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The ornamental design for acoustically coupled modem, as shown. |
FIG. 1--is a top plan view of acoustically coupled modem in accordance with my new design;
FIG. 2--is a front elevational view thereof;
FIG. 3--is a left side view thereof;
FIG. 4--is a bottom plan view thereof;
FIG. 5--is a rear elevational view thereof; and
FIG. 6--is a right side view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Mar 16 1982 | KAWAKAMI, YOSHIKAZU | KABUSHIKI KASHA SUWA SEIKOSHA, A JAPANESE COMPANY | ASSIGNMENT OF ASSIGNORS INTEREST | 004003 | /0745 | |
Apr 15 1982 | Kabushiki Kaisha Epson Corporation | (assignment on the face of the patent) | / | |||
Apr 15 1982 | Suwa Seikosha | (assignment on the face of the patent) | / |
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