An electronic device may include a display assembly that is adhered to a cover sheet and the cover sheet is elastically bonded to a frame with a compressive and elastic bonding component. Inside the device, the display assembly is spaced apart from the frame, which allows the display assembly to bend or move. The compressive and elastic bonding component has two strong adhesive layers and a low modulus layer that dissipates stress of the display assembly via the cover sheet, such that the compressive and elastic bonding component permits the cover sheet to bend.
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3. An electronic device, comprising:
a frame comprising a base portion and four wall portions;
a cover sheet, wherein the cover sheet comprises glass and has four rim portions;
a compressive and elastic bonding component coupling the cover sheet to the frame, wherein each of the four rim portions of the cover sheet are coupled to a corresponding one of the four wall portions of the frame by the compressive and elastic bonding component; and
a display assembly rigidly coupled to the cover sheet, said display assembly being operable to display image content.
15. An electronic device, comprising:
a frame comprising a base portion and four wall portions, each wall portion comprising an upper edge;
a compressive and elastic bonding component coupled to the upper edge of each wall portion of the frame;
a cover sheet coupled to the compressive and elastic bonding component, the cover sheet, the compressive and elastic bonding component, and the frame together defining a cavity of an interior region of the device; and
a display assembly comprising a first surface and a second surface, the first surface of the display assembly rigidly coupled to the cover sheet, the display assembly positioned in the cavity of the interior region of the device, the display assembly being operable to display content, the second surface of the display assembly spaced apart from the base portion of the frame so as to allow movement of the display assembly.
1. An electronic device, comprising:
a frame comprising a base portion and four wall portions, each wall portion comprising an upper edge;
a compressive and elastic bonding component coupled to the upper edge of each wall portion of the frame, the compressive and elastic bonding component comprising:
a low modulus layer having a first major side and a second major side opposite the first major side, the low modulus layer comprising a cellular membrane structure;
a first adhesive layer adjacent the first major side of the low modulus layer; and
a second adhesive layer adjacent the second major side of the low modulus layer, the second adhesive layer coupled to each upper edge of each wall portion of the frame;
a cover sheet coupled to the first adhesive layer of the compressive and elastic bonding component, the cover sheet, the compressive and elastic bonding component, and the frame together defining a cavity of an interior region of the device; and
a display assembly comprising a first surface and a second surface, the first surface of the display assembly rigidly coupled to the cover sheet with a silicone optically clear adhesive, the display assembly positioned in the cavity of the interior region of the device, the display assembly being operable to display content, the second surface of the display assembly spaced apart from the base portion of the frame so as to allow movement of the display assembly.
2. The electronic device of
the low modulus layer comprises one of a cross-linked polyethylene, a polyester polyurethane, an ethafoam polyethylene, a zotefoam polyethylene, or a polyether polyurethane material; and
the first adhesive layer and the second adhesive layer comprise one of an epoxy, a urethane, a silicone, a polyisobutylene, an acrylic, or a cyanoacrylate material.
4. The electronic device of
5. The electronic device of
6. The electronic device of
a low modulus layer having a first major side and a second major side;
a first adhesive layer adjacent the first major side of the low modulus layer, the first adhesive layer coupled to the cover sheet; and
a second adhesive layer adjacent the second major side of the low modulus layer, the second adhesive layer coupled to the frame.
7. The electronic device of
8. The electronic device of
9. The electronic device of
10. The electronic device of
a touch sensing element coupled to the cover sheet and disposed adjacent to the display assembly and a respective wall portion of the frame.
11. The electronic device of
12. The electronic device of
13. The electronic device of
14. The electronic device of
a sealing ring coupled to four rim portions of the cover sheet and coupled to respective upper edges of four wall portions of the frame, the sealing ring adjacent the compressive and elastic bonding component.
16. The electronic device of
a low modulus layer having a first major side and a second major side opposite the first major side, the low modulus layer comprising a cellular membrane structure;
a first adhesive layer adjacent the first major side of the low modulus layer and coupled to the cover sheet; and
a second adhesive layer adjacent the second major side of the low modulus layer, the second adhesive layer coupled to each upper edge of each wall portion of the frame.
17. The electronic device of
the low modulus layer comprises one of a cross-linked polyethylene, a polyester polyurethane, an ethafoam polyethylene, a zotefoam polyethylene, or a polyether polyurethane material; and
the first adhesive layer and the second adhesive layer comprise one of an epoxy, a urethane, a silicone, a polyisobutylene, an acrylic, or a cyanoacrylate material.
18. The electronic device of
19. The electronic device of
a processing element coupled to the frame and electrically coupled to the display assembly; and
a storage element electrically coupled to the processing element.
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Popular electronic devices include tablet computers, electronic book readers and smartphones. Such electronic devices typically include a housing, a display assembly and a cover sheet. The cover sheet is typically a rigid sheet, such as a sheet of toughened glass, which protects the display assembly while being sufficiently transparent as to permit viewing of the images generated by the display assembly. It is advantageous for a cover sheet to be scratch and damage resistant, while also being thin and light. In order to ensure that the cover sheet remains coupled to a frame, the cover sheet can be rigidly coupled to the frame. Such a rigid coupling is believed to be beneficial in order for the cover sheet to remain coupled to the frame after an electronic device is subject to an external force, such as an impact from being dropped.
Although such electronic devices are expected to be durable, they may be subject to stress that causes damage beyond normal wear and tear. Accordingly, there is a need to increase the durability of such electronic devices.
In the following description, reference is made to the accompanying drawings which illustrate several embodiments of the present disclosure. It is to be understood that other embodiments may be utilized and system or process changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description is not to be taken in a limiting sense, and the scope of the embodiments of the present invention is defined only by the claims of the issued patent. It is to be understood that drawings are not necessarily drawn to scale.
In accordance with embodiments of the present invention, mobile computing devices are provided with a cover sheet, such as a cover glass, coupled to a frame, such as a housing, via a compressible and elastic bonding component. A display assembly is rigidly coupled to the underside of the cover sheet inside of the frame, and the display assembly may be spaced apart from the frame, thereby providing clearance for the display assembly to move or bend within the frame. The bending of the display assembly may cause a shear force on the cover sheet, which is rigidly coupled to the display assembly. Because the cover sheet is coupled to the frame with the compressive and elastic bonding component, the cover sheet is free to move or bend with the display assembly, thereby preventing undesirable levels of shear stress and possible delamination between the display assembly and the cover sheet. The compressive and elastic bonding component may comprise a low modulus layer between two adhesive layers, which may allow transfer of stress from the display assembly to the cover sheet.
In contrast, in the configuration illustrated in
In an alternative embodiment,
Under some embodiments, the low modulus layer 410 may be elastic, and may have elongation capacity and compression capacity. The low modulus layer 410 may be at least one of flexible, pliable, compliant, bendable, stretchable, deformable, and expandable. A low modulus layer 410 may comprise one of Sekisui WF006 made by Sekisui Chemical Co., Ltd., Iwatani ISR-ACF, ISR-ACF-THF and ISR-TUF-RP made by Iwatani Corporation, Korel® K10-SS made by Saint Gobain Performance Plastics Corporation, and Poron® 4701-15-06021-90P made by Rogers Corporation. A low modulus layer 410 may have a thickness from 50 microns to 500 microns. Under some embodiments, the low modulus layer 410 may comprise a foam material, which may comprise acrylic, urethane, polyethylene, polypropylene, and the like. A foam material may comprise a cellular membrane structure with voids and may be closed cell, semi-closed cell, or open cell. An example density of a foam is 0.2 g/cm3. An example 25% Compression Force Deflection is 0.0231 Mpa. In some embodiments, internal stress or energy of a display assembly 130 may be dissipated or released by the low modulus layer 410.
In some embodiments, the first and second adhesive layers 420, 430 are an adhesive coating. In other embodiments, the first and second adhesive layers 420, 430 are a double sided adhesive tape. It is to be understood that, although the low modulus layer 410 may be compressive and/or expansive, the first and second adhesive layers 420, 430 provide a strong bond of the compressive and elastic bonding component 150. An adhesive layer may comprise one of adhesives marketed under the brand names VHB 4914, 59XX Thin and 864XX, all from 3M Corporation. An adhesive layer may have a thickness, e.g., from 50 microns to 300 microns. In some embodiments, the adhesive layers 420, 430 may be tacky or tackified, may adhere to a variety of dissimilar surfaces, and may be based on acrylic, epoxy, urethane, silicone, polyisobutylene, cyanoacrylate, and the like.
It is to be understood that a compressive and elastic bonding component 150 may have different embodiments than that depicted in
As illustrated in
It is to be understood that, under some embodiments, it is desirable for the cover sheet 120 to flex underneath an applied force or pressure by the user's touch of the cover sheet 120. For example, a cover sheet 120 that is designed to accommodate flexure may transmit force or pressure to the touch sensing element 510. Under some embodiments, at least one gap or space is provided between components that are adhered to the cover sheet 120 and other components adhered to the frame 140. Such a gap or gaps may permit relative movement of those various components, which also may permit bending or flexing of the cover sheet 120. Under some embodiments, it may be advantageous for there to be gaps in the interior of the electronic device 110, however gaps may be disadvantageous because some or all of those gaps may facilitate the warping or bending of the display assembly 130 when subject to stress, as illustrated in
Under some embodiments, a touch sensing element 510 may comprise a force sensing component, which comprises one or more sensors configured to detect the application of physical pressure or force. The force sensing component may comprise one or more resistors which provide a variable resistance, such that the force sensing component exhibits a decrease in electrical resistance when an increase in force or pressure is applied to the force sensing component. In some embodiments, the force sensing component comprises a conductive polymer layer which changes resistance in a predictable manner in response to an applied force. The conductive polymer layer may comprise a film containing electrically conducting and non-conducting particles suspended in a matrix. In other embodiments, the force sensing component may comprise a piezoelectric sensor configured to measure changes in pressure, strain, or force by converting those changes into a variable electrical charge. It is to be understood that embodiments are not limited to that described for
In some embodiments, a compressive and elastic bonding component 150 may be a single strip having a hollowed rectangular shape that is located between respective upper edges of wall portions of the frame 140 and respective rim portions of the cover sheet 120. In other embodiments, the compressive and elastic bonding component 150 may comprise an L-shaped strip that may be located at a corner of the frame 140 and the cover sheet 120. For example, in relation to a frame 140, an L-shaped strip may be located with one leg of the L-shaped strip adhering to an upper edge of the first wall portion 642 of the frame 140 and the other leg of the L-shaped strip adhering to an upper edge of the second wall portion 644 of the frame 140. In relation to a cover sheet 120, that same L-shaped strip may be located with one leg of the L-shaped strip adhering to a first rim portion 622 of the cover sheet 120 and the other leg of the L-shaped strip adhering to a second rim portion 624 of the cover sheet 120. In some embodiments, two L-shaped strips may be placed at two opposing corners of the frame 140, with the length of each leg of the L-shaped strips corresponding to the length of the respective wall portion of the frame 140. In some embodiments, four L-shaped strips may be placed at the respective four corners of the frame 140, with the length of each leg of the L-shaped strips corresponding to half the length of the respective wall portion of the frame 140. In some embodiments, an L-shaped strip may include a pull tab to remove a release liner of the L-shaped strip.
In some embodiments, the frame may be formed by a base portion 640, a first wall portion 642 attached to the base portion 640 along a lower edge, a second wall portion 644 attached to the base portion 640 along a lower edge and attached to the first wall portion 642 along a side edge, a third wall portion 646 attached to the base portion 640 along a lower edge and attached to the second wall portion 644 along a side edge, and a fourth wall portion 648 attached to the base portion 640 along a lower edge, attached to the third wall portion 646 along a side edge and attached to the first wall portion 642 along another side edge. In some embodiments, the frame 140 may be rectangular shaped such that the second wall portion 644 and the fourth wall portion 648 may be each located between the first wall portion 642 and the third wall portion 646, and each wall portion 642, 644, 646, 648 may be orthogonal to the base portion 640.
Although not shown, a sealing ring or a gasket may travel around or encompass the exterior or periphery of the electronic device 110 where the cover sheet 120 and the frame 140 mate. In some embodiments, a sealing ring may encompass the rim portions of the cover sheet 120, may encompass upper edges of the wall portions of the frame, and may be proximate the compressive and elastic bonding component 150. Such a ring may comprise a thermoplastic polyurethane (TPU) material. A sealing ring may seal the electronic device 110 and may protect the compressive and elastic bonding component 150 from external elements. A sealing ring may also provide protection to the rim portions of the cover sheet 120 from scratches, cracks and other damage that may be caused by external forces.
The display panel 710 may be coupled to a light guide 730 with a liquid optically clear adhesive (LOCA) 720, which may be formed from a silicone material. The LOCA 720 may be placed atop the display panel 710, and may have a thickness of 150 microns. The LOCA 720 may comprise Loctite® 5192 made by Henkel Technologies. The light guide 730 may be a light guide film which may include grating elements for directing light from a light source 770 onto the display panel 710. The light source 770 may comprise one or more light-emitting diodes (LEDs) and may be coupled to a flexible printed circuit (FPC) 760. In addition, a white tape 780 or other type of light-diffusing reflective coating may be laid along a perimeter of the light source 770, which may help to diffuse light from the light source 770 and increase the uniformity of the light from the light source 770.
On top of the light guide 730 may be a layer or strip of solid optically clear adhesive (OCA) 740, which may be formed with a silicone material and may have a thickness of 50 microns. A silicone OCA 740 may comprise ARclear® 8932EE made by Adhesives Research, Inc. On top of the layer or strip of OCA 740 may be a layer or strip of OCA 750, which may be formed with an acrylic material and may have a thickness of 100 microns. An acrylic OCA 750 may comprise TAC EA134DD made by New Tac Kasei Co., Ltd. The acrylic OCA 750 may adhere the display assembly 130 to the cover sheet 120. It is to be understood that under some embodiments, optical bonding such as with OCA and LOCA may have a relatively weaker bond compared to a compressive and elastic bonding component 150 because of the transparent property of optical bonds that, for example, allows a user to be able to view a display of a display panel 710. Furthermore, OCA 740 may have low refractory properties, and OCA 750 may be ultraviolet (UV) cut and have a bond stronger than OCA 740.
It is to be understood that a display assembly 130 may comprise different layers than those schematically shown in
At step 814, a compressive and elastic bonding component 150 may comprise a laminated structure. For example the laminated structure may include a low modulus layer 410 with a first adhesive layer 420 and a second adhesive layer 430 to form a compressive and elastic bonding component 150. For further example, the laminated structure of a compressive and elastic bonding component may include a low modulus layer having a first major side and a second major side, a first adhesive layer adjacent the first major side of the low modulus layer, and a second adhesive layer adjacent the second major side of the low modulus layer. A lamination process may include heat, pressure, adhesives, and the like. Under an embodiment, a compressive and elastic bonding component 150 may be produced with roll-to-roll lamination. For example, each of a low modulus material, a first adhesive material, and a second adhesive material may be positioned on a respective roll. Then, each material may be inserted into a roll-to-roll machine with the low modulus material in between the two adhesive materials. After the three layers are laminated via the roll-to-roll machine, the compressive and elastic bonding component 150 may be placed on an output roll. Under another embodiment, a compressive and elastic bonding component 150 may be produced through a wet coating and curing process. For example, a low modulus material may be inserted into a wet coating station. The wet coating station may apply a coating of liquid adhesive on both sides of the low modulus material, after which the liquid adhesive may be cured in a curing station by utilizing heat, ultraviolet light, or a combination of heat and ultraviolet light. The lamination process and the wet coating and curing process may include applying a release liner to one or more of the external surfaces of the compressive and elastic bonding component 150.
At step 816, the cover sheet 120 may be elastically bonded to the frame 140 with the compressive and elastic bonding component 150. At step 818, a sealing ring may seal the electronic device 110 by encompassing the compressive and elastic bonding component 150 that elastically bonds the cover sheet 120 to the frame 140.
The electronic device 110 may include a display component 906. The display component 906 may comprise the display assembly 130 or may alternatively comprise, for example, one or more devices such as cathode ray tubes (CRTs), liquid crystal display (LCD) screens, gas plasma-based flat panel displays, LCD projectors, or other types of display devices, etc.
The electronic device 110 may include one or more input devices 908 operable to receive inputs from a user. The input devices 908 can include, for example, a push button, touch pad, touch screen, wheel, joystick, keyboard, mouse, trackball, keypad, accelerometer, light gun, game controller, or any other such device or element with which a user can provide inputs to the electronic device 110. These input devices 908 may be incorporated into the electronic device 110 or operably coupled to the electronic device 110 via wired or wireless interface. For computing devices with touch sensitive displays, the input devices 908 can include a touch sensor that operates in conjunction with the display component 906 to permit users to interact with the image displayed by the display component 906 using touch inputs (e.g., with a finger or stylus). An example input device 908 is the touch sensing element 510 illustrated in
The electronic device 110 may also include at least one communication interface 912, comprising one or more wireless components operable to communicate with one or more separate devices within a communication range of the particular wireless protocol. The wireless protocol can be any appropriate protocol used to enable devices to communicate wirelessly, such as Bluetooth, cellular, IEEE 802.11, or infrared communications protocols, such as an IrDA-compliant protocol. It should be understood that the electronic device 110 may also include one or more wired communications interfaces for coupling and communicating with other devices.
The electronic device 110 may also include a power supply 914, such as, for example, a rechargeable battery operable to be recharged through conventional plug-in approaches, or through other approaches such as capacitive charging.
The electronic device 110 also includes a processing element 904 for executing instructions and retrieving data stored in a storage element 902. As would be apparent to one of ordinary skill in the art, the storage element 902 can include one or more different types of memory, data storage or computer-readable storage media, such as, for example, a first data storage for program instructions for execution by the processing element 904, a second data storage for images or data and/or a removable storage for transferring data to other devices.
The storage element 902 may store software for execution by the processing element 904, such as, for example, operating system software 922 and applications 940. The storage element 902 may also store a data item 942, such as, for example, data files corresponding to one or more applications 940.
Embodiments of the present invention may provide various advantages not provided by prior art systems. The electronic device may have enhanced touch sensing technology due to the strong bond of adhesive layers of the elastic bonding component, and may have increased durability in extreme environments due to the low modulus layer of the elastic bonding component dissipating stress experienced by the display assembly. For further example, the low modulus layer of the elastic bonding component may improve the durability of an electronic device when an object, such as a user's set of keys, is dropped on the cover sheet.
While the invention has been described in terms of particular embodiments and illustrative figures, those of ordinary skill in the art will recognize that the invention is not limited to the embodiments or figures described. For example, many of the embodiments described above in relation to electronic paper displays may be applied to other display assemblies such as a liquid crystal display that is backlit, and the like. For further example, many of the embodiments described above in relation to a frame may be applied to a frame with a bezel, such as a front panel of a housing.
Although various systems described herein may be embodied in software or code executed by general purpose hardware as discussed above, as an alternative the same may also be embodied in dedicated hardware or a combination of software/general purpose hardware and dedicated hardware. If embodied in dedicated hardware, each can be implemented as a circuit or state machine that employs any one of or a combination of a number of technologies. These technologies may include, but are not limited to, discrete logic circuits having logic gates for implementing various logic functions upon an application of one or more data signals, application specific integrated circuits having appropriate logic gates, or other components, etc. Such technologies are generally well known by those of ordinary skill in the art and, consequently, are not described in detail herein. If embodied in software, each block or step may represent a module, segment, or portion of code that comprises program instructions to implement the specified logical function(s). The program instructions may be embodied in the form of source code that comprises human-readable statements written in a programming language or machine code that comprises numerical instructions recognizable by a suitable execution system such as a processing component in a computer system. If embodied in hardware, each block may represent a circuit or a number of interconnected circuits to implement the specified logical function(s).
Although the processes, flowcharts and methods described herein may describe a specific order of execution, it is understood that the order of execution may differ from that which is described. For example, the order of execution of two or more blocks or steps may be scrambled relative to the order described. Also, two or more blocks or steps may be executed concurrently or with partial concurrence. Further, in some embodiments, one or more of the blocks or steps may be skipped or omitted. It is understood that all such variations are within the scope of the present disclosure.
Also, any logic or application described herein that comprises software or code can be embodied in any non-transitory computer-readable medium for use by or in connection with an instruction execution system such as a processing component in a computer system. In this sense, the logic may comprise, for example, statements including instructions and declarations that can be fetched from the computer-readable medium and executed by the instruction execution system. In the context of the present disclosure, a “computer-readable medium” can be any medium that can contain, store, or maintain the logic or application described herein for use by or in connection with the instruction execution system. The computer-readable medium can comprise any one of many physical media such as, for example, magnetic, optical, or semiconductor media. More specific examples of a suitable computer-readable media include, but are not limited to, magnetic tapes, magnetic floppy diskettes, magnetic hard drives, memory cards, solid-state drives, USB flash drives, or optical discs. Also, the computer-readable medium may be a random access memory (RAM) including, for example, static random access memory (SRAM) and dynamic random access memory (DRAM), or magnetic random access memory (MRAM). In addition, the computer-readable medium may be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), or other type of memory device.
It should be emphasized that the above-described embodiments of the present disclosure are merely possible examples of implementations set forth for a clear understanding of the principles of the disclosure. Many variations and modifications may be made to the above-described embodiment(s) without departing substantially from the spirit and principles of the disclosure. All such modifications and variations are intended to be included herein within the scope of this disclosure and protected by the following claims.
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