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The ornamental design for an acoustically coupled modem, as shown. |
FIG. 1 is a top plan view of an acoustically coupled modem in accordance with my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a left side view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a bottom plan view thereof; and
FIG. 7 is a perspective view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Aug 06 1983 | MIZUNO, MASAHIKO | Epson Corporation | ASSIGNMENT OF ASSIGNORS INTEREST | 004167 | /0464 | |
Aug 06 1983 | MIZUNO, MASAHIKO | Kabushiki Kaisha Suwa Seikosha | ASSIGNMENT OF ASSIGNORS INTEREST | 004167 | /0464 | |
Aug 19 1983 | Epson Corporation | (assignment on the face of the patent) | / | |||
Aug 19 1983 | Kabushiki Kaisha Suwa Seikosha | (assignment on the face of the patent) | / |
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