An electronics chassis comprises an electronics module residing in the chassis and fronted by a multi-piece faceplate system. The multi-piece faceplate system includes a faceplate and a faceplate assembly. The faceplate assembly includes an ejection lever pivotally coupled to the electronics module. The ejection lever includes an ejection latch coupled to the faceplate assembly. The ejection latch is configured to facilitate retention of the electronics module within the chassis when said faceplate assembly is in a closed position. The ejection latch is further configured to facilitate ejection of the electronics module from the chassis when the faceplate assembly is in an open position.
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9. A multi-piece faceplate system for use in an electronics module residing in a slot defined in an electronics chassis, said faceplate system comprising:
a faceplate; and
a faceplate assembly with: an ejection lever pivotally coupled to said electronics module, said ejection lever including an ejection tool operatively positioned proximate the slot, an ejection latch releasably coupled to said faceplate assembly, a lever arm extending between said ejection tool and said ejection latch, said ejection latch comprises a spring arm movable with respect to said lever arm to facilitate retention of said electronics module within said chassis when said faceplate assembly is in a closed position, and configured to facilitate ejection of said electronics module from said chassis when said faceplate assembly is in an open position, wherein a gap is defined between a distal end of said lever arm and said spring arm, and a user interface assembly configured to facilitate interaction between the electronics module and a user.
1. An electronics chassis comprising:
an electronics module residing in a slot defined within the electronics chassis;
a multi-piece faceplate system coupled to said electronics module and comprising:
a faceplate; and
a faceplate assembly with:
an ejection lever pivotally coupled to said electronics module, said ejection lever including an ejection tool positioned proximate the slot;
an ejection latch releasably coupled to said faceplate;
a lever arm extending between said ejection tool and said ejection latch, said ejection latch comprises a spring arm movable with respect to said lever arm to facilitate retention of said electronics module within said electronics chassis when said faceplate assembly is in a closed position, and configured to facilitate ejection of said electronics module from said electronics chassis when said faceplate assembly is in an open position, wherein a gap is defined between a distal end of said lever arm and said spring arm, and;
a user interface assembly configured to facilitate interaction between said electronics module and a user.
16. A method of assembling an electronics chassis, said method comprising:
providing an electronics module configured to reside in a slot defined in an electronics chassis;
providing a multi-piece faceplate system including a faceplate and a faceplate assembly, wherein the faceplate assembly includes an ejection lever including an ejection tool, an ejection latch, and a lever arm extending between said ejection tool and said ejection latch;
pivotally coupling the ejection lever to the electronics module;
operatively coupling the ejection tool to the electronics chassis;
releasably coupling the ejection latch to the faceplate, wherein the ejection latch includes a spring arm movable with respect to the lever arm to facilitate retention of the electronics module within the electronics chassis when the faceplate assembly is in a closed position, and to facilitate ejection of the electronics module from the electronics chassis when the faceplate assembly is in an open position, wherein a gap is defined between a distal end of said lever arm and said spring arm; and
coupling a user interface assembly to the faceplate assembly, wherein the user interface assembly is configured to facilitate interaction between the electronics module and a user.
2. The electronics chassis according to
3. The electronics chassis according to
4. The electronics chassis according to
5. The electronics chassis according to
6. The electronics chassis according to
7. The electronics chassis according to
8. The electronics chassis according to
10. The faceplate assembly according to
11. The faceplate assembly according to
12. The faceplate assembly according to
13. The faceplate assembly according to
14. The faceplate assembly according to
15. The faceplate assembly according to
17. The method according to
latchably coupling the projection to a projection land on the faceplate; and
biasing the spring arm to engage the projection with the projection land to retain the electronics module within the slot and to disengage the projection from the projection land to eject the electronics module from the slot.
18. The method according to
19. The method according to
inputting, by a user, a command on the user interface assembly using the interactive device;
relaying, through the flex circuit, a signal generated by the interactive device between the user interface assembly and a circuit board housed within the electronics module; and
indicating, to the user, the status of the electronics module on the module status indicator and the status of at least one electrical component coupled to the electronics module on a respective component status indicator of a plurality of component status indicators.
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This application claims priority to and the benefit of the filing date of U.S. Provisional Application No. 61/757,196 filed on Jan. 27, 2013, which is hereby incorporated by reference in its entirety.
The embodiments described herein relate generally to an electronics module for a power distribution rack, and, more specifically, to a faceplate assembly for an electronics module and methods of assembly and use thereof.
Electrical components or modules are sometimes stored in a stacked relationship not only to allow the components or modules to be electrically interconnected with one another, but also so they can be readily accessed and used. This is particularly true in power management situations in which a large number of densely packed individual components are typically mounted together in a rack system to create a desired power management system. Such rack systems may consist of a frame structure including shelf assemblies that define individual slots into which smaller electronics modules, such as power modules, rectifiers, or controllers can be inserted. Due to high currents during operation and close proximity, the electronics may become fairly hot and would benefit from ventilation.
Further, the rack systems, including shelves and electronics modules, have been optimized to allow for the greatest number of modules in the smallest possible area. However, these modules are so densely packed that the clearance space between the modules residing on one shelf and the overlying shelf has been reduced such that it has become difficult to easily remove the modules from their respective slots, which is important for maintenance, repair or replacement. Due to the limited clearance between the module and the shelf, it is difficult for a technician to adequately grasp the module and exert enough force to disengage the corresponding electrical interfaces from each other. For example, it is often difficult to apply enough insertion and ejection force to adequately couple corresponding electrical interfaces.
In one aspect, an electronics chassis is provided. The chassis comprises an electronics module residing in the chassis and fronted by a multi-piece faceplate system. The multi-piece faceplate system includes a faceplate and a faceplate assembly. The faceplate assembly includes an ejection lever pivotally coupled to the electronics module. The ejection lever includes an ejection latch coupled to the faceplate assembly. The ejection latch is configured to facilitate retention of the electronics module within the chassis when said faceplate assembly is in a closed position. The ejection latch is further configured to facilitate ejection of the electronics module from the chassis when the faceplate assembly is in an open position.
In another aspect, a multi-piece faceplate system for use in an electronics module is provided. The multi-piece faceplate system resides within an electronics chassis and includes a faceplate and a faceplate assembly. The faceplate assembly includes an ejection lever pivotally coupled to the electronics module. The ejection lever includes an ejection latch coupled to the faceplate assembly. The ejection latch is configured to facilitate retention of the electronics module within the chassis when the faceplate assembly is in a closed position and is configured to facilitate ejection of the electronics module from the chassis when the faceplate assembly is in an open position.
In yet another aspect, a method of assembling an electronics chassis is provided. The method comprises providing an electronics module configured to reside in an electronics chassis and providing a multi-piece faceplate system including a faceplate and a faceplate assembly. The faceplate assembly includes an ejection lever and an ejection latch. The ejection lever is pivotally coupled to the electronics module. The ejection latch is removably coupled to the faceplate to facilitate retention of the electronics module within the electronics chassis when the faceplate assembly is in a closed position, and to facilitate ejection of the electronics module from the electronics chassis when the faceplate assembly is in an open position.
The embodiments include new faceplate systems that are placed in front of electronic modules such as power rectifiers. The faceplate systems have multiple pieces including one piece that permits, for example, ventilation in more than one direction due to a shape of the faceplate. Another piece of the faceplate systems has projective features to enable retention and to ease grabbing, opening and closing of the faceplate system. The faceplate system has simplified latching mechanisms to aid ejection of the electronic modules. After much simulation and experimentation, these and additional features were found to provide superior performance, reduced costs and easy use.
In the depicted exemplary embodiment of
In
As shown in
In one embodiment, the ejection of the electronics module 100 is accomplished by the features all co-located on one piece of the faceplate assembly 130. In the depicted exemplary embodiment, ejection lever 180 includes an integrated spring latch 188, an insertion/ejection tool 192, and a lever body 184 extending there between. Integrated spring latch 188 is configured to facilitate operation of ejection lever 180 and to retain module 100 within shelf assembly 50 as described in further detail below. Insertion/ejection tool 192 is configured to cooperate with at least a portion of sidewall 70 to facilitate insertion and removal of module 100 from shelf assembly 50 as described in further detail below. In the exemplary embodiment, user interface assembly 160 includes a user interface 164 and an integrated flex circuit 162. User interface assembly 160 is configured to display the overall status of module 100 and to interact with a user (not shown) to indicate the status of a plurality of components coupled to module 100. Flex circuit 162 is configured to relay a signal generated by the user-user interface interaction to PCB 120.
In one exemplary embodiment, insertion/ejection tool 192 of ejection lever 180 includes an insertion portion 194 that comprises a first contact surface 195 and an ejection portion 198 that comprises a second contact surface 199. In the exemplary embodiment, insertion portion 194 and ejection portion 198 are spaced apart to define a cavity 196 there between. As described in further detail below, cavity 196 is configured to accept fulcrum section 75 to facilitate insertion and ejection of module 100 from shelf 60. Insertion portion 194 has an arcuate shape, and specifically, insertion portion 194 has a continuously smooth hook shape to engage at least a portion of shelf 60 to facilitate operation of ejection lever 180. In the exemplary embodiment, insertion/ejection tool 192 is integrally formed with ejection lever 180. Alternatively, insertion/ejection tool 192 may be formed separately and coupled to ejection lever 180. Ejection lever body 184 is spaced between insertion/ejection tool 192 and integrated spring latch 188. In the exemplary embodiment, integrated spring latch 188 includes a spring arm 189 and an activation knob 182 coupled at a distal end of spring arm 189. Spring arm 189 includes a wedge or a projection 190 that is configured to cooperate with a projection land 144 on faceplate 140 to facilitate locking ejection lever 180 to faceplate 140 and retaining module 100 within shelf assembly 50.
In one exemplary embodiment, integrated spring latch 188 and insertion/ejection tool 192 work simultaneously to facilitate insertion and ejection of module 100 (shown in
In one exemplary embodiment, module status indicator 166 and each of the plurality of component indicators 168 include a multi-colored integrated light emitting diode (LED) configured to indicate the status of module 100 or the status of any of the electronic components coupled to module 100, respectively. In the exemplary embodiment, integrated flex circuit 162 of user interface assembly 160 is threaded through a single wide-tolerance slot 150 defined in faceplate 140 and user interface 164 is coupled to a user interface accepting surface 148 of faceplate 140 using a pressure sensitive adhesive. Alternatively, user interface 164 may be coupled to surface 148 of faceplate 140 using any coupling means that enables user interface assembly 160 to operate as described herein. The LEDs of module status indicator 166 and each of the plurality of component indicators 168 are integrated into flex circuit 162 and user interface 164 such that faceplate 140 requires no additional openings defined therein, other than slot 150. Flex circuit 162 is coupled to a connector 172 on PCB 120 and is configured to transmit signals between user interface 164 and PCB 120 as described in further detail below.
In an exemplary method of use or operation, after a component is coupled to module 100, switch 170 receives input from a user, in the form of the user pressing switch 170, to command module 100 to determine the status of any components coupled to module 100 and report back the status of each electronic component and of module 100 overall. Integrated flex circuit 162 is configured to relay a signal generated by the user pressing switch 170 to PCB 120 for analysis. Module 100, specifically PCB 120, includes logic that receives the signal from flex circuit 162 and determines the number of electronic components coupled to module 100 and their individual statuses, that is, whether they are operating normally. For each component coupled to module 100 that is operating normally, PCB 120 sends a response signal through flex circuit 162 to the LED that corresponds with that component, and the LED will turn a first color, e.g., green. For each component coupled to module 100 that is not operating normally, the LED shows a second color, e.g., red. If there are not as many components coupled to module 100 as there are indicators 168, the LEDs for those indicators 168 remain unlit. As such, membrane switch 170 facilitates interaction between the user and module 100 that indicates not only the status of module 100, but also of each electronic component coupled to module 100. Module status indicator 166 provides an instant indication through its LED of the status of module 100 on a system level, and the plurality of component indicators 168 provide indications through LEDs of the status of each electronic component coupled to module 100 individually.
In one method of use and assembly, the faceplate 140 is screwed or bolted onto the interior of the upper and/or lower (e.g. PCB 120) surface of the electronics module 100. The faceplate assembly 130 is bolted onto the interior side of the bottom surface of the electronics module 100 or onto the PCB 120. In this sense, the faceplate 140 and faceplate assembly 130 are both directly attached to the electronics module 100 or to its chassis. The spring arm 189 locks into a body of the stationary faceplate 140 via the integrated spring latch 188 including projection 190 and the flexibility to move due to the gap 185 space between 182 and 184 (see
If the chassis (outer shell) and electronics module 100 contain sensitive electronics or power electronics that are used in datacenters and/or telecommunication centers where a power outage would be especially problematic, the faceplate 140 or faceplate assembly 130 is coated with a fluorescent-like material or paint so that they would be highly visible.
In one exemplary embodiment, faceplate 140 includes a wave-like, undulated front face 143 that includes a first peak 149 at one end, a trough 151 in the middle portion, and a second peak 155 at the second opposing end. Similarly, ejection lever 180 (shown in
Exemplary embodiments of electronics module shelf assemblies are described herein. The shelf assembly includes at least one electronics module that includes a faceplate assembly. The faceplate assembly includes a faceplate, an ejection lever, and a user interface assembly. The faceplate and ejection lever are undulated and include a plurality of vents to facilitate cooling the internal components of the module. The ejection lever includes an integrated spring latch that cooperates with the faceplate to lock the module in place and retain the module within the shelf assembly. The user interface assembly includes a plurality of component status indicators that provide the status of each electric component coupled to the module. Furthermore, the user interface includes a membrane switch that allows a user to interact with the module and receive feedback from the module regarding the status of the module as a whole and the status of each electronic component coupled to the module. Additionally, the user interface assembly includes a flex circuit that couples the interface, having the status indicators and the switch, to a circuit board within the module. The flex circuit is configured to provide power to the user interface to illuminate a plurality of LEDs that are formed integrally with the user interface and to relay signals between the user interface and the circuit board to facilitate user interaction with the module.
As compared to at least some known electronic module assemblies, the integrated spring latch in the ejection lever eliminates the need for additional components, such as a spring, to ejection the module from the shelf assembly. Furthermore, because only the ejection lever transitions from an open position to a closed position, instead of the whole faceplate assembly, the faceplate protects the internal components of the module even during insertion and ejection. Additionally, the user interface assembly allows interaction between a user and the module not seen in known electronic module assemblies. Also, the need for complex lightpipes and manufacturing tolerances of openings in known faceplates into which to insert the lightpipes and LEDs are eliminated because the use of a flex circuit allows for a single wide tolerance slot in the faceplate and the LEDs are integral with the flex circuit and the user interface.
Exemplary embodiments of an electronics module shelf assembly and methods for assembling the same are described above in detail. The methods and assemblies are not limited to the specific embodiments described herein, but rather, components of assemblies and/or steps of the methods may be utilized independently and separately from other components and/or steps described herein. For example, the methods may also be used in combination with other electronic module assemblies, and are not limited to practice with only the power distribution modules and assemblies as described herein. Rather, the exemplary embodiment can be implemented and utilized in connection with many other electronic module applications.
Although specific features of various embodiments of the invention may be shown in some drawings and not in others, this is for convenience only. In accordance with the principles of the invention, any feature of a drawing may be referenced and/or claimed in combination with any feature of any other drawing. Further, although words such as “top” and “bottom” are used throughout the specification, there is no absolute orientation in the universe. For example, when the modules slotted into a chassis on its side, then top and bottom become the sides.
This written description uses examples to disclose the invention, including the best mode, and also to enable any person skilled in the art to practice the invention, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the invention is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal language of the claims.
Nguyen, Khanh Quoc, Reed, Christopher George
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Mar 15 2013 | General Electric Company | (assignment on the face of the patent) | / | |||
Apr 04 2013 | NGUYEN, KHANH QUOC | General Electric Company | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 030162 | /0167 | |
Apr 04 2013 | REED, CHRISTOPHER GEORGE | General Electric Company | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 030162 | /0167 | |
Jul 20 2018 | General Electric Company | ABB Schweiz AG | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 050207 | /0405 | |
Feb 07 2020 | ABB Schweiz AG | ABB POWER ELECTRONICS INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 052430 | /0136 |
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