|
The ornamental design for a heat sink or similar apparatus, substantially as shown. |
|||||||||||||||||
FIG. 1 is a perspective view of a heat sink or similar apparatus showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a side elevational view thereof;
FIG. 5 is a side elevational view of the opposite side thereof;
FIG. 6 is a top plan view thereof; and
FIG. 7 is a bottom plan view of the heat sink or similar apparatus of my invention.
| Patent | Priority | Assignee | Title |
| 6633485, | Nov 20 2002 | Illinois Tool Works Inc. | Snap-in heat sink for semiconductor mounting |
| D275648, | Sep 30 1982 | LASALLE BUSINESS CREDIT, INC | Stud-mounted heat sink for electronic devices |
| Patent | Priority | Assignee | Title |
| 3670215, |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Oct 22 1979 | Thermalloy Incorporated | (assignment on the face of the patent) | / |
| Date | Maintenance Fee Events |
| Date | Maintenance Schedule |