|
The ornamental design for a low profile integrated circuit dip socket, substantially as shown. |
FIG. 1 is a right front perspective view of a low profile integrated circuit socket showing our new design;
FIG. 2 is a front end elevational view thereof;
FIG. 3 is a rear end elevational view thereof;
FIG. 4 is a bottom plan view thereof;
FIG. 5 is a right front perspective view of an eight pin socket embodiment thereof;
FIG. 6 is a bottom plan view of the socket of FIG. 5;
FIG. 7 is a front end elevational view thereof;
FIG. 8 is a rear end elevational view thereof;
FIG. 9 is a rear perspective view of the socket of FIG. 1; and
FIG. 10 is a rear perspective view of the socket of FIG. 5.
Freehauf, Eugene G., Hollingsworth, Gene C.
Patent | Priority | Assignee | Title |
D316251, | Dec 19 1988 | Mosaic Semiconductor, Inc.; MOSAIC SEMICONDUCTOR, INC , 7420 CARROLL ROAD, SAN DIEGO, CA 92121, A CA CORP | In-line semiconductor package |
D331195, | Feb 14 1991 | The Clorox Company | Bottle |
D553099, | Jan 20 2006 | Watlow Electric Manufacturing Company | Power controller assembly |
Patent | Priority | Assignee | Title |
2832942, | |||
3732529, |
Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jun 16 1975 | Zero Corporation | (assignment on the face of the patent) | / |
Date | Maintenance Fee Events |
Date | Maintenance Schedule |