A protective device capable of dissipating heat for protecting an electronic device includes a carrier and a flexible heat transfer unit. The carrier is used for correspondingly connecting to or receiving the electronic device therein and has a plurality of edges. The flexible heat transfer unit is arranged at one of the edges of the carrier and has a first and a second extended portion. The first extended portion is extended onto and connected to an inner side of the carrier, whereas the second extended portion is extended away from the carrier to connect to a flip cover. The first extended portion of the flexible heat transfer unit is in direct or indirect contact with a heat source of the electronic device, such that heat produced by the heat source can be transferred from the carrier to the flip cover via the flexible heat transfer unit.
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1. A protective device capable of dissipating heat for protecting an electronic device, comprising:
a carrier for correspondingly connecting to or receiving the electronic device therein and having a first inner side oriented to the electronic device and a plurality of edges surrounding the first inner side;
a flexible connecting element being arranged at one of the edges of the carrier and having two opposite ends that respectively form a first and a second extended portion; the first extended portion being extended onto and partially across an upper surface of the first inner side of the carrier, the first extended portion being connected to the first inner side of the carrier, and the second extended portion being extended away from the carrier to form a flip cover, which can be turned towards or away from the carrier; and the first extended portion being in direct or indirect contact with at least one heat source of the electronic device,
wherein the first extended portion has a first contact surface facing away from the first inner side of the carrier and oriented to the electronic device and the flexible connecting element is a flexible thin heat pipe.
12. A protective device capable of dissipating heat for protecting an electronic device, comprising:
a carrier for correspondingly connecting to or receiving the electronic device therein and having a first inner side oriented to the electronic device and a plurality of edges surrounding the first inner side;
a flexible connecting element being arranged at one of the edges of the carrier and having two opposite ends that respectively form a first and a second extended portion; the first extended portion being extended onto and partially across an upper surface of the first inner side of the carrier, the first extended portion being connected to the first inner side of the carrier, and the second extended portion being extended away from the carrier to form a flip cover, which can be turned towards or away from the carrier; and the first extended portion being in direct or indirect contact with at least one heat source of the electronic device,
wherein the flip cover has a second inner side; the second extended portion of the flexible connecting element being extended onto and connected to the second inner side of the flip cover; and the second extended portion having a second contact surface facing away from the second inner side of the flip cover,
wherein the flip cover is provided with an on-cover heat transfer element; the on-cover heat transfer element having a third and a fourth contact end, one of which being in contact with the second contact surface of the flexible connecting element.
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The present invention relates to a protective device, and more specifically, to a protective device that is capable of dissipating heat.
Since the demand for portable devices has rapidly increased in recent years, smartphones and tablet PCs now far outnumber personal and notebook computers and quick improvement has also been made in smartphones. For example, being light and small and having largely improved performance, smartphones have higher and higher heating density, so that heat dissipation thereof has become an important issue. Generally, passive heat dissipation devices are widely used in most portable devices in view of the light weight and small volume thereof. Heat produced by electronic elements needs to be transferred to an outer side of a case of the portable device and dissipates into ambient air by way of natural convection and radiation. For the portable device, since the performance of the screen is very likely adversely affected by increased temperature, the heat produced by the electronic elements is normally transferred to a back case of the portable device via an internal heat transfer design without being transferred to the screen.
When the portable device operates, the temperature distribution on the back case of the portable device is uneven, and local hot spots tend to form at positions with electronic elements of high heating density, such as the central processing unit (CPU), the power amplifier (PA), the graphical display unit (GDU), or the battery, to result in rising temperature of the portable device. Apart from the problem of heat dissipation, the rising temperature of the portable device also tends to cause a burn of a user's skin that is in contact with the heated portable device for long hours.
Furthermore, during communication over the smartphone, the rising temperature of the smartphone also causes rising temperature and discomfort around the user's ear. Therefore, it is desirable to work out a way for effectively transferring the heat from the back case of the portable device to the ambient air, so as to prevent the heat from concentrating on the back case of the portable device, eliminate the forming of local hot spots on the back case, and lower the high temperature at local areas.
To solve the above problems, a primary object of the present invention is to provide a protective device capable of dissipating heat, so that heat produced by an electronic device and transferred to a carrier of the protective device can be further transferred via a flexible heat transfer unit to a position outside the carrier to dissipate into ambient air.
Another object of the present invention is to provide a flexible heat transfer unit connected to between a carrier and a flip cover, so that heat transferred to the carrier can be further transferred via the flexible heat transfer unit to the flip cover to dissipate into ambient air.
A further object of the present invention is to provide a protective device capable of dissipating heat, which forms an additional heat dissipation path outside an electronic device to prevent heat produced by the electronic device from concentrating on a back case of the electronic device.
A still further object of the present invention is to provide a protective device capable of dissipating heat, so as to prevent local hot spots from forming on the back case of an electronic device
To achieve the above and other objects, the protective device according to the present invention for protecting an electronic device includes a carrier and a flexible heat transfer unit. The carrier is used for correspondingly connecting to or receiving the electronic device therein and has a first inner side oriented to the electronic device and a plurality of edges. The flexible heat transfer unit is arranged at one of the edges of the carrier and two opposite ends thereof respectively form a first and a second extended portion. The first extended portion is extended onto and connected to the first inner side, whereas the second extended portion is extended away from the carrier. The first extended portion of the flexible heat transfer unit is in direct or indirect contact with at least one heat source of the electronic device.
According to an embodiment of the protective device, the first extended portion has a first contact surface facing away from the first inner side of the carrier and oriented to the electronic device.
According to an embodiment of the protective device, the first contact surface of the first extended portion is in contact with the heat source of the electronic device.
According to an embodiment of the protective device, the carrier is provided with an on-carrier heat transfer element, which is in contact with the at least one heat source of the electronic device and has a first contact end in contact with the first contact surface of the first extended portion.
According to an embodiment of the protective device, the flexible heat transfer unit can be a graphite sheet or a metal foil-attached graphite sheet.
According to an embodiment of the protective device, the metal foil-attached graphite sheet includes at least one layer of metal foil attached to at least one layer of graphite sheet.
According to an embodiment of the protective device, the metal foil is made of gold, silver, copper, aluminum, or any combination thereof.
According to an embodiment of the protective device, the first contact surface is the metal foil.
According to an embodiment of the protective device, the flexible heat transfer unit is a flexible thin heat pipe.
According to an embodiment of the protective device, the second extended portion of the flexible heat transfer unit is extended to form a flip cover, which can be turned towards or away from the carrier.
According to an embodiment of the protective device, the flip cover can be a graphite sheet or a metal foil-attached graphite sheet.
According to an embodiment of the protective device, the second extended portion of the flexible heat transfer unit is connected to a flip cover, which can be turned towards or away from the carrier.
According to an embodiment of the protective device, the flip cover has a second inner side. The second extended portion of the flexible heat transfer unit is extended onto and connected to the second inner side of the flip cover. The second extended portion has a second contact surface facing away from the second inner side of the flip cover.
According to an embodiment of the protective device, the flip cover is provided with an on-cover heat transfer element, which has at least one contact end in contact with the second contact surface of the flexible heat transfer unit.
According to an embodiment of the protective device, the second contact surface of the flexible heat transfer unit is the metal foil.
According to an embodiment of the protective device, the carrier is a back base of the electronic device and is provided on the edges surrounding the first inner side with a plurality of clamping sections.
According to an embodiment of the protective device, the edges surrounding the first inner side of the carrier are respectively upwardly extended to form a protective wall, which has a free end inwardly bent to form a retaining edge, such that the first inner side, the protective walls and the retaining edges together define a receiving space to receive the electronic device therein.
The protective device according to another embodiment of the present invention for protecting an electronic device having a heat source includes a carrier having a first inner side for correspondingly connecting to or receiving the electronic device therein; a flip cover having a second inner side; a flexible heat transfer unit being connected to between the flip cover and the carrier, and having a first extended portion connected to the first inner side of the carrier and a second extended portion connected to the flip cover. The flip cover is supported by the flexible heat transfer unit to be turnable towards or away from the carrier; and the first extended portion of the flexible heat transfer unit is in direct or indirect contact with the heat source of the electronic device, such that heat produced by the heat source can be transferred from the carrier to the flip cover via the flexible heat transfer unit.
The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein
The present invention will now be described with some preferred embodiments thereof and by referring to the accompanying drawings. For the purpose of easy to understand, elements that are the same in the preferred embodiments are denoted by the same reference numerals.
Please refer to
The first extended portion 21 has a first contact surface 211 facing away from the first inner side 11 of the carrier 10. The first extended portion 21 has an extended length determined according to the heat source positions in different electronic devices. For example, the first extended portion 21 can extend from the fourth edge 12d towards the second edge 12b by a length about one-third, two-thirds, or a half of the width of the carrier 10. The second extended portion 22 is extended away from the carrier 10 to form a flip cover 23, which has a second inner side 231 and can be turned towards or away from the carrier 10.
Please refer to
Referring to
Further, in another possible embodiment, the flexible heat transfer unit 20 is a flexible thin heat pipe, which is flexible and repeatedly bendable and provides high heat transfer effect.
Please refer to
When the carrier 10 is correspondingly connected to the electronic device 30, the clamping sections 13 on the first to fourth edges 12a-12d are clamped onto the front case 31 of the electronic device 30, such that the heat source 32 of the electronic device 31 is in direct contact with the first contact surface 211 of the first extended portion 21. After that, the flip cover 23 can be turned towards the carrier 10 to cover the front case 31 and the touch screen 33 of the electronic device 30 or be turned away from the carrier 10.
Referring to
Please refer to
In the illustrated second preferred embodiment, the second contact end 162 is in contact with the heat source 32 of the electronic device 30 illustrated in
The on-carrier heat transfer element 16 can be, for example, an ultra thin heat pipe as shown in
Please refer to
In another possible embodiment, the second contact surface 221 of the second extended portion 22 is preferably the metal foil 203, as shown in
The heat produced by the heat source 32 of the electronic device 30 illustrated in
Please refer to
In the illustrated fourth preferred embodiment, the second contact end 162 is in contact with the heat source 32 of the electronic device 30 illustrated in
Please refer to
In the illustrated fifth preferred embodiment, the electronic device 50 includes a front and a back case 51, 52. When the electronic device 50 is received in the receiving space 15 of the carrier 10, the front case 51 is held in place by the retaining edges 141 and the back case 52 is in contact with the first contact surface 211 of the first extended portion 21 of the flexible heat transfer unit 20, such that the heat can be transferred from the back case 52 to the flip cover 23 via the flexible heat transfer unit 20 to dissipate into the ambient air.
In conclusion, with the above arrangements, the heat transferred to the carrier 10 can be further transferred via the flexible heat transfer unit 20 to the flip cover 23 for dissipating into the ambient air. The present invention provides an additional heat dissipation path outside the electronic device 30, 50 to prevent the produced heat from concentrating on the back case of the electronic device 30, 50, so as to effectively eliminate the problem of forming local hot spots on the back case of the electronic device 30, 50.
The present invention has been described with some preferred embodiments thereof and it is understood that many changes and modifications in the described embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.
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Dec 17 2014 | Asia Vital Components Co., Ltd. | (assignment on the face of the patent) | / | |||
Dec 17 2014 | WU, CHUN-MING | ASIA VITAL COMPONENTS CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 034534 | /0298 |
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