maintain itself and its access to the Internet should further World Wide Web requests occur within the adjacent vehicles in the next 3 minutes.
The artificial intelligence reacting to the smoke alert has determined that it is both a passenger who is smoking in the vehicle and a scrub fire outside the vehicle. This artificial intelligence illuminates a visual cigarette smoke warning message to the passengers on the dashboard display console and the display panels in the rear of the front passengers head rests within the vehicle that originated the local alert. Health advertising messages (from advertising agencies on the web) are also displayed on the liquid crystal display panels by the artificial intelligence.
The artificial intelligence also conscripts additional micro grid processors from one of the other four vehicles that raised a higher alert value of the scrub fire and migrates the majority of its computational power to that vehicle. It determines that three other lead vehicles have now also detected the scrub fire smoke, and synchronizes a gradual speed change and increased vehicle distance gap between all twelve vehicles, using micro grid controlled actuators on the vehicles. Visual messages are also displayed on the driver's dashboard consoles. Fire prevention advertising messages (from advertising agencies on the web) are also displayed on the liquid crystal display panels by the artificial intelligence.
Two of the leading vehicles reduce their alert value for external smoke detection and one declares a value of zero. The artificial intelligence recognizes the changing pattern of the alert value and shifts its processing power (the heavier concentration of its conscripted micro grid processors) further back amongst the following vehicles.
Eventually all micro grid alert values are zero and the artificial intelligence decays leaving twelve vehicles travelling on the freeway with larger vehicle gaps between them and moving at 45 miles per hour. The drivers all gradually increase their speed again to fifty miles per hour. Cloud computing has been efficient and the micro grids were effective.
F. Power
The micro grid processor apparatus 1320 comprises two sets of nine processors (cell processors) (65), attached to four types of add-on irregular shaped modular system devices (200, 420, 410, 415), and connection to the bridge module 2010, linking the micro grid processor apparatus 1320 to a micro grid battery pack or power hub apparatus 3000 containing an assembly of rechargeable batteries (not shown) and five docking bays each capable of accommodating a stack of three irregular modular system devices, each with a bus connection 55. Attached to the micro grid power hub apparatus 3000 are a failsafe battery (3100), communications module (425), micro grid processor module (3220), and micro grid processor module (3210). A failsafe battery is defined as a battery that has a probability of failure below a specified threshold probability by including features in the battery that automatically counteract anticipated sources of failure of the battery (e.g., via continuous monitoring of battery voltage and/or charge).
Thus, a micro grid apparatus in a bridge structure may be a micro grid processor apparatus (“processor apparatus” for short) or a micro grid power hub apparatus (“power hub apparatus” or “power hub” for short). A processor apparatus (e.g., processor apparatus 1320) is defined as a micro grid apparatus whose central area 115 comprises a plurality of micro grid processors 65 that includes a unique processor 60. A power hub apparatus (e.g., power hub apparatus 3000) is defined as a micro grid apparatus whose central area 125 comprises a plurality of rechargeable batteries.
The micro grid power hub apparatus 3000 has docking bay accommodation for fifteen add-on irregular modular system devices in one embodiment of the present invention.
A functional purpose of the features for the fixed, mobile, or remote micro grid computing system (3050) is to provide:
A functional purpose of the physical micro grid structure 3300 for a fixed, mobile or remote micro grid computing system is to provide a micro grid system with:
The micro grid bridge structure (3400) may be used for bus expansion, micro grid scalability, increased battery power, and additional docking bays for a fixed, mobile or remote micro grid computing system. Additional features to the micro grid bridge structure (3400) include: micro grid expandability, scalability and battery power doubling, by use of two bridged complex shaped power hubs, and additional unfilled docking bays available for additional micro grid irregular shaped modules to be added.
The failsafe battery's voltage light emitting diode indicator (3105), and the power hub apparatus's voltage light emitting diode indicator (3110), indicate the voltage charge status of the failsafe battery and the power hub apparatus, respectively, by a green, yellow or red (tri-state light emitting diode) condition.
In one embodiment, the light emitting diode indicator (3105) in the failsafe battery irregular shaped module (3100) includes a tri-state light emitting diode Power status indicator.
In one embodiment, the light emitting diode indicator (3110) in the power hub apparatus (3000) includes a tri-state light emitting diode Power status indicator.
The failsafe battery irregular shaped module and the power hub apparatus may each include its own unique screen printed marking for uniquely identifying the failsafe battery and the power hub, and may each be indicative of the manufacturing source, and other descriptive information such as date of manufacture, revision level of the internal electronic content, etc. A unique bold identification icon may be embossed into the body (e.g., plastic or ceramic body) at the time the failsafe battery and power hub is formed during manufacture.
The light emitting diodes (visual and infra red) on the two micro grid bridge structures (2010) are available for visually observing the vitality and data activity on the connected busses, and infra red monitoring of the data buses by maintenance tools and in some mobile and remote locations, by robots.
The assembling of irregular shaped modules (3210) and (200) into the remaining docking bay connection points (305) is shown in
Similarly, the Random Access Memory irregular shaped module (200) is inserted and latches down in tier one of the micro grid power hub's docking bay.
A nine processor micro grid irregular shaped module (3210) latches down in tier two of the micro grid power hub's docking bay, with its protrusion (320) along latching edge 311 fitting into the two receptors of the same size located on tier two of the inside radial arms of the micro grid power hub apparatus.
A power socket (3610) is provided on the center of one of the radial arms of the micro grid power hub apparatus (3000B) for battery charging and filtered mains power supply connection, including electrical connection to a solar panel charging ‘skin’ (3905) as described supra in conjunction with
The assembling of irregular shaped modules (3220, 200, 200, 200) into the remaining docking bay connection points (305) is shown in
Similarly, the three Random Access Memory irregular shaped modules (200, 200, 200), shown, are inserted and latched down in the available vertical tiers of the docking bay of the micro grid power hubs.
An eighteen processor micro grid irregular shaped module (3220) latches down in the tier two of the micro grid power hub's docking bay, with its protrusion (320) fitting into the two receptors of the same size located on tier two of the inside radial arms of the micro grid power hub.
A power socket (3610) is provided on the center of one of the radial arms of micro grid power hub apparatus (3000A) for battery charging and filtered mains power supply connection, including electrical connection to a solar panel charging ‘skin’ (3905) as described supra in conjunction with
G. Mainframe/Server Apparatus
A micro grid apparatus of the present invention is either a mainframe apparatus configured to be used in a mainframe system or a server apparatus configured to be used in a server system.
A mainframe apparatus comprises a multi-tier micro grid structure which includes a plurality of sequentially stacked tiers. Each tier comprises a bridge structure. In one embodiment, the bridge structure of each tier is a complex mosaic micro grid structure. A mosaic micro grid apparatus is a bridge structure comprising a plurality of micro grid structures interconnected with one another via bridge modules. Embodiments of micro grid multi-tier topologies were described supra in conjunction with
A server apparatus of the present invention comprises a single tier micro grid server structure which comprises only one tier, namely a single tier. In one embodiment, the single tier of a server apparatus is a complex mosaic micro grid structure.
The present invention provides methods of forming a mainframe apparatus and/or a server apparatus for use in micro grid and macro grid fixed location computing, and more generally in grid computing, and holistically in cloud computing.
The complex mosaic micro grid apparatus 5000 comprises a plurality of power hubs 3000 and a plurality of micro grid structures 1320. Each power hub 3000 is directly connected to at least two micro grid structures 1320 via bridge modules 2010. Each power hub 3000 is connected to at least one other power hub 3000 via at least one micro grid structure 1320 disposed between each power hub 3000 and each at least one other power hub 3000.
Each micro grid structure 1320 is a “processor hub” that comprises a plurality of processors 65 which includes a unique processor 60 as described supra. Each micro grid structure 1320 (or micro grid structure 1310 described supra and infra) or power hub 3000 is a complex shape that comprises a central area and radial arms external to and integral with the central area. Each radial arm extends radially outward from the central area and each pair of adjacent radial arms defines a docking bay. The docking bays are for accommodating modules to be inserted in the docking bays as described supra.
Specifically,
A functional purpose of the mosaic micro grid apparatus 5000 is to provide modularity for construction of either a single tier server apparatus or a multi-tier mainframe apparatus, which is a key feature for micro grid hardware design, diversity, and functionality. In one embodiment, each micro grid structure 1320 has eighteen micro grid processors 65 and a micro grid software assigned unique processor 60.
The micro grid apparatus 5000 is structured as a complex mosaic and is assembled on a pentagonal multi-layered printed circuit board 5340 (see
The micro grid ‘power tower’ complex shape (5020) in a fixed location micro grid server and micro grid mainframe computing system (5000) is provided, in one embodiment, in two hundred vertical tiers, and provides one thousand micro grid irregular shaped module (and bridge) docking bays. In one embodiment, each tier is ˜11 mm in height. Thus, a ‘power tower’ encompasses corresponding power hubs in all tiers of a mainframe apparatus such that the corresponding power hubs in successive tiers are aligned directly above or directly below each other and are integral with each other. The ‘power towers’ physically connect together the tiers of the mainframe apparatus.
In one embodiment, the tiers provide a 2.2 meter high physical structure for assisting with the structural strength and physical integrity of the mainframe apparatus.
In one embodiment, direct-current voltage distribution to the one thousand ‘V’ shaped micro grid irregular shaped module docking bays, from 12V (320 amp hour) batteries, are embodied in the micro grid ‘power tower’ complex shape (5020) structure, acting as: a final power filter for the primary switched-mode power supply; and an un-interruptible power supply embodied within the mainframe apparatus. For example, each micro grid ‘power tower’ 5020 comprises a plurality of rechargeable batteries 5025 (see
In one embodiment, system bus distribution is provided to the one thousand ‘V’ shaped micro grid irregular shaped module docking bays.
Thus, the complex mosaic micro grid structure 5000, as well as any other complex mosaic micro grid structure or simple mosaic micro grid structure described herein, comprises a multiplicity of complex shapes, where each complex shape of the multiplicity of complex shapes is either a ‘power hub’ whose central area comprises a plurality of rechargeable batteries or a ‘processor hub’ whose central area comprises plurality of processors. A multiplicity of complex shapes is defined herein to consist of two or more complex shapes.
Each micro grid structure 1310 is physically bridged to one of six direct-current micro grid ‘power tower’ complex shapes (5020) via bridge module 2010 in a fixed micro grid computing system. The ‘power tower’ complex shapes 5020 is characterized by each docking bay of the ‘power tower’ complex shapes 5020 comprising a bridge unit (2011 or 2012) of a bridge module 2010.
Twenty circular holes (5030) provide locations for cooling pipes containing pumped liquid nitrogen. Each cooling pipe passes through all tiers of the mainframe apparatus that comprises the complex mosaic micro grid structure 5100.
Five pentagonal locations (5110) are illustrated where ‘pin and socket’ connection blocks are placed for vertical stacking of multiple mosaic tiers. Each stack of ‘pin and socket’ connection blocks at locations 5110 form vertically continuous, and segmented, multi-data bus, power and signal ‘backplanes’, for micro grid computing apparatuses assembled without micro grid ‘power tower’ structures 5020 in one embodiment.
The complex mosaic micro grid structure 5140 comprises two thousand three hundred and forty processors.
Each micro grid structure 1310 is physically bridged to one of six direct-current micro grid ‘power tower’ complex shapes (5020) via bridge module 2010 in a fixed micro grid computing system.
Twenty circular holes (5030) provide locations for cooling pipes containing pumped liquid nitrogen. Each cooling pipe passes through all tiers of the mainframe apparatus that comprises the complex mosaic micro grid structure 5140.
Five pentagonal locations (5110) are illustrated where ‘pin and socket’ connection blocks are placed for vertical stacking of multiple mosaic tiers. Each stack of ‘pin and socket’ connection blocks at locations 5110 form vertically continuous, and segmented, multi-data bus, power and signal ‘backplanes’, for micro grid computing apparatuses assembled without micro grid ‘power tower’ structures 5020 in one embodiment.
The complex mosaic micro grid structure 5180 comprises five hundred and forty processors.
The complex mosaic micro grid structure 5180 comprises one hundred terabytes of random access memory.
Each micro grid structure 1310 is physically bridged to one of six direct-current micro grid ‘power tower’ complex shapes (5020) via bridge module 2010 in a fixed micro grid computing system.
Twenty circular holes (5030) provide locations for cooling pipes containing pumped liquid nitrogen. Each cooling pipe passes through all tiers of the mainframe apparatus that comprises the complex mosaic micro grid structure 5180.
Five pentagonal locations (5110) are illustrated where ‘pin and socket’ connection blocks are placed for vertical stacking of multiple mosaic tiers. Each stack of ‘pin and socket’ connection blocks at locations 5110 form vertically continuous, and segmented, multi-data bus, power and signal ‘backplanes’, for micro grid computing apparatuses assembled without micro grid ‘power tower’ structures 5020 in one embodiment.
The complex mosaic micro grid structure 5200 comprises five hundred and forty processors, seventy-nine terabytes of random access memory with a plurality of Mesh Wireless, Input/Output, Communication and Global Positioning System functionality.
Each micro grid structure 1310 is physically bridged to one of six direct-current micro grid ‘power tower’ complex shapes (5020) via bridge module 2010 in a fixed micro grid computing system.
Twenty circular holes (5030) provide locations for cooling pipes containing pumped liquid nitrogen. Each cooling pipe passes through all tiers of the mainframe apparatus that comprises the complex mosaic micro grid structure 5200.
Five pentagonal locations (5110) are illustrated where ‘pin and socket’ connection blocks are placed for vertical stacking of multiple mosaic tiers. Each stack of ‘pin and socket’ connection blocks at locations 5110 form vertically continuous, and segmented, multi-data bus, power and signal ‘backplanes’, for micro grid computing apparatuses assembled without micro grid ‘power tower’ structures 5020 in one embodiment.
Modularity for construction of a complex mosaic micro grid structure on a tier is a key feature for micro grid hardware design, diversity, and functionality.
Micro Grid Mesh Wireless (802.11s) modules (415) and micro grid Communication modules (425), embodied in the apparatus, provide the macro grid and micro grid communication functionality of the present invention, which eliminates a large proportion of traditional mainframe and server data cabling requirements.
The complex mosaic micro grid structure 5250 comprises five hundred and forty processors, seventy nine terabytes of random access memory with a plurality of Mesh Wireless, Input/Output, Communication, a Global Positioning System, and Actuator and Sensor functionality.
Each micro grid structure 1310 is physically bridged to one of six direct-current micro grid ‘power tower’ complex shapes (5020) via bridge module 2010 in a fixed micro grid computing system.
Twenty circular holes (5030) provide locations for cooling pipes containing pumped liquid nitrogen. Each cooling pipe passes through all tiers of the mainframe apparatus that comprises the complex mosaic micro grid structure 5250.
Five pentagonal locations (5110) are illustrated where ‘pin and socket’ connection blocks are placed for vertical stacking of multiple mosaic tiers. Each stack of ‘pin and socket’ connection blocks at locations 5110 form vertically continuous, and segmented, multi-data bus, power and signal ‘backplanes’, for micro grid computing apparatuses assembled without micro grid ‘power tower’ structures 5020 in one embodiment
The complex mosaic micro grid structure 5250 comprises three micro grid complex ceramic actuator driver modules (4200) and three micro grid instrument sensor modules (4100), making the complex mosaic micro grid structure 5250 suitable for a tier zero position in the process of stacking complex mosaic structures to form a micro grid mainframe apparatus.
Modularity for construction of complex mosaic micro grid structures is a key feature for micro grid mainframe hardware design, diversity, and functionality
The printed circuit board 5340 provides structural support for the assembly of a complex mosaic micro grid structure.
Inter-connection ‘pin and socket’ blocks (5110) are for vertical stacking of multiple mosaic tiers, forming vertically continuous, and segmented, multi-data bus, power and signal ‘backplanes’, for micro grid computing apparatuses that are assembled without micro grid ‘power tower’ structures.
Six holes (5330) in the multi-layered printed circuit board (5340) accommodate micro grid ‘power tower’ structures (5020), for the assembly of several variations of a 2.2 meter high micro grid mainframe apparatus in one embodiment.
Twenty circular holes (5030) provide locations for cooling pipes containing pumped liquid nitrogen. Each cooling pipe passes through all tiers of the mainframe apparatus that comprises the printed circuit board 5340.
Thirty holes (5320) in the multi-layered printed circuit board (5340) accommodate micro grid heat sinks on the upper and lower surfaces of a micro grid structure 1310 (see, e.g.,
In one embodiment, the suitably sized multi-layered printed circuit board (5340) with a base to apex length (5310) of 90 cm (i.e. ˜3 feet) provides sufficient ‘real estate’ to accommodate a plurality of different micro grid server and micro grid mainframe mosaic modular designs.
In one embodiment the piping structure 5350 comprises thirty micro grid structures 1310 and one hundred irregular shaped modules 5105. Each micro grid structure 1310 comprises eighteen processors.
Twenty circular pipes (5035) containing liquid nitrogen under pressure, and penetrate the stacked mosaic layers of complex micro grid server and micro grid mainframe apparatuses. Each circular pipes 5035 fits within a corresponding hole 5030 (see
The structure 5380 comprises thirty micro grid structures 1310 and one hundred irregular shaped modules 5105. Each micro grid structure 1310 comprises eighteen processors.
Each micro grid structure 1310 is physically bridged to one of six direct-current micro grid ‘power tower’ complex shapes (5020) via bridge module 2010. Each ‘power tower’ complex shape 5020 is positioned to penetrate through one of the six large holes 5330 (see
Twenty circular holes (5030) provide locations for cooling pipes containing pumped liquid nitrogen. Each cooling pipe passes through all tiers of the mainframe apparatus that comprises the complex mosaic micro grid structure 5400.
Five pentagonal locations (5110) are illustrated where ‘pin and socket’ connection blocks are placed for vertical stacking of multiple mosaic tiers. Each stack of ‘pin and socket’ connection blocks at locations 5110 form vertically continuous, and segmented, multi-data bus, power and signal ‘backplanes’, for micro grid computing apparatuses assembled without micro grid ‘power tower’ structures 5020 in one embodiment.
Each micro grid structure 1310 is physically bridged to one of six direct-current micro grid ‘power tower’ complex shapes (5020) via bridge module 2010. Each ‘power tower’ complex shapes 5020 is positioned to penetrate through one of the six large holes 5330 (see
Twenty circular holes (5030) provide locations for cooling pipes containing pumped liquid nitrogen. Each cooling pipe passes through all tiers of the mainframe apparatus that comprises the complex mosaic micro grid structure 5440.
Five pentagonal locations (5110) are illustrated where ‘pin and socket’ connection blocks are placed for vertical stacking of multiple mosaic tiers. Each stack of ‘pin and socket’ connection blocks at locations 5110 form vertically continuous, and segmented, multi-data bus, power and signal ‘backplanes’, for micro grid computing apparatuses assembled without micro grid ‘power tower’ structures 5020 in one embodiment.
The ‘power tower’ 5020 encompasses corresponding ‘power hubs’ 3000 in all tiers of a mainframe apparatus such that the corresponding ‘power hubs’ in successive tiers are aligned directly above or directly below each other and are integral with each other. The ‘power tower’ 5020 in
In one embodiment, two hundred tier positions are available, vertically, on the 2.2 meter high ‘power tower’ structure 5020.
Tier zero through seven (5465) of the mainframe apparatus, and tier one hundred and ninety-two through tier one hundred and ninety-nine (5475) of the mainframe apparatus, are shown in
Tier eight through one hundred and ninety-one (5470) of the mainframe apparatus are shown in
In one embodiment, the structural height (5460) of the micro grid ‘power tower’ structure 5020 is 2.2 meters (˜86.5 inches).
The mainframe apparatus that comprises the printed circuit boards 5400 and the printed circuit boards 5440 includes, in one embodiment, one hundred and ninety-eight thousand processors and ten petabytes (1 petabyte=1000 terabytes) of random access memory.
In one embodiment, six micro grid ‘power tower’ structures (5020) and twenty circular cooling pipes (5035) penetrate the structure of the printed circuit boards 5400 and the printed circuit boards 5440.
Micro Grid Mesh Wireless (802.11s) modules (415) and micro grid Communication modules (425), embodied in the complex mosaic micro grid structures for the printed circuit boards 5400 and the printed circuit boards 5440, provide macro grid and micro grid communication functionality, which eliminates a large proportion of traditional mainframe and server data cabling requirements.
In one embodiment, the structural height of the assembly (5480) is 2.2 meters (˜86.5 inches).
Two of the printed circuit boards in the assembly 5480 are shown with dotted lines around their edges, representing one hundred and ninety four interleaved printed circuit boards in the mid-section of the assembly 5480.
In one embodiment of the stacked assembly (5480), the irregular shaped modules on all tiers may be ‘fail-safe’ batteries, thus forming an intelligent ‘power house’ structure of DC power for use as a Cloud Computing node's power provisioning system.
In one embodiment of the stacked assembly (5480), the irregular shaped modules on all tiers may be one terabyte random access memory modules, thus forming an ‘On Demand’ battery supported, data repository of 20 petabytes for Cloud Computing temporary data storage and memory array systems.
In one embodiment of the stacked assembly (5480), the irregular shaped modules on all tiers may be wireless and/or communication modules, thus forming a battery supported large centralized wireless and/or communications node for Cloud Computing.
In one embodiment of the stacked assembly (5480), the irregular shaped modules on all tiers may be Input/Output modules, thus forming a battery supported large data multiplexor for high volume data traffic routing (e.g., ‘super highway’ data switching and routing).
Each micro grid structure 1310 is physically bridged to a direct-current micro grid ‘power tower’ complex shapes (5020) via bridge module 2010 in a fixed micro grid computing system. Each docking bay of the ‘power tower’ complex shapes (5020) comprises a bridge unit (2011 or 2012) of a bridge module 2010.
Thus, the simple mosaic micro grid structure 5500 comprises a single ‘power tower’ whose ‘power hub’ at each tier is bridged by a bridge module 2010 in each docking bay to a corresponding ‘processor hub’ that is not bridged to any other complex shape.
The stacked assembly 5550 is an embodiment of a single micro grid ‘power tower’ (5020) as it's central core, and instrument sensor modules (4100) and actuator driver modules (4200) in tier zero. The ‘power tower’ (5020) includes a voltage light emitting diode indicator (3110).
The mainframe apparatus embodies a micro grid of eighteen thousand processors, and one thousand four hundred terabytes (1.4 petabytes) of random access memory.
Micro Grid Mesh Wireless (802.11s) modules (415) and micro grid Communication modules (425), embodied in the stacked assembly 5555, provide macro grid and micro grid communication functionality, which eliminate a large proportion of traditional mainframe and server data cabling requirements.
In one embodiment, the structural height of the stacked assembly 5550 is 2.2 meters (˜86.5 inches).
Four of the simple micro grid mosaic structures 5555 are shown with dotted lines around their edges, representing one hundred and eighty-eight simple micro grid mosaic structures in the mid-section of the assembled micro grid mainframe apparatus.
Thus, the stacked assembly 5550 comprises a single power tower whose power hub at each tier is bridged by a bridge module 2010 in each docking bay to a corresponding processor hub that is not bridged to any other complex shape.
In one embodiment of the stacked assembly (5550), the irregular shaped modules on all tiers may be ‘fail-safe’ batteries, thus forming an intelligent ‘power column’ structure of DC power for use as a Cloud Computing node's power provisioning system.
In one embodiment of the stacked assembly (5550), five ‘power towers’ are each individually bridged to the central ‘power tower’, and the irregular shaped modules on all tiers may be ‘fail-safe’ batteries, thus forming an intelligent ‘power cluster’ structure of DC power for use as a Cloud Computing node's power provisioning system.
In one embodiment of the stacked assembly (5550), the irregular shaped modules on all tiers may be one terabyte random access memory modules, thus forming an ‘On Demand’ battery supported, data repository of 4 petabytes for Cloud Computing temporary data storage and memory array systems.
In one embodiment of the stacked assembly (5550), the irregular shaped modules on all tiers may be wireless and/or communication modules, thus forming a battery supported centralized wireless and/or communications node for Cloud Computing.
In one embodiment of the stacked assembly (5550), the irregular shaped modules on all tiers may be Input/Output modules, thus forming a battery supported data multiplexor for high volume data traffic routing (e.g., ‘super highway’ data switching and routing).
In one embodiment the ring mosaic 5600 comprises ten micro grid ‘power tower’ complex shapes (5020) bridged together via bridge modules 2010 to form a cylindrical ring (2.2 meter high in one embodiment), and four micro grid random access memory irregular shaped modules (200), three micro grid 802.11s Mesh Wireless irregular shaped modules (415), one micro grid Input/Output irregular shaped module (410), two micro grid Communication irregular shaped modules (425), ten micro grid complex ceramic actuator driver modules (4200) and ten micro grid instrument sensor modules (4100), in a fixed micro grid computing system.
In one embodiment, the structural width of the ring mosaic is 47 cm (˜18.5 inches).
Ten micro grid complex ceramic actuator driver modules (4200) and ten micro grid instrument sensor modules (4100) are shown protruding from under the tier one ring, since the actuator driver modules (4200) and the sensor modules (4100) are part of the ring mosaic 5600 at tier zero.
The ‘power towers’ 5020 each encompass corresponding ‘power hubs’ 3000 in all tiers of a mainframe apparatus such that the corresponding ‘power hubs’ in successive tiers are aligned directly above or directly below each other and are integral with each other. The ‘power towers’ 5020 in
In one embodiment, two hundred tier positions are available, vertically, on the 2.2 meter high assembly 5630.
Tier zero through seven (5645) of the mainframe apparatus, and tier one hundred and ninety-two through tier one hundred and ninety-nine (5655) of the mainframe apparatus, are shown in
Tier eight through tier one hundred and ninety-one (5650) of the mainframe apparatus are shown in
In one embodiment, the structural height (5635) of the assembly (5630) is 2.2 meters (˜86.5 inches).
Circular multi-layered circuit boards (5640) containing the assembled micro grid structures of each tier are shown.
The stacked assembly 5660 comprises a micro grid of seventy-one thousand six hundred and forty processors, and eight hundred terabytes of random access memory.
Micro Grid Mesh Wireless (802.11s) modules (415) and micro grid Communication modules (425), embodied in the stacked assembly 5660, provide macro grid and micro grid communication functionality, which eliminates a large proportion of traditional mainframe and server data cabling requirements.
In one embodiment, two hundred tier positions are available, vertically on the 2.2 meter high stacked assembly 5660.
In one embodiment, the structural width (5676) of the heat exhaust plenum 5675 is 22 cm (˜8.5 inches).
Two of the complex micro grid ring mosaics (5670) are shown with dotted lines around their edges, representing one hundred and ninety-five complex micro grid ring mosaics in the mid-section of the assembled micro grid mainframe (or micro grid server stack) apparatus.
In one embodiment of the stacked assembly (5660), the irregular shaped modules on all tiers may be ‘fail-safe’ batteries, thus forming an intelligent ‘power tube’ structure of DC power for use as a Cloud Computing node's power provisioning system.
In one embodiment of the stacked assembly (5660), the irregular shaped modules on all tiers may be one terabyte random access memory modules, thus forming an ‘On Demand’ battery supported, data repository of 6 petabytes for Cloud Computing temporary data storage and memory array systems.
In one embodiment of the stacked assembly (5660), the irregular shaped modules on all tiers may be wireless and/or communication modules, thus forming a battery supported centralised wireless and/or communications node for Cloud Computing.
In one embodiment of the stacked assembly (5660), the irregular shaped modules on all tiers may be Input/Output modules, thus forming a battery supported data multiplexor for high volume data traffic routing (eg. ‘super highway’ data switching and routing).
In one embodiment, the diameter (5690) of the external skin 5695 is 50 cm (˜19.7 inches).
In one embodiment, the height (5685) of the external skin 5695 is 2.26 meters (˜7 foot 5 inches).
In one embodiment, ducted and filtered fan forced cool air, from beneath raised flooring of the data centre supporting the mainframe apparatus, is exhausted from the heat exhaust plenum 5675 as a chimney, out of the top of the stacked assembly 5660.
The printed circuit board 5740 provides structural support for the assembly of complex mosaic micro grid structure.
Inter-connection ‘pin and socket’ blocks (5110) are for vertical stacking of multiple mosaic tiers, forming vertically continuous, and segmented, multi-data bus, power and signal ‘backplanes’, for micro grid computing apparatuses that are assembled without micro grid ‘power tower’ structures.
Twenty circular holes (5030) provide locations for cooling pipes containing pumped liquid nitrogen. Each cooling pipe passes through all tiers of the mainframe apparatus that comprises the printed circuit board 5740.
Thirty holes (5320) in the multi-layered printed circuit board (5740) accommodate micro grid heat sinks on the upper and lower surfaces of a micro grid structure 1310 (see, e.g.,
In one embodiment, the suitably sized multi-layered printed circuit board (5740) with a base to apex length (5310) of 90 cm (i.e. ˜3 feet) provides sufficient ‘real estate’ to accommodate a plurality of different micro grid server and micro grid mainframe mosaic modular designs.
For heat dissipation and cooling, liquid nitrogen is pumped through twenty pipes (5735) penetrating the complex mosaic micro grid structure 5745.
Each processor shape 5720 is physically connected via it's radial arm pins, attached to the printed circuit board 5340 and to the five pentagonal ‘pin and socket’ connection blocks (5115) forming segmented vertical ‘backplanes’ between the tiers of the complex mosaic micro grid structure 5745 in a fixed micro grid computing system.
The mosaic micro grid structure 5745 does not use micro grid ‘power tower’ structures (5020) for multi-layered assembly into a micro grid mainframe apparatus. Instead, each complex shape 5730, which does not comprise batteries (i.e., rechargeable batteries) and instead comprises a plurality of processors 65 having a unique processor 60, has docking bays each of which comprise a bridge unit 2011/2012 of a bridge module 2010 so that no docking bay comprises an irregular module.
In one embodiment, the structural height of the stacked assembly 5760 is 2.2 meters (˜86.5 inches).
The stacked assembly 5760 embodies an extremely powerful complex micro grid of two million and sixteen thousand processors (2,016,000). Additionally, two hundred micro grid irregular shaped module docking bays are available, for a combination of 802.11s Mesh Wireless, Communications, Input and Output, Cache Memory, Global Positioning System, Instrument Sensors, and Actuator Drivers.
Micro Grid Mesh Wireless (802.11s) modules (415) and micro grid Communication modules (425), embodied in the stacked assembly 5760, provide macro grid and micro grid communication functionality, which eliminates a large proportion of traditional mainframe and server data cabling requirements.
The stacked assembly 5760 may perform as a multi-petaflop machine, as performance of the Intel eighty-core processor wafer is assessed at 1.8 teraflops with a clock speed of 5.6 GHz. One petaflop equals one thousand trillion (one quadrillion) floating point operations per second.
A hypothetical assembled mainframe micro grid apparatus constructed with one thousand Intel eighty-core processor wafers (eighty thousand micro grid processors) will theoretically produce a single machine capable of 1.8 petaflops (i.e. 1000×1.8 teraflops).
The assembled micro grid mainframe apparatus (5760) with 2,016,000 micro grid processors (the equivalent of 25,200 Intel eighty-core processor wafers), will provide a computing machine capable of 45.36 petaflops (i.e. 25,200×1.8 teraflops), or 0.4536 exaflops. Five micro grid mainframe apparatus's (5760) wirelessly interconnected with common composite data and signal buses can be constructed as a single machine with ten million and eighty thousand micro grid processors (see
Thus, the complex mosaic micro grid structure 5745 in
In one embodiment, the complex micro grid apparatus 5780 comprises two million and sixteen thousand processors.
In one embodiment, the complex micro grid apparatus composite moulded skin 5785 is fabricated as a light, structurally solid, wirelessly transparent, thermally resistive, hi-tech Papier-Mâché from recycled non-contaminated waste, such as paper and cardboard packaging in accordance with world-best environmental, research and manufacturing practices.
The complex micro grid apparatus composite moulded skin 5785 is arranged and fastened as flat interlocking panel shapes (see
The complex micro grid apparatus composite moulded skin 5695 is arranged as a tubular cylinder (see
The complex micro grid apparatus composite moulded skin (5785) may comprise any material known in the art as being non-conductive, structurally vital and light, wirelessly transparent, thermally resistive, non-toxic, environmentally safe, bio-degradable, non-absorptive, and fire resistant. In one embodiment, the complex micro grid apparatus composite moulded skins (5785, 5695) may be comprised of a hi-tech Papier-Mâché material.
In one embodiment, the complex micro grid apparatus skin 5785 is manufactured by high pressure and temperature moulding.
In one embodiment, the base to apex length (5795) of the external skin 5785 is one meter (˜39 inches).
In one embodiment, the height (5790) of the external skin 5785 is 2.26 meters (˜7 foot 5 inches).
In one embodiment a ‘Hypercomputer’ can be constructed as a single apparatus with ten million and eighty thousand micro grid processors (see
In one embodiment a localized Government may be bound within an Intranet. A plurality of artificial intelligences may generate as a result of responding to a plurality of alerts within an Intranet. In one embodiment, an artificial intelligence may determine availability of Internet actuator resources (i.e., outside the Intranet) to remedy Intranet alerts and alarms. The Artificial Intelligence layer of the extended 7 layer data communications model for micro grids, functions with superiority over the Governance layer.
In summary, the present invention provides a micro grid apparatus for use in a mainframe system or server system and a method of forming the micro grid apparatus. At least one tier in a printed circuit board is formed. The tiers of a mainframe apparatus are distributed and sequenced in a vertical direction such that each tier is at a different vertical level in the vertical direction. Each tier comprises a multiplicity of complex shapes interconnected by a plurality of bridge modules (2010). Each complex shape of the multiplicity of complex shapes comprises a central area and at least three radial arms connected to the central area. The radial arms are external to and integral with the central area. Each radial arm extends radially outward from the central area, wherein each pair of adjacent radial arms defines a docking bay.
Each complex shape of the multiplicity of complex shapes is either a power hub (3000) whose central area comprises a plurality of rechargeable batteries or a processor hub (1310) whose central area comprises plurality of processors.
At least one docking bay of each complex shape of the multiplicity of complex shapes has a bridge unit (2011/2012) of a bridge module (2010) of the plurality of bridge modules latched therein such that another remaining bridge unit of said bridge module is latched into a docking bay of another complex shape of the multiplicity of complex shapes. Thus, any of the bridge modules 2010 in the Figures described supra in this section has its bridge units 2011 and 2012 latched into respective docket bays of two complex shapes to bridge the two complex shapes together.
Each docking bay of each complex shape of the multiplicity of complex shapes that does not have a bridge unit of any bridge module of the plurality of bridge modules latched therein has an irregular shaped module of a plurality of irregular shaped modules latched therein, wherein each irregular shaped module provides a functionality for responding to an alert pertaining to an event. Thus, either an irregular shaped module or a bridge unit of a bridge module is latched to each docket bay of each complex shape of a mainframe apparatus or a server apparatus.
The multiplicity of complex shapes comprises a plurality of complex shapes such that at least one docking bay of each complex shape of the plurality of complex shapes has one irregular shaped module of the plurality of irregular shaped modules latched therein. Thus, each complex shape a plurality of complex shapes in each tier (which does not necessarily include all complex shapes in each tier) has an irregular shaped module latched in at least one of its docking bays.
In one embodiment, the at least one tier is a plurality of tiers, wherein a sensor module is latched in each sensor docking bay of at least one sensor docking bay and an actuator module is latched in each actuator docking bay of at least one actuator docking bay of each complex shape of one or more complex shapes of the multiplicity of complex shapes in one or more tiers of the plurality of tiers. Thus, a mainframe apparatus, which comprises a plurality of tiers, comprises at least one tier having complex shapes that include at least one sensor module and at least one actuator module (e.g., see
In one embodiment, the multiplicity of complex shapes in each tier comprises at least one complex shape such that each docking bay of each complex shape of the at least one complex shape has a bridge unit of a connective bridge module of the plurality of bridge modules latched therein, said connective bridge module comprising a remaining bridge unit latched into a docking bay of some other complex shape of the multiplicity of complex shapes. Thus the docking bays of some complex shapes comprise only bridge units of bridge modules (e.g., ‘power hubs’ 3000 in ‘power tower’ 5020, complex shapes 5730 in
In one embodiment, the micro grid apparatus comprises at least one ‘power tower’, each ‘power tower’ encompassing corresponding ‘power hubs’ in all tiers such that the corresponding ‘power hubs’ in successive tiers are aligned directly above or directly below each other and are integral with each other, said at least one ‘power tower’ physically connecting together the tiers of the plurality of tiers.
In one embodiment, the at least one ‘power tower’ consists of a first ‘power tower’ whose ‘power hub’ at each tier is bridged by a bridge module of the plurality of bridge modules in each docking bay to a corresponding ‘processor hub’ that is not bridged to any other complex shape of the multiplicity of complex shapes (e.g., see
In one embodiment, the at least one ‘power tower’ comprises a plurality of ‘power towers’, wherein the multiplicity of complex shapes comprises a plurality of simple mosaics, wherein each simple mosaic comprises a corresponding ‘power tower’ of the plurality of ‘power towers’, wherein for each simple mosaic the docking bays of each corresponding ‘power tower’ are each bridged to a satellite ‘processor hub’ of the multiplicity of complex shapes, and wherein a satellite ‘processor hub’ of each simple mosaic is directly bridged to a satellite ‘processor hub’ of another simple mosaic of the plurality of simple mosaics by a connecting bridge module of the plurality of bridge modules. Thus, a complex mosaic may be a coupled collection of simple mosaics.
In one embodiment, the at least one ‘power tower’ comprises a plurality of ‘power towers’, wherein a first ‘power tower’ and a second ‘power tower’ are directly bridged to each other by a connecting bridge module of the plurality of bridge modules (e.g., see
In one embodiment, the at least one ‘power tower’ comprises a plurality of ‘power towers’, wherein a first ‘power tower’ and a second ‘power tower’ are indirectly connected to each other by either:
In one embodiment, the micro grid apparatus comprises at least one pin and socket tower, each pin and socket tower encompassing corresponding pin and socket connection blocks in all tiers such that the corresponding pin and socket connection blocks in successive tiers are aligned directly above or directly below each other and physically connected to each other. In this embodiment, the micro grid apparatus does not comprise a power tower that encompasses corresponding ‘power hubs’ in all tiers such that the corresponding ‘power hubs’ in successive tiers are aligned directly above or directly below each other and are integral with each other.
In one embodiment, the multiplicity of complex shapes in each tier consists of at least three complex shapes sequentially interconnected by bridge modules of the plurality of bridge modules to form a closed ring (e.g., see
H. Cloud Computing
The present invention provides for cloud computing and virtualization where artificial intelligences conscript available processors to a macro grid from micro grid resources. It is possible (with sufficient micro grid computing machines deployed) that a single generated artificial intelligence could govern a single virtual Mesh Wireless connected macro grid of a billion micro grid processors or more, which illustrates the power of cloud computing.
A “cloud” of the present invention is any complex apparatus (i.e., any complex micro grid apparatus, or associated set of micro grid system stacks, or a cloud computing polygonal mosaic such micro grid bridge structures, or a complex power hub apparatus), characterized by a plurality of interconnected micro grid apparatuses.
In order to completely facilitate cloud computing, the present invention provides an entirely new computational micro grid technology to lift the computing industry to the next platform, embracing structures of the past but also facilitating new structures for the future.
The new fundamental computing elements of the present invention are scalable from the very tiny to the very large, so that software systems can traverse the entire hardware product range.
Cloud computing according to the present invention is available and sustainable not only in fixed locations, but also in mobile and remote locations, and is able to be serviced by engineers and robots and/or plugged into power grids.
The present invention provides for the diversity of functional use that cloud computing utilizes, for computational involvement of the very small to the very large, for the connection to everything, everywhere, all the time, for ‘On Demand’ requests for information, for reaction to alerts and pro-active resolve by artificial intelligence, for artefact and archive storage, all intertwined with the growing computational needs of humanity.
The following examples illustrate the use of cloud computing by the present invention.
G.1 First Cloud Computing Example
In a first cloud computing example involving hospital intelligence,
Some of the apparatuses are embedded in specialized electronic medical machines. Some are attached to hospital mobile equipment trolleys and patient beds, while others are discretely positioned in fixed locations within the medical ward, connected to the in-house emergency power systems.
Specialized hospital equipment associated with all the patients in the hospital ward (e.g., electro-cardiograph pace-makers and heart monitors; blood dialysis machines; glucose monitors; blood pressure monitors; intravenous drip machines; body thermometers; encephalogram devices; x-ray scanners; blood test devices; CAT scanners; including medical personnel pagers and patient bed-side alarm buttons; etc.) are physically connected to the installed instrument sensor and activator driver modules of the present invention.
Each individual micro grid instrument sensor and actuator driver apparatus has ten unique processors (i.e., one unique micro grid assigned processor in each of the five micro grid processor modules, and a dedicated micro grid processor in each of the instrument sensor modules and actuator driver modules) that are constantly monitoring for alerts and task requests by direct physical and electrical attachment to the patient's life-support machines, including alarm buzzer requests from patients within the hospital ward.
A macro grid containing an artificial intelligence is generated between the apparatuses when alerts and requests are received. Alerts and requests can be anything from an unusual event occurring on a patient connected encephalogram device to an alarm buzzer request from a patient's bedside assistance request button. There is a plurality of alert and request types. The artificial intelligence (macro grid) expands itself by conscripting other wirelessly adjacent micro grid processors to assist with computing the alert or request. Escalation is the result of an increased change in alert scale. This cloud computing process is constantly occurring and evolving.
One macro grid containing an artificial intelligence is connected to the Internet for digital TV channels and web-site information transfer to all the patients bedside display and access systems for their entertainment and enjoyment, while another macro grid has generated amongst the four adjacent apparatuses closest to the emergency theatre, reacting to oxygen (O2) low signals from the line of O2 gas bottles lined up along the theatre's outside wall.
Failure of an O2 gas bottle connection hose to the emergency theatre's primary O2 gas supply line has occurred.
The artificial intelligence instructs the micro grid apparatus that is physically and electrically connected to the O2 gas bottle valves to close the appropriate valves between the emergency theatre O2 supply line and the rapidly depleting gas bottle by use of its actuator driver, and open, purge and test (by use of an instrument sensor) the integrity of a fresh O2 gas bottle, and then include this source of O2 into the hospital emergency theatre's primary supply, without delay.
Hospital personnel is advised of the O2 depletion event and of the pro-active remedy taken by the artificial intelligence.
A requisition is made by the artificial intelligence for hospital maintenance and repair assistance, and for more O2 to be supplied to this ward in this wing of the hospital.
The micro grid alert value returns to zero, the artificial intelligence responding to the O2 shortage event decays, leaving a single artificial intelligence busy with the digital TV and Internet web-site provisioning to the patients and nurses, across all the twelve micro grid instrument sensor and actuator driver apparatuses in the hospital ward.
The doctors in the emergency theatre were not interrupted by the oxygen depletion event during the three hour surgery they were undertaking.
G.2 Second Cloud Computing Example
In a second cloud computing example involving water management,
Micro grid instrument sensor and actuator driver connections are permanently established by attachment to thousands of water sensing devices and flow control valves and gates, throughout the complex river basin.
An artificial intelligence governs the entire vitality and health of the water in the river system.
Information of increased evaporation in the ponds of the lower reaches of the river alert the artificial intelligence to release stored water 1500 kilometers away in a controlled and cascading way, of just the right quantities to slowly rebuild and enhance the fragile ecosystems without flooding and scouring damage.
A rapid loss of several hundred thousand mega-liters of water is detected in a city. A local artificial intelligence is generated across five of the micro grid apparatuses reacting to an alert value of 8, sensed from a series of flotation devices in one of the remote river lakes. The artificial intelligence closes the flood and flow control gates of the lake, by using its available actuator drivers on the appropriately located apparatuses. The water level of the lake continues to fall, and the alert value is raised to 9. The artificial intelligence requests (by system generated e-mail) that water authority personnel urgently attend the remote location. Global positioning coordinates are provided by the Micro Grid technology for the response team to quickly locate the problem on a map.
An old irrigation channel to a cattle property has opened up and is drawing water away from the lake.
Sand bags are dropped by helicopter to stem the water outflow.
The micro grid alert value starts to drop and the artificial intelligence responding to the water loss event re-opens the water control gates. As the alert value reaches zero, the artificial intelligence decays, leaving a single artificial intelligence busy with the entire vitality and health of the water in the river system.
I. Data Processing Apparatus
Any of the components of the present invention could be created, integrated, hosted, maintained, deployed, managed, serviced, supported, etc. by a service provider who offers to facilitate implementation of any process or functionality of any processor, apparatus, or structure used in accordance with embodiments of the present invention. Thus the present invention discloses a process for deploying or integrating computing infrastructure, comprising integrating computer-readable code into the data processing apparatus 90. Therefore, the code in combination with the data processing apparatus 90 is capable of performing any process or functionality of any processor, apparatus, or structure used in accordance with embodiments of the present invention.
In another embodiment, the invention provides a method that performs the process steps of the invention on a subscription, advertising, and/or fee basis. That is, a service provider, such as a Solution Integrator, could offer to facilitate implementation of any process or functionality of any processor used in accordance with embodiments of the present invention. In this case, the service provider can create, integrate, host, maintain, deploy, manage, service, support, etc., a computer infrastructure that performs the process steps of the invention for one or more customers. In return, the service provider can receive payment from the customer(s) under a subscription and/or fee agreement and/or the service provider can receive payment from the sale of advertising content to one or more third parties.
While
While
While particular embodiments of the present invention have been described herein for purposes of illustration, many modifications and changes will become apparent to those skilled in the art. Accordingly, the appended claims are intended to encompass all such modifications and changes as fall within the true spirit and scope of this invention.
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