An electronic device can include a heat transfer structure that is positioned between a first component that generates heat and a second component that dissipates heat. The heat transfer structure transfers heat from the first component to the second component. The heat transfer structure can include a heat transfer member including a thermal conductive layer attached to at least one flexible layer and at least one deformable region created by a shape of the heat transfer member.
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1. A heat transfer member, comprising:
a flexible layer; and
a thermal conductive layer attached to the flexible layer; wherein
a first end of the heat transfer member is coupled to a second end of the heat transfer member, thereby forming an enclosed loop; and
the loop is deformable to conform to a size of a gap between a heat generating component and a heat dissipating component.
10. An electronic device, comprising:
a first component;
a second component; and
a heat transfer member disposed between the first and second components to transfer heat from one of the first or second components to the other of the first and second components, comprising:
first and second ends coupled to the first component; and
an intermediate portion between the first and second ends coupled to the second component and defining a space between the heat transfer member and the first component;
wherein
the heat transfer member comprises a thermal conductive layer and a flexible layer attached to the thermal conductive layer; and
the intermediate portion is deformable to adjust to a size of a gap between the first and second components.
21. An electronic device, comprising:
a heat generating component;
a heat dissipating component set apart from the heat generating component by a gap; and
a looped heat transfer member disposed in the gap and defining an inner surface and an outer surface, the looped heat transfer member comprising a flexible layer and a thermal conductive layer; wherein
a first portion of the outer surface is coupled to the heat generating component;
a second portion of the outer surface is coupled to the heat generating component;
a third portion of the outer surface between the first and second portions is coupled to the heat dissipating component; and
the looped heat transfer member is deformed by the heat generating component and the heat dissipating component to fit within the gap.
3. The heat transfer member as in
5. The heat transfer member as in
6. The heat transfer member as in
the flexible layer comprises a first flexible sub-layer and a second flexible sub-layer;
the thermal conductive layer is positioned between the first and second flexible sub-layers; and
the heat transfer member further comprises a first adhesive layer disposed over the first flexible sub-layer.
7. The heat transfer member as in
8. The heat transfer member as in
9. The heat transfer member as in
11. The electronic device as in
the space is filled with air; and
the thermal conductive layer comprises a graphite layer.
12. The electronic device as in
one of the first or the second component comprises a display; and
the heat transfer member is attached to a bottom surface of the display.
14. The electronic device as in
15. The electronic device as in
the flexible layer comprises a first flexible sub-layer and a second flexible sub-layer;
the thermal conductive layer is positioned between the first and second flexible sub-layers; and
the heat transfer member further comprises a first adhesive layer disposed over the first flexible sub-layer.
16. The electronic device as in
17. The electronic device as in
18. The electronic device as in
19. The electronic device as in
20. The electronic device as in
22. The electronic device of
a first flexible layer; and
a second flexible layer;
a thermal conductive layer positioned between the first and second flexible layers; and
a first adhesive layer disposed over the first flexible layer.
23. The electronic device of
a surface of the first flexible layer is in substantially complete contact with a first surface of the thermal conductive layer; and
a surface of the second flexible layer is in substantially complete contact with a second surface of the thermal conductive layer.
24. The electronic device of
the electronic device further comprises an electronic component; and
the looped heat transfer member defines an opening positioned relative to the electronic component such that the looped heat transfer member does not contact the electronic component.
25. The electronic device of
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This application claims the benefit of and priority to U.S. Provisional Patent Application No. 61/884,412, filed Sep. 30, 2013 and titled “Heat Transfer Structure,” the disclosure of which is hereby incorporated herein in its entirety.
The present invention relates to electronic devices, and more particularly to a heat transfer structure that transfers heat from one component to another component in an electronic device.
Microprocessors, integrated circuits, displays, and other sophisticated electronic components in an electronic device should typically operate within a certain range of temperatures. Some of these components, however, can generate relatively high temperatures and heat during operation of the electronic device. For example, microprocessors, integrated circuits, and displays can produce excessive heat during operation. The excessive heat can degrade the performance of these components, which can in turn adversely impact the reliability and performance of the electronic device. And over time, in some devices the heat produced by these components can result in system failure.
One type of a heat dissipation structure is a heat sink. A heat sink is a component that facilitates heat dissipation from the surface of a heat source, such as a heat-generating electronic component, to a cooler environment, typically air. Another type of heat dissipation structure is a heat spreader that can dissipate heat by transferring the heat from a heat source to another substrate, as shown in
In some devices, the gap 106 between the electronic component 102 and the second component 104 is not always known or certain when constructing the device. For example, the gap 106 can vary from device to device due to manufacturing variances, or different devices that include the same electronic component 102 can be designed with different sized gaps. Additionally, some components can be damaged or the performance of a component can be adversely affected when a heat dissipation structure introduces a physical pressure on the electronic component 102. For example, a heat dissipating structure positioned on the bottom surface of a display, such as a liquid crystal display, can produce pressure on the bottom surface of the display, and this pressure can result in the formation of artifacts that are visible in images viewed on the display.
Embodiments described herein provide a heat transfer structure that may introduce reduced or near zero physical pressure on an electronic component. In one aspect, the heat transfer structure can include a heat transfer member that includes a thermal conductive layer attached to at least one flexible layer, and at least one deformable region created by a shape of the heat transfer member. The at least one deformable region allows the heat transfer structure to deform or flex, which can result in the heat transfer structure introducing reduced physical pressure on the electronic component.
In another aspect, an electronic device can include an electronic component that generates heat and a second component that dissipates heat. A heat transfer structure is disposed between the electronic and second components to transfer heat from the electronic component to the second component. The heat transfer structure may include a heat transfer member that includes a thermal conductive layer attached to at least one flexible layer, and at least one deformable region created by a shape of the heat transfer member.
In yet another aspect, a method for providing a heat transfer structure can include providing a heat transfer member that includes a thermal conductive layer attached to at least one flexible layer, and providing at least one deformable region that is created by a shape of the heat transfer member.
Embodiments of the invention are better understood with reference to the following drawings. The elements of the drawings are not necessarily to scale relative to each other. Identical reference numerals have been used, where possible, to designate identical features that are common to the figures.
Embodiments described herein provide a heat transfer structure that may generate reduced or near zero physical pressure on an electronic component. The heat transfer structure can include a heat transfer member that includes a thermal conductive layer attached to at least one flexible layer, and at least one deformable region created by a shape of the heat transfer member. The at least one deformable region allows the heat transfer structure to deform or flex, which can result in the heat transfer structure introducing reduced or near zero physical pressure on the electronic component.
One or more heat transfer structures can be included in an electronic device. The heat transfer structure can be positioned between an electronic component that generates heat and a second component that dissipates heat. The heat transfer structure transfers heat from the electronic component to the second component. In one embodiment, the heat transfer structure is positioned between a display and a second component. The heat transfer member in the heat transfer structure can be disposed between a flexible layer and an adhesive layer. Alternatively, the heat transfer member can be positioned between two flexible layers. An adhesive layer can be disposed over at least one of the adhesive layers. The heat transfer member can be configured into various shapes that produce or result in at least one deformable region adjacent to the heat transfer member. For example, in one embodiment the heat transfer member is wrapped onto itself in a rounded shape, and the interior region of the rounded shape forms the deformable region. As another example, the heat transfer member has a wing-like shape or a “U” shaped region with extended horizontal surfaces at the tops of the sides of the U-shaped region, and the regions within and between the U-shaped region create the deformable regions.
In some embodiments, the heat transfer member can include one or more openings or cutouts that prevent heat from transferring to a substrate at the locations of the cutouts or openings. Additionally or alternatively, the thermal conductive layer in the heat transfer member can include one or more regions that have higher thermal density than other regions of the thermal conductive layer. The regions having a higher thermal density or densities can transfer different amounts of heat to a substrate than other regions of the thermal conductive layer. In some embodiments, the thermal conductive layer is formed with a metal such as copper, silver, or gold. The metallic thermal conductive layer can function as an EMI or RF shield for one or more electronic components disposed below the metallic thermal conductive layer.
Directional terminology, such as “top”, “bottom”, “front”, “back”, “leading”, “trailing”, etc., is used with reference to the orientation of the Figure(s) being described. Because components of embodiments described herein can be positioned in a number of different orientations, the directional terminology is used for purposes of illustration only and is in no way limiting. When used in conjunction with layers of a device, the directional terminology is intended to be construed broadly, and therefore should not be interpreted to preclude the presence of one or more intervening layers or other intervening features or elements. Thus, a given layer that is described as being formed, positioned, disposed on or over another layer, or that is described as being formed, positioned, disposed below or under another layer may be separated from the latter layer by one or more additional layers or elements.
Referring now to
The heat transfer structure 202 is positioned between a first component 208 and a second component 210. The heat transfer structure 202 can be attached to the first and second components using any suitable attachment mechanism. For example, an adhesive can be used to affix the heat transfer structure 202 to the first and second components 208, 210. As will be described in more detail later, the heat transfer member 204 includes a thermal conductive layer that is used to transfer heat from one component that is a heat source (e.g., first component 208) to another component that dissipates the transferred heat (e.g., second component 210).
In one embodiment, the first component 208 is an electronic component and the second component 210 is a support structure for the electronic component 208. By way of example only, the electronic component can be a display in an electronic device such as a smart telephone, a tablet computing device, a wearable computing device or display, and a digital music player. The display can include any suitable display technology, including, but not limited to a multi-touch sensing touchscreen that uses liquid crystal display (LCD) technology, light emitting diode (LED) technology, or organic light-emitting display (OLED) technology.
The deformable region 206 can include any suitable deformable matter. For example, in one embodiment, the deformable region 206 is filled with air. Other embodiments can include different types of deformable materials in at least one deformable region, such as a gel or a deformable structure (e.g., an elastomeric structure or a foam structure).
Referring now to
The heat transfer member 404 can be attached to the first component 208 at contact regions 410. Similarly, the heat transfer member 404 can be attached to the second component 210 at contact region 412. The heat transfer member 404 can be attached to the first and second components using any suitable attachment mechanism. For example, an adhesive can be used to affix the heat transfer member to the first and second components.
Like the embodiment shown in
Other embodiments can arrange the heat transfer member 204, 404 in different configurations or shapes having any given dimensions and size. For example, the heat transfer member 204, 404 can be configured in a hexagon shape, in a shape similar to a square wave, and/or in a rectangle. Additionally or alternatively, some embodiments can include two or more heat transfer structures that have different shapes and/or dimensions.
Referring now to
The first and second flexible layers 604, 606 are attached to the flexible thermal conductive layer 602 and provide mechanical strength to the thermal conductive layer. In one embodiment, the thermal conductive layer 602 is laminated to the first and second flexible layers. The first and second flexible layers 604, 606 can be made of any suitable material, examples of which include polyethylene terephthalate (PET) or another type of polymer.
A first adhesive layer 608 is disposed over the first flexible layer 604 and a second adhesive layer 610 is positioned under the second flexible layer 606. Depending on the configuration of the heat transfer structure, one of the adhesive layers is optional and can be omitted in some embodiments. Alternatively, the first and second adhesive layers 608, 610 can be configured in segments that cover only portions of the first and second flexible layers. For example, in the embodiment shown in
Referring now to
Referring now to
In one embodiment, the heat transfer member 900 is thin and yet flexible. For example, the second flexible layer is a PET layer that is approximately 6 microns thick. The thermal conductive layer can be a graphite layer that has a thickness of approximately 17 microns. And the first flexible layer and the first adhesive layer combined may have a thickness of approximately 10 microns. The layers of a heat transfer member can have different thicknesses in other embodiments.
Referring now to
The openings can be used to form cutouts in a heat transfer member in some embodiments. The cutouts can prevent heat from spreading to certain areas of a substrate, while the remaining sections of the heat transfer member spread heat to other areas of the substrate. For example, a substrate can have an area that includes electronic components that may not be able to withstand heat or dissipate heat. A cutout in a heat transfer member can be used to prevent heat from transferring to the area with the electronic components.
Referring now to
The incomplete cutouts 1302 are formed through the first adhesive layer 608, the first flexible layer 604, and the thermal conductive layer 602, but not through the second flexible layer 606 in the illustrated embodiment. The incomplete cutouts produce heat transfer regions 1304 in the heat transfer member 1300. The heat transfer member 1300 can introduce a reduced amount of contact force on an electronic component (e.g., first component 208) as a result of the incomplete cutouts 1302. For example, the heat transfer regions 1304 combined can have a smaller contact area on the electronic component than the heat transfer region shown in
In
The thermal conductive layer 1600 can be made of any suitable thermal conductive material that has a more planar structure, such as graphite. Additionally, the additional layers of thermal conductive material can be located on only one surface of a thermal conductive layer, or one or more regions of increased thickness can be positioned on two or more surfaces of a thermal conductive layer. Additionally or alternatively, an additional layer of thermal conductive material can be disposed over another additional layer of thermal conductive material.
Referring now to
The electronic device 1700 includes an enclosure 1702 at least partially surrounding a display 1704 and one or more buttons 1706 or input devices. The enclosure 1702 can form an outer surface or partial outer surface and protective case for the internal components of the electronic device 1700, and may at least partially surround the display 1704. The enclosure 1702 can be formed of one or more components operably connected together, such as a front piece and a back piece. Alternatively, the enclosure 1702 can be formed of a single piece operably connected to the display 1704.
The display 1704 can be implemented with any suitable technology, including, but not limited to, a multi-touch sensing touchscreen that uses liquid crystal display (LCD) technology, light emitting diode (LED) technology, organic light-emitting display (OLED) technology, organic electroluminescence (OEL) technology, or another type of display technology. The button 1706 can take the form of a home button, which may be a mechanical button, a soft button (e.g., a button that does not physically move but still accepts inputs), an icon or image on a display or on an input region, and so on. Further, in some embodiments, the button 1706 can be integrated as part of a cover glass of the electronic device.
One or more heat transfer structures described herein can be used to transfer heat from a bottom surface of the display 1704 to a support structure or heat sink in the electronic device 1700. The heat transfer structures introduce a reduced physical pressure compared to prior art thermal contacts or heat transfer structures. In some embodiments, the heat transfer structure(s) may produce substantially no physical pressure on the bottom surface of the display 1704.
A determination is then made at block 1806 as to whether another adhesive layer is to be included in the heat transfer member. If so, the process returns to block 1804 and another adhesive layer is disposed over a flexible layer. For example, the second adhesive layer can be disposed under the second flexible layer, as shown in
When another adhesive layer will not be disposed over a flexible layer, the method passes to block 1808 where one or more cutouts and/or incomplete openings may be formed in the thermal conductive member. Any suitable method can be used to produce the one or more cutouts and/or incomplete openings in the thermal conductive layer.
Next, as shown in block 1810, the heat transfer member can be configured into a shape that provides one or more deformable structures. As one example, the heat transfer member can be wrapped onto itself to form a rounded shape, and the interior region of the rounded shape forms a deformable region. As another example, the heat transfer member can be configured into a wing-like shape or a U-shaped region having extended horizontal surfaces at the top of the sides. The regions within and between the U shaped region can form the deformable regions.
Next, as shown in block 1812, the heat transfer member is positioned between a heat generating component and a heat dissipating component. The one or more adhesive layers can be used to attach the heat transfer structure to the heat generating component and the heat dissipating component. For example, the first adhesive layer shown in
Other embodiments can perform the method shown in
Various embodiments have been described in detail with particular reference to certain features thereof, but it will be understood that variations and modifications can be effected within the spirit and scope of the disclosure. And even though specific embodiments have been described herein, it should be noted that the application is not limited to these embodiments. In particular, any features described with respect to one embodiment may also be used in other embodiments, where compatible. Likewise, the features of the different embodiments may be exchanged, where compatible. For example, some embodiments can include two or more heat transfer structures, and a thermal conductive layer in one structure can be made of material that is different from a thermal conductive material in another thermal transfer structure. The two or more heat transfer structures can be used with a single electronic component that generates heat or with multiple electronic components.
Heresztyn, Amaury J., Wright, Derek W., Chowdhury, Ihtesham H., Lam, Henry H.
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Sep 30 2013 | HERESZTYN, AMAURY J | Apple Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 031584 | /0559 | |
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