Patent
   D247032
Priority
Jun 16 1975
Filed
Jun 16 1975
Issued
Jan 24 1978
Expiry
Jan 24 1992
Assg.orig
Entity
unknown
3
2
n/a
The ornamental design for a low profile integrated circuit dip socket, substantially as shown.

FIG. 1 is a right front perspective view of a low profile integrated circuit socket showing our new design;

FIG. 2 is a front end elevational view thereof;

FIG. 3 is a rear end elevational view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right front perspective view of an eight pin socket embodiment thereof;

FIG. 6 is a bottom plan view of the socket of FIG. 5;

FIG. 7 is a front end elevational view thereof;

FIG. 8 is a rear end elevational view thereof;

FIG. 9 is a rear perspective view of the socket of FIG. 1; and

FIG. 10 is a rear perspective view of the socket of FIG. 5.

Freehauf, Eugene G., Hollingsworth, Gene C.

Patent Priority Assignee Title
D316251, Dec 19 1988 Mosaic Semiconductor, Inc.; MOSAIC SEMICONDUCTOR, INC , 7420 CARROLL ROAD, SAN DIEGO, CA 92121, A CA CORP In-line semiconductor package
D331195, Feb 14 1991 The Clorox Company Bottle
D553099, Jan 20 2006 Watlow Electric Manufacturing Company Power controller assembly
Patent Priority Assignee Title
2832942,
3732529,
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jun 16 1975Zero Corporation(assignment on the face of the patent)
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