A layout system automatically generates via definitions for a routing tool based on manufacturability of vias based on the via definitions. A physical verification tool of the system applies a set of preliminary via definitions to an integrated circuit test design at each of a plurality of offsets from a plurality of via locations to generate a set of candidate via definitions. candidate via definitions that violate one or more design rules are discarded. A hierarchy constructor tool ranks the resulting candidate via definitions based on a combination of their manufacturability and frequency of applicability in the test design, and a predefined number of the candidate via definitions are selected based on their ranking. These selected via definitions can be used by a routing tool to generate a layout for another (non-test) integrated circuit device.
|
5. A non-transitory computer readable medium embodying a set of executable instructions, the set of executable instructions to manipulate at least one processor to perform a method comprising:
apply a plurality of preliminary via definitions to a test design of a test integrated circuit device to identify a set of candidate via definitions;
generate a set of selected via definitions based on a comparison of the candidate via definitions to a set of design rules, the set of selected via definitions to be used by a design tool for design of an integrated circuit device by:
identifying, for each of the set of candidate via definitions, a set of offsets where the corresponding preliminary via definition can be used without violating any of the set of design rules; and
ranking the set of candidate via definitions based on a design-for-manufacturability (dfm) characteristic and the identified set of offsets for each of the set of candidate via locations, wherein ranking comprises:
identifying, for each of the set of candidate via definitions, a set of offsets where the corresponding preliminary via definition can be used without violating any of the set of design rules; and
ranking the set of candidate via definitions based on the dfm characteristic and the identified set of offsets for each of the set of candidate via locations by:
establishing a set of links between the preliminary via definitions of the candidate via definitions and their corresponding offsets;
assigning a preliminary weight to each of the set of links based on the corresponding preliminary via definition's corresponding dfm characteristic; and
adjusting the preliminary weight of at least one of the set of links based on the preliminary via definition associated with links having the highest total weight to identify a set of adjusted weights; and
generating the set of selected via definitions based on the set of adjusted weights; and
generating a layout of an integrated circuit device based data representing the set of selected via definitions.
1. A computer-implemented method comprising:
applying, at a computer device, a plurality of preliminary via definitions to an integrated circuit test design to identify a set of candidate via definitions;
generating and storing at the computer device data representing a set of selected via definitions based on a comparison of the candidate via definitions to a set of design rules, the set of selected via definitions to be used by a design tool for design of an integrated circuit device; and
generating at the computer device a layout of the integrated circuit device based on the data representing the set of selected via definitions;
wherein generating the data representing the set of selected via definitions comprises:
generating the data representing the set of selected via definitions by ranking the set of candidate via definitions based on a design-for-manufacturability (dfm) characteristic;
wherein ranking the set of candidate via definitions comprises:
identifying, for each of the set of candidate via definitions, a set of offsets where a corresponding preliminary via definition can be used without violating any of the set of design rules; and
ranking the set of candidate via definitions based on the dfm characteristic and the identified set of offsets for each of the set of candidate via locations; and
wherein each of the set of candidate via definitions includes a corresponding preliminary via definition and offset, and herein generating the set of selected via definitions comprises:
establishing a set of links between the preliminary via definitions of the candidate via definitions and their corresponding offsets;
assigning a preliminary weight to each of the set of links based on the corresponding preliminary via definition's corresponding dfm characteristic;
adjusting the preliminary weight of at least one of the set of links based on the preliminary via definition associated with links having the highest total weight to identify a set of adjusted weights; and
generating the set of selected via definitions based on the set of adjusted weights.
2. The method of
applying a first preliminary via definition of the plurality of preliminary via definitions at a first via location of the test design to generate a first candidate via definition of the set of candidate via definitions; and
applying the first preliminary via definition at a first offset from the first via location to generate a second candidate via definition of the set of candidate via definitions.
3. The method of
applying a second preliminary via definition of the plurality of preliminary via definitions at the first via location of the test design to generate a third candidate via definition of the set of candidate via definitions; and
applying the second preliminary via definition at the first offset from the first via location to generate a fourth candidate via definition of the set of candidate via definitions.
4. The method of
identifying the preliminary via definition associated with links having the highest total weight;
identifying a first set of links connected to the identified preliminary via definition;
identifying a set of offsets connected to the identified first set of links;
identifying a second set of links connected to the set of offsets; and
generating a set of adjusted weights for the second set of links by subtracting the corresponding weight of one of the first set of links from the corresponding weights of the second set of links.
6. The computer readable medium of
apply a first preliminary via definition of the plurality of preliminary via definitions at a first via location of the test design to generate a first candidate via definition of the set of candidate via definitions; and
apply the first preliminary via definition at a first offset from the first via location to generate a second candidate via definition of the set of candidate via definitions.
7. The computer readable medium of
apply a second preliminary via definition of the plurality of preliminary via definitions at the first via location of the test design to generate a third candidate via definition of the set of candidate via definitions; and
apply the second preliminary via definition at the first offset from the first via location to generate a fourth candidate via definition of the set of candidate via definitions.
8. The computer readable medium of
identify the preliminary via definition associated with links having the highest total weight;
identify a first set of links connected to the identified preliminary via definition;
identify a set of offsets connected to the identified first set of links;
identify a second set of links connected to the set of offsets; and
generate a set of adjusted weights for the second set of links by subtracting the corresponding weight of one of the first set of links from the corresponding weights of the second set of links.
|
1. Field of the Disclosure
The present disclosure relates generally to integrated circuit devices and more particularly to vias for integrated circuit devices.
2. Description of the Related Art
An integrated circuit device typically includes vias to connect different metal layers of the integrated circuit device. The vias can have different shapes, surrounding metal area, and other characteristics that determine the reliability and manufacturability of the vias. A via design having a particularly high level of reliability and manufacturability is referred to as a design-for-manufacturability, or DFM, via. Typically, the greater the number of DFM vias in an integrated circuit device design, the greater the manufacturing yield and reliability of the integrated circuits resulting from the design.
It is typically desirable to include as many DFM vias in the integrated circuit device design as practical. However, because of design rule restrictions, layout issues, and other factors, DFM vias sometimes cannot be used in particular via locations of the integrated circuit device. Accordingly, during design of the integrated circuit device, a routing tool is sometimes used to identify via locations where DFM vias can be used. The routing tool is supplied with a plurality of via definitions, with each definition representing a different via design and associated DFM quality. At each via location, the routing tool attempts to use each via definition, and selects the definition that has the highest DFM quality and does not violate a routing rule or other design rule. The ability of the routing rule to improve the overall manufacturability of the integrated circuit device depends on the quality of the supplied via definitions. However, generation of the via definitions is typically done manually, consuming a large amount of time and engineering resources.
The present disclosure may be better understood, and its numerous features and advantages made apparent to those skilled in the art by referencing the accompanying drawings. The use of the same reference symbols in different drawings indicates similar or identical items.
The IC layout system 100 is generally configured to perform at least two operations: automatic generation of a set of selected via definitions 119 and use of the selected via definitions 119 to prepare an integrated circuit device layout 151 to be used to create integrated circuit devices corresponding to an integrated circuit device design 150. In at least one embodiment, the IC layout system 100 may be part of a larger system of design and testing tools to generated the integrated circuit device layout 151, wherein the system includes modules to perform design qualification tests, manufacturing qualification tests, verification tests, device timing tests, and the like.
To generate the selected via definitions 119, the IC layout system 100 employs a test design 101. The test design 101 reflects a layout for a test integrated circuit device, including one or more test structures and via locations for vias to connect metal layers of the test integrated circuit device. The test structures can reflect fully functional electrical circuits, such as processor cores, memory controllers, memory devices, and the like, or can be structures that do not reflect fully functional electrical circuits, but are structures that have characteristics similar to a functional electrical circuit. For example, the test structures may be collections of logic gates that are do not perform any useful function, but are arranged to consume a similar amount of area in an integrated circuit device as a functional structure, such as a processor core or memory area.
The test design 101 is reflected in a design file 102. In at least one embodiment, a portion of the test design 101 is first instantiated in a set of design requirements indicating specified behavior to be achieved by defined modules of the test design 101. Based on the design requirements, one or more designers can use a software development environment executing at one or more computer devices to generate the test design 101. For example, the designers can employ register transfer language (RTL) or other descriptor language to create computer-implemented modules that are expected to achieve the design requirements. The computer devices generate the design file 102 based on the computer implemented modules. In some embodiments, the design file 102 is generated as a machine interpretable (e.g. computer interpretable) file that describes the layout of the test design 101 according to a standard or proprietary format. The design file 102 thus describes each semiconductor layer of the test design 101 and the relative position of each test structure and via location in the test design 101.
To generate the selected via definitions 119, the IC layout system 100 first generates a set of candidate via definitions 110 using a physical verification tool 104 to iteratively apply a set of preliminary via definitions 103 to via locations of the test design 101 and to identify whether the resulting via positions would violate any of a set of design rules 105. The preliminary via definitions 103 are a set of predefined via definitions each describing a different via topology. In particular, each of the preliminary via definitions 103 describes a via having a corresponding via topology, consisting of the shape and area of the via itself, and the shape and area of any surrounding metal. A physical verification tool 104 assigns to each of the preliminary via definitions a corresponding initial manufacturability value, referred to herein as a DFM value. In at least one embodiment, the preliminary via definitions 103 are supplied by the semiconductor foundry or other manufacturer that is expected to manufacture integrated circuits based on the device design 150. Each DFM value reflects a corresponding combination of the relative ease with which the corresponding via topology can be manufactured by a semiconductor foundry or other manufacturer, and the expected reliability of the resulting via. For example, via topologies having a larger area of via and larger surrounding metal are typically assigned a higher initial DFM value, reflecting greater manufacturability and reliability, than topologies having smaller via areas and smaller surrounding metal layers. As described further herein, the initial DFM values are used to identify the expected manufacturability of the candidate via definitions 110 and the expected manufacturability is used to select particular candidate via definitions for particular via locations in the device layout 151 so that overall manufacturability of the integrated circuit devices based on the device layout 151 is improved.
The physical verification tool 104 is a design tool that can apply defined geometric structures, such as the preliminary via definitions 103, to any position of an integrated circuit layout, such as the layout of the test design 101 as reflected in the design file 102. In addition, the physical verification tool 104 can identify whether the application of the structures at a particular position violates any of the design rules 105. The design rules 105 can reflect recommended or required parameters indicating restrictions on how structures, including vias, can be placed in an integrated circuit layout. For example, the design rules can indicate required spacing between structures in the integrated circuit layout to ensure that structures do not interfere with each other.
The design file 102 indicates a set of recommended or expected locations where vias are to be placed in the test design 101. For purposes of description, these recommended or expected locations are referred to herein as “nominal via locations.” In operation, the physical verification tool 104 applies (places) a via according to each of the preliminary via definitions 103 at each of a set of predefined offsets from each of the nominal via locations and identifies whether the application violates any of the design rules 105. Each of the predefined offsets reflects an x (horizontal) and y (vertical) offset from the nominal via location. To illustrate by way of an example, the preliminary via definitions can include definitions design Via Definition A, Via Definition B, and Via Definition C, with the resulting vias designated Via A, Via B, and Via C, respectively. The predefined offsets can be (0,0) (indicating the via is placed at the nominal via location), (+j, +k) (indicating the via is placed at an offset of +j in the x-direction and +k in the y-direction), and (−j, −k) (indicating the via is placed at an offset of −j in the x-direction and −k in the y-direction). The nominal via locations can be designated VL-1, VL-2, VL-3, and VL-4. The physical verification tool 104 first applies Via A at each of the set of predefined offsets relative to VL-1 (i.e. at VL-1+offset (0,0), VL-1+(+j,+k) and VL-1+(−j,−k)), and identifies whether each placement violates any of the design rules 105. The physical verification tool 104 then repeats the process for Via B and Via C.
Each via definition and offset pair represents a potential via definition for the device design 150. However, the device design 150 is expected to have similar design rules as the design rules 105, and employ similar structures as included in the test design 101. Accordingly, those pairs of via definitions and offsets that violate one of the design rules 105 are not expected to be useful for the device design 150, and are therefore discarded by the physical verification tool 104. The remaining via definition and offset pairs (those that do not violate any of the design rules 105) are stored as the candidate via definitions 110. The following table illustrates an example of the candidate via definitions 110 according to one embodiment, based on the example of Vias A, B, and C described above:
Candidate Via Definition
Preliminary Via
Designator
Definition
Offset
1
A
(0,0)
2
A
(+j,+k)
3
B
(+j,+k)
4
B
(-j,-k)
5
C
(0,0)
Each of the candidate via definitions 110 thus represents a different pair of preliminary via definition and offset. In some scenarios, each of the candidate via definitions can be used by a routing tool 121 to place vias in the device layout 151 for the device design 150, as described further below. However, in many cases the number of candidate via definitions 110 is too large to be used by the routing tool 121, either because of limitations in the tool itself or because using all of the definitions would render the layout process for the device design 150 unreasonably inefficient. Accordingly, the IC layout system 100 includes a hierarchy constructor 106 to arrange the candidate via definitions in a hierarchy based on the initial DFM values for the preliminary via definitions for each of the candidate via definitions and based on the number of different offsets where each preliminary via definition is used. The hierarchy constructor 106 thus arranges the candidate via definitions 110 according to a combination of the manufacturability of each of the candidate via definitions and the frequency with which a particular via topology (as indicated by the preliminary via definitions) is likely to be used in the device layout 151. After ranking, the hierarchy constructor 106 selects a threshold number of the candidate via definitions 110 based on their ranking (e.g. selecting the highest N ranked candidate via definitions) and stores the selected via definitions as the selected via definitions 119.
To illustrate, in at least one embodiment the hierarchy constructor 106 selects the selected via definitions by constructing a bi-partite graph consisting of two sets of nodes, and links between the nodes. One set of nodes represents the preliminary via definitions reflected in the candidate via definitions 110 and the other set of nodes represents the offsets reflected in the candidate via definitions 110. A link between nodes of the two sets reflects that the two corresponding nodes form one of the candidate via definitions 110. The hierarchy constructor 106 weights each link according to the initial DFM value of its corresponding preliminary via definition. The hierarchy constructor 106 then selects the preliminary via definition node having links with the highest total weight. For the corresponding offset nodes, the hierarchy constructor 106 re-weights their connected links that are not connected to the selected preliminary via definition node. An example of this process is described in greater detail below with respect to
The routing tool 121 uses the selected via definitions 119 to generate the device layout 151 based on the device design 150. For example, in one embodiment, the device design 150 is represented by a data file that indicates a set of nominal via locations for the layout of the device. At each of the nominal via locations, the routing tool tests each of the selected via definitions 119 by placing a via based on the corresponding preliminary via definition at the corresponding offset indicated by the selected via definition. The routing tool 121 then assigns a manufacturability score to the placed via based on the initial DFM value associated with the preliminary via definition and on other manufacturability factors. The routing tool 121 then compares the manufacturability scores for each of the selected via definitions 119 at each of the nominal via locations and assigns, for each nominal via location, the selected via definition having the high manufacturability score at that location. The routing tool 121 then uses the assigned via definitions to generate the device layout 151. The manufacturability and reliability of the device layout 151 is thereby enhanced.
For example, location 260 illustrated at
At view 301, the hierarchy constructor 106 has assigned a preliminary weight to each link where the preliminary weight for each link corresponds to the initial DFM value for its connected preliminary via definition node. For example, in the illustrated embodiment of
After assigning a preliminary weight to each link, the hierarchy constructor 106 identifies which of the preliminary via definition nodes has links with the highest combined weight. In the example of
As shown at view 302, the adjustment of the weights can cause some weights to fall to or below a threshold level of zero. The hierarchy constructor 106 eliminates the links for those weights, as illustrated at view 303. Elimination of a link causes the corresponding candidate via definition to be omitted from the selected via definitions 119. A link having an adjusted weight below zero represents a candidate via definition having a relatively low combination of manufacturability and likelihood that the definition can be used without violating one of the design rules 105. Accordingly, by ensuring that the candidate via definitions corresponding to links having low adjusted weights are eliminated, the hierarchy constructor 106 enhances the overall manufacturability of the selected via definitions 119.
In at least one embodiment, the hierarchy constructor 106 iteratively repeats the weight adjustment process until only a threshold number of links remains. In the event that the weight adjustment process for the Selected Node does not cause elimination of any links, the hierarchy constructor 106 selects, for the Selected Node, the preliminary via definition node having links with the next-highest combined weight. The hierarchy constructor 106 continues adjusting weights in a similar fashion as described until the threshold number of links remains. The hierarchy constructor 106 then selects the candidate via definitions corresponding to the remaining links for the selected via definitions 119.
At block 406, the hierarchy constructor 106 ranks the candidate via definitions 110 based on a combination of each candidate via definition's manufacturability (as indicated by the definition's corresponding preliminary via definition) and the candidate via definition's likely flexibility (as indicated by the number of offsets linked to the definition's corresponding preliminary via definition). At block 408, the hierarchy constructor 106 selects a threshold number of the candidate via definitions 110 according to their ranking and stores the selected definitions as the selected via definitions 119. At block 410, the routing tool 121 uses the selected via definitions to generate the device layout 151 for the device design 150.
In some embodiments, certain aspects of the techniques described above may implemented by one or more processors of a processing system executing instructions defined in code executable by the processors. The executable instructions may be stored or otherwise tangibly embodied on a non-transitory computer readable storage medium. The instructions and certain data can, when executed by the one or more processors, manipulate the one or more processors to perform one or more aspects of the techniques described above. The non-transitory computer readable storage medium can include, for example, a magnetic or optical disk storage device, solid state storage devices such as Flash memory, a cache, random access memory (RAM) or other non-volatile memory device or devices, and the like. The executable instructions stored on the non-transitory computer readable storage medium may be in source code, assembly language code, object code, or other instruction format that is interpreted or otherwise executable by one or more processors.
Note that not all of the activities or elements described above in the general description are required, that a portion of a specific activity or device may not be required, and that one or more further activities may be performed, or elements included, in addition to those described. Still further, the order in which activities are listed are not necessarily the order in which they are performed. Also, the concepts have been described with reference to specific embodiments. However, one of ordinary skill in the art appreciates that various modifications and changes can be made without departing from the scope of the present disclosure as set forth in the claims below. Accordingly, the specification and figures are to be regarded in an illustrative rather than a restrictive sense, and all such modifications are intended to be included within the scope of the present disclosure.
Benefits, other advantages, and solutions to problems have been described above with regard to specific embodiments. However, the benefits, advantages, solutions to problems, and any feature(s) that may cause any benefit, advantage, or solution to occur or become more pronounced are not to be construed as a critical, required, or essential feature of any or all the claims. Moreover, the particular embodiments disclosed above are illustrative only, as the disclosed subject matter may be modified and practiced in different but equivalent manners apparent to those skilled in the art having the benefit of the teachings herein. No limitations are intended to the details of construction or design herein shown, other than as described in the claims below. It is therefore evident that the particular embodiments disclosed above may be altered or modified and all such variations are considered within the scope of the disclosed subject matter. Accordingly, the protection sought herein is as set forth in the claims below.
Patent | Priority | Assignee | Title |
11177210, | Dec 31 2019 | NXP B V | Integrated circuit with non-functional structures |
Patent | Priority | Assignee | Title |
5798937, | Sep 28 1995 | SHENZHEN XINGUODU TECHNOLOGY CO , LTD | Method and apparatus for forming redundant vias between conductive layers of an integrated circuit |
20070101307, | |||
20080127024, | |||
20090294981, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Dec 17 2013 | SHARMA, PUNEET | Freescale Semiconductor, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031866 | /0626 | |
Dec 19 2013 | YUAN, CHI-MIN | Freescale Semiconductor, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031866 | /0626 | |
Dec 20 2013 | Freescale Semiconductor, Inc. | (assignment on the face of the patent) | / | |||
Feb 17 2014 | Freescale Semiconductor, Inc | CITIBANK, N A , AS NOTES COLLATERAL AGENT | SUPPLEMENT TO IP SECURITY AGREEMENT | 032445 | /0493 | |
Feb 17 2014 | Freescale Semiconductor, Inc | CITIBANK, N A , COLLATERAL AGENT | SUPPLEMENT TO IP SECURITY AGREEMENT | 032445 | /0689 | |
Dec 07 2015 | CITIBANK, N A | MORGAN STANLEY SENIOR FUNDING, INC | CORRECTIVE ASSIGNMENT OF INCORRECT NUMBER 14085520 PREVIOUSLY RECORDED AT REEL: 037458 FRAME: 0420 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTON OF SECURITY INTEREST IN PATENTS | 037785 | /0568 | |
Dec 07 2015 | CITIBANK, N A | MORGAN STANLEY SENIOR FUNDING, INC | CORRECTIVE ASSIGNMENT OF INCORRECT APPL NO 14 085,520 PREVIOUSLY RECORDED AT REEL: 037515 FRAME: 0390 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS | 037792 | /0227 | |
Dec 07 2015 | CITIBANK, N A | MORGAN STANLEY SENIOR FUNDING, INC | CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT APPL NO 14 085,520 PREVIOUSLY RECORDED AT REEL: 037515 FRAME: 0420 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS | 037879 | /0581 | |
Dec 07 2015 | CITIBANK, N A | MORGAN STANLEY SENIOR FUNDING, INC | CORRECTIVE ASSIGNMENT TO CORRECT THE FILING AND REMOVE APPL NO 14085520 REPLACE IT WITH 14086520 PREVIOUSLY RECORDED AT REEL: 037515 FRAME: 0390 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS | 037926 | /0642 | |
Dec 07 2015 | CITIBANK, N A | MORGAN STANLEY SENIOR FUNDING, INC | CORRECTIVE ASSIGNMENT OF INCORRECT PATENT APPLICATION NUMBER 14085520 ,PREVIOUSLY RECORDED AT REEL: 037458 FRAME: 0399 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS | 037785 | /0454 | |
Dec 07 2015 | CITIBANK, N A | MORGAN STANLEY SENIOR FUNDING, INC | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED ON REEL 037458 FRAME 0420 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS | 037515 | /0420 | |
Dec 07 2015 | CITIBANK, N A | MORGAN STANLEY SENIOR FUNDING, INC | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED ON REEL 037458 FRAME 0399 ASSIGNOR S HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS | 037515 | /0390 | |
Dec 07 2015 | CITIBANK, N A | MORGAN STANLEY SENIOR FOUNDING, INC | ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS | 037458 | /0399 | |
Dec 07 2015 | CITIBANK, N A , AS COLLATERAL AGENT | Freescale Semiconductor, Inc | PATENT RELEASE | 037357 | /0790 | |
May 25 2016 | Freescale Semiconductor, Inc | MORGAN STANLEY SENIOR FUNDING, INC | SUPPLEMENT TO THE SECURITY AGREEMENT | 039138 | /0001 | |
Jun 22 2016 | MORGAN STANLEY SENIOR FUNDING, INC | NXP B V | RELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS | 040928 | /0001 | |
Jun 22 2016 | MORGAN STANLEY SENIOR FUNDING, INC | NXP B V | CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001 ASSIGNOR S HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST | 052915 | /0001 | |
Jun 22 2016 | MORGAN STANLEY SENIOR FUNDING, INC | NXP B V | CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001 ASSIGNOR S HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST | 052915 | /0001 | |
Sep 12 2016 | MORGAN STANLEY SENIOR FUNDING, INC | NXP, B V F K A FREESCALE SEMICONDUCTOR, INC | CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001 ASSIGNOR S HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST | 052917 | /0001 | |
Sep 12 2016 | MORGAN STANLEY SENIOR FUNDING, INC | NXP, B V , F K A FREESCALE SEMICONDUCTOR, INC | RELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS | 040925 | /0001 | |
Sep 12 2016 | MORGAN STANLEY SENIOR FUNDING, INC | NXP, B V F K A FREESCALE SEMICONDUCTOR, INC | CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001 ASSIGNOR S HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST | 052917 | /0001 | |
Nov 07 2016 | Freescale Semiconductor Inc | NXP USA, INC | CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040632 FRAME: 0001 ASSIGNOR S HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME | 044209 | /0047 | |
Nov 07 2016 | Freescale Semiconductor, Inc | NXP USA, INC | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 040632 | /0001 | |
Sep 03 2019 | MORGAN STANLEY SENIOR FUNDING, INC | NXP B V | RELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS | 050744 | /0097 |
Date | Maintenance Fee Events |
Sep 18 2018 | M1551: Payment of Maintenance Fee, 4th Year, Large Entity. |
Dec 05 2022 | REM: Maintenance Fee Reminder Mailed. |
May 22 2023 | EXP: Patent Expired for Failure to Pay Maintenance Fees. |
Date | Maintenance Schedule |
Apr 14 2018 | 4 years fee payment window open |
Oct 14 2018 | 6 months grace period start (w surcharge) |
Apr 14 2019 | patent expiry (for year 4) |
Apr 14 2021 | 2 years to revive unintentionally abandoned end. (for year 4) |
Apr 14 2022 | 8 years fee payment window open |
Oct 14 2022 | 6 months grace period start (w surcharge) |
Apr 14 2023 | patent expiry (for year 8) |
Apr 14 2025 | 2 years to revive unintentionally abandoned end. (for year 8) |
Apr 14 2026 | 12 years fee payment window open |
Oct 14 2026 | 6 months grace period start (w surcharge) |
Apr 14 2027 | patent expiry (for year 12) |
Apr 14 2029 | 2 years to revive unintentionally abandoned end. (for year 12) |