FIG. 1 is a perspective view of a heat sink or similar article showing my
new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a side elevational view thereof, the opposite side being a mirror
image; and
FIG. 5 is an end elevational view thereof, the opposite end being a mirror
image.
Moore, Marvin F.
Patent |
Priority |
Assignee |
Title |
6633485, |
Nov 20 2002 |
Illinois Tool Works Inc. |
Snap-in heat sink for semiconductor mounting |
D295281, |
Apr 01 1985 |
Aavid Thermalloy, LLC |
Heat sink or similar article |
D296778, |
Oct 31 1985 |
LASALLE BUSINESS CREDIT, INC |
Slotted dual-channel heat sink for electronic devices |
D361986, |
Apr 05 1994 |
WAKEFIELD THERMAL SOLUTIONS, INC |
Heat sink |
D390539, |
Jul 29 1996 |
WAKEFIELD THERMAL SOLUTIONS, INC |
Heat sink |
D407381, |
Jul 29 1996 |
WAKEFIELD THERMAL SOLUTIONS, INC |
Heat sink |
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Maintenance Fee Events |
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Date |
Maintenance Schedule |