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The ornamental design for a modularized housing unit for electronic apparatus or the like, as shown. |
FIG. 1 is a front perspective view of a modularized housing unit for electronic apparatus or the like showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a front elevation view thereof;
FIG. 4 is a left hand side view thereof;
FIG. 5 is a right hand side view thereof;
FIG. 6 is a rear view thereof; and
FIG. 7 is a bottom plan view thereof.
Eppich, Helmut, Dwillies, Paul K. L.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
May 13 1976 | Ebco Industries, Ltd. | (assignment on the face of the patent) | / |
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