|
The ornamental design for a casing for electronic components or the like, as shown. |
|||||||||||||||||
FIG. 1 is a top view of a casing for electronic components or the like showing my new design;
FIG. 2 is a side view of the casing of FIG. 1;
FIG. 3 is a rear view thereof;
FIG. 4 is a bottom view of the casing of FIGS. 1-3;
FIG. 5 is a top front perspective view thereof;
FIG. 6 is a bottom front perspective view thereof.
| Patent | Priority | Assignee | Title |
| 11859915, | Jan 31 2019 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
| D300624, | Jan 16 1986 | Electronic housing for breadboarding blocks | |
| D726134, | Nov 15 2013 | Housing assembly | |
| D856944, | Jan 31 2019 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
| D856945, | Jan 31 2019 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
| D896767, | Dec 02 2019 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
| D969760, | Dec 02 2019 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
| Patent | Priority | Assignee | Title |
| 3348148, | |||
| 3631299, | |||
| 209400, |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Oct 20 1976 | Hewlett-Packard Company | (assignment on the face of the patent) | / |
| Date | Maintenance Fee Events |
| Date | Maintenance Schedule |