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The ornamental design for a control housing for a soldering device, as shown and described. |
FIG. 1 is a perspective view of a control housing for a soldering device, showing my new design;
FIG. 2 is a right side elevational view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a perspective view of a second embodiment of a control housing for a soldering device;
FIG. 7 is an elevational view of the front panel of the second embodiment; and
FIG. 8 is an elevational view of the front panel of the first embodiment.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Nov 13 1981 | The Cooper Group Deutschland GmbH | (assignment on the face of the patent) | / | |||
Jan 12 1984 | RITTMANN, GUNTHER | COOPER GROUP DEUTSCHLAND GMBH, THE | ASSIGNMENT OF ASSIGNORS INTEREST | 004213 | /0749 |
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