A driving method of a semiconductor device for compensating variation in threshold voltage and mobility of a transistor is provided. A driving method of a semiconductor device including a transistor and a capacitor electrically connected to a gate of the transistor includes a first period where voltage corresponding to threshold voltage of the transistor is held in the capacitor, a second period where a total voltage of video signal voltage and threshold voltage is held in the capacitor holding the threshold voltage, and a third period where charge held in the capacitor in accordance with the total voltage of the video signal voltage and the threshold voltage in the second period is discharged through the transistor.
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7. A semiconductor device comprising:
a pixel comprising:
a light-emitting element;
a transistor;
a first capacitor;
a second capacitor; and
a third capacitor,
wherein one of a source and a drain of the transistor is directly connected to a first electrode of the light-emitting element,
wherein the other of the source and the drain of the transistor is electrically connected to a first wiring,
wherein a first terminal of the first capacitor is directly connected to a gate of the transistor,
wherein a first terminal of the second capacitor is directly connected to the one of the source and the drain of the transistor,
wherein the transistor comprises an oxide semiconductor layer comprising a channel region,
wherein a second terminal of the second capacitor is electrically connected to a second wiring,
wherein a first terminal of the third capacitor is electrically connected to a second terminal of the first capacitor, and
wherein a second terminal of the third capacitor is electrically connected to the second wiring.
1. A semiconductor device comprising:
a pixel comprising:
a light-emitting element;
a transistor;
a first capacitor;
a second capacitor; and
a third capacitor,
wherein one of a source and a drain of the transistor is directly connected to a first electrode of the light-emitting element,
wherein the other of the source and the drain of the transistor is electrically connected to a first wiring,
wherein a first terminal of the first capacitor is directly connected to a gate of the transistor,
wherein a first terminal of the second capacitor is directly connected to the one of the source and the drain of the transistor,
wherein the transistor comprises a source region and a drain region in a semiconductor substrate,
wherein a second terminal of the second capacitor is electrically connected to a second wiring,
wherein a first terminal of the third capacitor is electrically connected to a second terminal of the first capacitor, and
wherein a second terminal of the third capacitor is electrically connected to the second wiring.
2. The semiconductor device according to
3. The semiconductor device according to
4. The semiconductor device according to
wherein the one of the source and the drain of the transistor is electrically connected to the light-emitting element via the first switch.
5. The semiconductor device according to
wherein the second terminal of the first capacitor is electrically connected to the other of the source and the drain of the transistor via the second switch.
6. An electronic device comprising the semiconductor device according to
8. The semiconductor device according to
9. The semiconductor device according to
10. The semiconductor device according to
wherein the one of the source and the drain of the transistor is electrically connected to the light-emitting element via the first switch.
11. The semiconductor device according to
wherein the second terminal of the first capacitor is electrically connected to the other of the source and the drain of the transistor via the second switch.
12. An electronic device comprising the semiconductor device according to
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This application is a continuation of U.S. application Ser. No. 12/712,479, filed Feb. 25, 2010, now allowed, which claims the benefit of a foreign priority application filed in Japan as Serial No. 2009-045603 on Feb. 27, 2009, both of which are incorporated by reference.
1. Field of the Invention
The present invention relates to a semiconductor device, a display device, or a light-emitting device, or a driving method thereof.
2. Description of the Related Art
Flat panel displays such as liquid crystal displays (LCD) become widely used in recent years. However, LCDs have various drawbacks such as a narrow viewing angle, narrow chromaticity range, and slow response speed. Thus, to overcome those drawbacks, research of an organic EL (also referred to as an electroluminescence, an organic light-emitting diode, an OLED, or the like) displays have been actively conducted (Patent Document 1).
However, organic EL displays have a problem in which current characteristics of transistors for controlling current which flows into organic EL elements vary from pixel to pixel. When current flowing into the organic EL elements (that is, current flowing into the transistors) varies, luminance of the organic EL elements also varies, whereby display screens display images with unevenness. Thus, methods for compensating variation in threshold voltage of transistors have been examined (Patent Documents 2 to 6).
However, even if variation in the threshold voltage of the transistors is compensated, variation in mobility of the transistors also leads to variation in current flowing into an organic EL element, so that image unevenness occurs. Thus, methods for compensating not only the threshold voltage but also variation in mobility of transistors have been examined (Patent Documents 7 and 8).
[Patent Document 1] Japanese Published Patent Application No. 2003-216110
[Patent Document 2] Japanese Published Patent Application No. 2003-202833
[Patent Document 3] Japanese Published Patent Application No. 2005-31630
[Patent Document 4] Japanese Published Patent Application No. 2005-345722
[Patent Document 5] Japanese Published Patent Application No. 2007-148129
[Patent Document 6] International Publication No. WO2006/060902
[Patent Document 7] Japanese Published Patent Application No. 2007-148128 (paragraph 0098)
[Patent Document 8] Japanese Published Patent Application No. 2007-310311 (paragraph 0026)
In techniques disclosed in Patent Documents 7 and 8, variation in mobility of a transistor is compensated while an image signal (a video signal) is input to a pixel, so that problems occur.
For example, since variation in mobility of a transistor is compensated while an image signal is input to a pixel, an image signal cannot be input to another pixel during the compensation. In general, the number of the pixels, the number of frame frequencies, screen size, and/or the like determine the maximum length of the period in which the image signal is input to each pixel (so-called, one gate selection period or one horizontal period). Therefore, if the period for compensating variation in mobility increases in one gate selection period, periods of other processes (input of an image signal, acquisition of threshold voltage, or the like) are shortened. Therefore, various processes need to be performed in one gate selection period in a pixel. As a result, accurate processes cannot be performed because of lack of processing period, or compensation of variation in mobility is insufficient because the period in which variation in mobility is compensated is insufficient.
Further, one gate selection period per one pixel becomes shorter as the number of the pixels and frame frequencies increase, or as the screen size increases. Therefore, input of an image signal to the pixel, compensation of variation in mobility, or the like cannot be performed sufficiently.
Alternatively, in the case where variation in mobility is compensated while an image signal is input, such compensation of variation in mobility is easily affected by distortion of the waveform of the image signal. Therefore, the degree of compensation of mobility varies between the cases where distortion of the waveform of the image signal is large and where distortion of the waveform of the image signal is small. Accordingly, accurate compensation is impossible.
Alternatively, in the case where variation in mobility is compensated while an image signal is input to a pixel, it is difficult to perform dot sequential driving in many cases. In dot sequential driving, when an image signal is input to a pixel of a specific row, an image signal is input not to all the pixels of the row at a time but to the pixels one by one. Thus, the length of the period in which an image signal is input varies from one pixel to another pixel. Therefore, when variation in mobility is compensated while an image signal is input, the length of the period for compensating variation in mobility varies from one pixel to another pixel, so that the amount of compensation also varies from one pixel to another pixel. Thus, compensation cannot be normally performed. Therefore, in the case where variation in mobility is compensated while an image signal is input, line sequential driving is needed in which a signal is input to all pixels of the row at a time, not dot sequential driving.
Furthermore, in line sequential driving, the structure of a source signal line driver circuit (also referred to as a video signal line driver circuit, a source driver, or a data driver) is more complicated than that in dot sequential driving. For example, for the source signal line driver circuit in line sequential driving, a circuit such as a DA converter, an analog buffer, or a latch circuit is needed in many cases. However, the analog buffer includes an operational amplifier, a source follower circuit, or the like in many cases and is easily influenced by variation in current characteristics of a transistor. Thus, when a circuit is configured using a TFT (a thin film transistor), a circuit compensating variation in current characteristics of a transistor is necessary. Accordingly, the scale of a circuit and power consumption is increased. Therefore, when a TFT is used as a transistor for a pixel portion, there can be difficulty in forming the pixel portion and the signal line driver circuit over the same substrate. Therefore, the signal line driver circuit is necessarily formed by using a different means from that of the pixel portion. Thus, the cost may rise. Furthermore, the pixel portion and the signal line driver circuit are necessarily connected using COG (chip on glass), TAB (tape automated bonding), or the like, so that a contact failure may be generated, reliability may be degraded, for example.
Then, it is an object of an embodiment of the present invention to reduce adverse effects of variation in threshold voltage of a transistor. Alternatively, it is an object of an embodiment of the present invention to reduce influence of variation in mobility of a transistor. Alternatively, it is an object of an embodiment of the present invention to reduce influence of variation of current characteristic of a transistor. Alternatively, it is an object of an embodiment of the present invention to ensure a long input period of an image signal. Alternatively, it is an object of an embodiment of the present invention to obtain a long compensation period for reducing influence of variation in threshold voltage. Alternatively, it is an object of an embodiment of the present invention to obtain a long compensation period to reduce influence of variation in mobility. Alternatively, it is an object of an embodiment of the present invention to prevent distortion of the waveform of the image signal from influencing compensation for variation in mobility. Alternatively, it is an object of an embodiment of the present invention to enable use of not only line sequential driving but also dot sequential driving. Alternatively, it is an object of an embodiment of the present invention to form a pixel and a driver circuit on the same substrate. Alternatively, it is an object of an embodiment of the present invention to reduce electric power consumption. Alternatively, it is an object of an embodiment of the present invention to reduce manufacturing costs. Alternatively, it is an object of an embodiment of the present invention to reduce the possibility of causing a contact failure at a connection portion of wirings. Note that description of these objects does not preclude the existence of another object. Note that an embodiment of the present invention does not have to attain all the above objects.
An embodiment of the invention is a driving method of a semiconductor device including a transistor and a capacitor electrically connected to a gate of the transistor. The driving method of a semiconductor device includes a first period where voltage corresponding to threshold voltage of the transistor is held in the capacitor, a second period where total voltage of video signal voltage and threshold voltage is held in the capacitor holding the threshold voltage, and a third period where charge held in the capacitor according to the total voltage of video signal voltage and threshold voltage in the second period is discharged through the transistor.
An embodiment of the invention is a driving method of a semiconductor device including a transistor and a capacitor electrically connected to a gate of the transistor. The driving method of a semiconductor device includes a first period where charge held in the capacitor is initialized, a second period where voltage corresponding to threshold voltage of the transistor is held in the capacitor, a third period where total voltage of video signal voltage and threshold voltage is held in the capacitor holding the threshold voltage, and a fourth period where charge held in the capacitor according to the total voltage of video signal voltage and threshold voltage in the third period is discharged through the transistor.
An embodiment of the invention is a driving method of a semiconductor device including a transistor, a capacitor electrically connected to a gate of the transistor, and a display element. The driving method of a semiconductor device includes a first period where voltage corresponding to threshold voltage of the transistor is held in the capacitor, a second period where total voltage of video signal voltage and the threshold voltage are held in the capacitor holding the threshold voltage, a third period where charge held in the capacitor according to the total voltage of the video signal voltage and the threshold voltage in the second period is discharged through the transistor, and a fourth period where current is supplied to the display element through the transistor after the third period.
An embodiment of the invention is a driving method of a semiconductor device including a transistor, a capacitor electrically connected to a gate of the transistor, and a display element. The driving method of a semiconductor device includes a first period where charge held in the capacitor is initialized, a second period where voltage corresponding to threshold voltage of the transistor held in the capacitor, a third period where total voltage of video signal voltage and the threshold voltage is held in the capacitor holding the threshold voltage, a fourth period where charge held in the capacitor according to the total voltage of the video signal voltage and the threshold voltage in the third period is discharged through the transistor, and a fifth period where current is supplied to the display element through the transistor after the third period.
Note that a variety of switches can be used as the switch. For example, an electrical switch or a mechanical switch can be used. That is, any element can be used as long as it can control a current flow, without limitation on a certain element. For example, a transistor (e.g., a bipolar transistor or a MOS transistor), or a diode (e.g., a PN diode, a PIN diode, a Schottky diode, an MIM (metal insulator metal) diode, an MIS (metal insulator semiconductor) diode, or a diode-connected transistor) can be used as the switch. Alternatively, a logic circuit in which such elements are combined can be used as the switch.
An example of a mechanical switch is a switch formed using a MEMS (micro electro mechanical system) technology, such as a digital micromirror device (DMD). Such a switch includes an electrode which can be moved mechanically, and operates by controlling conduction and non-conduction in accordance with movement of the electrode.
Note that a CMOS switch may be used as the switch by using both an n-channel transistor and a p-channel transistor.
Note that when it is explicitly described that “A and B are connected”, the case where A and B are electrically connected, the case where A and B are functionally connected, and the case where A and B are directly connected are included therein. Here, each of A and B is an object (e.g., a device, an element, a circuit, a wiring, an electrode, a terminal, a conductive film, or a layer). Accordingly, another element may be provided between elements having a connection relation illustrated in drawings and texts, without limitation on a predetermined connection relation, for example, the connection relation illustrated in the drawings and the texts.
For example, in the case where A and B are electrically connected, one or more elements which enable electrical connection between A and B (e.g., a switch, a transistor, a capacitor, an inductor, a resistor, and/or a diode) may be connected between A and B. In the case where A and B are functionally connected, one or more circuits which enable functional connection between A and B (e.g., a logic circuit such as an inverter, a NAND circuit, or a NOR circuit; a signal converter circuit such as a DA converter circuit, an AD converter circuit, or a gamma correction circuit; a potential level converter circuit such as a power supply circuit (e.g., a dc-dc converter, a step-up dc-dc converter, or a step-down dc-dc converter) or a level shifter circuit for changing a potential level of a signal; a voltage source; a current source; a switching circuit; an amplifier circuit such as a circuit which can increase signal amplitude, the amount of current, or the like, an operational amplifier, a differential amplifier circuit, a source follower circuit, or a buffer circuit; a signal generation circuit; a memory circuit; and/or a control circuit) may be connected between A and B. For example, in the case where a signal output from A is transmitted to B even when another circuit is provided between A and B, A and B are functionally connected.
Note that when it is explicitly described that “A and B are electrically connected”, the case where A and B are electrically connected (i.e., the case where A and B are connected with another element or another circuit therebetween), the case where A and B are functionally connected (i.e., the case where A and B are functionally connected with another circuit therebetween), and the case where A and B are directly connected (i.e., the case where A and B are connected without another element or another circuit therebetween) are included therein. That is, when it is explicitly described, “A and B are electrically connected”, the description is the same as the case where it is explicitly described only, “A and B are connected”.
Note that a display element, a display device which is a device including a display element, a light-emitting element, and a light-emitting device which is a device including a light-emitting element can employ a variety of modes and include a variety of elements. For example, a display element, a display device, a light-emitting element, and a light-emitting device can include a display medium whose contrast, luminance, reflectivity, transmittance, or the like changes by electromagnetic action, such as an EL (electroluminescence) element (e.g., an EL element containing organic and inorganic materials, an organic EL element, or an inorganic EL element), an LED (e.g., a white LED, a red LED, a green LED, or a blue LED), a transistor (a transistor which emits light depending on the amount of current), an electron emitter, a liquid crystal element, electronic ink, an electrophoretic element, a grating light valve (GLV), a plasma display (PDP), a digital micromirror device (DMD), a piezoelectric ceramic display, or a carbon nanotube. Note that display devices using an EL element include an EL display; display devices using an electron emitter include a field emission display (FED) and an SED (surface-conduction electron-emitter display) flat panel display; display devices using a liquid crystal element include a liquid crystal display (e.g., a transmissive liquid crystal display, a transflective liquid crystal display, a reflective liquid crystal display, a direct-view liquid crystal display, or a projection liquid crystal display); and display devices using electronic ink or an electrophoretic element included in electronic paper in their respective categories.
A liquid crystal element is an element that controls transmission or non-transmission of light by an optical modulation action of liquid crystal, and includes a pair of electrodes and liquid crystal. Note that, the optical modulation action of liquid crystal is controlled by an electric field (including a lateral electric field, a vertical electric field, and a diagonal electric field) applied to the liquid crystal. The following liquid crystal can be used for a liquid crystal element: nematic liquid crystal, cholesteric liquid crystal, smectic liquid crystal, discotic liquid crystal, thermotropic liquid crystal, lyotropic liquid crystal, low molecular liquid crystal, high molecular liquid crystal, polymer dispersed liquid crystal (PDLC), ferroelectric liquid crystal, anti-ferroelectric liquid crystal, main chain type liquid crystal, side chain type polymer liquid crystal, plasma addressed liquid crystal (PALC), and banana-shaped liquid crystal. Moreover, the following methods can be used for driving the liquid crystal, for example: a TN (twisted nematic) mode, an STN (super twisted nematic) mode, an IPS (in-plane-switching) mode, an FFS (fringe field switching) mode, an MVA (multi-domain vertical alignment) mode, a PVA (patterned vertical alignment) mode, an ASV (advanced super view) mode, an ASM (axially symmetric aligned microcell) mode, an OCB (optically compensated birefringence) mode, an ECB (electrically controlled birefringence) mode, an FLC (ferroelectric liquid crystal) mode, an AFLC (anti-ferroelectric liquid crystal) mode, a PDLC (polymer dispersed liquid crystal) mode, a guest-host mode, and a blue phase mode. Note that various kinds of liquid crystal elements and driving methods can be used without limitation on those described above.
As a transistor, a variety of transistors can be used. There is no limitation on the type of transistors. For example, a thin film transistor (TFT) including a non-single-crystal semiconductor film typified by a film made of amorphous silicon, polycrystalline silicon, microcrystalline (also referred to as microcrystal, nanocrystal, or semi-amorphous) silicon, or the like can be used.
Note that by using a catalyst (e.g., nickel) in the case of forming polycrystalline silicon, crystallinity can further be improved and a transistor having excellent electrical characteristics can be formed. Further, by using a catalyst (e.g., nickel) in the case of forming microcrystalline silicon, crystallinity can further be improved and a transistor having excellent electric characteristics can be formed. Note that it is possible to form polycrystalline silicon and microcrystalline silicon without using a catalyst (e.g., nickel).
The crystallinity of silicon is preferably enhanced to polycrystallinity or microcrystallinity in the entire panel, but not limited thereto. The crystallinity of silicon may be improved only in part of the panel.
Alternatively, a transistor can be formed by using a semiconductor substrate, an SOI substrate, or the like.
Alternatively, a transistor including a compound semiconductor or an oxide semiconductor, such as ZnO, a-InGaZnO, SiGe, GaAs, IZO, ITO, SnO, TiO, or AlZnSnO (AZTO) and a thin film transistor or the like obtained by thinning such a compound semiconductor or oxide semiconductor can be used. Note that such a compound semiconductor or oxide semiconductor can be used for not only a channel portion of a transistor but also for other applications. For example, such a compound semiconductor or oxide semiconductor can be used for a resistor, a pixel electrode, or a light-transmitting electrode. Further, since such an element can concurrently be formed the transistor, the costs can be reduced.
A transistor or the like formed by an inkjet method or a printing method can also be used.
Further, a transistor or the like including an organic semiconductor or a carbon nanotube can be used. Accordingly, such a transistor can be formed over a flexible substrate. A semiconductor device using such a substrate can resist a shock.
In addition, various types of transistors can be used. For example, a MOS transistor, a junction transistor, a bipolar transistor, or the like can be used as a transistor.
Further, a MOS transistor, a bipolar transistor, and/or the like may be formed over one substrate.
Furthermore, various transistors other than the above transistors can be used.
A transistor can be formed using various types of substrates. The type of a substrate is not limited to a certain type. As the substrate, a single crystalline substrate (e.g., a silicon substrate), an SOI substrate, a glass substrate, a quartz substrate, a plastic substrate, a metal substrate, a stainless steel substrate, a substrate including a stainless steel foil, a tungsten substrate, a substrate including a tungsten foil, or a flexible substrate can be used, for example. Examples of the glass substrate are barium borosilicate glass and aluminoborosilicate glass. Examples of the flexible substrate are flexible synthetic resin such as plastics typified by polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyethersulfone (PES), and acrylic. Alternatively, an attachment film (formed using polypropylene, polyester, vinyl, polyvinyl fluoride, polyvinyl chloride, or the like), paper including a fibrous material, a base material film (polyester, polyamide, polyimide, an inorganic vapor deposition film, paper, or the like), or the like can be used. Alternatively, the transistor may be formed using one substrate, and then, the transistor may be transferred and disposed to another substrate. As a substrate to which the transistor is transferred, a single crystal substrate, an SOI substrate, a glass substrate, a quartz substrate, a plastic substrate, a paper substrate, a cellophane substrate, a stone substrate, a wood substrate, a cloth substrate (including a natural fiber (e.g., silk, cotton, or hemp), a synthetic fiber (e.g., nylon, polyurethane, or polyester), a regenerated fiber (e.g., acetate, cupra, rayon, or regenerated polyester), or the like), a leather substrate, a rubber substrate, a stainless steel substrate, a substrate including a stainless steel foil, or the like can be used. A skin (e.g., epidermis or corium) or hypodermal tissue of an animal such as a human being can be used as a substrate to which the transistor is transferred. Alternatively, the transistor may be formed using one substrate and the substrate may be thinned by polishing. As a substrate to be polished, a single crystal substrate, an SOI substrate, a glass substrate, a quartz substrate, a plastic substrate, a stainless steel substrate, a substrate including a stainless steel foil, or the like can be used. By using such a substrate, a transistor with excellent properties or low power consumption can be formed, a device with high durability or high heat resistance can be provided, or reduction in weight or thickness can be achieved.
Note that the structure of a transistor can be a variety of structures, without limitation on a certain structure. For example, a multi-gate structure having two or more gate electrodes can be used.
As another example, a structure where gate electrodes are formed above and below a channel can be used. Note that when the gate electrodes are formed above and below the channel, a structure where a plurality of transistors are connected in parallel is provided.
A structure where a gate electrode is formed above a channel region, a structure where a gate electrode is formed below a channel region, a staggered structure, an inverted staggered structure, a structure where a channel region is divided into a plurality of regions, or a structure where channel regions are connected in parallel or in series can be used. Moreover, a structure where a source electrode or a drain electrode overlaps with a channel region (or part thereof) can be used.
Note that a variety of transistors can be used, and the transistor can be formed using a variety of substrates. Accordingly, all the circuits which are necessary to realize a predetermined function can be formed using one substrate. For example, all the circuits which are necessary to realize the predetermined function can be formed using a glass substrate, a plastic substrate, a single crystal substrate, an SOI substrate, or any other substrate. Alternatively, some of the circuits which are necessary to realize the predetermined function can be formed using one substrate and some of the circuits which are necessary to realize the predetermined function can be formed using another substrate. That is, not all the circuits which are necessary to realize the predetermined function need to be formed using one substrate. For example, some of the circuits which are necessary to realize the predetermined function can be formed by transistors using a glass substrate, some of the circuits which are necessary to realize the predetermined function can be formed using a single crystal substrate, and an IC chip including transistors formed using the single crystal substrate can be connected to the glass substrate by COG (chip on glass) so that the IC chip is provided over the glass substrate. Alternatively, the IC chip can be connected to the glass substrate by TAB (tape automated bonding) or with a printed wiring board.
Note that a transistor is an element having at least three terminals of a gate, a drain, and a source. The transistor has a channel region between a drain region and a source region, and current can flow through the drain region, the channel region, and the source region. Here, since the source and the drain of the transistor change depending on the structure, the operating condition, and the like of the transistor, it is difficult to define which is a source or a drain. Thus, a region which serves as a source or a drain is not referred to as a source or a drain in some cases. In such a case, one of the source and the drain may be referred to as a first terminal and the other of the source and the drain may be referred to as a second terminal, for example. Alternatively, one of the source and the drain may be referred to as a first electrode and the other of the source and the drain may be referred to as a second electrode. Further alternatively, one of the source and the drain may be referred to as a first region and the other of the source and the drain may be referred to as a second region.
Note that a transistor may be an element having at least three terminals of a base, an emitter, and a collector. In this case also, the emitter and the collector may be referred to as a first terminal and a second terminal, for example.
Note that when it is explicitly described that B is formed on or over A, it does not necessarily mean that B is formed in direct contact with A. The description includes the case where A and B are not in direct contact with each other, that is, the case where another object is placed between A and B. Here, each of A and B is an object (e.g., a device, an element, a circuit, a wiring, an electrode, a terminal, a conductive film, or a layer).
Accordingly, for example, when it is explicitly described that a layer B is formed on (or over) a layer A, it includes both the case where the layer B is formed in direct contact with the layer A; and the case where another layer (e.g., a layer C or a layer D) is formed in direct contact with the layer A, and the layer B is formed in direct contact with the layer C or the layer D. Note that another layer (e.g., the layer C or the layer D) may be a single layer or a plurality of layers.
Similarly, when it is explicitly described that B is formed above A, it does not necessarily mean that B is formed in direct contact with A, and another object may be placed between A and B. Accordingly, the case where a layer B is formed above a layer A includes the case where the layer B is formed in direct contact with the layer A and the case where another layer (e.g., a layer C and a layer D) is formed in direct contact with the layer A and the layer B is formed in direct contact with the layer C or the layer D. Note that another layer (e.g., the layer C or the layer D) may be a single layer or a plurality of layers.
Note that when it is explicitly described that B is formed over, on, or above A, it includes the case where B is formed obliquely over/above A.
Note that the same can be said when it is explicitly described that B is formed below or under A.
Note that when an object is explicitly described in a singular form, the object is preferably singular. However, embodiments of the present invention are not limited thereto, and such singular forms can include plural forms. Similarly, explicit plural forms preferably mean plural forms. However, embodiments of the present invention are not limited thereto, and such plural forms can include singular forms.
Note that the size, the thickness of layers, or regions in diagrams are sometimes exaggerated for simplicity. Therefore, embodiments of the present invention are not limited to such scales.
Note that a diagram schematically illustrates an ideal example, and embodiments of the present invention are not limited to the shape or the value illustrated in the diagram. For example, the following can be included: variation in shape due to a manufacturing technique or dimensional deviation; or variation in signal, voltage, or current due to noise or difference in timing.
Technical terms are used in order to describe a specific embodiment or the like in many cases. Note that interpretation in an embodiment of the invention should not be limited on terms.
Note that terms which are not defined (including terms used for science and technology, such as technical terms and academic parlance) can be used as the terms which have a meaning equivalent to a general meaning that an ordinary person skilled in the art understands. It is preferable that the term defined by dictionaries or the like is construed as a consistent meaning with the background of related art.
The terms such as first, second, and third are used for distinguishing various elements, members, regions, layers, and areas from others. Therefore, the terms such as first, second, and third do not limit the number of elements, members, regions, layers, areas, or the like. Further, for example, “first” can be replaced with “second”, “third”, or the like.
Terms for describing spatial arrangement, such as “over”, “above”, “under”, “below”, “laterally”, “right”, “left”, “obliquely”, “back”, “front”, “inside”, “outside”, and “in”, are often used for briefly showing, with reference to a diagram, a relation between an element and another element or between some characteristics and other characteristics. Note that embodiments of the present invention are not limited thereto, and such terms for describing spatial arrangement can indicate not only the direction illustrated in a diagram but also another direction. For example, when it is explicitly described that “B is over A”, it does not necessarily mean that B is placed over A, and can include the case where B is placed under A because a device in a diagram can be inverted or rotated by 180°. Accordingly, “over” can refer to the direction described by “under” in addition to the direction described by “over”. Note that embodiments of the present invention are not limited thereto, and “over” can refer to other directions described by “laterally”, “right”, “left”, “obliquely”, “back”, “front”, “inside”, “outside”, and “in”, in addition to the directions described by “over” and “under” because a device in a diagram can be rotated in a variety of directions. That is, terms for describing spatial arrangement can be appropriately construed as circumstances demand.
An embodiment of the present invention can reduce influence of variation in threshold voltage of a transistor. Alternatively, an embodiment of the present invention can reduce influence of variation in mobility of a transistor. Alternatively, an embodiment of the present invention can reduce influence of variation of current characteristic of a transistor. Alternatively, an embodiment of the present invention can obtain a long inputting period of an image signal. Alternatively, an embodiment of the present invention can obtain a long compensation period for reducing influence of variation in threshold voltage. Alternatively, an embodiment of the present invention can obtain a long compensation period for reducing influence of variation in mobility. Alternatively, an embodiment of the present invention can prevent distortion of waveform of an image signal from influencing compensation for variation in mobility. Alternatively, an embodiment of the present invention can perform not only line sequential driving but also dot sequential driving. Alternatively, an embodiment of the present invention can form a pixel and a driver circuit over one substrate. Alternatively, an embodiment of the present invention can reduce power consumption. Alternatively, an embodiment of the present invention can reduce manufacturing costs. Alternatively, an embodiment of the present invention can reduce a contact failure at a connection portion of wirings.
In the accompanying drawings:
Hereinafter, embodiments will be described with reference to the drawings. Note that the embodiments can be implemented in various ways and it will be readily appreciated by those skilled in the art that modes and details of the embodiments can be changed in various ways without departing from the spirit and scope of the present invention. Therefore, the present invention should not be construed as being limited to the following description of the embodiments. Note that in structures described below, the same portions or portions having similar functions are denoted by common reference numerals in different drawings, and description thereof is not repeated.
Further, a content (or may be part of the content) described in one embodiment may be applied to, combined with, or replaced by a different content (or may be part of the different content) described in the embodiment and/or a content (or may be part of the content) described in one or a plurality of different embodiments.
Note that in each embodiment, a content described in the embodiment is a content described with reference to a variety of diagrams or a content described with a text described in this specification.
Note that by combining a diagram (or may be part of the diagram) illustrated in one embodiment with another part of the diagram, a different diagram (or may be part of the different diagram) illustrated in the embodiment, and/or a diagram (or may be part of the diagram) illustrated in one or a plurality of different embodiments, much more diagrams can be formed.
Note that in a diagram or a text described in one embodiment, part of the diagram or the text is taken out, and one embodiment of the invention can be constituted. Thus, in the case where a diagram or a text related to a certain portion is described, the context taken out from part of the diagram or the text is also disclosed as one embodiment of the invention, and one embodiment of the invention can be constituted. Therefore, for example, in a diagram (e.g., a cross-sectional view, a plan view, a circuit diagram, a block diagram, a flow chart, a process diagram, a perspective view, a cubic diagram, a layout diagram, a timing chart, a structure diagram, a schematic view, a graph, a list, a ray diagram, a vector diagram, a phase diagram, a waveform chart, a photograph, or a chemical formula) or a text in which one or more active elements (e.g., transistors or diodes), wirings, passive elements (e.g., capacitors or resistors), conductive layers, insulating layers, semiconductor layers, organic materials, inorganic materials, components, substrates, modules, devices, solids, liquids, gases, operating methods, manufacturing methods, or the like are described, part of the diagram or the text is taken out, and one embodiment of the invention can be constituted. For example, M pieces of circuit elements (e.g., transistors or capacitors) (M is an integer, where M<N) are taken out from a circuit diagram in which N pieces of circuit elements (e.g., transistors or capacitors) (N is an integer) are provided, and one embodiment of the invention can be constituted. As another example, M pieces of layers (M is an integer, where M<N) are taken out from a cross-sectional view in which N pieces of layers (N is an integer) are provided, and one embodiment of the invention can be constituted. As another example, M pieces of elements (M is an integer, where M<N) are taken out from a flow chart in which N pieces of elements (N is an integer) are provided, and one embodiment of the invention can be constituted.
A circuit structure in the period for compensating variation in threshold voltage of a transistor 101 is shown in
In
In
A wiring 104 and the second terminal of the transistor 101 are in a non-conduction state. Further, the wiring 104 and the second terminal of the capacitor 102A are in a non-conduction state, and the wiring 104 and the first terminal of the capacitor 102B are in a non-conduction state. Note that, as shown in
Note that an image signal, a predetermined voltage, or the like is supplied to the transistor 101, the capacitor 102A, or the capacitor 102B through the wiring 104 in some cases. Accordingly, the wiring 104 can be referred to as “a source signal line”, “an image signal line”, “a video signal line”, or the like.
A circuit structure in the period for compensating variation in current characteristics such as mobility of the transistor 101 is shown in
In
In
The wiring 104 and the second terminal of the transistor 101 are in a non-conduction state. Further, the wiring 104 and the second terminal of the capacitor 102A are in a non-conduction state, and the wiring 104 and the first terminal of the capacitor 102B are in a non-conduction state. Note that, as shown in
Note that it is preferable that a voltage corresponding to the threshold voltage of the transistor 101 is held in the capacitor 102A before a connection structure becomes like a connection structure in
Note that there is a possibility that in the case where the capacitors 102A and 102B hold the total voltage of a voltage corresponding to the threshold voltage of the transistor 101 and an image signal voltage, the voltage slightly varies by switching noise or the like. However, there is no problem even if voltage slightly varies, as long as some variation does not hamper actual operation. Accordingly, for example, in the case where the total voltage of the voltage corresponding to the threshold voltage of the transistor 101 and an image signal voltage is input to the capacitors 102A and 102B, the voltage actually held in the capacitors 102A and 102B is not completely equal to and slightly different from the input voltage due to influence of noise or the like in some cases. Note that a minor fluctuation is insignificant as long as the fluctuation is within the range that does not influence on actual operation.
Next, a circuit structure in the period in which current is supplied to the display element 105 through the transistor 101 is shown in
In
In
That is, in transition from the period for compensating variation in current characteristics such as mobility of the transistor 101 (
As an example, as shown in
Different examples from the example in
Note that the expression “A and B are in a conduction state” can indicate connection of various elements between A and B. For example, a resistor, a capacitor, a transistor, a diode, and the like can be connected in series or in parallel between A and B. Similarly, the expression “A and B are in a non-conduction state” can indicate connection of various elements are connected between A and B. As long as at least A and B are in a non-conduction state, various elements can be connected in other portions. For example, elements such as a resistor, a capacitor, a transistor, a diode, and the like can be connected in series or in parallel.
Therefore, for example,
In addition, in each connection of wirings and elements, switches for establishing or breaking a conduction state can be eliminated A circuit where switches are eliminated is shown in
In this manner, in the period in which variation in current characteristics such as mobility of the transistor 101 is compensated (
The above-described circuit structures illustrated in
Note that the period in which current is supplied to the display element 105 (
Thus, it is preferable the charge held in the capacitors 102A and 102B at the termination of the period in which variation in current characteristics such as mobility of the transistor 101 is compensated is substantially equal in amount to the charge held in the capacitors 102A and 102B at the start of the period in which current is supplied to the display element 105. Note that there may be an insignificant difference between both these periods due to the influence of noise or the like. Specifically, the difference in the amount of charge between both these periods is preferably 10% or less, more preferably 3% or less. It is more preferable that the difference of the amount of charge is 3% or less, because human eyes cannot receive the difference when a human sees a display element affected by the difference.
Accordingly, a graph of the current-voltage characteristics in the period before discharge, that is, a period before the period in which variation in current characteristics such as mobility of the transistor 101 is compensated (
Note that a graph shown in
Note that current characteristics of the transistor 101 whose variation can be compensated include not only mobility, but also the threshold voltage, parasitic resistance in the source portion (the drain portion), and resistance in the lightly doped drain region (LDD region) of the transistor 101, contact resistance in a contact hole electrically connected to the transistor 101, and the like. Variation in these current characteristics can also be reduced as in the case of mobility, because charge is discharged through the transistor 101.
Thus, the amount of charge in the capacitors 102A and 102B in a period before the discharge, that is, in the period before the period in which variation in current characteristics such as mobility of the transistor 101 is compensated (
Note that the discharge of the charge held in the capacitors 102A and 102B is preferably stopped soon after part of the charge is discharged. If the charge is completely discharged, that is, if the charge is discharged until no current flows, information of an image signal is almost lost. Thus, it is preferable that the discharge is stopped before charge is completely discharged. In other words, the discharge is preferably stopped while current flows to the transistor 101.
Accordingly, when the length of one gate selection period (or one horizontal period, a value obtained by dividing one frame period by the number of rows of pixels, or the like) is compared with that of the period in which variation in current characteristics such as mobility of the transistor 101 is compensated (
Alternatively, when the length of a period in which an image signal is input to a pixel is compared with that of the period in which variation in current characteristics such as mobility of the transistor 101 is compensated (
Alternatively, the length of a period in which the threshold voltage of the transistor is obtained (
Note that in the period in which variation in current characteristics such as mobility of the transistor 101 is compensated (
For example, the case where there are a plurality of circuits as illustrated in any of
Then, when the W/L of the transistor 101A is larger than W/L of the transistor 101B, it is preferable that total capacitance value of the capacitors 102A_1 and 102B_1 is larger than that of the capacitors 102A_2 and 102B_2. Since the amount of charge discharged from the transistor 101A is larger than that of charge from the transistor 101B, the total of voltage of the capacitors 102A_2 and 102B_2 is also largely changed. Thus, it is preferable that the total capacitance value of the capacitors 102A_1 and 102B_1 is large in order to adjust the amount of the voltage change. Alternatively, when the channel width W of the transistor 101A is larger than the channel width W of the transistor 101B, it is preferable that the total capacitance value of the capacitors 102A_1 and 102B_1 is larger than the total capacitance value of the capacitors 102A_2 and 102B_2. Alternatively, when the channel length L of the transistor 101A is smaller than the channel length L of the transistor 101B, it is preferable that the total capacitance value of the capacitors 102A_1 and 102B_1 is larger than the total capacitance value of the capacitors 102A_2 and 102B_2.
Note that it is possible to provide a capacitor additionally in order to control the amount of discharge of total charge of charge held in the capacitors 102A and charge held in 102B. For example,
In
Similarly,
For example, the cases where there are a plurality of circuits which are illustrated in
Then, when W/L of the transistor 101A is larger than W/L of the transistor 101B, it is preferable that the total capacitance value of the capacitors 102A_1 and 102B_1 is larger than that of the capacitors 102A_2 and 102B_2. Alternatively, it is preferable that the total capacitance value of the capacitors 402A_1 and 402B_1 is larger than that of capacitors 402A_2 and 402B_2. Alternatively, it is preferable that the total capacitance value of the capacitors 102A_1, 102B_1, 402A_1, and 402B_1 is larger than that of the capacitors 102A_2, 102B_2, 402A_2, and 402B_2. Since the amount of charge discharged from the transistor 101A is larger than that of charge from the transistor 101B, a potential is adjusted. Alternatively, when the channel width W of the transistor 101A is larger than the channel width W of the transistor 101B, it is preferable that the capacitance value of the capacitor 102A_1 is larger than the capacitance value of the capacitor 102A_2. Alternatively, it is preferable that the total capacitance value of the capacitors 402A_1 and 402B_1 is larger than that of the capacitors 402A_2 and 402B_2. Alternatively, it is preferable that the total capacitance value of the capacitors 102A_1, 102B_1, 402A_1, and 402B_1 is larger than that of the capacitors 102A_2, 102B_2, 402A_2, and 402B_2. Alternatively, when the channel length L of the transistor 101A is smaller than the channel length L of the transistor 101B, it is preferable that the total capacitance value of the capacitors 102A_1 and 102B_1 is larger than that of the capacitors 102A_2 and 102B_2. Alternatively, it is preferable that the total capacitance value of the capacitors 402A_1 and 402B_1 is larger than that of the capacitors 402A_2 and 402B_2. Alternatively, it is preferable that the total capacitance value of the capacitors 102A_1, 102B_1, 402A_1, and 402B_1 is larger than that of the capacitors 102A_2, 102B_2, 402A_2, and 402B_2.
Note that the following state is possible: the total capacitance value of the capacitors 402A_1 and 402B_1 is different from that of the capacitors 402A_2 and 402B_2, and the total capacitance value of the capacitors 102A_1 and 102B_1 is substantially equal to that of the capacitors 102A_2 and 102B_2. In other words, the capacitance value can be adjusted using not the total capacitance value of the capacitors 102A_1 and 102B_1 and the total capacitance value of the capacitors 102A_2 and 102B_2, but the capacitors 402A_1 and 402A_2. When the total capacitance value of the capacitors 102A_1 and 102B_1 is different from that of the capacitors 102A_2 and 102B_2, it is possible that levels of image signals are possible to differ, which may cause other significant adverse effects. Therefore, it is preferable that the capacitance value is adjusted using the capacitors 402A_1 and 402A_2.
Note that the connection structure of the circuit is not limited to those shown in
Note that, a capacitor can be additionally provided for the circuits in
Note that in
Note that, in
Note that the case where the transistor 101 is a p-channel transistor in
Note that the transistor 101 controls the amount of current flowing into the display element 105 and has a capability for driving the display element 105 in many cases.
Note that the wiring 103 has a capability to supply electric power to the display element 105 in many cases. Alternatively, the wiring 103 has a capability to supply current which flows in the transistor 101 in many cases.
Note that the wiring 107 has a capability for supplying voltage to the capacitor 102A or the capacitor 102B in many cases. Alternatively, in many cases, the wiring 107 has a function by which a gate potential of the transistor 101 is not easily changed by noise or the like.
Note that voltage corresponding to the threshold voltage of the transistor 101 means the voltage having a level that is the same level as or close to the threshold voltage of transistor 101. For example, when the threshold voltage of the transistor 101 is high, the voltage corresponding to the threshold voltage is also high. When the threshold voltage of the transistor 101 is low, the voltage corresponding to the threshold voltage is also low. As thus described, voltage of which level is determined depending on the threshold voltage is referred to as voltage corresponding to the threshold voltage. Thus, the voltage of which level is slightly different from the threshold voltage due to influence of noise can also be referred to as the voltage corresponding to the threshold voltage.
Note that the display element 105 is an element having functions of change luminance, brightness, reflectivity, transmittance, or the like. Thus, as an example of the display element 105, a liquid crystal element, a light-emitting element, an organic EL element, an electrophoretic element, or the like can be used.
Note that in this embodiment, what is illustrated in the drawing can be freely combined with or replaced with what is described in other embodiments as appropriate.
This embodiment will be described a specific example of the circuit and driving method described in Embodiment 1.
A specific example of the circuit structure described in Embodiment 1 is illustrated in
Note that a switch is preferably provided additionally in order to control a potential of the gate of the transistor 101 or a potential of the second terminal of the transistor 101. However, the present invention is not limited thereto. An example of a circuit additionally provided with a switch is shown in each of
Note that one wiring is used to serve as the wiring 606 and another wiring, so that the number of the wirings can be reduced. For example,
Note that the connection structure of the circuit is not limited thereto. As long as elements are provided so as to be able to desirably operate, various circuit structures can be realized by providing a switch, a transistor, or the like in various places.
As thus described, an example of the structure described in Embodiment 1 can have a variety of structures. Further, specific examples can similarly be realized in other structures.
As an example, examples of the structure in
Further, example of the structure in
Note that the switch 203 can be eliminated by controlling a potential supplied to the wiring 104 and by controlling timing of on/off of the switch 601. For example,
Note that the capacitor 102A can be eliminated by utilizing parasitic capacitance caused by cross-over capacitance of wirings, or the like. For example,
As thus described, in
Next, an operation method will be described. Here, description is made with reference to the circuit of
First, in a period illustrated in
Note that it is preferable that the potential of the wiring 106 is lower than that of the wiring 103. Note that the potential is not limited thereto. These potentials are used when the transistor 101 is a p-channel transistor. Thus, when the polarity of the transistor 101 is an n-channel type, it is preferable that the potential of the wiring 106 is higher than that of the wiring 103.
Then, in a period illustrated in
Note that when charge in the capacitor 102A is discharged, almost complete discharge is possible. In that case, since current hardly flows into the transistor 101, the level of a voltage between the gate and the source of the transistor 101 is very close to the level of the threshold voltage of the transistor 101. Note that the discharge can be stopped before charge is completely discharged.
Note that, no big problem occurs when the length of the period changes in the case where charge in the capacitor 102A are discharged in this period. This is because, since charge is almost completely discharged after a certain length of time, influence on the operation is small even if the length of the period changes. Therefore, not line sequential driving but dot sequential driving can be applied to this operation. Thus, the structure can be realized with a simple structure of the driving circuit. Therefore, when a circuit illustrated in
Then, in the period shown in
Through the operation, the total voltage of the voltage corresponding to the threshold voltage and the video signal voltage is supplied to the capacitor 102A, which leads to accumulation of charge corresponding to the voltage therein.
Then, in a period of the state shown in
Then, in a period shown in
Note that, in the case of a circuit structure in
Note that in
Note that the contents described with each drawing in this embodiment can be freely combined with or replaced with the contents described in another embodiment as appropriate.
In this embodiment, another specific example or deformation example of the circuit and driving method which are described in Embodiment 1.
Specific examples of
Operation of a circuit shown in
The first period T1 is described. In the first period T1, the wiring 1101 has a potential of VDD, the wiring 1102 has a potential of VDD, the wiring 1103_1 has a potential of VgL, and the wiring 1104 has a potential of VdL. As a result, charge accumulated in the capacitor 1105 are discharged, so that a potential of each node is initialized. Then, the second period T2 is described. In the second period T2, the wiring 1101 has a potential of VSS, the wiring 1102 has a potential of VDD, the wiring 1103_1 has a potential of VgH, and the wiring 1104 has a potential of VdH. As a result, the capacitor 1105 is charged up. Then, the third period T3 is described. In the third period T3, the wiring 1101 has a potential of “0”, the wiring 1102 has a potential of “0”, the wiring 1103_1 has a potential of VgL, and the wiring 1104 has a potential of VdH. As a result, charge is discharged from the capacitor 1105, so that the threshold voltage of the transistor 1106 is held in parasitic capacitance between a gate and a source of the transistor 1106. That is, the third period T3 corresponds to a period (
Note that the connection structure of the circuit is not limited thereto. As long as elements are provided so as to be able to desirably operate, various circuit structures can be realized by providing a switch, a transistor, or the like in various places.
For example, a circuit where the transistors 1106 and 1107 are n-channel transistors is shown in
In this manner, various structures can be shown as examples of the structure described in Embodiment 3. Further, specific examples of
Note that in this embodiment, what is illustrated in the drawing can be freely combined with or replaced with what is described in other embodiments as appropriate.
In this embodiment, a specific example of the circuits described in Embodiments 1 to 3 will be described.
As an example,
The circuit illustrated in
Next, correspondence between the elements in
A gate of the transistor 601M is connected to a wiring 1201M. A gate of the transistor 201M is connected to a wiring 1202M. A gate of the transistor 202M is connected to a wiring 1203M. A gate of the transistor 203M is connected to a wiring 1204M.
Note that each wiring connected to the gate of the transistor can be connected to a wiring of another pixel or another wiring of the same pixel.
Note that the wiring 106M can be connected to a wiring 106P, a wiring 106N, and a wiring 106Q.
Various other circuits can be formed as in
Note that in this embodiment, what is illustrated in the drawing can be freely combined with or replaced with what is described in other embodiments as appropriate.
Next, another structure example and driving method of a display device will be described. In this embodiment, a method is described by which an image for interpolating motion of an image (an input image) input from the outside of a display device is generated inside the display device on the basis of a plurality of input images and the generated image (the generation image) and the input image are sequentially displayed. Note that when an image for interpolating motion of an input image is a generation image, motion of moving images can be made smooth, and decrease in quality of moving images because of afterimages or the like due to hold driving can be suppressed. Here, moving image interpolation is described below. Ideally, display of moving images is realized by controlling the luminance of each pixel in real time; however, individual control of pixels in real time has problems such as the enormous number of control circuits, space for wirings, and the enormous amount of input image data. Thus, it is difficult to realize the individual control of pixels. Therefore, for display of moving images by a display device, a plurality of still images are sequentially displayed in a certain cycle so that display appears to be moving images. The cycle (in this embodiment, referred to as an input image signal cycle and denoted by Tin) is standardized, and for example, 1/60 second in NTSC and 1/50 second in PAL. Such a cycle does not cause a problem of moving image display in a CRT, which is an impulsive display device. However, in a hold-type display device, when moving images conforming to these standards are displayed without change, a defect (hold blur) in which display is blurred because of afterimages or the like due to hold driving occurs. Since hold blur is recognized by discrepancy between unconscious motion interpolation due to human eye tracking and hold-type display, the hold blur can be reduced by making the input image signal cycle shorter than that in conventional standards (by making the control closer to individual control of pixels in real time). However, it is difficult to reduce the length of the input image signal cycle because the standard needs to be changed and the amount of data is increased. However, when an image for interpolating motion of an input image is generated inside the display device on the basis of a standardized input image signal and display is performed while the generation image interpolates the input image, hold blur can be reduced without change in the standard or increase in the amount of data. Operation such that an image signal is generated inside the display device on the basis of an input image signal to interpolate motion of the input image is referred to as moving image interpolation.
By a method for interpolating moving images in this embodiment, motion blur can be reduced. The method for interpolating moving images in this embodiment can include an image generation method and an image display method. Further, by using a different image generation method and/or a different image display method for motion with a specific pattern, motion blur can be effectively reduced.
In the example of the method for interpolating moving images in this embodiment, as illustrated in
Here, an example of a specific generation method of the image 5123, which is generated on the basis of the images 5121 and 5122, is described. It is necessary to detect motion of an input image in order to interpolate moving images. In this embodiment, a method called a block matching method can be used in order to detect motion of an input image. Note that this embodiment is not limited thereto, and a variety of methods (e.g., a method for obtaining a difference of image data or a method using Fourier transformation) can be used. In the block matching method, first, image data for one input image (here, image data of the image 5121) is stored in a data storage unit (e.g., a memory circuit such as a semiconductor memory or a RAM). Then, an image in the next frame (here, the image 5122) is divided into a plurality of regions. Note that the divided regions can have the same rectangular shapes as illustrated in
Note that the size of the image generation vector 5128 can be determined in accordance with the display timing of the image 5123. In the example of
Note that in the case where a new image is generated by moving a plurality of regions having different motion vectors in this manner, a portion where one region has already been moved to a region that is a destination for another region or a portion to which any region is not moved is generated in some cases (i.e., overlap or blank occurs in some cases). For such portions, data can be compensated. As a method for compensating an overlap portion, a method by which overlap data is averaged; a method by which data is arranged in order of priority according to the direction of motion vectors or the like, and high-priority data is used as data in a generation image; or a method by which one of color and brightness is arranged in order of priority and the other thereof is averaged can be used, for example. As a method for compensating a blank portion, a method by which image data of the portion of the image 5121 or the image 5122 is used as data in a generation image without modification, a method by which image data of the portion of the image 5121 or the image 5122 is averaged, or the like can be used. Then, the generated image 5123 is displayed at the timing in accordance with the size of the image generation vector 5128, so that motion of moving images can be made smooth, and the decrease in quality of moving images because of afterimages or the like due to hold driving can be suppressed.
In another example of the method for interpolating moving images in this embodiment, as illustrated in
Another example of the method for interpolating moving images in this embodiment is an example in which the shape of an object which is moved in an image is detected and different processings are performed depending on the shape of the moving object.
Note that in this embodiment, what is illustrated in the drawing can be freely combined with or replaced with what is described in other embodiments as appropriate.
In this embodiment, an example of a display device will be described.
First, an example of a system block of a liquid crystal display device is described with reference to
The circuit 5361 has a function of supplying a signal, voltage, current, or the like to the circuit 5362, the circuit 5363_1, the circuit 5363_2, and the circuit 5365 in response to a video signal 5360 and can function as a controller, a control circuit, a timing generator, a power supply circuit, a regulator, or the like. In this embodiment, for example, the circuit 5361 supplies a signal line driver circuit start signal (SSP), a signal line driver circuit clock signal (SCK), a signal line driver circuit inverted clock signal (SCKB), video signal data (DATA), or a latch signal (LAT) to the circuit 5362. Alternatively, as an example, the circuit 5361 supplies a scan line driver circuit start signal (GSP), a scan line driver circuit clock signal (GCK), or a scan line driver circuit inverted clock signal (GCKB) to the circuit 5363_1 and the circuit 5363_2. Further alternatively, the circuit 5361 supplies a backlight control signal (BLC) to the circuit 5365. Note that this embodiment is not limited thereto, and the circuit 5361 can supply various other signals, voltages, currents, or the like to the circuit 5362, the circuit 5363_1, the circuit 5363_2, and the circuit 5365.
The circuit 5362 has a function of outputting video signals to the plurality of wirings 5371 in response to a signal supplied from the circuit 5361 (e.g., SSP, SCK, SCKB, DATA, or LAT), and can function as a signal line driver circuit. The circuit 5363_1 and the circuit 5363_2 each have a function of outputting scan signals to the plurality of wirings 5372 in response to a signal supplied from the circuit 5361 (e.g., GSP, GCK, or GCKB), and can function as a scan line driver circuit. The circuit 5365 has a function of controlling the luminance (or the average luminance) of the lighting device 5366 by controlling the amount of electric power supplied to the lighting device 5366, time to supply the electric power to the lighting device 5366, or the like in accordance with the signal (BLC) supplied from the circuit 5361. The circuit 5365 can function as a power supply circuit.
Note that when video signals are input to the plurality of wirings 5371, the plurality of wirings 5371 can function as signal lines, video signal lines, source lines, or the like. When scan signals are input to the plurality of wirings 5372, the plurality of wirings 5372 can function as signal lines, scan lines, gate lines, or the like. Note that this embodiment is not limited thereto.
Note that when the same signal is input to the circuit 5363_1 and the circuit 5363_2 from the circuit 5361, scan signals output from the circuit 5363_1 to the plurality of wirings 5372 and scan signals output from the circuit 5363_2 to the plurality of wirings 5372 have approximately the same timings in many cases. Accordingly, load caused by driving of the circuits 5363_1 and 5363_2 can be reduced. Thus, the display device can be made larger. Alternatively, the display device can have higher definition. Alternatively, since the channel width of transistors included in the circuits 5363_1 and 5363_2 can be reduced, a display device with a narrower frame can be obtained. Note that this embodiment is not limited thereto, and the circuit 5361 can supply different signals to the circuit 5363_1 and the circuit 5363_2.
Note that one of the circuit 5363_1 and the circuit 5363_2 can be eliminated.
Note that a wiring such as a capacitor line, a power supply line, or a scan line can be additionally provided in the pixel portion 5364. Then, the circuit 5361 can output a signal, a voltage, or the like to such a wiring. Further, a circuit similar to the circuit 5363_1 or the circuit 5363_2 can be additionally provided. The additionally provided circuit can output a signal such as a scan signal to the additionally provided wiring.
Note that the pixel 5367 can include a light-emitting element such as an EL element as a display element. In that case, as illustrated in
Note that
Note that as in
The above is the description of one example of the system block of the display device.
Next, examples of structures of the display device will be described with reference to
In
Note that in the case where the circuit is formed over a substrate which is different from the substrate where the pixel portion 5364 is formed, the substrate can be mounted on a flexible printed circuit (FPC) by tape automated bonding (TAB). Alternatively, the substrate can be mounted on the same substrate 5380 as the pixel portion 5364 by chip on glass (COG).
In the case where the circuit is formed over a different substrate from the pixel portion 5364, a transistor formed using a single crystal semiconductor can be formed on the substrate. Therefore, the circuit formed over the substrate can have advantages such as improvement in driving frequency, improvement in driving voltage, or reduction of variation in output signals.
Note that a signal, voltage, current, or the like is input from an external circuit through an input terminal 5381 in many cases.
In
Note that as illustrated in
In
Note that in
In
Note that also in
Note that in this embodiment, what is illustrated in the drawing can be freely combined with or replaced with what is described in other embodiments as appropriate.
In this embodiment, an example of steps for manufacturing a transistor and a capacitor will be described. In particular, manufacturing steps in which an oxide semiconductor is used for a semiconductor layer will be described. As an oxide semiconductor layer, a layer represented by InMO3(ZnO)m (m>0) can be used. Note that M represents one or more of metal elements selected from Ga, Fe, Ni, Mn, and Co. As an example, only Ga may be contained as M, or any of the above metal elements in addition to Ga, for example, Ga and Ni or Ga and Fe may be contained as M. Note that the oxide semiconductor may contain a transition metal element such as Fe or Ni or oxide of the transition metal element as an impurity element in addition to the metal element contained as M. Such a thin film can be referred to as an In—Ga—Zn—O-based non-single-crystal film. As the oxide semiconductor, ZnO can be used. Note that the concentration of mobile ions in the oxide semiconductor layer, typically sodium, is preferably 5×1018/cm3 or less, more preferably 1×1018/cm3 or less so as to suppress change in electric characteristics of a transistor. Note that this embodiment is not limited thereto, and various other oxide semiconductor materials can be used for a semiconductor layer. Alternatively, for the semiconductor layer, a single crystal semiconductor, a polycrystalline semiconductor, a microcrystalline (microcrystal or nanocrystal) semiconductor, an amorphous semiconductor, various non-single-crystal semiconductors, or the like can be used.
An example of steps for manufacturing a transistor and a capacitor is described with reference to
First, a first conductive layer is formed over the entire surface of a substrate 5420 by a sputtering method. Next, the first conductive layer is selectively etched by using a resist mask formed through a photolithography process using a first photomask, so that a conductive layer 5421 and a conductive layer 5422 are formed. The conductive layer 5421 can function as a gate electrode. The conductive layer 5422 can function as one electrode of the capacitor. Note that this embodiment is not limited thereto, and each of the conductive layers 5421 and 5422 can include a portion functioning as a wiring, a gate electrode, or an electrode of the capacitor. After that, the resist mask is removed.
Next, an insulating layer 5423 is formed over the entire surface by a plasma CVD method or a sputtering method. The insulating layer 5423 can function as a gate insulating layer and is formed so as to cover the conductive layers 5421 and 5422. Note that the thickness of the insulating layer 5423 is often in the range of 50 nm to 250 nm.
When a silicon oxide layer is used as the insulating layer 5423, the silicon oxide layer can be formed by a CVD method using an organosilane gas. As the organosilane gas, yttrium oxide (Y2O3) or the following silicon-containing compound can be used: tetraethyl orthosilicate (TEOS) (chemical formula: Si(OC2H5)4), tetramethylsilane (TMS) (chemical formula: Si(CH3)4), tetramethylcyclotetrasiloxane (TMCTS), octamethylcyclotetrasiloxane (OMCTS), hexamethyldisilazane (HMDS), triethoxysilane (chemical formula: SiH(OC2H5)3), or trisdimethylaminosilane (chemical formula: SiH(N(CH3)2)3).
Then, the insulating layer 5423 is selectively etched by using a resist mask formed through a photolithography process using a second photomask, so that a contact hole 5424 which reaches the conductive layer 5421 is formed. After that, the resist mask is removed. Note that this embodiment is not limited thereto, and the contact hole 5424 can be eliminated. Alternatively, the contact hole 5424 can be formed after an oxide semiconductor layer is formed. A cross-sectional view of the steps so far corresponds to
Next, an oxide semiconductor layer is formed over the entire surface by a sputtering method. Note that this embodiment is not limited thereto, and it is possible to form the oxide semiconductor layer by a sputtering method and to form an n+ layer thereover. Note that the thickness of the oxide semiconductor layer is often in the range of 5 nm to 200 nm.
Before the oxide semiconductor layer is formed by a sputtering method, reverse sputtering in which plasma is generated by introduction of an argon gas is preferably performed. By the reverse sputtering, dust attached to a surface of the insulating layer 5423 and a bottom surface of the contact hole 5424 can be removed. The reverse sputtering is a method in which voltage is applied to a substrate side, not to a target side, in an argon atmosphere by using an RF power supply and plasma is generated so that a substrate surface is modified. Note that this embodiment is not limited thereto, and nitrogen, helium, or the like can be used instead of the argon atmosphere. Alternatively, the reverse sputtering can be performed in an atmosphere where oxygen, N2O, or the like is added to the argon atmosphere or in an atmosphere where Cl2, CF4, or the like is added to the argon atmosphere. Note that by the reverse sputtering, the thickness of the insulating layer 5423 is reduced from the surface by preferably approximately 2 nm to 10 nm. Formation of the oxide semiconductor layer without exposure to air after such plasma treatment is effective in preventing dust or moisture from being attached to the interface between the gate insulating layer and the oxide semiconductor layer.
Then, the oxide semiconductor layer is selectively etched using a third photomask. After that, a resist mask is removed.
Next, a second conductive layer is formed over the entire surface by a sputtering method. Then, the second conductive layer is selectively etched by using a resist mask formed through a photolithography process using a fourth photomask, so that a conductive layer 5429, a conductive layer 5430, and a conductive layer 5431 are formed. The conductive layer 5429 is connected to the conductive layer 5421 through the contact hole 5424. The conductive layers 5429 and 5430 can function as the source electrode and the drain electrode. The conductive layer 5431 can function as the other electrode of the capacitor. Note that this embodiment is not limited thereto, and each of the conductive layers 5429, 5430, and 5431 can include a portion functioning as a wiring, the source or drain electrode, or the electrode of the capacitor.
Note that if heat treatment (e.g., at 200° C. to 600° C.) is performed in a subsequent step, the second conductive layer preferably has heat resistance high enough to withstand the heat treatment. Accordingly, for the second conductive layer, Al and a heat-resistant conductive material (e.g., an element such as Ti, Ta, W, Mo, Cr, Nd, Sc, Zr, or Ce; an alloy in which these elements are combined; or nitride containing any of these elements) are preferably used in combination. Note that this embodiment is not limited thereto, and by employing a layered structure, the second conductive layer can have heat resistance. For example, it is possible to provide a film of a heat-resistant conductive material such as Ti or Mo above and below an Al film.
Before the second conductive layer is formed by a sputtering method, reverse sputtering in which plasma is generated by introduction of an argon gas is preferably performed so that dust attached to the surface of the insulating layer 5423, a surface of the oxide semiconductor layer, and the bottom surface of the contact hole 5424 is removed. Note that this embodiment is not limited thereto, and nitrogen, helium, or the like can be used instead of the argon atmosphere. Alternatively, the reverse sputtering can be performed in an atmosphere where oxygen, hydrogen, N2O, or the like is added to the argon atmosphere or in an atmosphere where Cl2, CF4, or the like is added to the argon atmosphere.
Note that at the time of etching the second conductive layer, part of the oxide semiconductor layer is also etched, so that an oxide semiconductor layer 5425 is formed. By this etching, part of the oxide semiconductor layer 5425, which overlaps with the conductive layer 5421, or part of the oxide semiconductor layer 5425, over which the second conductive layer is not formed, is etched to be thinned in many cases. Note that this embodiment is not limited thereto, and it is possible not to etch the oxide semiconductor layer. However, in the case where the n+ layer is formed over the oxide semiconductor layer, the oxide semiconductor layer is often etched. After that, the resist mask is removed. The transistor 5441 and the capacitor 5442 are completed when this etching is finished. A cross-sectional view of the steps so far corresponds to
Here, when the reverse sputtering is performed before the second conductive layer is formed by a sputtering method, the thickness of an exposed portion of the insulating layer 5423 is reduced by preferably approximately 2 nm to 10 nm in some cases. Accordingly, a recessed portion is sometimes formed in the insulating layer 5423. Alternatively, by performing the reverse sputtering after the second conductive layer is etched to form the conductive layers 5429, 5430, and 5431, end portions of the conductive layers 5429, 5430, and 5431 are curved in some cases as illustrated in
Next, heat treatment is performed at 200° C. to 600° C. in an air atmosphere or a nitrogen atmosphere. Through this heat treatment, rearrangement at the atomic level occurs in the In—Ga—Zn—O-based non-single-crystal layer. This heat treatment (including optical annealing) is important because strain energy which inhibits carrier movement is released by the heat treatment. Note that there is no particular limitation on the timing at which the heat treatment is performed, and the heat treatment can be performed at any time after the oxide semiconductor layer is formed.
Then, an insulating layer 5432 is formed over the entire surface. The insulating layer 5432 can have a single-layer structure or a layered structure. For example, when an organic insulating layer is used as the insulating layer 5432, the organic insulating layer is formed in such a manner that a composition which is a material for the organic insulating layer is applied and subjected to heat treatment at 200° C. to 600° C. in an air atmosphere or a nitrogen atmosphere. By forming the organic insulating layer in contact with the oxide semiconductor layer in such a manner, a thin film transistor with highly reliable electric characteristics can be manufactured. Note that when organic insulating layer is used as the insulating layer 5432, a silicon nitride film or a silicon oxide film can be provided below the organic insulating layer.
Note that instead of application of the composition, the following method can be used depending on the material: dip coating, spray coating, an ink-jet method, a printing method, a doctor knife, a roll coater, a curtain coater, a knife coater, or the like.
Note that without performing the heat treatment after the oxide semiconductor layer is formed, the heat treatment for the composition, which is the material for the organic insulating layer, can also serve to heat the oxide semiconductor layer.
The insulating layer 5432 can be formed to a thickness of 200 nm to 5 μm, preferably 300 nm to 1 μm.
Next, the third conductive layer is formed over the entire surface. Then, the third conductive layer is selectively etched by using a resist mask formed through a photolithography process using a fifth photomask, so that a conductive layer 5433 and a conductive layer 5434 are formed. A cross-sectional view of the steps so far corresponds to
Since the capacitor 5442 has a structure where the conductive layer 5431 is sandwiched between the conductive layers 5422 and 5434, the capacitance value of the capacitor 5442 can be increased. Note that this embodiment is not limited thereto, and one of the conductive layers 5422 and 5434 can be eliminated.
Note that after the resist mask is removed by wet etching, it is possible to perform heat treatment at 200° C. to 600° C. in an air atmosphere or a nitrogen atmosphere.
Through the above steps, the transistor 5441 and the capacitor 5442 can be manufactured.
Note that as illustrated in
In
Note that as illustrated in
In
A complete depletion state can be obtained by making the thickness of the oxide semiconductor layer (or a channel layer) smaller than that of a depletion layer formed in the case where the transistor is off. Accordingly, the off-state current can be reduced. In order to realize this, the thickness of the oxide semiconductor layer is preferably 20 nm or less, more preferably 10 nm or less, and further preferably 6 nm or less.
Note that in order to realize reduction in operation voltage, reduction in off-state current, increase in the on/off ratio of drain current, improvement in S value, or the like of the transistor, the thickness of the oxide semiconductor layer is preferably the smallest among those of the layers included in the transistor. For example, the thickness of the oxide semiconductor layer is preferably smaller than that of the insulating layer 5423. More preferably, the thickness of the oxide semiconductor layer is half or less, further preferably ⅕ or less, and still preferably 1/10 or less than the thickness of the insulating layer 5423. Note that this embodiment is not limited thereto, and the thickness of the oxide semiconductor layer can be larger than that of the insulating layer 5423 in order to improve the reliability. Since the thickness of the oxide semiconductor layer is preferably larger particularly in the case where the oxide semiconductor layer is etched as in
Note that in order to increase the withstand voltage of the transistor, the thickness of the insulating layer 5423 is preferably larger, more preferably 5/4 or more, and further preferably 4/3 or more than the thickness of the first conductive layer. Note that this embodiment is not limited thereto, and the thickness of the insulating layer 5423 can be smaller than that of the first conductive layer in order to increase the mobility of the transistor.
Note that for the substrate, the insulating film, the conductive film, and the semiconductor layer in this embodiment, materials described in other embodiments or materials similar to those described in this specification can be used.
Note that in this embodiment, what is illustrated in the drawing can be freely combined with or replaced with what is described in other embodiments as appropriate.
In this embodiment, examples of structures of transistors will be described with reference to
The insulating layer 5261 can function as a base film. The insulating layer 5354 functions as an element isolation layer (e.g., a field oxide film). Each of the insulating layer 5263, the insulating layer 5302, and the insulating layer 5356 can function as a gate insulating film. Each of the conductive layer 5264, the conductive layer 5301, and the conductive layer 5357 can function as a gate electrode. Each of the insulating layer 5265, the insulating layer 5267, the insulating layer 5305, and the insulating layer 5358 can function as an interlayer film or a planarization film. Each of the conductive layer 5266, the conductive layer 5304, and the conductive layer 5359 can function as a wiring, an electrode of a transistor, an electrode of a capacitor, or the like. Each of the conductive layer 5268 and the conductive layer 5306 can function as a pixel electrode, a reflective electrode, or the like. The insulating layer 5269 can function as a bank. Each of the conductive layer 5271 and the conductive layer 5308 can function as a counter electrode, a common electrode, or the like.
As each of the substrate 5260 and the substrate 5300, a glass substrate, a quartz substrate, a single crystal substrate (e.g., a silicon substrate), an SOI substrate, a plastic substrate, a metal substrate, a stainless steel substrate, a substrate including a stainless steel foil, a tungsten substrate, a substrate including a tungsten foil, or a flexible substrate can be used, for example. Examples of the glass substrate are barium borosilicate glass and aluminoborosilicate glass. Examples of the flexible substrate are flexible synthetic resin such as plastics typified by polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyethersulfone (PES), and acrylic. Alternatively, an attachment film (formed using polypropylene, polyester, vinyl, polyvinyl fluoride, polyvinyl chloride, or the like), paper including a fibrous material, a base material film (polyester, polyamide, polyimide, an inorganic vapor deposition film, paper, or the like), or the like can be used.
As the semiconductor substrate 5352, a single crystal silicon substrate having n-type or p-type conductivity can be used, for example. Note that this embodiment is not limited thereto, and a substrate which is similar to the substrate 5260 can be used. As an example, the region 5353 is a region where an impurity is added to the semiconductor substrate 5352, and functions as a well. For example, in the case where the semiconductor substrate 5352 has p-type conductivity, the region 5353 has n-type conductivity and functions as an n-well. On the other hand, in the case where the semiconductor substrate 5352 has n-type conductivity, the region 5353 has p-type conductivity and functions as a p-well. As an example, the region 5355 is a region where an impurity is added to the semiconductor substrate 5352, and functions as a source region or a drain region. Note that an LDD region can be formed in the semiconductor substrate 5352.
For the insulating layer 5261, a single-layer structure or a layered structure of an insulating film containing oxygen or nitrogen, such as a silicon oxide (SiOx) film, a silicon nitride (SiNx) film, a silicon oxynitride (SiOxNy) (x>y) film, or a silicon nitride oxide (SiNxOy) (x>y) film can be used, for example. In the case where the insulating layer 5261 has a two-layer structure, a silicon nitride film and a silicon oxide film can be formed as a first insulating layer and a second insulating layer, respectively, for example. In the case where the insulating layer 5261 has a three-layer structure, a silicon oxide film, a silicon nitride film, and a silicon oxide film can be formed as a first insulating layer, a second insulating layer, and a third insulating layer, respectively, for example.
For the semiconductor layer 5262, the semiconductor layer 5303a, and the semiconductor layer 5303b, a non-single-crystal semiconductor (e.g., amorphous silicon, polycrystalline silicon, or microcrystalline silicon), a single crystal semiconductor, a compound semiconductor or an oxide semiconductor (e.g., ZnO, InGaZnO, SiGe, GaAs, WO, ITO, SnO, TiO, or AlZnSnO (AZTO)), an organic semiconductor, or a carbon nanotube can be used, for example.
For example, the region 5262a is an intrinsic region where an impurity is not added to the semiconductor layer 5262, and functions as a channel region. However, a slight amount of impurities can be added to the region 5262a. The concentration of the impurity added to the region 5262a is preferably lower than the concentration of an impurity added to the region 5262b, the region 5262c, the region 5262d, or the region 5262e. Each of the region 5262b and the region 5262d is a region to which an impurity is added at low concentration, and functions as an LDD (lightly doped drain) region. Note that the region 5262b and the region 5262d can be eliminated. Each of the region 5262c and the region 5262e is a region to which an impurity is added at high concentration, and functions as a source region or a drain region.
Note that the semiconductor layer 5303b is a semiconductor layer to which phosphorus or the like is added as an impurity element, and has n-type conductivity.
Note that when an oxide semiconductor or a compound semiconductor is used for the semiconductor layer 5303a, the semiconductor layer 5303b can be eliminated.
For each of the insulating layer 5263, the insulating layer 5273, and the insulating layer 5356, a single-layer structure or a layered structure of an insulating film containing oxygen or nitrogen, such as a silicon oxide (SiOx) film, a silicon nitride (SiNx) film, a silicon oxynitride (SiOxNy) (x>y) film, or a silicon nitride oxide (SiNxOy) (x>y) film can be used, for example.
As each of the conductive layer 5264, the conductive layer 5266, the conductive layer 5268, the conductive layer 5271, the conductive layer 5301, the conductive layer 5304, the conductive layer 5306, the conductive layer 5308, the conductive layer 5357, and the conductive layer 5359, a conductive film having a single-layer structure or a layered structure can be used, for example. For the conductive film, a single-layer film containing one element selected from the group consisting of aluminum (Al), tantalum (Ta), titanium (Ti), molybdenum (Mo), tungsten (W), neodymium (Nd), chromium (Cr), nickel (Ni), platinum (Pt), gold (Au), silver (Ag), copper (Cu), manganese (Mn), cobalt (Co), niobium (Nb), silicon (Si), iron (Fe), palladium (Pd), carbon (C), scandium (Sc), zinc (Zn), phosphorus (P), boron (B), arsenic (As), gallium (Ga), indium (In), tin (Sn), oxygen (O), zirconium (Zr), and cerium (Ce); or a compound containing one or more elements selected from the above group can be used, for example. Examples of the compound are an alloy containing one or more elements selected from the above group (e.g., an alloy material such as indium tin oxide (ITO), indium zinc oxide (IZO), indium tin oxide containing silicon oxide (ITSO), zinc oxide (ZnO), tin oxide (SnO), cadmium tin oxide (CTO), aluminum-neodymium (Al—Nd), aluminum-tungsten (Al—W), aluminum-zirconium (Al—Zr), aluminum-titanium (Al—Ti), aluminum-cerium (Al—Ce), magnesium-silver (Mg—Ag), molybdenum-niobium (Mo—Nb), molybdenum-tungsten (Mo—W), or molybdenum-tantalum (Mo—Ta)); a compound containing nitrogen and one or more elements selected from the above group (e.g., a nitride film containing titanium nitride, tantalum nitride, or molybdenum nitride); and a compound containing silicon and one or more elements selected from the above group (e.g., a silicide film containing tungsten silicide, titanium silicide, nickel silicide, aluminum silicon, or molybdenum silicon). Alternatively, a nanotube material such as a carbon nanotube, an organic nanotube, an inorganic nanotube, or a metal nanotube can be used.
Note that silicon (Si) can contain an n-type impurity (e.g., phosphorus) or a p-type impurity (e.g., boron). When silicon contains the impurity, increase in conductivity or a function similar to a general conductor can be realized. Accordingly, such silicon can be utilized easily as a wiring, an electrode, or the like.
Note that as silicon, silicon with various levels of crystallinity, such as single crystal silicon, polycrystalline silicon (polysilicon), or microcrystalline (microcrystal) silicon; or silicon without crystallinity, such as amorphous silicon, can be used. By using single crystal silicon or polycrystalline silicon as silicon, the resistance of a wiring, an electrode, a conductive layer, a conductive film, a terminal, or the like can be reduced. By using amorphous silicon or microcrystalline silicon as silicon, a wiring or the like can be formed through a simple process.
Note that when a semiconductor material such as silicon is used for the conductive layer, the semiconductor material such as silicon can be formed at the same time as a semiconductor layer of a transistor.
Aluminum and silver have high conductivity, so that signal delay can be reduced. Moreover, since aluminum and silver can be easily etched, they are easily patterned and can be minutely processed.
Copper has high conductivity, so that signal delay can be reduced. When copper is used for the conductive layer, a layered structure is preferably employed in order to improve adhesion.
Molybdenum and titanium are preferable because of the following reasons: molybdenum and titanium are not likely to cause defects even if they are in contact with an oxide semiconductor (e.g., ITO or IZO) or silicon; and molybdenum and titanium are easily etched and have high heat resistance. Accordingly, molybdenum or titanium is preferably used for a conductive layer which is in contact with an oxide semiconductor or silicon.
Tungsten is preferable because it has advantages such as high heat resistance.
Neodymium is preferable because it has advantages such as high heat resistance. In particular, when an alloy material of neodymium and aluminum is used for the conductive layer, aluminum hardly causes hillocks. Note that this embodiment is not limited thereto, and hillocks are hardly generated in aluminum when an alloy material of aluminum and tantalum, zirconium, titanium, or cerium is used. In particular, an alloy material of aluminum and cerium can drastically reduce arcing.
Since ITO, IZO, ITSO, ZnO, Si, SnO, CTO, a carbon nanotube, or the like has light-transmitting properties, such a material can be used for a portion through which light passes, such as a pixel electrode, a counter electrode, or a common electrode. In particular, IZO is preferable because it is easily etched and processed. In etching IZO, residues are hardly left. Accordingly, when IZO is used for a pixel electrode, defects (e.g., short circuit or orientation disorder) of a liquid crystal element or a light-emitting element can be reduced.
Note that a conductive layer can have a single-layer structure or a multi-layer structure. When a single-layer structure is employed, a process for manufacturing a wiring, an electrode, a conductive layer, a conductive film, a terminal, or the like can be simplified, the number of days for a process can be reduced, and costs can be reduced. On the other hand, when a multi-layer structure is employed, a wiring, an electrode, or the like with high quality can be formed while an advantage of each material is utilized and a disadvantage thereof is reduced. For example, when a low-resistant material (e.g., aluminum) is included in a multi-layer structure, reduction in resistance of a wiring can be realized. As another example, when a layered structure is employed in which a low heat-resistant material is sandwiched between high heat-resistant materials, heat resistance of a wiring, an electrode, or the like can be increased while advantages of the low heat-resistance material are utilized. As an example of such a layered structure, it is preferable to employ a layered structure in which a layer containing aluminum is sandwiched between layers containing molybdenum, titanium, neodymium, or the like.
When wirings, electrodes, or the like are in direct contact with each other, they adversely affect each other in some cases. For example, in some cases, one wiring or one electrode is mixed into a material of another wiring or another electrode and changes its properties, whereby an intended function cannot be obtained. As another example, when a high-resistant portion is formed, a problem may occur so that the portion cannot be normally formed. In such cases, a material whose properties are changed by reaction with a different material can be sandwiched between or covered with materials which do not easily react with the different material. For example, when ITO and aluminum are connected to each other, titanium, molybdenum, an alloy of neodymium, or the like can be sandwiched between ITO and aluminum. For example, when silicon and aluminum are connected to each other, titanium, molybdenum, or an alloy of neodymium can be sandwiched between silicon and aluminum. Note that such a material can be used for a wiring, an electrode, a conductive layer, a conductive film, a terminal, a via, a plug, or the like.
For each of the insulating layer 5265, the insulating layer 5267, the insulating layer 5269, the insulating layer 5305, and the insulating layer 5358, an insulating layer having a single-layer structure or a layered structure can be used, for example. As the insulating layer, a film containing oxygen or nitrogen, such as a silicon oxide (SiOx) film, a silicon nitride (SiNx) film, a silicon oxynitride (SiOxNy) (x>y) film, or a silicon nitride oxide (SiNxOy) (x>y) film; a film containing carbon such as diamond-like carbon (DLC); an organic material such as a siloxane resin, epoxy, polyimide, polyamide, polyvinyl phenol, benzocyclobutene, or acrylic; or the like can be used, for example.
For the light-emitting layer 5270, an organic EL element or an inorganic EL element can be used, for example. As an example, the organic EL element can have a single-layer structure or a layered structure of a hole injection layer formed using a hole injection material, a hole transport layer formed using a hole transport material, a light-emitting layer formed using a light-emitting material, an electron transport layer formed using an electron transport material, an electron injection layer formed using an electron injection material, or a layer in which a plurality ofse materials are mixed.
The following liquid crystal can be used for the liquid crystal layer 5307: nematic liquid crystal, cholesteric liquid crystal, smectic liquid crystal, discotic liquid crystal, thermotropic liquid crystal, lyotropic liquid crystal, low molecular liquid crystal, high molecular liquid crystal, polymer dispersed liquid crystal (PDLC), ferroelectric liquid crystal, anti-ferroelectric liquid crystal, main chain type liquid crystal, side chain type polymer liquid crystal, plasma addressed liquid crystal (PALC), and banana-shaped liquid crystal. Moreover, the following methods can be used for driving the liquid crystal, for example: a TN (twisted nematic) mode, an STN (super twisted nematic) mode, an IPS (in-plane-switching) mode, an FFS (fringe field switching) mode, an MVA (multi-domain vertical alignment) mode, a PVA (patterned vertical alignment) mode, an ASV (advanced super view) mode, an ASM (axially symmetric aligned microcell) mode, an OCB (optically compensated birefringence) mode, an ECB (electrically controlled birefringence) mode, an FLC (ferroelectric liquid crystal) mode, an AFLC (anti-ferroelectric liquid crystal) mode, a PDLC (polymer dispersed liquid crystal) mode, a guest-host mode, and a blue phase mode.
Note that an insulating layer which functions as an alignment film, an insulating layer which functions as a protrusion portion, or the like can be formed over the insulating layer 5305 and the conductive layer 5306.
Note that a color filter, a black matrix, an insulating layer which functions as a protrusion portion, or the like can be formed over the conductive layer 5308. An insulating layer which functions as an alignment film can be formed below the conductive layer 5308.
Note that in the cross-sectional structure in
Note that in the cross-sectional structure in
Note that in the cross-sectional structure in
Note that in this embodiment, what is illustrated in the drawing can be freely combined with or replaced with what is described in other embodiments as appropriate.
In this embodiment, examples of electronic devices will be described.
The electronic devices illustrated in
The electronic devices described in this embodiment each include the display portion for displaying some sort of information. In the electronic device, influence of variation in characteristics of transistors is reduced in the display portion, whereby an extremely uniform image can be displayed.
Next, application examples of the semiconductor device will be described.
Note that although this embodiment gives the wall and the prefabricated bath as examples of the building, this embodiment is not limited thereto and the semiconductor device can be provided in a variety of buildings.
Next, examples in which the semiconductor device is provided so as to be integrated with a moving body will be described.
Note that although this embodiment gives the body of the vehicle and the body of the plane as examples of the moving body, this embodiment is not limited thereto. The semiconductor device can be provided for a variety of moving bodies such as a two-wheeled motor vehicle, a four-wheeled vehicle (including a car, bus, and the like), a train (including a monorail, a railway, and the like), and a ship.
Note that in this embodiment, what is illustrated in the drawing can be freely combined with or replaced with what is described in other embodiments as appropriate.
This application is based on Japanese Patent Application serial no. 2009-045603 filed with Japan Patent Office on Feb. 27, 2009, the entire contents of which are hereby incorporated by reference.
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