Patent
   D249790
Priority
Oct 20 1976
Filed
Oct 20 1976
Issued
Oct 03 1978
Expiry
Oct 03 1992
Assg.orig
Entity
unknown
7
3
n/a
The ornamental design for a casing for electronic components or the like, as shown.

FIG. 1 is a top view of a casing for electronic components or the like showing my new design;

FIG. 2 is a side view of the casing of FIG. 1;

FIG. 3 is a rear view thereof;

FIG. 4 is a bottom view of the casing of FIGS. 1-3;

FIG. 5 is a top front perspective view thereof;

FIG. 6 is a bottom front perspective view thereof.

Ainscow, Geoffrey R.

Patent Priority Assignee Title
11859915, Jan 31 2019 Advanced Thermal Solutions, Inc. Fluid mover enclosure
D300624, Jan 16 1986 Electronic housing for breadboarding blocks
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D896767, Dec 02 2019 Advanced Thermal Solutions, Inc. Fluid mover enclosure
D969760, Dec 02 2019 Advanced Thermal Solutions, Inc. Fluid mover enclosure
Patent Priority Assignee Title
3348148,
3631299,
209400,
/
Executed onAssignorAssigneeConveyanceFrameReelDoc
Oct 20 1976Hewlett-Packard Company(assignment on the face of the patent)
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