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patent | score | priority | expiry | expired | references | current assignee | title |
|---|---|---|---|---|---|---|---|
| 6573606 | 1 | 2001-06-14 | 2021-06-14 | 1 | 257 | GOOGLE LLC; | Chip to wiring interface with single metal alloy layer applied to surface of copper interconnect |
| 9443796 | 1 | 2013-03-15 | 2033-12-14 | 1 | 152 | Taiwan Semiconductor Manufacturing Company, L…; | Air trench in packages incorporating hybrid bonding |
| 8802538 | 2 | 2013-03-15 | 2033-06-26 | 0 | 176 | Taiwan Semiconductor Manufacturing Company, L…; | Methods for hybrid wafer bonding |
| 9142517 | 2 | 2012-10-31 | 2032-10-31 | 0 | 162 | Taiwan Semiconductor Manufacturing Company, L…; | Hybrid bonding mechanisms for semiconductor wafers |
| 9257399 | 2 | 2013-10-17 | 2033-11-26 | 1 | 159 | Taiwan Semiconductor Manufacturing Company, L…; | 3D integrated circuit and methods of forming the same |
| 6503834 | 11 | 2000-10-03 | 2020-10-03 | 1 | 28 | International Business Machines Corp.; | Process to increase reliability CuBEOL structures |
| 8816358 | 19 | 2013-07-03 | 2033-07-03 | 0 | 16 | Taiwan Semiconductor Manufacturing Co., Ltd.; | Plasmonic nanostructures for organic image sensors |
| 8901609 | 24 | 2013-07-17 | 2033-07-17 | 0 | 7 | Taiwan Semiconductor Manufacturing Company, L…; | Transistor having doped substrate and method of making the same |
| 8924246 | 26 | 2011-12-20 | 2032-12-18 | 0 | 38 | MSHIFT INC ; | Systems and methods for mobile payments |
| 8969882 | 32 | 2013-08-26 | 2033-08-26 | 0 | 4 | Taiwan Semiconductor Manufacturing Company, L…; | Transistor having an ohmic contact by screen layer and method of making the same |
| 9711555 | 32 | 2013-09-27 | 2034-08-19 | 0 | 19 | Taiwan Semiconductor Manufacturing Company, L…; | Dual facing BSI image sensors with wafer level stacking |
| 9170325 | 34 | 2012-08-30 | 2034-03-03 | 1 | 7 | Microsoft Technology Licensing, LLC; | Distance measurements between computing devices |
| 9960129 | 38 | 2012-10-31 | 2032-10-31 | 0 | 15 | Taiwan Semiconductor Manufacturing Company, L…; | Hybrid bonding mechanisms for semiconductor wafers |
| 9646860 | 44 | 2013-08-09 | 2033-10-11 | 0 | 10 | Taiwan Semiconductor Manufacturing Company, L…; | Alignment systems and wafer bonding systems and methods |
| 11048294 | 44 | 2017-04-25 | 2037-06-26 | 0 | 11 | HUAWEI TECHNOLOGIES CO , LTD ; | Liquid crystal display comprising a front camera disposed inside a through hole that forms a light channel and extends through the liquid crystal display, electronic device comprising the same |
| 8237247 | 46 | 2006-09-07 | 2026-12-12 | 1 | 8 | GLOBALFOUNDRIES Inc; | CMOS devices incorporating hybrid orientation technology (HOT) with embedded connectors |
| 9245991 | 47 | 2013-08-12 | 2033-11-09 | 0 | 3 | Taiwan Semiconductor Manufacturing Company, L…; | Semiconductor device, high electron mobility transistor (HEMT) and method of manufacturing |
| 9093511 | 49 | 2013-07-17 | 2033-07-17 | 0 | 3 | Taiwan Semiconductor Manufacturing Company, L…; | Transistor having high breakdown voltage and method of making the same |
| 8975641 | 50 | 2013-08-26 | 2033-08-26 | 0 | 3 | Taiwan Semiconductor Manufacturing Company, L…; | Transistor having an ohmic contact by gradient layer and method of making the same |
| 9446467 | 50 | 2013-03-14 | 2033-05-07 | 0 | 5 | Taiwan Semiconductor Manufacturing Company, L…; | Integrate rinse module in hybrid bonding platform |
| 9076854 | 51 | 2013-08-26 | 2033-08-26 | 1 | 3 | Taiwan Semiconductor Manufacturing Company, L…; | Semiconductor device |
| 9837291 | 52 | 2014-01-24 | 2034-01-24 | 0 | 6 | Taiwan Semiconductor …; Taiwan Semiconductor …; | Wafer processing method and apparatus |
| 7153776 | 55 | 2002-11-27 | 2023-11-06 | 1 | 4 | GLOBALFOUNDRIES Inc; | Method for reducing amine based contaminants |
| 9281203 | 55 | 2013-08-23 | 2033-08-23 | 1 | 2 | Taiwan Semiconductor Manufacturing Co., Ltd.; | Silicon dot formation by direct self-assembly method for flash memory |
| 10790189 | 56 | 2013-10-17 | 2033-11-28 | 0 | 4 | Taiwan Semiconductor Manufacturing Company, L…; | 3D integrated circuit and methods of forming the same |
| 9508722 | 58 | 2013-11-22 | 2033-11-22 | 1 | 3 | Taiwan Semiconductor Manufacturing Company Li…; | Semiconductor arrangment with capacitor |
| 9548376 | 58 | 2013-08-12 | 2033-08-12 | 0 | 1 | Taiwan Semiconductor Manufacturing Company, L…; | Method of manufacturing a semiconductor device including a barrier structure |
| 9508659 | 61 | 2013-07-01 | 2034-01-15 | 1 | 0 | Taiwan Semiconductor Manufacturing Company, L…; | Method and apparatus to protect a wafer edge |
| 7494918 | 62 | 2006-10-05 | 2027-02-20 | 1 | 3 | International Busines…; Advanced Micro Device…; | Semiconductor structures including multiple crystallographic orientations and methods for fabrication thereof |
| 9466663 | 62 | 2013-10-25 | 2033-12-11 | 1 | 1 | Taiwan Semiconductor Manufacturing Company Li…; | Semiconductor arrangement having capacitor separated from active region |
| 9478632 | 62 | 2013-08-26 | 2033-08-26 | 1 | 1 | Taiwan Semiconductor Manufacturing Company, L…; | Method of manufacturing a semiconductor device |
| 10109756 | 62 | 2013-08-09 | 2033-08-09 | 0 | 2 | Taiwan Semiconductor Manufacturing Company, L…; | Backside illuminated photo-sensitive device with gradated buffer layer |
| 10665449 | 63 | 2013-03-14 | 2034-07-17 | 0 | 2 | Taiwan Semiconductor Manufacturing Company, L…; | Integrate rinse module in hybrid bonding platform |
| 9385136 | 65 | 2013-08-23 | 2033-08-23 | 1 | 1 | TAIWAN SEMICONDUCTOR MANUFACTURING CO , LTD ; | Silicon dot formation by self-assembly method and selective silicon growth for flash memory |
| 9786628 | 66 | 2013-03-15 | 2033-05-15 | 0 | 1 | Taiwan Semiconductor Manufacturing Company, L…; | Air trench in packages incorporating hybrid bonding |
| 11037978 | 68 | 2013-09-27 | 2033-11-25 | 0 | 1 | Taiwan Semiconductor Manufacturing Company, L…; | Dual facing BSI image sensors with wafer level stacking |
| 11231376 | 68 | 2019-08-29 | 2040-04-15 | 0 | 1 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LT…; | Method for semiconductor wafer inspection and system thereof |
| 9837421 | 70 | 2013-10-25 | 2033-10-25 | 0 | 1 | Taiwan Semiconductor Manufacturing Company Li…; | Semiconductor arrangement having capacitor separated from active region |
| 7595232 | 71 | 2006-09-07 | 2027-07-10 | 1 | 1 | GLOBALFOUNDRIES Inc; | CMOS devices incorporating hybrid orientation technology (HOT) with embedded connectors |
| 9214539 | 71 | 2013-09-03 | 2033-09-03 | 1 | 2 | Taiwan Semiconductor Manufacturing Co., Ltd.; | Gallium nitride transistor with a hybrid aluminum oxide layer as a gate dielectric |
| 10039837 | 73 | 2013-12-02 | 2034-12-02 | 0 | 0 | JENKEM TECHNOLOGY CO., LTD. (TIANJIN); | Multi-arm polyethylene glycol-azido derivative |
| 10497860 | 74 | 2013-09-11 | 2033-09-11 | 0 | 2 | Taiwan Semiconductor Manufacturing Co., Ltd.; | Perpendicular magnetic random-access memory (MRAM) formation by direct self-assembly method |
| 7790553 | 75 | 2008-07-10 | 2028-10-13 | 1 | 2 | GLOBALFOUNDRIES Inc; | Methods for forming high performance gates and structures thereof |
| 7790581 | 75 | 2006-01-09 | 2028-05-11 | 1 | 1 | International Business Machines Corporation; | Semiconductor substrate with multiple crystallographic orientations |
| 7491623 | 76 | 2006-08-30 | 2026-08-30 | 0 | 0 | Taiwan Semiconductor Manufacturing Company, L…; | Method of making a semiconductor structure |
| 8053838 | 76 | 2008-06-26 | 2028-08-26 | 1 | 3 | GLOBALFOUNDRIES Inc; | Structures, fabrication methods, design structures for strained fin field effect transistors (FinFets) |
| 10090196 | 76 | 2013-10-17 | 2033-10-17 | 0 | 2 | Taiwan Semiconductor Manufacturing Company, L…; | 3D integrated circuit and methods of forming the same |
| 11282697 | 76 | 2013-03-14 | 2033-08-15 | 0 | 0 | Taiwan Semiconductor Manufacturing Company, L…; | Integrate rinse module in hybrid bonding platform |
| 9299768 | 77 | 2013-10-06 | 2033-10-06 | 1 | 0 | Taiwan Semiconductor Manufacturing Company Li…; | Semiconductor device with non-linear surface |
| 9502396 | 77 | 2013-03-15 | 2033-05-15 | 1 | 0 | Taiwan Semiconductor Manufacturing Company, L…; | Air trench in packages incorporating hybrid bonding |
| 10453889 | 78 | 2013-09-27 | 2034-03-10 | 0 | 1 | Taiwan Semiconductor Manufacturing Company, L…; | Dual facing BSI image sensors with wafer level stacking |
| 9553096 | 79 | 2013-11-22 | 2033-11-22 | 0 | 0 | Taiwan Semiconductor Manufacturing Company Li…; | Semiconductor arrangement with capacitor |
| 10037968 | 79 | 2013-08-09 | 2033-08-09 | 0 | 1 | Taiwan Semiconductor Manufacturing Company; | Alignment systems and wafer bonding systems and methods |
| 9299784 | 80 | 2013-10-06 | 2033-10-12 | 1 | 0 | Taiwan Semiconductor Manufacturing Company Li…; | Semiconductor device with non-linear surface |
| 10756222 | 80 | 2013-08-09 | 2033-08-09 | 0 | 1 | Taiwan Semiconductor Manufacturing Company, L…; | Backside illuminated photo-sensitive device with gradated buffer layer |
| 8754446 | 81 | 2006-08-30 | 2029-02-09 | 1 | 0 | ALSEPHINA INNOVATIONS INC; | Semiconductor structure having undercut-gate-oxide gate stack enclosed by protective barrier material |
| 9153717 | 81 | 2013-08-09 | 2033-08-09 | 0 | 0 | Taiwan Semiconductor Manufacturing Company, L…; | Backside illuminated photo-sensitive device with gradated buffer layer |
| 10504904 | 81 | 2013-12-31 | 2033-12-31 | 0 | 0 | Taiwan Semiconductor Manufacturing Company Li…; | Semiconductor arrangement with capacitor and method of fabricating the same |
| 10998494 | 81 | 2013-09-11 | 2033-09-11 | 0 | 0 | Taiwan Semiconductor Manufacturing Co., Ltd.; | Perpendicular magnetic random-access memory (MRAM) formation by direct self-assembly method |
| 11011524 | 81 | 2013-11-22 | 2033-11-22 | 0 | 0 | LIMITED; | Semiconductor arrangement with capacitor |
| 8288281 | 82 | 2002-11-27 | 2024-01-29 | 1 | 0 | GLOBALFOUNDRIES Inc; | Method for reducing amine based contaminants |
| 10280259 | 82 | 2013-12-02 | 2034-12-02 | 0 | 0 | JENKEM TECHNOLOGY CO., LTD.; | Alkynyl multi-arm polyethylene glycol derivative |
| 11037932 | 82 | 2013-10-25 | 2033-10-25 | 0 | 0 | Taiwan Semiconductor Manufacturing Company Li…; | Semiconductor arrangement having capacitor separated from active region |
| 11394593 | 82 | 2018-04-18 | 2039-04-15 | 0 | 0 | HUAWEI TECHNOLOGIES CO , LTD ; | Data channel transmission method, data channel receiving method, and apparatus |
| 11503208 | 82 | 2018-03-26 | 2038-03-26 | 0 | 1 | HUAWEI TECHNOLOGIES CO , LTD ; | Intelligent assistant control method and terminal device for recommending a photographing mode to a user |
| 11854795 | 82 | 2013-03-14 | 2033-05-07 | 0 | 0 | Taiwan Semiconductor Manufacturing Company, L…; | Integrate rinse module in hybrid bonding platform |
| 11856750 | 82 | 2013-11-22 | 2034-07-21 | 0 | 0 | Taiwan Semiconductor Manufacturing Company Li…; | Semiconductor arrangement with capacitor |
| 9064821 | 83 | 2013-08-23 | 2033-10-04 | 1 | 0 | Taiwan Semiconductor Manufacturing Co. Ltd.; | Silicon dot formation by self-assembly method and selective silicon growth for flash memory |
| 9455341 | 83 | 2013-07-17 | 2033-07-17 | 0 | 0 | Taiwan Semiconductor Manufacturing Company, L…; | Transistor having a back-barrier layer and method of making the same |
| 11276587 | 83 | 2014-01-24 | 2034-01-24 | 0 | 0 | Taiwan Semiconductor Manufacturing Company, L…; | Wafer bonding method and apparatus with curved surfaces |
| 11984365 | 83 | 2021-03-19 | 2042-01-28 | 0 | 0 | Taiwan Semiconductor Manufacturing Company, L…; | Semiconductor structure inspection using a high atomic number material |
| 11994902 | 83 | 2017-04-25 | 2037-06-26 | 0 | 0 | Huawei Technologies Co., Ltd.; | Liquid crystal display comprising a light channel formed through a stack including at least a color film layer, a thin-film-transistor layer, and a backlight and electronic device having the same |
| 7696573 | 84 | 2007-10-31 | 2028-01-02 | 1 | 0 | GLOBALFOUNDRIES Inc; | Multiple crystallographic orientation semiconductor structures |
| 9978754 | 84 | 2013-11-22 | 2033-11-22 | 0 | 0 | Taiwan Semiconductor Manufacturing Company Li…; | Semiconductor arrangement with capacitor |
| 10809635 | 84 | 2017-11-20 | 2038-11-14 | 0 | 1 | Taiwan Semiconductor Manufacturing Company, L…; | Defect inspection method and defect inspection system |
| 11463145 | 84 | 2018-05-04 | 2039-07-15 | 0 | 0 | HUAWEI TECHNOLOGIES CO , LTD ; | Information transmission method and device |
| 9966436 | 85 | 2013-10-06 | 2033-10-06 | 0 | 0 | Taiwan Semiconductor Manufacturing Company Li…; | Semiconductor device with non-linear surface |
| 10008506 | 85 | 2013-11-22 | 2033-11-22 | 0 | 0 | Taiwan Semiconductor Manufacturing Company Li…; | Semiconductor arrangement with capacitor |
| 9890245 | 86 | 2013-12-02 | 2034-12-02 | 0 | 0 | JENKEM TECHNOLOGY CO., LTD. (TIANJIN); | Stearic acid derivatives and oleic acid derivatives of multi-arm polyethylene glycol |
| 10269807 | 86 | 2013-10-25 | 2033-10-25 | 0 | 0 | Taiwan Semiconductor Manufacturing Company Li…; | Semiconductor arrangement having capacitor separated from active region |
| 11705923 | 86 | 2019-11-22 | 2040-11-20 | 0 | 0 | UNIVERS PTE LTD ; | Method and apparatus for storing data, and computer device and storage medium thereof |
| 11281252 | 87 | 2017-04-25 | 2037-06-26 | 0 | 0 | Huawei Technologies Co., Ltd.; | Liquid crystal display comprising an optical component having a component body that is competely or partially disposed in a pin through-hole in a backlight and electronic device having the same |
| 11222896 | 88 | 2013-12-31 | 2033-12-31 | 0 | 0 | LIMITED; | Semiconductor arrangement with capacitor and method of fabricating the same |
| 11457480 | 88 | 2018-04-28 | 2039-07-02 | 0 | 0 | HUAWEI TECHNOLOGIES CO , LTD ; | Asynchronous uplink transmission method, device, and storage medium |
| 11894408 | 88 | 2013-09-27 | 2034-05-19 | 0 | 0 | MANUFACTURING COMPANY, LTD.; | Dual facing BSI image sensors with wafer level stacking |
| 11900586 | 88 | 2018-04-13 | 2040-01-22 | 0 | 0 | Taiwan Semiconductor Manufacturing Company, L…; | Hot spot defect detecting method and hot spot defect detecting system |
| 10504756 | 89 | 2014-01-24 | 2034-01-24 | 0 | 0 | Taiwan Semiconductor Manufacturing Company; | Wafer processing method and apparatus |
| 7393738 | 90 | 2007-01-16 | 2027-01-16 | 0 | 1 | Meta Platforms, Inc; | Subground rule STI fill for hot structure |
| 8242544 | 90 | 2002-11-27 | 2023-12-10 | 1 | 0 | GLOBALFOUNDRIES U S INC ; | Semiconductor structure having reduced amine-based contaminants |
| 9130026 | 90 | 2013-09-03 | 2033-09-03 | 0 | 0 | Taiwan Semiconductor Manufacturing Co., Ltd.; | Crystalline layer for passivation of III-N surface |
| 9887155 | 90 | 2012-09-28 | 2032-12-17 | 0 | 1 | Taiwan Semiconductor Manufacturing Company, L…; | Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same |
| 11424964 | 90 | 2017-08-31 | 2038-08-29 | 0 | 0 | HUAWEI TECHNOLOGIES CO , LTD ; | Sounding reference signal receiving method, apparatus, and system |
| 7803708 | 91 | 2002-11-27 | 2025-03-03 | 1 | 0 | GLOBALFOUNDRIES Inc; | Method for reducing amine based contaminants |
| 9257636 | 91 | 2013-09-11 | 2033-09-11 | 1 | 0 | Taiwan Semiconductor Manufacturing Co., Ltd.; | Perpendicular magnetic random-access memory (MRAM) formation by direct self-assembly method |
| 10269575 | 91 | 2013-10-06 | 2033-10-06 | 0 | 0 | Taiwan Semiconductor Manufacturing Company Li…; | Semiconductor device with non-linear surface |
| 10417954 | 92 | 2017-03-15 | 2037-07-31 | 0 | 1 | XIAMEN TIANMA MICRO-ELECTRONICS CO., LTD.; | Display panel and display device |
| 10464882 | 92 | 2015-04-24 | 2036-04-20 | 0 | 0 | JENKEM TECHNOLOGY CO., LTD. (BEIJING); | Y-type discrete polyethylene glycol derivative and preparation method thereof |
| 10655621 | 92 | 2013-06-28 | 2035-06-23 | 0 | 0 | DANFOSS A S; | Control system and method of a VFD-based pump and pump system |
| 11611005 | 92 | 2013-08-09 | 2034-02-11 | 0 | 0 | Taiwan Semiconductor Manufacturing Company, L…; | Backside illuminated photo-sensitive device with gradated buffer layer |
| 10283448 | 93 | 2012-09-28 | 2032-10-12 | 0 | 0 | Taiwan Semiconductor Manufacturing Company, L…; | Multiple metal layer semiconductor device and low temperature stacking method of fabricating the same |
| 10527035 | 93 | 2013-06-28 | 2036-11-21 | 0 | 0 | DANFOSS A S; | Anti-ripple injection method and apparatus and control system of a pump |
| 10872406 | 93 | 2018-04-13 | 2039-01-15 | 0 | 0 | Taiwan Semiconductor Manufacturing Company, L…; | Hot spot defect detecting method and hot spot defect detecting system |
| 11770823 | 93 | 2018-05-11 | 2039-11-08 | 0 | 0 | HUAWEI TECHNOLOGIES CO , LTD ; | Uplink transmission method and user equipment |
| 11917614 | 93 | 2019-03-29 | 2041-03-13 | 0 | 0 | HUAWEI TECHNOLOGIES CO , LTD ; | Uplink control information transmission method and apparatus |
| 8513779 | 94 | 2006-09-07 | 2026-09-07 | 0 | 0 | GLOBALFOUNDRIES U S INC ; | CMOS devices incorporating hybrid orientation technology (HOT) with embedded connectors |
| 10458403 | 95 | 2013-06-28 | 2034-12-29 | 0 | 0 | DANFOSS A S; | Servo pump control system and method |
| 9825040 | 96 | 2013-12-31 | 2033-12-31 | 0 | 0 | Taiwan Semiconductor Manufacturing Company Li…; | Semiconductor arrangement with capacitor and method of fabricating the same |
| 10951149 | 97 | 2013-06-28 | 2034-11-07 | 0 | 0 | DANFOSS A S; | Method and apparatus for pulse-width modulation of a variable-frequency drive |
| 11500934 | 97 | 2020-06-30 | 2041-05-20 | 0 | 0 | Vesoft. Inc; | POI recommendation method and device based on graph database, and storage medium |
| 11359089 | 98 | 2017-03-30 | 2038-06-14 | 0 | 0 | JENKEM TECHNOLOGY CO., LTD. (BEIJING); | Method for preparing Y-branched hydrophilic polymer carboxylic acid derivative |
| 12068207 | 98 | 2022-05-27 | 2042-10-07 | 0 | 0 | Taiwan Semiconductor …; Taiwan Semiconductor …; | Simultaneous multi-bandwidth optical inspection of semiconductor devices |
| 7993990 | 99 | 2007-10-31 | 2027-10-31 | 1 | 0 | GLOBALFOUNDRIES Inc; | Multiple crystallographic orientation semiconductor structures |
| 11216759 | 99 | 2018-01-02 | 2039-02-17 | 0 | 0 | SHANGHAI JIAO TONG UNIVERSITY; | Real-time economic dispatch method of power system |
| 11501371 | 99 | 2020-03-26 | 2040-11-17 | 0 | 0 | XI'AN JI'AOTONG UNIVERSITY; | Distributed energy transaction matching method based on energy network constraints and multiple knapsack model |
| 11693843 | 99 | 2020-08-31 | 2041-06-15 | 0 | 0 | VESOFT INC ; | Data processing method and system of a distributed graph database |
| 11874831 | 99 | 2021-08-19 | 2042-04-14 | 0 | 0 | Vesoft Inc.; | Method and system for managing execution plan in graph database |