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Patent
D266075
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Priority
Apr 01 1980
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Filed
May 30 1980
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Issued
Sep 07 1982
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Expiry
Sep 07 1996
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Assg.orig
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Entity
unknown
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1
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4
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The ornamental design for heat releasing plate for mounting semiconductor components, as shown and described.
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FIG. 1 is a front view of the heat releasing plate for mounting
semi-conductor components showing the new design;
FIG. 2 is a plan view thereof;
FIG. 3 is a bottom view thereof;
FIG. 4 is a right side view thereof; and
FIG. 5 is a sectional view taken on line 5--5 of FIG. 2.
Asanuma, Yoshihiko
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