An overhead electrical grounding mesh and mechanical grid structure for a data center includes a plurality of orthogonally arranged grid beams. Each of the grid beams is a rigid and electrically conductive grid beam to provide an overhead structure configured to be positioned over electronic equipment in the data center. The grid structure is configured to provide support for electronic equipment connected to the grid structure and to provide support for mechanical equipment in the data center that is connected to the grid structure. The grid structure is further adapted to be electrically coupled to the electronic equipment to provide an electrically conductive ground mesh for the electronic equipment in the data center.
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16. An apparatus, comprising:
a first grid beam and a second grid beam arranged substantially parallel and that are electrically conductive;
a cross-beam that is electrically conductive and disposed substantially orthogonal to, and between, the first grid beam and the second grid beam, wherein the cross-beam comprises a hinged portion that enables a collapsible electrical connection to the first grid bream by overcoming a spring force resulting from a disposition of an open-loop spring structure of the hinged portion; and
an electrically conductive mesh adapted to provide electromagnetic shielding to a device of a data center, wherein:
the cross-beam, first grid beam, and second grid beam are oriented above devices, including the device, of the data center,
the cross-beam is repositionable to another position substantially orthogonal to, and between, the first grid beam and the second grid beam, and
the cross-beam is electrically connected to the first grid beam and the second grid beam.
9. A method, comprising:
positioning a conductive grounding mesh and a mechanical grid structure above an equipment rack in a data center, wherein the mechanical grid structure provides support for electronic equipment and mechanical equipment in the data center, wherein the conductive ground mesh provides electromagnetic shielding for the electronic equipment in the data center, wherein the mechanical grid structure comprises a first grid beam collapsibly connected to a second grid beam via a hinged portion of the second grid beam, wherein the hinged portion comprises an open-loop spring biasing actuation of the hinged portion, and wherein the hinged portion enables electrical connectivity between the first grid beam and the second grid beam; and
attaching a signal cable or a power cable to the mechanical grid structure to route the signal cable or the power cable above the electronic and mechanical equipment in the data center to reduce an electromagnetic susceptibility of the electronic equipment and emissions of the electronic equipment.
1. A system, comprising:
a conductive mesh and mechanical grid structure comprising a plurality of orthogonally arranged grid beams, wherein a first grid beam and a second grid beam of the plurality of orthogonally arranged grid beams are rigid and electrically conductive grid beams disposed above a plurality of electronic equipment in a data center, wherein the second grid beam is arranged orthogonal to the first grid beam via a hinged portion of the second grid beam adapted to enable a collapsible connection of the second grid beam to the first grid beam, wherein the hinged portion comprises an open-loop spring to facilitate the collapsible connection, wherein the hinged portion enables electrical connectivity between the first grid beam and the second grid beam, and wherein the conductive mesh and mechanical grid structure are configured to provide:
support for an electronic equipment of the plurality of electronic equipment in the data center, and
support for a mechanical equipment of a plurality of mechanical equipment in the data center;
and wherein the conductive mesh and mechanical grid structure is adapted to provide shielding from electrical interference to another electronic equipment of the plurality of electronic equipment in the data center.
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The present application claims the benefit of U.S. Provisional Patent Application No. 61/783,518, filed Mar. 14, 2013, which application is incorporated herein by reference in its entirety.
The present disclosure relates generally to data centers, and more specifically to an overhead structure in a data center that provides both electrical grounding functionality and mechanical structure for electrical and mechanical components in the data center.
Data centers are buildings or portions of buildings that house electronic equipment, such as telecommunications equipment, networking equipment, computer systems like servers, and so on, along with mechanical equipment like air conditioning units and signal and power cable routing structures required for operation of the electronic equipment. Current data centers generally have a raised floor and under-floor plenum, and may have a separate plenum between the structural ceiling and a drop-down ceiling, for air circulation for heating, ventilation and air conditioning. Such plenum spaces may also be used to house signal and/or power cables and the ancillary hardware required to organize, support and manage such cabling.
In a raised floor structure, the data center includes a slab floor over which is positioned an elevated, or raised, floor on which equipment, including equipment racks and air conditioning units, may be placed. The space underneath the raised floor may be used, in addition to routing signal and power cables, to house an electrical ground grid or mesh for the data center equipment, and to provide passage for the air flow required to maintain the equipment at desired operating temperatures.
Data center design has shifted, however, away from the extensive use of the raised floor plenum for housing cabling. Instead, it is preferred to keep the raised floor plenum relatively uncluttered to ensure the unrestricted flow of air to cool data center equipment. As a result of this design shift, cabling and its associated support hardware is increasingly being displaced to overhead areas on top of, and above, the upper surfaces of equipment racks and cabinets located in the data center, and upwardly toward the ceiling region of the data center.
As a result, cables are increasingly being positioned within the data center in locations remote from the electrical ground mesh which typically remains in the raised floor plenum. This increasing physical separation of the upwardly positioned cabling and the electrical ground mesh within the raised floor plenum causes an undesirable increase in the electromagnetic susceptibility and emissions of the data center. This occurs because the physical separation of the cabling and the electrical ground mesh creates a large pick-up area of an inductive loop within the data center, as will be appreciated by those of ordinary skill in the art. It may also create an increased risk of data center equipment damage due to a nearby lightning strike or high power electrical ground fault. There is thus a need for improved data center structures that mitigate the electrical and mechanical challenges created by such data center design changes to provide reliable operation of the data center.
According to one embodiment of the present disclosure, an overhead electrical grounding mesh and mechanical grid structure for a data center includes a plurality of orthogonally arranged grid beams. Each of the grid beams is a rigid and electrically conductive grid beam to provide an overhead structure configured to be positioned over electronic equipment in the data center. The grid structure is also configured to provide support for electronic equipment connected to the grid structure and to provide support for mechanical equipment in the data center that is connected to the grid structure. The grid structure is further adapted to be electrically coupled to the electronic equipment to provide an electrically conductive ground mesh for the electronic equipment in the data center. In some embodiments, the overhead electrical grounding mesh may be incorporated into a ceiling structure of the data center thereby defining an air plenum space in a manner similar to a traditional drop ceiling.
In the following description, certain details are set forth in conjunction with the described embodiments to provide a sufficient understanding of the subject disclosure. One of ordinary skill in the art will appreciate, however, that the embodiments of this disclosure may be practiced without these particular details. Furthermore, one of ordinary skill in the art will appreciate that the example embodiments described below do not limit the scope of the present disclosure, and will also understand that various modifications, equivalents, and combinations of the disclosed embodiments, and components thereof, are within the scope of the present disclosure. Embodiments including fewer than all the components of any of the respective described embodiments may also be within the scope of the present disclosure although not expressly described in detail below. Finally, the operation of well-known components, structures, and/or processes has not been shown or described in detail below to avoid unnecessarily obscuring the present disclosure.
As seen in
Before describing the grid structure 102 in more detail, some of the additional physical features of the data center 100 will be discussed with reference to
As previously described and depicted in
As previously described and further depicted in
Positioning the grid structure 102 above the equipment and racks 108 in a data center positions the grounding mesh proximate the signal cables and is advantageous for reducing unwanted electromagnetic interference within the data center. For example, as previously mentioned, signal cables and power cables are increasingly being positioned above the equipment racks 108 instead of in the space 114 below the raised floor 110 to ensure there is adequate space for required airflow in the space 114. Leaving the ground mesh under the raised floor 110 while positioning the signal cables above the equipment racks 108 undesirably increases the electromagnetic susceptibility of the electronic equipment contained in the equipment racks due to the enlarged pick-up area of an inductive loop created by the increased distance between such signal cables and the under-the-floor ground mesh. The grid structure 102 reduces such electromagnetic susceptibility through its positioning proximate the signal cables coupled to the grid structure.
In the embodiment of
The grid structure 602 further includes collapsible transverse grid-beams 612 that are attached to the longitudinal grid-beam 604 at corresponding cross-beam portions 600 through an attachment and hinge structure 614. The collapsible transverse grid-beam 612 includes a first transverse grid-beam section 616 having one end attached to the hinge structure 614 and a second transverse grid-beam section 618 having one end attached to the hinge structure as shown in
In operation, one or both of the grid-beam sections 616, 618 can be folded downward from a horizontal position, which is the position of the transverse grid-beam section 616 in
Grid structure 602 is further configured to support ceiling tiles 620, much as does a conventional suspended or “drop ceiling” prevalent in commercial office buildings. This enables equipment above the grid structure 602 to be hidden from view when the tiles 620 are in place, and can also provide an area above the grid structure 602 for additional airflow control as does a conventional drop ceiling.
In the embodiment depicted in
Even though various embodiments and advantages of the present disclosure have been set forth in the foregoing description, the present disclosure is illustrative only, and changes may be made in detail and yet remain within the broad principles of the present disclosure. Many of the specific details of certain embodiments are set forth in the description and accompanying figures to provide a thorough understanding of such embodiments. One skilled in the art will understand, however, that the subject matter of the present disclosure may be practiced without several of the details described. Moreover, one skilled in the art will understand that the figures related to the various embodiments are not to be interpreted as necessarily conveying any specific or relative physical dimensions. Specific or relative physical dimensions, if stated, should not to be considered limiting unless the claims expressly state otherwise. Further, illustrations of the various embodiments when presented by way of illustrative examples are intended only to further illustrate certain details of the various embodiments, and should not be interpreted as limiting the scope of the appended claims.
Sparrowhawk, Bryan, Seefried, Jeffrey P.
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Mar 11 2014 | SEEFRIED, JEFFREY P | LEVITON MANUFACTURING CO INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 032432 | /0303 | |
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Jul 01 2014 | SPARROWHAWK, BRYAN | LEVITON MANUFACTURING CO | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 035770 | /0493 | |
Jul 01 2014 | SEEFRIED, JEFFREY P | LEVITON MANUFACTURING CO | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 035770 | /0493 |
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