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The ornamental design for a casing for electronic components or the like, as shown. |
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FIG. 1 is a top view of a casing for electronic components or the like showing my new design;
FIG. 2 is a side view of the casing of FIG. 1;
FIG. 3 is a rear view thereof;
FIG. 4 is a bottom view of the casing of FIGS. 1-3;
FIG. 5 is a top front perspective view thereof;
FIG. 6 is a bottom front perspective view thereof.
| Patent | Priority | Assignee | Title |
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| D284580, | Dec 27 1982 | DUNLOP MANUFACTURING, INC ; SR&D, INC | Stringed instrument amplifier or the like |
| D726134, | Nov 15 2013 | Housing assembly | |
| D975088, | Mar 04 2021 | Computer casing |
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Oct 20 1976 | Hewlett-Packard Company | (assignment on the face of the patent) | / |
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