Heat-sink for electronic semiconductor devices

Abstract

Description

FIG. 1 is a perspective view of a heat sink for electronic semiconductor devices showing my new design, the semiconductor being shown in broken lines for illustrative purposes only;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a side elevational view thereof, looking toward the right side of the heat-sink as it is shown in FIG. 1;

FIG. 5 is a side elevational view thereof, looking toward the left side of the heat-sink as it is shown in FIG. 1;

FIG. 6 is a top plan view thereof; and

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a heat-sink for electronic semiconductor devices, substantially as shown and described.