A rigid, flat plate diaphragm for an acoustic device is illustrated. The internal supporting structure of the diaphragm provides a combination of torsional and translational stiffeners, which resemble a number of crossbars. These stiffeners brace and support the diaphragm motion, thus causing its response to not be adversely affected by fabrication stresses and causing it to be very similar in dynamic response to an ideal flat plate operating in a frequency range that extends well beyond the audible.
|
18. An acoustic diaphragm, comprising a rigid plate shaped member cantilevered about one side thereof on a torsional spring pivotal support having a “T”-shaped cross section configured to provide a dynamic response of the rigid plate-shaped member extending throughout the audible range, said rigid plate shaped member having torsional and translational stiffeners to stiffen the acoustic diaphragm to provide a first resonant frequency above the audible range.
1. An acoustic diaphragm having a dynamic response extending throughout the audible range, comprising:
a rigid plate shaped member which extends in a plane,
a torsional spring having a structure which extends from the plane, and which has a cross section which tunes a resonant frequency of the acoustic diaphragm, which supports the rigid plate for pivotal movement, and
torsional and translational stiffeners extending from the plane, configured to stiffen the rigid plate-shaped member and control a static deflection of the rigid plate-shaped member due to residual manufacturing stress.
11. An acoustic diaphragm having a dynamic response extending beyond an audible range, comprising:
a rigid plate shaped member having a planar sheet having torsional and translational stiffeners extending from the planar sheet; and
a torsional spring configured to support the rigid plate shaped member for pivotal displacement, disposed on a side of the rigid plate shaped member, and having a member extending from the planar sheet, wherein a cross section of the torsional spring comprising the member extending from the planar sheet tunes a resonant frequency of the acoustic diaphragm;
the torsional and translational stiffeners being configured to limit a static deflection of the rigid plate shaped member.
2. The acoustic diaphragm in accordance with
3. The acoustic diaphragm in accordance with
4. The acoustic diaphragm in accordance with
5. The acoustic diaphragm in accordance with
6. The acoustic diaphragm in accordance with
7. The acoustic diaphragm in accordance with
8. The acoustic diaphragm in accordance with
9. The acoustic diaphragm in accordance with
10. The acoustic diaphragm in accordance with
12. The acoustic diaphragm in accordance with
13. The acoustic diaphragm in accordance with
14. The acoustic diaphragm in accordance with
15. The acoustic diaphragm in accordance with
16. The acoustic diaphragm in accordance with
17. The acoustic diaphragm in accordance with
19. The acoustic diaphragm in accordance with
20. The acoustic diaphragm in accordance with
21. The acoustic diaphragm in accordance with
|
This application is a Continuation of U.S. patent application Ser. No. 13/013,812, Filed Jan. 25, 2011 (US 20120189151 A1, published Jul. 26, 2012), now U.S. Pat. No. 8,582,795 issued Nov. 12, 2013, which is a Continuation of U.S. patent application Ser. No. 10/689,189, filed Oct. 20, 2003, now U.S. Pat. No. 7,876,924, issued Jan. 25, 2011, each of which are expressly incorporated herein by reference in their entirety.
This invention was made with government support under award DAAD17-00-C-0149 awarded by the ARMY/ARL. The government has certain rights in the invention.
The present invention relates to acoustic devices such as microphones and hearing aids and, more particularly, to an improved diaphragm for a microphone having a robust dynamic response in a frequency range extending well past the audible.
Fabrication of substantially flat, compliant diaphragms is essential to the success of sensitive microphones. A significant obstacle to achieving this goal is the inevitable residual stresses induced during the process of manufacturing miniature microphone diaphragms. The thickness of miniature microphone diaphragms is typically on the order of microns. Stresses in such thin films can result in warpage or buckling, or can lead to breakage. Much effort has been put into controlling the flatness and dynamic performance of thin film diaphragms.
One common method to prevent the aforementioned warpage is to clamp all four edges or all four corners of a thin diaphragm and utilize tensile stress to control the flatness. The tension, however, increases the stiffness of the diaphragm and consequently decreases the sensitivity of the microphone. The inability to accurately control the tensile stress during fabrication also leads to unpredictable dynamic characteristics for the microphone.
To achieve an acceptable sensitivity, a microphone diaphragm needs to be very compliant. The cantilever structure described in this invention is an alternative to conventional four-edge (or four-corner) clamped devices. The new cantilever design seeks to achieve a sensitive microphone, since cantilever diaphragms are much more compliant than tensioned diaphragms.
One of the objects of the present invention is to provide a robust microphone diaphragm design that maintains good dimensional control under the influences of residual stresses, either compressive or tensile, while having its dynamic response dominated only by a single mode of vibration. The response of the diaphragm is predicted to be extremely close to that of an ideal rigid plate over a frequency range extending well beyond the audible range.
The internal supporting structure of this diaphragm provides a combination of torsional and translational stiffeners that resemble a number of crossbars. These stiffeners brace and support the diaphragm motion, thus causing it to be very similar in dynamic response to an ideal flat plate operating in a frequency range extending well beyond the audible. The diaphragm is essentially constrained to pivot about an edge upon which it is supported. The supported end has an overlapping T-section whose length and cross-sectional dimensions can be adjusted to tune the resonant frequency.
In U.S. Pat. No. 5,633,552, issued to Lee et al, a method is disclosed for fabricating a micro-machined pressure transducer having a multilayer silicon nitride thin film cantilever diaphragm. The technique relies on the symmetry of the stress gradient in the two outer layers, and a larger tensile stress (250 MPa) in the second layer to maintain diaphragm flatness.
The diaphragm of the present invention relies on the use of stiffeners to maintain flatness rather than, as the prior art teaches, attempting to balance existing stresses in the various layers of the diaphragm. The patent shows static deflections due to stress of more than 15 microns. Predictable maximum deflection of the diaphragm of the current invention will be approximately 0.5 microns. This is an improvement over the related art by a factor of 30.
In U.S. Pat. No. 5,870,482, issued to Loeppert et al, a cantilever center support diaphragm is illustrated. This patent uses a corrugated structure and a sandwich of two quilted films separated by a thin 2-3 micron sacrificial layer, in order to match the diaphragm compliance to the desired pressure range. It is also desired to counter any curling tendency of the diaphragm. In the current invention the design provides better control over the flatness.
In U.S. Pat. No. 5,146,435, issued to Bernstein, a structure consisting of a single crystal silicon diaphragm supported on its corners by patterned silicon springs is shown. By supporting the diaphragm only at the corners as suggested by Bernstein, it is possible to increase the diaphragm compliance and subsequently, the sensitivity to sound.
While this approach permits a design that is more compliant than the usual approach where the diaphragm is supported entirely around its perimeter, it does not ensure that the stresses in the structure will not result in warpage (if the stress is tensile) and it is quite possible that compressive stresses will result in buckling.
By incorporating stiffeners in the present inventive diaphragm, improved flatness is achieved. The current inventive diaphragm is supported on specially designed torsional springs that have very high stiffness in the transverse direction, but which have well-controlled stiffness in torsion.
In accordance with the present invention, there is provided an improved diaphragm for a microphone, acoustic sensor, or hearing aid that is not adversely affected by fabrication stresses. It is robust in the sense that it is not affected by fabrication stresses. The diaphragm comprises a rigid flat plate of polysilicon or similar material. The internal supporting structure provides a combination of torsional and translational stiffeners that resemble a number of crossbars. These stiffeners brace and support the diaphragm motion, thus causing it to be very similar in dynamic response to an ideal flat plate operating in a frequency range that extends well beyond the audible. The diaphragm is essentially constrained to pivot about an edge upon which it is supported. The supported end has an overlapping T-section, whose length and cross-sectional dimensions can be adjusted to tune the resonant frequency.
It is an object of this invention to provide an improved diaphragm for a microphone, hearing aid, or acoustic device.
It is another object of the invention to provide a diaphragm for a microphone, hearing aid, or acoustic sensor that is not affected by fabrication stresses.
A complete understanding of the present invention may be obtained by reference to the accompanying drawings, when considered in conjunction with the subsequent detailed description, in which:
Generally speaking, the invention features an internally stiffened, rigid, flat plate diaphragm for an acoustic device. The internal supporting structure of the diaphragm provides a combination of torsional and translational stiffeners, which resemble a number of crossbars. These stiffeners brace and support the diaphragm motion, thus causing it to be very similar in dynamic response to an ideal flat plate operating in a frequency range that extends well beyond the audible.
Now referring to
The diaphragm 10 can be used in a microphone, and can be fabricated from polycrystalline silicon or similar material in a microfabrication process. In the microfabrication process, the diaphragm is highly robust and tolerant of fabrication defects. The diaphragm 10 maintains exceptional flatness under the influence of either compressive or tensile stresses that may occur during manufacture. The dynamic response of the diaphragm conforms to an ideal flat plate over a frequency range extending well beyond the audible range. The dynamic characteristics of the diaphragm 10 can be readily tuned without adversely influencing the flatness or ruggedness thereof.
The “T” section 14 can be adjusted in length and cross-section for tuning the resonant frequency. The overall dimensions of the diaphragm 10 are 1 mm by 1 mm. The stiffening crossbars 11 and 12, respectively, can be 4 microns thick and 40 microns tall.
A first mode of vibration is predictably at 24 kHz, and a second mode is at 84 kHz. The second mode is well above the audible frequency, and therefore will not influence the response. Utilization of stiffeners 11 and 12 pushes the unwanted modes of diaphragm 10 into the ultrasonic frequency range so that the response is very similar to an ideal flat plate structure.
The diaphragm 10 has high bending rigidity, as shown in
Since other modifications and changes varied to fit particular operating requirements and environments will be apparent to those skilled in the art, the invention is not considered limited to the example chosen for purposes of disclosure, and covers all changes and modifications which do not constitute departures from the true spirit and scope of this invention.
Having thus described the invention, what is desired to be protected by Letters Patent is presented in the subsequently appended claims.
Patent | Priority | Assignee | Title |
9554213, | Oct 01 2012 | The Research Foundation for The State University of New York | Hinged MEMS diaphragm |
9906869, | Oct 01 2012 | The Research Foundation for The State University of New York | Hinged MEMS diaphragm, and method of manufacture thereof |
Patent | Priority | Assignee | Title |
5870482, | Feb 25 1997 | Knowles Electronics, LLC | Miniature silicon condenser microphone |
6535460, | Aug 11 2000 | Knowles Electronics, LLC | Miniature broadband acoustic transducer |
7545945, | Aug 05 2005 | The Research Foundation for The State University of New York | Comb sense microphone |
7876924, | Oct 20 2003 | The Research Foundation for The State University of New York | Robust diaphragm for an acoustic device |
8582795, | Oct 20 2003 | The Research Foundation of State University of New York | Robust diaphragm for an acoustic device |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Nov 12 2013 | The Research Foundation for The State University of New York | (assignment on the face of the patent) | / | |||
Nov 12 2013 | MILES, RONALD N | The Research Foundation for The State University of New York | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031590 | /0627 | |
Nov 13 2013 | CUI, WEILI | The Research Foundation for The State University of New York | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031590 | /0627 |
Date | Maintenance Fee Events |
Feb 15 2019 | M2551: Payment of Maintenance Fee, 4th Yr, Small Entity. |
Apr 10 2023 | REM: Maintenance Fee Reminder Mailed. |
Sep 25 2023 | EXP: Patent Expired for Failure to Pay Maintenance Fees. |
Date | Maintenance Schedule |
Aug 18 2018 | 4 years fee payment window open |
Feb 18 2019 | 6 months grace period start (w surcharge) |
Aug 18 2019 | patent expiry (for year 4) |
Aug 18 2021 | 2 years to revive unintentionally abandoned end. (for year 4) |
Aug 18 2022 | 8 years fee payment window open |
Feb 18 2023 | 6 months grace period start (w surcharge) |
Aug 18 2023 | patent expiry (for year 8) |
Aug 18 2025 | 2 years to revive unintentionally abandoned end. (for year 8) |
Aug 18 2026 | 12 years fee payment window open |
Feb 18 2027 | 6 months grace period start (w surcharge) |
Aug 18 2027 | patent expiry (for year 12) |
Aug 18 2029 | 2 years to revive unintentionally abandoned end. (for year 12) |